JP2008519695A5 - - Google Patents
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- Publication number
- JP2008519695A5 JP2008519695A5 JP2007540350A JP2007540350A JP2008519695A5 JP 2008519695 A5 JP2008519695 A5 JP 2008519695A5 JP 2007540350 A JP2007540350 A JP 2007540350A JP 2007540350 A JP2007540350 A JP 2007540350A JP 2008519695 A5 JP2008519695 A5 JP 2008519695A5
- Authority
- JP
- Japan
- Prior art keywords
- suspension spring
- substrate
- sacrificial layer
- suspension
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000725 suspension Substances 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 11
- 239000000463 material Substances 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000005365 phosphate glass Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/985,530 US7273762B2 (en) | 2004-11-09 | 2004-11-09 | Microelectromechanical (MEM) device including a spring release bridge and method of making the same |
| PCT/US2005/038848 WO2006052472A2 (en) | 2004-11-09 | 2005-10-25 | Microelectromechanical (mem) device including a spring release bridge and method of making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008519695A JP2008519695A (ja) | 2008-06-12 |
| JP2008519695A5 true JP2008519695A5 (enExample) | 2008-12-18 |
Family
ID=36314958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007540350A Pending JP2008519695A (ja) | 2004-11-09 | 2005-10-25 | ばね解放ブリッジを備えたマイクロ電気機械(mem)装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7273762B2 (enExample) |
| JP (1) | JP2008519695A (enExample) |
| TW (1) | TWI358389B (enExample) |
| WO (1) | WO2006052472A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100833508B1 (ko) * | 2006-12-07 | 2008-05-29 | 한국전자통신연구원 | 멤즈 패키지 및 그 방법 |
| US8136383B2 (en) * | 2007-08-28 | 2012-03-20 | Westerngeco L.L.C. | Calibrating an accelerometer |
| JP4636187B2 (ja) * | 2008-04-22 | 2011-02-23 | 株式会社デンソー | 力学量センサの製造方法および力学量センサ |
| TWI360516B (en) * | 2008-05-09 | 2012-03-21 | Pixart Imaging Inc | In-plane sensor and method for making same |
| US8877648B2 (en) | 2009-03-26 | 2014-11-04 | Semprius, Inc. | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby |
| CN102139854B (zh) * | 2010-01-28 | 2013-07-24 | 钜晶电子股份有限公司 | 微机电系统结构及其制造方法 |
| US9010170B2 (en) | 2010-08-16 | 2015-04-21 | Westerngeco L.L.C. | Method and apparatus to test an accelerometer |
| US9217805B2 (en) | 2010-10-01 | 2015-12-22 | Westerngeco L.L.C. | Monitoring the quality of particle motion data during a seismic acquisition |
| ITTO20120691A1 (it) * | 2012-08-01 | 2014-02-02 | Milano Politecnico | Sensore d'urto con meccanismo bistabile e metodo per il rilevamento di urti |
| JP6085757B2 (ja) * | 2013-03-13 | 2017-03-01 | 国立研究開発法人産業技術総合研究所 | 微小構造体の作製方法 |
| FR3005045A1 (fr) | 2013-04-25 | 2014-10-31 | Commissariat Energie Atomique | Structure microelectromecanique et/ou nanoelectromecanique a facteur de qualite ajustable |
| US9612254B2 (en) * | 2014-06-27 | 2017-04-04 | Nxp Usa, Inc. | Microelectromechanical systems devices with improved lateral sensitivity |
| US9764942B2 (en) | 2015-05-15 | 2017-09-19 | Murata Manufacturing Co., Ltd. | Multi-level micromechanical structure |
| FI126508B (en) | 2015-05-15 | 2017-01-13 | Murata Manufacturing Co | Method for manufacturing a multilevel micromechanical structure |
| DE102016209732B4 (de) | 2016-06-02 | 2025-02-06 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
| CN112141999B (zh) * | 2020-09-27 | 2024-01-02 | 地球山(苏州)微电子科技有限公司 | 一种mems器件的制造方法及mems器件 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6004208A (en) * | 1992-11-04 | 1999-12-21 | Kabushiki Kaisha Ace Denken | Slot machine that can superimpose on a display screen images from different storage locations |
| US5258097A (en) | 1992-11-12 | 1993-11-02 | Ford Motor Company | Dry-release method for sacrificial layer microstructure fabrication |
| US5393061A (en) * | 1992-12-16 | 1995-02-28 | Spielo Manufacturing Incorporated | Video gaming machine |
| JP2733379B2 (ja) * | 1993-12-28 | 1998-03-30 | 株式会社エース電研 | 遊技機 |
| US5542295A (en) | 1994-12-01 | 1996-08-06 | Analog Devices, Inc. | Apparatus to minimize stiction in micromachined structures |
| US5725428A (en) * | 1995-03-09 | 1998-03-10 | Atronic Casino Technology Distribution Gmbh | Video slot machine |
| JP3518067B2 (ja) * | 1995-07-04 | 2004-04-12 | 株式会社デンソー | 半導体力学量センサ |
| DE19526903B4 (de) * | 1995-07-22 | 2005-03-10 | Bosch Gmbh Robert | Drehratensensor |
| US5704835A (en) * | 1995-12-13 | 1998-01-06 | Infinity Group, Inc. | Electronic second spin slot machine |
| JPH09223690A (ja) * | 1996-02-16 | 1997-08-26 | Denso Corp | 半導体装置の製造方法 |
| US5788573A (en) * | 1996-03-22 | 1998-08-04 | International Game Technology | Electronic game method and apparatus with hierarchy of simulated wheels |
| US5997401A (en) * | 1996-10-25 | 1999-12-07 | Sigma Game, Inc. | Slot machine with symbol save feature |
| JPH10170275A (ja) * | 1996-12-13 | 1998-06-26 | Toyota Central Res & Dev Lab Inc | 振動型角速度センサ |
| AUPO429596A0 (en) * | 1996-12-18 | 1997-01-23 | Aristocrat Leisure Industries Pty Ltd | Find the prize |
| US6234897B1 (en) * | 1997-04-23 | 2001-05-22 | Wms Gaming Inc. | Gaming device with variable bonus payout feature |
| US5980384A (en) * | 1997-12-02 | 1999-11-09 | Barrie; Robert P. | Gaming apparatus and method having an integrated first and second game |
| JPH11244453A (ja) * | 1998-03-04 | 1999-09-14 | Aruze Corp | 遊技機 |
| US6033307A (en) * | 1998-03-06 | 2000-03-07 | Mikohn Gaming Corporation | Gaming machines with bonusing |
| US6190255B1 (en) * | 1998-03-24 | 2001-02-20 | Wms Gaming Inc. | Bonus game for a gaming machine |
| JP3307328B2 (ja) * | 1998-05-11 | 2002-07-24 | 株式会社デンソー | 半導体力学量センサ |
| US6159098A (en) * | 1998-09-02 | 2000-12-12 | Wms Gaming Inc. | Dual-award bonus game for a gaming machine |
| US6060336A (en) * | 1998-12-11 | 2000-05-09 | C.F. Wan Incorporated | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
| US6159097A (en) * | 1999-06-30 | 2000-12-12 | Wms Gaming Inc. | Gaming machine with variable probability of obtaining bonus game payouts |
| US6232104B1 (en) | 1999-08-17 | 2001-05-15 | Dade Behring Inc. | Detection of differences in nucleic acids by inhibition of spontaneous DNA branch migration |
| JP2001281264A (ja) * | 2000-03-30 | 2001-10-10 | Denso Corp | 半導体力学量センサ |
| JP2002005955A (ja) * | 2000-06-26 | 2002-01-09 | Denso Corp | 容量式力学量センサ |
| US6632139B1 (en) * | 2000-08-31 | 2003-10-14 | Igt | Gaming device having a bonus scheme with symbol generator and symbol terminating condition |
| US6544898B2 (en) | 2001-06-25 | 2003-04-08 | Adc Telecommunications, Inc. | Method for improved die release of a semiconductor device from a wafer |
| JP4967204B2 (ja) * | 2001-08-01 | 2012-07-04 | 株式会社豊田中央研究所 | 微小構造体の製造方法 |
| US6632698B2 (en) * | 2001-08-07 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS |
| US6930364B2 (en) * | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
| US6634945B2 (en) * | 2001-09-28 | 2003-10-21 | Igt | Gaming device having independent bonus reels |
| JP2004106074A (ja) * | 2002-09-13 | 2004-04-08 | Sony Corp | 中空構造体の製造方法、及びmems素子の製造方法 |
| US6770506B2 (en) | 2002-12-23 | 2004-08-03 | Motorola, Inc. | Release etch method for micromachined sensors |
| US7102467B2 (en) * | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
-
2004
- 2004-11-09 US US10/985,530 patent/US7273762B2/en not_active Expired - Fee Related
-
2005
- 2005-10-25 JP JP2007540350A patent/JP2008519695A/ja active Pending
- 2005-10-25 WO PCT/US2005/038848 patent/WO2006052472A2/en not_active Ceased
- 2005-11-01 TW TW094138291A patent/TWI358389B/zh not_active IP Right Cessation
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