JP2008518225A5 - - Google Patents
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- Publication number
- JP2008518225A5 JP2008518225A5 JP2007538553A JP2007538553A JP2008518225A5 JP 2008518225 A5 JP2008518225 A5 JP 2008518225A5 JP 2007538553 A JP2007538553 A JP 2007538553A JP 2007538553 A JP2007538553 A JP 2007538553A JP 2008518225 A5 JP2008518225 A5 JP 2008518225A5
- Authority
- JP
- Japan
- Prior art keywords
- ridge
- cover plate
- plate
- structured
- fluid container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 42
- 230000001070 adhesive effect Effects 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 31
- 239000003566 sealing material Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 230000001404 mediated effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009141 biological interaction Effects 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04105340 | 2004-10-27 | ||
| EP04105340.6 | 2004-10-27 | ||
| PCT/IB2005/053361 WO2006046164A1 (en) | 2004-10-27 | 2005-10-13 | Fluid container composed of two plates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008518225A JP2008518225A (ja) | 2008-05-29 |
| JP2008518225A5 true JP2008518225A5 (enExample) | 2011-09-22 |
| JP4969449B2 JP4969449B2 (ja) | 2012-07-04 |
Family
ID=35501130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538553A Expired - Fee Related JP4969449B2 (ja) | 2004-10-27 | 2005-10-13 | 二つのプレートから構成される流体容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8916111B2 (enExample) |
| EP (1) | EP1807341A1 (enExample) |
| JP (1) | JP4969449B2 (enExample) |
| CN (1) | CN101048338B (enExample) |
| WO (1) | WO2006046164A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009064490A2 (en) * | 2007-11-14 | 2009-05-22 | The State Of Oregon Acting By & Through The State Board Of Higher Education On Behalf Of Oregon State University | Microchannel structures having bonded layers including height control features |
| ES2715605T3 (es) | 2007-11-21 | 2019-06-05 | Smith & Nephew | Apósito para heridas |
| GB0723855D0 (en) | 2007-12-06 | 2008-01-16 | Smith & Nephew | Apparatus and method for wound volume measurement |
| US20100310437A1 (en) * | 2008-02-15 | 2010-12-09 | Hiroshi Hirayama | Microchip and Method for Manufacturing the Same |
| KR100919400B1 (ko) * | 2008-04-07 | 2009-09-29 | 삼성전자주식회사 | 미세유동장치 및 그 제조방법 |
| DE102009024048B3 (de) * | 2009-05-08 | 2010-08-19 | Institut für Bioprozess- und Analysenmesstechnik e.V. | Montier- und demontierbares Mikrofluidiksystem und Verfahren zur Flutung des Systems |
| DE102010002915B4 (de) * | 2010-03-16 | 2012-10-18 | Senslab-Gesellschaft Zur Entwicklung Und Herstellung Bioelektrochemischer Sensoren Mbh | Mikrofluidischer Sensor |
| GB201015656D0 (en) | 2010-09-20 | 2010-10-27 | Smith & Nephew | Pressure control apparatus |
| US9067003B2 (en) | 2011-05-26 | 2015-06-30 | Kalypto Medical, Inc. | Method for providing negative pressure to a negative pressure wound therapy bandage |
| US9084845B2 (en) | 2011-11-02 | 2015-07-21 | Smith & Nephew Plc | Reduced pressure therapy apparatuses and methods of using same |
| EP3338821B1 (en) | 2012-03-12 | 2020-05-06 | Smith & Nephew plc | Dressing for reduced pressure wound therapy |
| JP6276251B2 (ja) | 2012-03-20 | 2018-02-07 | スミス アンド ネフュー ピーエルシーＳｍｉｔｈ ＆ Ｎｅｐｈｅｗ Ｐｕｂｌｉｃ Ｌｉｍｉｔｅｄ Ｃｏｍｐａｎｙ | デューティサイクル閾値の動的決定に基づく減圧療法システムの動作制御 |
| US9427505B2 (en) | 2012-05-15 | 2016-08-30 | Smith & Nephew Plc | Negative pressure wound therapy apparatus |
| US8846416B1 (en) * | 2013-03-13 | 2014-09-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming biochips and biochips with non-organic landings for improved thermal budget |
| WO2014142841A1 (en) | 2013-03-13 | 2014-09-18 | Illumina, Inc. | Multilayer fluidic devices and methods for their fabrication |
| KR101585329B1 (ko) * | 2014-06-03 | 2016-01-15 | 주식회사 나노엔텍 | 플라스틱 마이크로칩 |
| JP2016017890A (ja) * | 2014-07-09 | 2016-02-01 | キヤノン株式会社 | 流体デバイス及び流体デバイスの製造方法 |
| KR102279239B1 (ko) * | 2014-07-25 | 2021-07-19 | 삼성전자주식회사 | 임프린트 공정을 이용한 역상 패턴 전사방법 |
| JP6725528B2 (ja) | 2014-12-22 | 2020-07-22 | スミス アンド ネフュー ピーエルシーＳｍｉｔｈ ＆ Ｎｅｐｈｅｗ Ｐｕｂｌｉｃ Ｌｉｍｉｔｅｄ Ｃｏｍｐａｎｙ | 陰圧閉鎖療法の装置および方法 |
| WO2016207075A1 (en) | 2015-06-26 | 2016-12-29 | Novo Nordisk A/S | Method of forming an adhesive bond between first and second components of a device and a device formed by the method |
| NL1041407B1 (en) | 2015-07-24 | 2017-02-07 | Qmicro B V | Microfluidic device. |
| US20180156426A1 (en) * | 2016-12-07 | 2018-06-07 | GE Lighting Solutions, LLC | Led module bonding |
| JP6939415B2 (ja) * | 2017-10-27 | 2021-09-22 | ウシオ電機株式会社 | マイクロチップ |
| KR101976082B1 (ko) * | 2018-01-25 | 2019-05-07 | (주)인텍바이오 | 진단 칩의 제작 방법 |
| CN109334028A (zh) * | 2018-11-28 | 2019-02-15 | 常州工程职业技术学院 | 一种微流控芯片贴片结构及贴片工艺 |
| JP7618655B2 (ja) * | 2019-09-25 | 2025-01-21 | ザ チャールズ スターク ドレイパー ラボラトリー， インク． | 密閉型マイクロ流体デバイスを製造するためのシステムおよび方法 |
| KR102591840B1 (ko) * | 2020-12-30 | 2023-10-27 | 한양대학교 산학협력단 | 면역분석실험 자동화 장치 |
| EP4129479A1 (en) * | 2021-08-06 | 2023-02-08 | Microliquid SL | Self-filling structure for sealing microfluidic architectures, microfluidic device, method and associated uses thereof |
| CN117902051B (zh) * | 2024-02-06 | 2024-08-30 | 南京航空航天大学 | 采用埋入式微通道阵列的进气道及其设计方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU642444B2 (en) | 1989-11-30 | 1993-10-21 | Mochida Pharmaceutical Co., Ltd. | Reaction vessel |
| JPH03223674A (ja) * | 1989-11-30 | 1991-10-02 | Mochida Pharmaceut Co Ltd | 反応容器 |
| US6905882B2 (en) | 1992-05-21 | 2005-06-14 | Biosite, Inc. | Diagnostic devices and apparatus for the controlled movement of reagents without membranes |
| US5458852A (en) * | 1992-05-21 | 1995-10-17 | Biosite Diagnostics, Inc. | Diagnostic devices for the controlled movement of reagents without membranes |
| JP3376495B2 (ja) * | 1992-08-18 | 2003-02-10 | ソニー株式会社 | 接着剤の塗布方法及び接着治具 |
| DE19524795C2 (de) | 1995-07-07 | 1997-06-12 | Danfoss As | Chemische Analysevorrichtung |
| JPH09205126A (ja) * | 1996-01-25 | 1997-08-05 | Fujikura Ltd | ワークとベースの接着方法 |
| US5932315A (en) | 1997-04-30 | 1999-08-03 | Hewlett-Packard Company | Microfluidic structure assembly with mating microfeatures |
| US6878540B2 (en) | 1999-06-25 | 2005-04-12 | Cepheid | Device for lysing cells, spores, or microorganisms |
| MXPA02000144A (es) * | 1999-07-07 | 2002-07-02 | 3M Innovative Properties Co | Articulo de deteccion que tiene una pelicul a de control de fluidos. |
| SE0000300D0 (sv) | 2000-01-30 | 2000-01-30 | Amersham Pharm Biotech Ab | Microfluidic assembly, covering method for the manufacture of the assembly and the use of the assembly |
| DE10201640A1 (de) | 2002-01-17 | 2003-08-07 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer Folie mit Oberflächenstrukturen im Mikro- und Nanometerbereich sowie eine diesbezügliche Folie |
| WO2003062133A2 (en) | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
| JP3842681B2 (ja) * | 2002-03-25 | 2006-11-08 | 株式会社東芝 | 化学分析装置 |
| JP3880931B2 (ja) * | 2002-08-23 | 2007-02-14 | 株式会社エンプラス | プレートの組立構造 |
| JP3880930B2 (ja) * | 2002-07-26 | 2007-02-14 | 株式会社エンプラス | プレートの接着部構造 |
| EP1415707A1 (en) * | 2002-10-29 | 2004-05-06 | Corning Incorporated | Method and microfluidic reactor for photocatalysis |
| US7413709B2 (en) * | 2003-02-12 | 2008-08-19 | Agilent Technologies, Inc. | PAEK-based microfluidic device with integrated electrospray emitter |
| JP3768486B2 (ja) * | 2003-03-20 | 2006-04-19 | 株式会社エンプラス | 微小流体取扱装置 |
-
2005
- 2005-10-13 CN CN2005800367753A patent/CN101048338B/zh not_active Expired - Fee Related
- 2005-10-13 US US11/577,819 patent/US8916111B2/en not_active Expired - Fee Related
- 2005-10-13 WO PCT/IB2005/053361 patent/WO2006046164A1/en not_active Ceased
- 2005-10-13 JP JP2007538553A patent/JP4969449B2/ja not_active Expired - Fee Related
- 2005-10-13 EP EP20050790197 patent/EP1807341A1/en not_active Withdrawn
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