JP2008517475A - 電気接点を有する基板及びその製造方法 - Google Patents
電気接点を有する基板及びその製造方法 Download PDFInfo
- Publication number
- JP2008517475A JP2008517475A JP2007537448A JP2007537448A JP2008517475A JP 2008517475 A JP2008517475 A JP 2008517475A JP 2007537448 A JP2007537448 A JP 2007537448A JP 2007537448 A JP2007537448 A JP 2007537448A JP 2008517475 A JP2008517475 A JP 2008517475A
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- substrate
- contact pad
- pad
- contact pads
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- 239000000758 substrate Substances 0.000 title claims abstract description 96
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000001465 metallisation Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000007654 immersion Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 239000000543 intermediate Substances 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04105175 | 2004-10-20 | ||
PCT/IB2005/053408 WO2006043235A1 (en) | 2004-10-20 | 2005-10-18 | Substrate with electric contacts and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008517475A true JP2008517475A (ja) | 2008-05-22 |
Family
ID=35520813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007537448A Withdrawn JP2008517475A (ja) | 2004-10-20 | 2005-10-18 | 電気接点を有する基板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1805799A1 (zh) |
JP (1) | JP2008517475A (zh) |
CN (1) | CN101044619A (zh) |
WO (1) | WO2006043235A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302539A (ja) * | 2008-06-16 | 2009-12-24 | Intel Corp | 扁平はんだグリッド配列のための処理方法、装置及びコンピュータシステム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101754579B (zh) * | 2009-11-16 | 2012-02-22 | 华为终端有限公司 | 城堡式模块及终端设备 |
US8809123B2 (en) * | 2012-06-05 | 2014-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers |
CN103531562B (zh) * | 2012-07-04 | 2016-07-06 | 颀邦科技股份有限公司 | 半导体封装结构及其导线架 |
CN104681530B (zh) * | 2013-11-26 | 2017-09-26 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
CN106252247B (zh) * | 2016-09-05 | 2019-07-05 | 江苏纳沛斯半导体有限公司 | 半导体结构及其形成方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0001918D0 (en) * | 2000-01-27 | 2000-03-22 | Marconi Caswell Ltd | Flip-chip bonding arrangement |
US6596618B1 (en) * | 2000-12-08 | 2003-07-22 | Altera Corporation | Increased solder-bump height for improved flip-chip bonding and reliability |
US20020093106A1 (en) * | 2001-01-17 | 2002-07-18 | Ashok Krishnamoorthy | Bonding pad for flip-chip fabrication |
US6862378B2 (en) * | 2002-10-24 | 2005-03-01 | Triquint Technology Holding Co. | Silicon-based high speed optical wiring board |
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2005
- 2005-10-18 EP EP05794401A patent/EP1805799A1/en not_active Withdrawn
- 2005-10-18 JP JP2007537448A patent/JP2008517475A/ja not_active Withdrawn
- 2005-10-18 WO PCT/IB2005/053408 patent/WO2006043235A1/en active Application Filing
- 2005-10-18 CN CNA2005800361282A patent/CN101044619A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302539A (ja) * | 2008-06-16 | 2009-12-24 | Intel Corp | 扁平はんだグリッド配列のための処理方法、装置及びコンピュータシステム |
JP2012151487A (ja) * | 2008-06-16 | 2012-08-09 | Intel Corp | 扁平はんだグリッド配列のための処理方法、装置及びコンピュータシステム |
Also Published As
Publication number | Publication date |
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EP1805799A1 (en) | 2007-07-11 |
CN101044619A (zh) | 2007-09-26 |
WO2006043235A1 (en) | 2006-04-27 |
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