GB0001918D0 - Flip-chip bonding arrangement - Google Patents

Flip-chip bonding arrangement

Info

Publication number
GB0001918D0
GB0001918D0 GBGB0001918.2A GB0001918A GB0001918D0 GB 0001918 D0 GB0001918 D0 GB 0001918D0 GB 0001918 A GB0001918 A GB 0001918A GB 0001918 D0 GB0001918 D0 GB 0001918D0
Authority
GB
United Kingdom
Prior art keywords
under
bumps
bump portions
flip
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0001918.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Caswell Ltd
Original Assignee
Marconi Caswell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Caswell Ltd filed Critical Marconi Caswell Ltd
Priority to GBGB0001918.2A priority Critical patent/GB0001918D0/en
Publication of GB0001918D0 publication Critical patent/GB0001918D0/en
Priority to PCT/GB2001/000335 priority patent/WO2001056081A1/en
Priority to GB0102085A priority patent/GB2364172A/en
Ceased legal-status Critical Current

Links

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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Abstract

A flip-chip bonding arrangement for use with for example, a GaAs monolithic microwave integrated circuit (MMIC) 42, or an opto-electronic device, has one or more metal under-bump portions 44 attached to a first substrate 40. Corresponding bump portions 52 of an interconnecting metal are attached to the surface of the under bump portions 44 remote from the first substrate. The arrangement is characterised in that the sides of the under-bump portions are non-wettable by the interconnecting metal, and the height of the under-bump portion substantially determines the overall separation between the first and a second substrates when the two are bonded. The under bump portions 44 may be made from nickel or copper, and have a height of at least 10 žm, and of at most 100 žm. A method of providing a flip-chip bonding arrangement uses a seed layer, photoresist, under bumps and bumps formed in openings in the photoresist (Figures 5a-5g). A further method of bonding two substrates uses a plurality of solder bumps and contact means. A thin layer of gold is deposited on the solder bumps. Without the application of a flux, the temperature of the solder-bumps is raised so that a solder connection is made between the bumps and the contact means.
GBGB0001918.2A 2000-01-27 2000-01-27 Flip-chip bonding arrangement Ceased GB0001918D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0001918.2A GB0001918D0 (en) 2000-01-27 2000-01-27 Flip-chip bonding arrangement
PCT/GB2001/000335 WO2001056081A1 (en) 2000-01-27 2001-01-26 Flip-chip bonding arrangement
GB0102085A GB2364172A (en) 2000-01-27 2001-01-26 Flip Chip Bonding Arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0001918.2A GB0001918D0 (en) 2000-01-27 2000-01-27 Flip-chip bonding arrangement

Publications (1)

Publication Number Publication Date
GB0001918D0 true GB0001918D0 (en) 2000-03-22

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0001918.2A Ceased GB0001918D0 (en) 2000-01-27 2000-01-27 Flip-chip bonding arrangement
GB0102085A Withdrawn GB2364172A (en) 2000-01-27 2001-01-26 Flip Chip Bonding Arrangement

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0102085A Withdrawn GB2364172A (en) 2000-01-27 2001-01-26 Flip Chip Bonding Arrangement

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GB (2) GB0001918D0 (en)
WO (1) WO2001056081A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930032B2 (en) * 2002-05-14 2005-08-16 Freescale Semiconductor, Inc. Under bump metallurgy structural design for high reliability bumped packages
US20040007779A1 (en) * 2002-07-15 2004-01-15 Diane Arbuthnot Wafer-level method for fine-pitch, high aspect ratio chip interconnect
US20070273025A1 (en) * 2002-11-06 2007-11-29 Koninklijke Philips Electronics N.V. Device Comprising Circuit Elements Connected By Bonding Bump Structure
EP1536469A1 (en) * 2003-11-28 2005-06-01 EM Microelectronic-Marin SA Semiconductor device with connecting bumps
WO2005093816A1 (en) 2004-03-05 2005-10-06 Infineon Technologies Ag Semiconductor device for radio frequency applications and method for making the same
EP1805799A1 (en) * 2004-10-20 2007-07-11 Koninklijke Philips Electronics N.V. Substrate with electric contacts and method of manufacturing the same
CN102881607B (en) * 2012-09-27 2015-02-18 中国科学院长春光学精密机械与物理研究所 Novel focal plane array electrical interconnection process
US9806043B2 (en) 2016-03-03 2017-10-31 Infineon Technologies Ag Method of manufacturing molded semiconductor packages having an optical inspection feature

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993515A (en) * 1975-03-31 1976-11-23 Rca Corporation Method of forming raised electrical contacts on a semiconductor device
US4930001A (en) * 1989-03-23 1990-05-29 Hughes Aircraft Company Alloy bonded indium bumps and methods of processing same
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
US5192835A (en) * 1990-10-09 1993-03-09 Eastman Kodak Company Bonding of solid state device to terminal board
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
US5656858A (en) * 1994-10-19 1997-08-12 Nippondenso Co., Ltd. Semiconductor device with bump structure
EP0708481A3 (en) * 1994-10-20 1997-04-02 Hughes Aircraft Co Improved flip chip high power monolithic integrated circuit thermal bumps and fabrication method
US5789271A (en) * 1996-03-18 1998-08-04 Micron Technology, Inc. Method for fabricating microbump interconnect for bare semiconductor dice
US5790377A (en) * 1996-09-12 1998-08-04 Packard Hughes Interconnect Company Integral copper column with solder bump flip chip

Also Published As

Publication number Publication date
WO2001056081A1 (en) 2001-08-02
GB0102085D0 (en) 2001-03-14
GB2364172A (en) 2002-01-16

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