JP2008515167A - 高速、高集積電気コネクタ - Google Patents
高速、高集積電気コネクタ Download PDFInfo
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- 235000012431 wafers Nutrition 0.000 claims abstract description 98
- 239000000463 material Substances 0.000 claims abstract description 94
- 239000004020 conductor Substances 0.000 claims abstract description 66
- 239000011230 binding agent Substances 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000000835 fiber Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002223 garnet Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 52
- 239000000945 filler Substances 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JXGGISJJMPYXGJ-UHFFFAOYSA-N lithium;oxido(oxo)iron Chemical compound [Li+].[O-][Fe]=O JXGGISJJMPYXGJ-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NQNBVCBUOCNRFZ-UHFFFAOYSA-N nickel ferrite Chemical compound [Ni]=O.O=[Fe]O[Fe]=O NQNBVCBUOCNRFZ-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
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- H—ELECTRICITY
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- H01R13/46—Bases; Cases
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
- H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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Abstract
【解決手段】電気的損失材料のブリッジ接地部材を備えた電気コネクタ。損失導電部材は、インサート成形工程を通じて部分的導電部材を形成し、設定可能なバインダに導電粒子を添加すことによって形成することができる。絶縁ハウジング内に保持された信号導体を含むウエハから組み立てられたコネクタは、添加された熱可塑性樹脂を絶縁ハウジングにモールドすることで損失導電部材を組み込む。損失導電部材は、磁気的損失材料と共に使用することができる。損失導電部材は、グランド・システム(接地システム)がコネクタ内で共振することを低減し、これにより、コネクタの高周波性能を向上させる。
【選択図】図9a
Description
Claims (51)
- 複数のウエハを有する電気コネクタ用のウエハであって、
a)1列に整列した複数の第1型の接触要素と、
b)複数の個別の導電要素であって、それぞれが前記第1型の接触要素の少なくとも1つと隣接して配置された前記導電要素と、
c)少なくとも前記複数の第1型の接触要素を固定する絶縁材料と、
d)前記個別の導電要素をブリッジする電気的損失材料と、
を備えたウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は損失導電体を含む、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、損失誘電体を含む、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、前記個別の導電要素の各々と直接接触することにより、前記導電要素をブリッジする、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、前記個別の導電要素の各々と容量結合することにより、前記導電要素をブリッジする、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、バインダと、複数の導電粒子とをその中に含む、ウエハ。 - 請求項6に記載のウエハにおいて、
前記導電粒子はフレーク(flakes)を含む、ウエハ。 - 請求項6に記載のウエハにおいて、
前記導電粒子はファイバを含む、ウエハ。 - 請求項8に記載のウエハにおいて、
前記ファイバは金属被覆されたファイバを含む、ウエハ。 - 請求項9に記載のウエハにおいて、
前記ファイバはニッケル被覆された黒鉛ファイバを含む、ウエハ。 - 請求項6に記載のウエハにおいて、
前記バインダは熱可塑性樹脂である、ウエハ。 - 請求項6に記載のウエハにおいて、
前記バインダは硬化性接着剤である、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、繊維質基板、バインダ、及び該バインダ内に配置された複数の導電粒子を持つ予備成形品(プレフォーム)である、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、1オーム/スクウェアから103オーム/スクウェアの表面抵抗を有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、10オーム/スクウェアから100オーム/スクウェアの表面抵抗を有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、20Ω/スクウェアから40Ω/スクウェアの表面抵抗を有する、ウエハ。 - 請求項14に記載のウエハにおいて、
前記電気的損失材料は、前記各導電要素に隣接する領域において、0.025mmから1mmの厚さを有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、0.01Ωcmから1Ωcmのバルク抵抗を有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、0.05Ωcmから0.5Ωcmのバルク抵抗を有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記電気的損失材料は、0.1Ωcmから0.2Ωcmのバルク抵抗を有する、ウエハ。 - 請求項1に記載のウエハにおいて、
前記複数の個別の導電要素はL字形状である、ウエハ。 - 請求項21に記載のウエハにおいて、
前記電気的損失材料は、導電粒子を含むバインダを有し、各個別の導電要素の少なくとも一部は、該バインダに埋め込まれている、ウエハ。 - 請求項1に記載のウエハにおいて、
前記複数の個別導電要素は、前記第1型の接触要素の列内に配置されている、ウエハ。 - 請求項1に記載のウエハにおいて、
前記複数の個別の導電要素は、前記列に平行な線上に配置されている、ウエハ。 - 請求項1に記載の第1のウエハと、
前記第1のウエハに平行に整列された複数の類似のウエハとを備え、
隣接ウエハ間に磁気的損失材料の層を更に含む、コネクタ。 - 複数の領域を備える電気コネクタであって、
a)絶縁材料と、
b)複数の信号導体であって、各信号導体は、接触尾部と、接触部とそれらの間の中間部とを有し、各信号導体の中間部の少なくとも一部は前記絶縁材料中に固定されている、前記信号導体と、
c)複数のシールド部材であって、各シールド部材は、信号導体の中間部に隣接した中間部を有する、前記シールド部材と、
d)各シールド部材の中間部に隣接して配置された電気的損失材料と
を備える電気コネクタ。 - 請求項26に記載の電気コネクタであって、
隣接ウエハにおいて、前記複数のシールド部材と信号導体との間に配置された磁気的損失材料を更に備える、電気コネクタ。 - 請求項26に記載の電気コネクタにおいて、
複数の信号導体の中間部は平面内に位置し、各シールド部材は該平面に平行な第1部分と、該平面を横断する第2部分とを備える、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、各シールド部材の中間部に接触している、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、各シールド部材の中間部に容量結合している、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、1Ω/スクウェアから103Ω/スクウェアの表面抵抗を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、10Ω/スクウェアから100Ω/スクウェアの表面抵抗を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、20Ω/スクウェアから40Ω/スクウェアの表面抵抗を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、0.01Ωcmから1Ωcmのバルク抵抗を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、0.05Ωcmから0.5Ωcmのバルク抵抗を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、0.1Ωcmから0.2Ωcmのバルク抵抗を有する、電気コネクタ。 - 請求項27に記載の電気コネクタであって、
前記磁気的損失材料は、0.1から1.0の磁気損失正接を有する、電気コネクタ。 - 請求項27に記載の電気コネクタであって、
前記磁気的損失材料は、フェライトを有する、電気コネクタ。 - 請求項27に記載の電気コネクタであって、
前記磁気的損失材料は、イットリウム・ガーネット(yttrium garnet)及び/又はアルミニウム・ガーネット(aluminum garnet)を有する、電気コネクタ。 - 請求項26に記載の電気コネクタであって、
前記電気的損失材料は、バインダを含み、各シールド部材が少なくとも一部で該バインダに埋め込まれて配置されている、電気コネクタ。 - a)複数の印刷回路基板であって、各印刷回路基板は複数の接地構造と複数の信号配線とを有する前記印刷回路基板と、
b)複数の電気コネクタであって、各々が前記複数の印刷回路基板の1つに取り付けられる電気コネクタであって、
i)第1の複数の導電部材であって、各々が前記複数の印刷回路基板の少なくとも1つにおいて接地構造に連結されている、前記第1の複数の導電部材と、
ii)第2複数の導電部材であって、各々が前記複数の印刷回路基板の少なくとも1つにおいて前記複数の信号配線の少なくとも1つに連結され、前記第2複数の導電部材は、前記第1の複数の導電部材中の少なくとも2つの導電部材とグループで配置され、該第1の複数の導電部材は、各グループにおいて、前記第2複数の導電部材中の導電部材に隣接して配置されている、前記第2複数の導電部材と、
iii)複数の部分的導電部材であって、各々が、1グループにおいて前記第2複数の導電部材中の導電部材に隣接して配置された前記第1の複数の導電部材中の少なくとも2つの導電部材を連結している、部分的導電部材と、
を有する前記電気コネクタと、
を備える電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、1Ω/スクウェアから103Ω/スクウェアの表面抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、10Ω/スクウェアから100Ω/スクウェアの表面抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、20Ω/スクウェアから40Ω/スクウェアの表面抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、0.01Ωcmから1Ωcmのバルク抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、0.05Ωcmから0.5Ωcmのバルク抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記部分的導電部材の各々は、0.1Ωcmから0.2Ωcmのバルク抵抗を有する、電子システム。 - 請求項41に記載の電子システムであって、
前記複数の部分的導電部材の各々は、1つのグループにおいて、前記第2複数の導電部材の導電部材に隣接して配置された前記第1の複数の導電部材の少なくとも2つの導電部材の周囲にモールドされている、電子システム。 - 請求項41に記載の電子システムであって、
複数の磁気的損失部材であって、各磁気的損失部材が隣接するグループ間に配置されている前記磁気的損失部材を更に備える電子システム。 - 請求項41に記載の電子システムであって、
前記複数の部分的導電部材の各々は、第1部分、第2部分及び第3部分を備え、
前記第1部分及び第3部分は前記第1の複数の導電部材中の導電部材に隣接し、
前記第2部分は、前記第1部分及び前記第3部分と結合しており、前記第2部分は前記第1部分及び前記第3部分よりも高い導電率を有する、電子システム。 - 請求項50に記載の電子システムであって、
前記第2部分は金属シートを備える、電子システム。
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US10/955,571 US7371117B2 (en) | 2004-09-30 | 2004-09-30 | High speed, high density electrical connector |
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Also Published As
Publication number | Publication date |
---|---|
US20160211618A1 (en) | 2016-07-21 |
ATE531102T1 (de) | 2011-11-15 |
US7371117B2 (en) | 2008-05-13 |
US9899774B2 (en) | 2018-02-20 |
WO2006039277A1 (en) | 2006-04-13 |
EP1794845B1 (en) | 2013-03-27 |
US7771233B2 (en) | 2010-08-10 |
EP1794845A1 (en) | 2007-06-13 |
EP2262061A1 (en) | 2010-12-15 |
CN101124697B (zh) | 2011-03-23 |
EP2262061B1 (en) | 2011-10-26 |
JP5020822B2 (ja) | 2012-09-05 |
US20060068640A1 (en) | 2006-03-30 |
CN102176586A (zh) | 2011-09-07 |
CN102176586B (zh) | 2012-11-28 |
US20180166828A1 (en) | 2018-06-14 |
US20130196553A1 (en) | 2013-08-01 |
US20080194146A1 (en) | 2008-08-14 |
US8371875B2 (en) | 2013-02-12 |
US20110003509A1 (en) | 2011-01-06 |
US9300074B2 (en) | 2016-03-29 |
CN101124697A (zh) | 2008-02-13 |
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