JP2008512230A - 熱的に制御される流体セルフアセンブリ法及び支持体 - Google Patents

熱的に制御される流体セルフアセンブリ法及び支持体 Download PDF

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Publication number
JP2008512230A
JP2008512230A JP2007530452A JP2007530452A JP2008512230A JP 2008512230 A JP2008512230 A JP 2008512230A JP 2007530452 A JP2007530452 A JP 2007530452A JP 2007530452 A JP2007530452 A JP 2007530452A JP 2008512230 A JP2008512230 A JP 2008512230A
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Japan
Prior art keywords
energy
support
fluid
energy absorbing
absorbing heat
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JP2007530452A
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Japanese (ja)
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JP2008512230A5 (https=
Inventor
ディロン ハース，ダニエル
ブレア ケイ，デイヴィッド
シャーマ，ラヴィ
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イーストマン コダック カンパニー
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Publication of JP2008512230A publication Critical patent/JP2008512230A/ja
Publication of JP2008512230A5 publication Critical patent/JP2008512230A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

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  • Physical Or Chemical Processes And Apparatus (AREA)
JP2007530452A 2004-09-03 2005-09-01 熱的に制御される流体セルフアセンブリ法及び支持体 Pending JP2008512230A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/849,302 US20060051517A1 (en) 2004-09-03 2004-09-03 Thermally controlled fluidic self-assembly method and support
PCT/US2005/031561 WO2006029091A2 (en) 2004-09-03 2005-09-01 Thermally controlled fluidic self-assembly method and support

Publications (2)

Publication Number Publication Date
JP2008512230A true JP2008512230A (ja) 2008-04-24
JP2008512230A5 JP2008512230A5 (https=) 2008-09-11

Family

ID=35759225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530452A Pending JP2008512230A (ja) 2004-09-03 2005-09-01 熱的に制御される流体セルフアセンブリ法及び支持体

Country Status (5)

Country Link
US (1) US20060051517A1 (https=)
EP (1) EP1784862A2 (https=)
JP (1) JP2008512230A (https=)
TW (1) TW200614394A (https=)
WO (1) WO2006029091A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512522A (ja) * 2010-03-19 2012-05-31 パナソニック株式会社 微細構造物を配置する方法
KR20210088607A (ko) * 2018-10-31 2021-07-14 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스

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US20060202944A1 (en) 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US8711063B2 (en) * 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
CN102971873B (zh) * 2010-07-14 2016-10-26 夏普株式会社 微小物体的配置方法、排列装置、照明装置以及显示装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
TWI434895B (zh) 2012-03-28 2014-04-21 Ind Tech Res Inst 染料與光電轉換裝置
JP6219929B2 (ja) * 2012-04-20 2017-10-25 レンセレイアー ポリテクニック インスティテュート 発光ダイオード及びそのパッケージング方法
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers
CN107833954B (zh) * 2016-09-15 2020-01-24 伊乐视有限公司 具有表面贴装发光元件的显示器
US10607515B2 (en) * 2018-04-19 2020-03-31 Lg Electronics Inc. Display device using semiconductor light emitting device and method for manufacturing the same
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
WO2021054550A1 (en) 2019-09-19 2021-03-25 Lg Electronics Inc. Device for self-assembling semiconductor light-emitting diodes
KR102260638B1 (ko) * 2019-09-26 2021-06-04 엘지전자 주식회사 반도체 발광소자의 자가조립 장치
DE112021006224T5 (de) * 2021-01-08 2023-10-05 Lg Electronics Inc. Selbstanbringungsvorrichtung und selbstanbringungsverfahren

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JPH09120943A (ja) * 1995-06-07 1997-05-06 Univ California 基板上に微細構造を組み付ける方法

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CA1268107A (en) * 1984-07-19 1990-04-24 Alfred Fuller Leatherman Thermoset bonding agent for non-distortion joining of self-supporting thermoset component parts
US4749833A (en) * 1987-08-07 1988-06-07 Tocco, Inc. Induction heating for adhesive bonding
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US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
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US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
CA2328578C (en) * 2000-12-15 2010-10-12 Shaw Industries Ltd. Method for inductively heating a substrate and a coating on said substrate
US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US6460966B1 (en) * 2001-08-23 2002-10-08 Hewlett-Packard Company Thin film microheaters for assembly of inkjet printhead assemblies
US7253091B2 (en) * 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US7018575B2 (en) * 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US6833277B2 (en) * 2002-01-24 2004-12-21 Massachusetts Institute Of Technology Method and system for field assisted statistical assembly of wafers

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH09120943A (ja) * 1995-06-07 1997-05-06 Univ California 基板上に微細構造を組み付ける方法

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JPN5007015741, Ｃ．Ｒ．ＢＡＲＲＹ, "Ａｐｐｒｏａｃｈｉｎｇ Ｐｒｏｇｒａｍｍａｂｌｅ Ｓｅｌｆ−Ａｓｓｅｍｂｌｙ ｆｒｏｍ Ｎａｎｏｐａｒｔｉｃｌｅ−Ｂａｓｅｄ Ｄｅｖｉｃｅｓ ｔｏ Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔｓ", ＰＲＯＣＥＥＤＯＮＧＳ ＯＦ ＴＨＥ ＦＯＵＮＤＡＴＩＯＮＳ ＯＦ ＮＡＮＯＳＣＩＥＮＣＥ, 20040421 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512522A (ja) * 2010-03-19 2012-05-31 パナソニック株式会社 微細構造物を配置する方法
KR20210088607A (ko) * 2018-10-31 2021-07-14 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스
KR102551554B1 (ko) 2018-10-31 2023-07-06 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스

Also Published As

Publication number Publication date
WO2006029091A2 (en) 2006-03-16
US20060051517A1 (en) 2006-03-09
EP1784862A2 (en) 2007-05-16
WO2006029091A3 (en) 2006-04-27
TW200614394A (en) 2006-05-01

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