TW200614394A - Thermally controlled fluidic self-assembly method and support - Google Patents

Thermally controlled fluidic self-assembly method and support

Info

Publication number
TW200614394A
TW200614394A TW094130020A TW94130020A TW200614394A TW 200614394 A TW200614394 A TW 200614394A TW 094130020 A TW094130020 A TW 094130020A TW 94130020 A TW94130020 A TW 94130020A TW 200614394 A TW200614394 A TW 200614394A
Authority
TW
Taiwan
Prior art keywords
support
binding sites
fluid
assembly method
micro
Prior art date
Application number
TW094130020A
Other languages
English (en)
Chinese (zh)
Inventor
Daniel Dillon Haas
David Blair Kay
Ravi Sharma
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200614394A publication Critical patent/TW200614394A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Physical Or Chemical Processes And Apparatus (AREA)
TW094130020A 2004-09-03 2005-09-02 Thermally controlled fluidic self-assembly method and support TW200614394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/849,302 US20060051517A1 (en) 2004-09-03 2004-09-03 Thermally controlled fluidic self-assembly method and support

Publications (1)

Publication Number Publication Date
TW200614394A true TW200614394A (en) 2006-05-01

Family

ID=35759225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130020A TW200614394A (en) 2004-09-03 2005-09-02 Thermally controlled fluidic self-assembly method and support

Country Status (5)

Country Link
US (1) US20060051517A1 (https=)
EP (1) EP1784862A2 (https=)
JP (1) JP2008512230A (https=)
TW (1) TW200614394A (https=)
WO (1) WO2006029091A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722905B2 (en) 2012-03-28 2014-05-13 Industrial Technology Research Institute Dyes and photoelectric conversion devices containing the same
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060202944A1 (en) 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US8711063B2 (en) * 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
CN102473598A (zh) * 2010-03-19 2012-05-23 松下电器产业株式会社 用于布置微结构的方法
CN102971873B (zh) * 2010-07-14 2016-10-26 夏普株式会社 微小物体的配置方法、排列装置、照明装置以及显示装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
JP6219929B2 (ja) * 2012-04-20 2017-10-25 レンセレイアー ポリテクニック インスティテュート 発光ダイオード及びそのパッケージング方法
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
CN107833954B (zh) * 2016-09-15 2020-01-24 伊乐视有限公司 具有表面贴装发光元件的显示器
US10607515B2 (en) * 2018-04-19 2020-03-31 Lg Electronics Inc. Display device using semiconductor light emitting device and method for manufacturing the same
CN111129245B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 一种led芯片、显示面板及显示面板的组装设备
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
WO2021054550A1 (en) 2019-09-19 2021-03-25 Lg Electronics Inc. Device for self-assembling semiconductor light-emitting diodes
KR102260638B1 (ko) * 2019-09-26 2021-06-04 엘지전자 주식회사 반도체 발광소자의 자가조립 장치
DE112021006224T5 (de) * 2021-01-08 2023-10-05 Lg Electronics Inc. Selbstanbringungsvorrichtung und selbstanbringungsverfahren

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035547A (en) * 1974-02-26 1977-07-12 William C. Heller Bonding element having separate heating and agitating particles
CA1268107A (en) * 1984-07-19 1990-04-24 Alfred Fuller Leatherman Thermoset bonding agent for non-distortion joining of self-supporting thermoset component parts
US4749833A (en) * 1987-08-07 1988-06-07 Tocco, Inc. Induction heating for adhesive bonding
US4983804A (en) * 1989-12-21 1991-01-08 At&T Bell Laboratories Localized soldering by inductive heating
US5605662A (en) * 1993-11-01 1997-02-25 Nanogen, Inc. Active programmable electronic devices for molecular biological analysis and diagnostics
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
JP3376183B2 (ja) * 1994-09-29 2003-02-10 キヤノン株式会社 インクジェット用水性インク、インクジェット記録方法及びブリード緩和方法
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6683663B1 (en) * 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6555408B1 (en) * 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6536106B1 (en) * 1999-06-30 2003-03-25 The Penn State Research Foundation Electric field assisted assembly process
DE69918551D1 (de) * 1999-09-17 2004-08-12 St Microelectronics Srl Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten
US6527964B1 (en) * 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6420266B1 (en) * 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
AU2427301A (en) * 1999-12-01 2001-06-12 Regents Of The University Of California, The Electric-field-assisted fluidic assembly of inorganic and organic materials, molecules and like small things including living cells
US6687987B2 (en) * 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
US20020149107A1 (en) * 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
CA2328578C (en) * 2000-12-15 2010-10-12 Shaw Industries Ltd. Method for inductively heating a substrate and a coating on said substrate
US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US6460966B1 (en) * 2001-08-23 2002-10-08 Hewlett-Packard Company Thin film microheaters for assembly of inkjet printhead assemblies
US7253091B2 (en) * 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US7018575B2 (en) * 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US6833277B2 (en) * 2002-01-24 2004-12-21 Massachusetts Institute Of Technology Method and system for field assisted statistical assembly of wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722905B2 (en) 2012-03-28 2014-05-13 Industrial Technology Research Institute Dyes and photoelectric conversion devices containing the same
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers

Also Published As

Publication number Publication date
WO2006029091A2 (en) 2006-03-16
US20060051517A1 (en) 2006-03-09
EP1784862A2 (en) 2007-05-16
WO2006029091A3 (en) 2006-04-27
JP2008512230A (ja) 2008-04-24

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