DE69918551D1 - Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten - Google Patents

Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten

Info

Publication number
DE69918551D1
DE69918551D1 DE69918551T DE69918551T DE69918551D1 DE 69918551 D1 DE69918551 D1 DE 69918551D1 DE 69918551 T DE69918551 T DE 69918551T DE 69918551 T DE69918551 T DE 69918551T DE 69918551 D1 DE69918551 D1 DE 69918551D1
Authority
DE
Germany
Prior art keywords
electrical
mechanical connection
microelectronic components
microelectronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918551T
Other languages
English (en)
Inventor
Bruno Murari
Ubaldo Mastromatteo
Benedetto Vigna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE69918551D1 publication Critical patent/DE69918551D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
DE69918551T 1999-09-17 1999-09-17 Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten Expired - Lifetime DE69918551D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99830586A EP1085568B1 (de) 1999-09-17 1999-09-17 Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten

Publications (1)

Publication Number Publication Date
DE69918551D1 true DE69918551D1 (de) 2004-08-12

Family

ID=8243591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918551T Expired - Lifetime DE69918551D1 (de) 1999-09-17 1999-09-17 Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten

Country Status (4)

Country Link
US (1) US6423938B1 (de)
EP (1) EP1085568B1 (de)
JP (1) JP3466554B2 (de)
DE (1) DE69918551D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1273958C (zh) * 2002-01-17 2006-09-06 新科实业有限公司 Fpc设计和hga组装方法
US6893885B2 (en) * 2002-01-18 2005-05-17 The Regents Of The University Of Michigan Method for electrically and mechanically connecting microstructures using solder
US7218473B2 (en) * 2002-03-22 2007-05-15 Seagate Technology Llc Two-stage sealing of a data storage assembly housing to retain a low density atmosphere
US7176106B2 (en) * 2003-06-13 2007-02-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
US6989493B2 (en) * 2004-03-03 2006-01-24 Seagate Technology Llc Electrical feedthrough assembly for a sealed housing
US9293169B2 (en) 2004-05-04 2016-03-22 Seagate Technology Llc Seal-type label to contain pressurized gas environment
US7251882B2 (en) * 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US20060051517A1 (en) * 2004-09-03 2006-03-09 Eastman Kodak Company Thermally controlled fluidic self-assembly method and support

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696188A (en) * 1981-10-09 1987-09-29 Honeywell Inc. Semiconductor device microstructure
US4472239A (en) * 1981-10-09 1984-09-18 Honeywell, Inc. Method of making semiconductor device
JPS58197523A (ja) * 1982-05-13 1983-11-17 Toyota Central Res & Dev Lab Inc 温度調節装置
JPS6249639A (ja) * 1985-08-29 1987-03-04 Sharp Corp 接続方式
DE3936679C2 (de) * 1988-11-05 1994-02-17 Murata Manufacturing Co Regelwiderstand
US5389218A (en) * 1989-01-24 1995-02-14 Gas Research Institute Process for operating a solid-state oxygen microsensor
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
JPH04364742A (ja) * 1991-06-12 1992-12-17 Seiko Epson Corp 半導体装置の構造及び半導体装置の製造方法
JPH07101692B2 (ja) * 1993-02-12 1995-11-01 日本電気株式会社 半導体装置
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
JPH08241942A (ja) * 1994-12-28 1996-09-17 Toyota Central Res & Dev Lab Inc 薄膜積層体
US5920978A (en) * 1995-03-01 1999-07-13 Fujitsu Limited Method of making a thin film magnetic slider
US5696491A (en) * 1995-06-07 1997-12-09 Regents Of The University Of California Self-excited microelectromechanical device
US6054277A (en) * 1996-05-08 2000-04-25 Regents Of The University Of Minnesota Integrated microchip genetic testing system
JPH1195535A (ja) * 1997-09-25 1999-04-09 Nec Corp 画像記録装置
EP0913921B1 (de) * 1997-10-29 2006-05-03 STMicroelectronics S.r.l. Verfahren zur Herstellung einer Halbleiter Microantrieb, insbesondere für Lese-Schreibekopf einem Festplattengerät, und so hergestellter Microantrieb
US6169965B1 (en) * 1997-12-31 2001-01-02 Honeywell International Inc. Fluid property and flow sensing via a common frequency generator and FFT
US6118637A (en) * 1998-01-08 2000-09-12 Seagate Technology, Inc. Piezoelectric assembly for micropositioning a disc drive head
US6232150B1 (en) * 1998-12-03 2001-05-15 The Regents Of The University Of Michigan Process for making microstructures and microstructures made thereby
JP3196748B2 (ja) * 1998-12-24 2001-08-06 日本電気株式会社 ヒートシンク
US6164837A (en) * 1998-12-30 2000-12-26 Mcdonnell Douglas Corporation Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing

Also Published As

Publication number Publication date
EP1085568A1 (de) 2001-03-21
JP3466554B2 (ja) 2003-11-10
JP2001135446A (ja) 2001-05-18
US6423938B1 (en) 2002-07-23
EP1085568B1 (de) 2004-07-07

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