JP2008511181A - 改善されたパッド除去速度および平坦化の研磨パッドおよび方法 - Google Patents

改善されたパッド除去速度および平坦化の研磨パッドおよび方法 Download PDF

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Publication number
JP2008511181A
JP2008511181A JP2007530116A JP2007530116A JP2008511181A JP 2008511181 A JP2008511181 A JP 2008511181A JP 2007530116 A JP2007530116 A JP 2007530116A JP 2007530116 A JP2007530116 A JP 2007530116A JP 2008511181 A JP2008511181 A JP 2008511181A
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JP
Japan
Prior art keywords
pad
isocyanate
layer
urethane
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007530116A
Other languages
English (en)
Japanese (ja)
Inventor
ドウェイン ハルバーグ，
ピーター レンテルン，
Original Assignee
ジェイエイチ ローデス カンパニー， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/924,832 external-priority patent/US20060046627A1/en
Priority claimed from US10/924,831 external-priority patent/US20060046064A1/en
Priority claimed from US10/924,833 external-priority patent/US20060099891A1/en
Application filed by ジェイエイチ ローデス カンパニー， インコーポレイテッド filed Critical ジェイエイチ ローデス カンパニー， インコーポレイテッド
Publication of JP2008511181A publication Critical patent/JP2008511181A/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2007530116A 2004-08-25 2005-08-24 改善されたパッド除去速度および平坦化の研磨パッドおよび方法 Withdrawn JP2008511181A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/924,832 US20060046627A1 (en) 2004-08-25 2004-08-25 Method of improving planarization of urethane polishing pads, and urethane polishing pad produced by the same
US10/924,831 US20060046064A1 (en) 2004-08-25 2004-08-25 Method of improving removal rate of pads
US10/924,833 US20060099891A1 (en) 2004-11-09 2004-11-09 Method of chemical mechanical polishing, and a pad provided therefore
PCT/US2005/030226 WO2006026343A1 (en) 2004-08-25 2005-08-24 Polishing pad and methods of improving pad removal rates and planarization

Publications (1)

Publication Number Publication Date
JP2008511181A true JP2008511181A (ja) 2008-04-10

Family

ID=35414549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530116A Withdrawn JP2008511181A (ja) 2004-08-25 2005-08-24 改善されたパッド除去速度および平坦化の研磨パッドおよび方法

Country Status (3)

Country Link
JP (1) JP2008511181A (ko)
KR (1) KR20070057157A (ko)
WO (1) WO2006026343A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010538461A (ja) * 2007-08-28 2010-12-09 プラクスエア・テクノロジー・インコーポレイテッド 化学機械平坦化用制動性ポリウレタンバッドを製造するための系及び方法
WO2015002199A1 (ja) * 2013-07-02 2015-01-08 富士紡ホールディングス株式会社 研磨パッド及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687119B2 (ja) 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5687118B2 (ja) 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2070041B (en) * 1980-02-20 1983-06-22 Dunlop Ltd Polyether-urethane foams
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US20040209554A1 (en) * 2002-06-04 2004-10-21 Akio Tsumagari Polishing material and method of polishing therewith
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010538461A (ja) * 2007-08-28 2010-12-09 プラクスエア・テクノロジー・インコーポレイテッド 化学機械平坦化用制動性ポリウレタンバッドを製造するための系及び方法
WO2015002199A1 (ja) * 2013-07-02 2015-01-08 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10213895B2 (en) 2013-07-02 2019-02-26 Fujibo Holdings, Inc. Polishing pad and method for manufacturing same

Also Published As

Publication number Publication date
WO2006026343A1 (en) 2006-03-09
KR20070057157A (ko) 2007-06-04

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A300 Application deemed to be withdrawn because no request for examination was validly filed

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Effective date: 20081104