JP2008508702A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008508702A5 JP2008508702A5 JP2007523020A JP2007523020A JP2008508702A5 JP 2008508702 A5 JP2008508702 A5 JP 2008508702A5 JP 2007523020 A JP2007523020 A JP 2007523020A JP 2007523020 A JP2007523020 A JP 2007523020A JP 2008508702 A5 JP2008508702 A5 JP 2008508702A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- region
- film
- light emitting
- avalanche
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59165804P | 2004-07-28 | 2004-07-28 | |
| US60/591,658 | 2004-07-28 | ||
| PCT/EP2005/008213 WO2006010618A1 (en) | 2004-07-28 | 2005-07-28 | Photonic devices monolithically integrated with cmos |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008508702A JP2008508702A (ja) | 2008-03-21 |
| JP2008508702A5 true JP2008508702A5 (enExample) | 2012-05-17 |
| JP5069559B2 JP5069559B2 (ja) | 2012-11-07 |
Family
ID=35240919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007523020A Expired - Fee Related JP5069559B2 (ja) | 2004-07-28 | 2005-07-28 | Cmosをモノリシックに集積した光素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8963169B2 (enExample) |
| EP (1) | EP1782481A1 (enExample) |
| JP (1) | JP5069559B2 (enExample) |
| CN (1) | CN101002326B (enExample) |
| WO (1) | WO2006010618A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4920342B2 (ja) * | 2006-08-24 | 2012-04-18 | 浜松ホトニクス株式会社 | シリコン素子の製造方法 |
| FR2906403B1 (fr) * | 2006-09-21 | 2008-12-19 | Commissariat Energie Atomique | Procede de recuit de cellules photovoltaiques |
| KR20110042052A (ko) * | 2008-06-11 | 2011-04-22 | 솔라 임플란트 테크놀로지스 아이엔씨. | 패시팅 및 이온 주입을 이용한 솔라 셀 제작 |
| JP5003699B2 (ja) * | 2009-03-10 | 2012-08-15 | 株式会社日立製作所 | シリコン発光ダイオード、シリコン光トランジスタ、シリコンレーザー及びそれらの製造方法。 |
| SG174289A1 (en) * | 2009-03-20 | 2011-10-28 | Solar Implant Technologies Inc | Advanced high efficiency crystalline solar cell fabrication method |
| EP2412036B1 (en) * | 2009-03-23 | 2019-08-28 | Hewlett-Packard Enterprise Development LP | Device with indirect-bandgap-semiconductor light-emitting diode |
| KR20120022872A (ko) * | 2009-05-22 | 2012-03-12 | 스미또모 가가꾸 가부시키가이샤 | 반도체 기판, 전자 디바이스, 반도체 기판의 제조 방법 및 전자 디바이스의 제조 방법 |
| EP2256812A1 (en) * | 2009-05-25 | 2010-12-01 | Nxp B.V. | Semiconductor device for increasing output power of a light emitting unit |
| KR101649004B1 (ko) * | 2009-05-26 | 2016-08-17 | 스미또모 가가꾸 가부시키가이샤 | 반도체 기판, 반도체 기판의 제조 방법 및 전자 디바이스 |
| US8749053B2 (en) | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
| TWI389329B (zh) * | 2009-06-29 | 2013-03-11 | Au Optronics Corp | 平面顯示面板、紫外光感測器及其製造方法 |
| EP2270840B1 (en) * | 2009-06-29 | 2020-06-03 | IMEC vzw | Method for manufacturing an III-V material substrate and the substrate thereof |
| CN102834905B (zh) * | 2010-02-09 | 2016-05-11 | 因特瓦克公司 | 太阳能电池制造中使用的可调阴影掩模组件 |
| US8237177B2 (en) * | 2010-07-12 | 2012-08-07 | National Semiconductor Corporation | Fully silicon ALED-photodiode optical data link module |
| JP2012156310A (ja) * | 2011-01-26 | 2012-08-16 | Sony Corp | 固体撮像素子、固体撮像素子の製造方法、および電子機器 |
| CN104428883B (zh) | 2011-11-08 | 2017-02-22 | 因特瓦克公司 | 基板处理系统和方法 |
| WO2013118248A1 (ja) | 2012-02-06 | 2013-08-15 | 株式会社日立製作所 | 発光素子 |
| EP2626917B1 (en) * | 2012-02-10 | 2017-09-27 | IHP GmbH-Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik | A CMOS-compatible germanium tunable Laser |
| SG2013075379A (en) | 2012-10-08 | 2014-05-29 | Agency Science Tech & Res | P-i-n photodiode |
| TWI570745B (zh) | 2012-12-19 | 2017-02-11 | 因特瓦克公司 | 用於電漿離子植入之柵極 |
| WO2015042610A2 (en) | 2013-09-23 | 2015-03-26 | Quantum Semiconductor Llc | Superlattice materials and applications |
| CN103787264B (zh) * | 2014-01-21 | 2016-06-15 | 华进半导体封装先导技术研发中心有限公司 | 一种应用于高速宽带光互连的硅通孔器件的制造方法及其器件 |
| US9691933B2 (en) | 2014-03-26 | 2017-06-27 | University Of Houston System | Radiation and temperature hard multi-pixel avalanche photodiodes |
| US9874693B2 (en) | 2015-06-10 | 2018-01-23 | The Research Foundation For The State University Of New York | Method and structure for integrating photonics with CMOs |
| WO2017127116A1 (en) * | 2016-01-22 | 2017-07-27 | Hewlett Packard Enterprise Development Lp | Cmos-photonics co-design |
| CN105842782B (zh) * | 2016-05-05 | 2019-04-16 | 湖南大学 | 一种采用石墨烯光电器件的单片光电集成电路 |
| US10403484B2 (en) * | 2017-04-18 | 2019-09-03 | University Of Southern California | Optical modulation of on-chip thermionic emission using resonant cavity coupled electron emitters |
| CN109904181B (zh) * | 2019-02-22 | 2022-09-02 | 上海集成电路研发中心有限公司 | 一种高填充因子的cmos成像传感器及其制作方法 |
| CN111048606B (zh) * | 2019-12-25 | 2021-06-29 | 武汉邮电科学研究院有限公司 | 一种高带宽高响应度的锗硅光电探测器 |
| JP2021150365A (ja) * | 2020-03-17 | 2021-09-27 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| EP3933926A1 (en) | 2020-07-03 | 2022-01-05 | IMEC vzw | Pixelated optoelectronic device |
| CN111682078B (zh) * | 2020-07-24 | 2022-09-30 | 中国科学技术大学 | 一种单行载流子光电探测器及其制作方法 |
| WO2025076496A1 (en) * | 2023-10-06 | 2025-04-10 | Quantum Semiconductor Llc | Optoelectronic, thermoelectric, photonic, materials and devices, fabricated on the back side surface of cmos wafers |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2396419A1 (fr) * | 1977-06-27 | 1979-01-26 | Thomson Csf | Diode capable de fonctionner en emetteur et detecteur de lumiere de la meme longueur d'onde alternativement |
| JPH02275670A (ja) * | 1989-01-18 | 1990-11-09 | Canon Inc | 光電変換装置および画像読取装置 |
| US5631664A (en) * | 1992-09-18 | 1997-05-20 | Olympus Optical Co., Ltd. | Display system utilizing electron emission by polarization reversal of ferroelectric material |
| US5686734A (en) * | 1993-01-22 | 1997-11-11 | Canon Kabushiki Kaisha | Thin film semiconductor device and photoelectric conversion device using the thin film semiconductor device |
| US5937274A (en) * | 1995-01-31 | 1999-08-10 | Hitachi, Ltd. | Fabrication method for AlGaIn NPAsSb based devices |
| US5621227A (en) | 1995-07-18 | 1997-04-15 | Discovery Semiconductors, Inc. | Method and apparatus for monolithic optoelectronic integrated circuit using selective epitaxy |
| EP1055260A1 (en) * | 1998-02-02 | 2000-11-29 | Uniax Corporation | Organic diodes with switchable photosensitivity |
| WO2000021280A1 (en) * | 1998-10-07 | 2000-04-13 | California Institute Of Technology | Silicon-on-insulator (soi) active pixel sensors with the photosites implemented in the substrate |
| AU5405400A (en) * | 1999-06-14 | 2001-01-02 | Carlos J.R.P. Augusto | Stacked wavelength-selective opto-electronic device |
| JP2001135851A (ja) * | 1999-11-05 | 2001-05-18 | Minolta Co Ltd | 光電変換素子および固体撮像装置 |
| ATE507585T1 (de) * | 2000-10-19 | 2011-05-15 | Quantum Semiconductor Llc | Verfahren zur herstellung von mit cmos integrierten heteroübergang-photodioden |
| US6525347B2 (en) * | 2001-03-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Photodetector and unit mounted with photodetector |
| US6847045B2 (en) * | 2001-10-12 | 2005-01-25 | Hewlett-Packard Development Company, L.P. | High-current avalanche-tunneling and injection-tunneling semiconductor-dielectric-metal stable cold emitter, which emulates the negative electron affinity mechanism of emission |
| US6720588B2 (en) * | 2001-11-28 | 2004-04-13 | Optonics, Inc. | Avalanche photodiode for photon counting applications and method thereof |
| KR100462164B1 (ko) * | 2002-01-11 | 2004-12-17 | 매그나칩 반도체 유한회사 | 필팩터를 향상시킨 씨모스 이미지센서 |
| EP1472739A1 (en) * | 2002-02-08 | 2004-11-03 | Qinetiq Limited | Photodetector circuit |
| WO2004027879A2 (en) * | 2002-09-19 | 2004-04-01 | Quantum Semiconductor Llc | Light-sensing device |
| US6642076B1 (en) * | 2002-10-22 | 2003-11-04 | Taiwan Semiconductor Manufacturing Company | Asymmetrical reset transistor with double-diffused source for CMOS image sensor |
| US7019383B2 (en) * | 2003-02-26 | 2006-03-28 | Skyworks Solutions, Inc. | Gallium arsenide HBT having increased performance and method for its fabrication |
| US8039882B2 (en) * | 2003-08-22 | 2011-10-18 | Micron Technology, Inc. | High gain, low noise photodiode for image sensors and method of formation |
| US7160753B2 (en) * | 2004-03-16 | 2007-01-09 | Voxtel, Inc. | Silicon-on-insulator active pixel sensors |
-
2005
- 2005-07-28 US US11/572,519 patent/US8963169B2/en active Active
- 2005-07-28 CN CN2005800251009A patent/CN101002326B/zh not_active Expired - Fee Related
- 2005-07-28 JP JP2007523020A patent/JP5069559B2/ja not_active Expired - Fee Related
- 2005-07-28 EP EP05768673A patent/EP1782481A1/en not_active Withdrawn
- 2005-07-28 WO PCT/EP2005/008213 patent/WO2006010618A1/en not_active Ceased
-
2014
- 2014-12-17 US US14/572,989 patent/US11043529B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5069559B2 (ja) | Cmosをモノリシックに集積した光素子 | |
| JP2008508702A5 (enExample) | ||
| US20250248092A1 (en) | Superlattice materials and applications | |
| US6943051B2 (en) | Method of fabricating heterojunction photodiodes integrated with CMOS | |
| EP1540733B1 (en) | Light-sensing device | |
| US8816443B2 (en) | Method of fabricating heterojunction photodiodes with CMOS | |
| US20080070340A1 (en) | Image sensor using thin-film SOI | |
| US20100230729A1 (en) | Pixel sensor cell including light shield | |
| US20110210382A1 (en) | Digital radiographic flat-panel imaging array with dual height semiconductor and method of making same | |
| US20150115321A1 (en) | Substrate structure, complementary metal oxide semiconductor device, and method of manufacturing complementary metal oxide semiconductor device | |
| US7265006B2 (en) | Method of fabricating heterojunction devices integrated with CMOS | |
| TW201103132A (en) | Solid-state image device, method for producing the same, and image pickup apparatus | |
| US20060014334A1 (en) | Method of fabricating heterojunction devices integrated with CMOS | |
| Augusto et al. | A new CMOS SiGeC avalanche photo-diode pixel for IR sensing |