JP2008505355A5 - - Google Patents
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- Publication number
- JP2008505355A5 JP2008505355A5 JP2007519200A JP2007519200A JP2008505355A5 JP 2008505355 A5 JP2008505355 A5 JP 2008505355A5 JP 2007519200 A JP2007519200 A JP 2007519200A JP 2007519200 A JP2007519200 A JP 2007519200A JP 2008505355 A5 JP2008505355 A5 JP 2008505355A5
- Authority
- JP
- Japan
- Prior art keywords
- alignment mechanism
- waveguide
- pattern
- mechanism pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 238000005253 cladding Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 230000003287 optical Effects 0.000 claims 2
Claims (3)
- 光学デバイスのための一体型整列機構を有する導波路を形成するための方法であって、以下の順序で
基板上に整列機構パターンを設ける工程と、
導波路を前記整列機構パターンの上に作製する工程と、
前記導波路の一部を除去して、前記整列機構パターンと前記基板を露わにする工程と、
前記光学デバイス整列機構を、前記露わになった基板に形成する工程と
を含む方法。 - 導波路を作製する工程が、
下部クラッディング層を前記整列機構パターンの上に堆積させる工程と、
導波路コア層を前記下部クラッディング層の上に堆積させる工程と
を含む、請求項1に記載の方法。 - 前記導波路の一部を除去して、前記整列機構パターンを露わにする工程が、整列機構パターンを前記導波路に形成する工程を含む、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/879,716 US20050284181A1 (en) | 2004-06-29 | 2004-06-29 | Method for making an optical waveguide assembly with integral alignment features |
PCT/US2005/014609 WO2006007022A1 (en) | 2004-06-29 | 2005-04-28 | Method for making an optical waveguide assembly with integral alignment features |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008505355A JP2008505355A (ja) | 2008-02-21 |
JP2008505355A5 true JP2008505355A5 (ja) | 2008-06-19 |
Family
ID=34971934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007519200A Pending JP2008505355A (ja) | 2004-06-29 | 2005-04-28 | 一体型整列機構を有する光導波路アセンブリを製造するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050284181A1 (ja) |
EP (1) | EP1761812A1 (ja) |
JP (1) | JP2008505355A (ja) |
KR (1) | KR20070045204A (ja) |
CN (1) | CN1977198A (ja) |
WO (1) | WO2006007022A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7365321B2 (en) * | 2004-03-22 | 2008-04-29 | Kla-Tencor Technologies Corp. | Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis |
KR20090130153A (ko) * | 2004-06-16 | 2009-12-17 | 히다치 가세고교 가부시끼가이샤 | 광도파로구조체, 광도파로형 광모듈 및 광파이버 어레이 |
US8447157B2 (en) * | 2005-06-24 | 2013-05-21 | 3M Innovative Properties Company | Optical device with cantilevered fiber array and method |
US7491287B2 (en) * | 2006-06-09 | 2009-02-17 | 3M Innovative Properties Company | Bonding method with flowable adhesive composition |
JP5156502B2 (ja) * | 2007-06-26 | 2013-03-06 | パナソニック株式会社 | 光モジュール |
US7822300B2 (en) * | 2007-11-20 | 2010-10-26 | Aptina Imaging Corporation | Anti-resonant reflecting optical waveguide for imager light pipe |
CN101910899A (zh) * | 2007-11-30 | 2010-12-08 | 3M创新有限公司 | 用于制备光学导波器的方法 |
CH700471B1 (de) * | 2009-02-17 | 2013-07-31 | Vario Optics Ag | Verfahren zur Herstellung einer elektro-optischen Leiterplatte mit Lichtwellenleiterstrukturen. |
US12057332B2 (en) | 2016-07-12 | 2024-08-06 | Ayar Labs, Inc. | Wafer-level etching methods for planar photonics circuits and devices |
CN107655923B (zh) * | 2017-10-13 | 2019-05-03 | 电子科技大学 | 一种实现输出方向大角度可调的太赫兹波传输聚束系统 |
US11101617B2 (en) | 2018-07-16 | 2021-08-24 | Ayar Labs, Inc. | Wafer-level handle replacement |
EP3983840A4 (en) * | 2019-06-17 | 2023-03-15 | Aayuna Inc. | PASSIVELY ALIGNED FIBER ARRAY TO WAVEGUIDE CONFIGURATION |
US11774689B2 (en) | 2021-10-25 | 2023-10-03 | Globalfoundries U.S. Inc. | Photonics chips and semiconductor products having angled optical fibers |
CN117561464A (zh) * | 2021-11-22 | 2024-02-13 | 华为技术有限公司 | 一种芯片、光纤阵列单元及通信系统 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3765969A (en) * | 1970-07-13 | 1973-10-16 | Bell Telephone Labor Inc | Precision etching of semiconductors |
US3774987A (en) * | 1972-06-27 | 1973-11-27 | Bell Electric Research Ltd | Coupling of lasers to optical fibres |
US3994559A (en) * | 1975-12-22 | 1976-11-30 | International Business Machines Corporation | Bidirectional guided mode optical film-fiber coupler |
US4210923A (en) * | 1979-01-02 | 1980-07-01 | Bell Telephone Laboratories, Incorporated | Edge illuminated photodetector with optical fiber alignment |
JPS5784408A (en) * | 1980-11-13 | 1982-05-26 | Nec Corp | Optical distributing circuit |
US5046763A (en) * | 1990-02-01 | 1991-09-10 | Teleflex Incorporated | Quick connect hose coupling assembly |
JPH04313710A (ja) * | 1990-03-14 | 1992-11-05 | Fujitsu Ltd | 光導波路部品の製造方法 |
FR2661516B1 (fr) * | 1990-04-27 | 1992-06-12 | Alcatel Fibres Optiques | Composant d'optique integree et procede de fabrication. |
US5175781A (en) * | 1991-10-11 | 1992-12-29 | United Technologies Corporation | Attaching optical fibers to integrated optic chips |
US5217568A (en) * | 1992-02-03 | 1993-06-08 | Motorola, Inc. | Silicon etching process using polymeric mask, for example, to form V-groove for an optical fiber coupling |
DE59306756D1 (de) * | 1992-03-07 | 1997-07-24 | Minnesota Mining & Mfg | Verfahren zum Herstellen von Bauelementen für Lichtwellenleiternetze und nach diesem Verfahren hergestellte Bauelemente |
JP3484543B2 (ja) * | 1993-03-24 | 2004-01-06 | 富士通株式会社 | 光結合部材の製造方法及び光装置 |
JP2798583B2 (ja) * | 1993-06-08 | 1998-09-17 | 日本電気株式会社 | 光デバイスの製造方法 |
EP0631159A1 (de) * | 1993-06-18 | 1994-12-28 | Siemens Aktiengesellschaft | Anordnung zur optischen Kopplung eines planaren optischen Wellenleiters und einer optischen Faser und Verfahren zur Herstellung eines für eine solche Anordnung geeigneten planaren Wellenleiters |
US5357593A (en) * | 1993-10-12 | 1994-10-18 | Alliedsignal Inc. | Method of attaching optical fibers to opto-electronic integrated circuits on silicon substrates |
US5432338A (en) * | 1993-10-28 | 1995-07-11 | Alliedsignal Inc. | Silicon opto-electronic integrated circuit for fiber optic gyros or communication |
JPH0829638A (ja) * | 1994-05-12 | 1996-02-02 | Fujitsu Ltd | 光導波路・光ファイバ接続構造及び光導波路・光ファイバ接続方法並びに光導波路・光ファイバ接続に使用される光導波路基板及び同基板の製造方法並びに光導波路・光ファイバ接続に使用されるファイバ基板付き光ファイバ |
US5611014A (en) * | 1994-12-07 | 1997-03-11 | Lucent Technologies Inc. | Optoelectronic device connecting techniques |
JP2964941B2 (ja) * | 1996-01-12 | 1999-10-18 | 日本電気株式会社 | 光デバイスの製造方法及び実装構造 |
US5600745A (en) * | 1996-02-08 | 1997-02-04 | Industrial Technology Research Institute | Method of automatically coupling between a fiber and an optical waveguide |
KR100265789B1 (ko) * | 1997-07-03 | 2000-09-15 | 윤종용 | 광섬유수동정렬방법 |
US6756185B2 (en) * | 2000-05-09 | 2004-06-29 | Shipley Company, L.L.C. | Method for making integrated optical waveguides and micromachined features |
US20030035643A1 (en) * | 2001-08-17 | 2003-02-20 | Photon-X, Inc. | Structure for attaching an optical fiber to a planar waveguide and method thereof |
-
2004
- 2004-06-29 US US10/879,716 patent/US20050284181A1/en not_active Abandoned
-
2005
- 2005-04-28 WO PCT/US2005/014609 patent/WO2006007022A1/en active Application Filing
- 2005-04-28 CN CNA200580021993XA patent/CN1977198A/zh active Pending
- 2005-04-28 KR KR1020077002014A patent/KR20070045204A/ko not_active Application Discontinuation
- 2005-04-28 JP JP2007519200A patent/JP2008505355A/ja active Pending
- 2005-04-28 EP EP05757393A patent/EP1761812A1/en not_active Withdrawn
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