JP2008308572A5 - - Google Patents
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- Publication number
- JP2008308572A5 JP2008308572A5 JP2007157107A JP2007157107A JP2008308572A5 JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5 JP 2007157107 A JP2007157107 A JP 2007157107A JP 2007157107 A JP2007157107 A JP 2007157107A JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- repeating unit
- unit represented
- mass
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007157107A JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007157107A JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008308572A JP2008308572A (ja) | 2008-12-25 |
| JP2008308572A5 true JP2008308572A5 (ru) | 2010-07-29 |
| JP5115045B2 JP5115045B2 (ja) | 2013-01-09 |
Family
ID=40236465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007157107A Expired - Fee Related JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5115045B2 (ru) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102276783B1 (ko) * | 2013-06-26 | 2021-07-14 | 닛산 가가쿠 가부시키가이샤 | 치환된 가교성 화합물을 포함하는 레지스트 하층막 형성 조성물 |
| WO2016171179A1 (ja) * | 2015-04-24 | 2016-10-27 | 東レ株式会社 | 樹脂組成物、それを用いた半導体素子の製造方法および半導体装置 |
| JP7097803B2 (ja) * | 2018-12-20 | 2022-07-08 | 信越ポリマー株式会社 | 導電性高分子含有液及びその製造方法、並びに導電性フィルム及びその製造方法 |
| CN115826360B (zh) * | 2022-12-23 | 2023-09-12 | 江苏艾森半导体材料股份有限公司 | 感光性聚酰亚胺组合物、图形的制造方法、固化物和电子部件 |
| CN115947648A (zh) * | 2022-12-28 | 2023-04-11 | 北京彤程创展科技有限公司 | 一种交联剂及其制备方法、光刻胶 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003252991A (ja) * | 2002-02-28 | 2003-09-10 | Dow Corning Toray Silicone Co Ltd | アクリルもしくはメタクリル官能性シリコーン変性ポリイミド樹脂、その製造方法および感光性樹脂組成物 |
| JP4374840B2 (ja) * | 2002-08-30 | 2009-12-02 | 東レ株式会社 | ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置 |
| JP4834949B2 (ja) * | 2003-07-24 | 2011-12-14 | 東レ株式会社 | 熱硬化性樹脂組成物およびそれを用いた電子部品 |
| JP4677887B2 (ja) * | 2004-11-24 | 2011-04-27 | 東レ株式会社 | 感光性樹脂組成物 |
| JP4826415B2 (ja) * | 2005-10-12 | 2011-11-30 | 東レ株式会社 | 感光性樹脂組成物 |
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2007
- 2007-06-14 JP JP2007157107A patent/JP5115045B2/ja not_active Expired - Fee Related