JP2008308513A - 接着剤組成物 - Google Patents
接着剤組成物 Download PDFInfo
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- JP2008308513A JP2008308513A JP2007154966A JP2007154966A JP2008308513A JP 2008308513 A JP2008308513 A JP 2008308513A JP 2007154966 A JP2007154966 A JP 2007154966A JP 2007154966 A JP2007154966 A JP 2007154966A JP 2008308513 A JP2008308513 A JP 2008308513A
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
- C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C09J175/06—Polyurethanes from polyesters
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
イソシアノエチルメタクリレート10質量部にメタノール100質量部を添加し、60℃で10時間撹拌することにより、N−(メタクロイルオキシエチル)カルバミン酸メチルエステルのメタノール溶液を得た。含有されているN−(メタクロイルオキシエチル)カルバミン酸メチルエステル10質量部となる量のそのメタノール溶液に、フェノキシ樹脂(YP50、東都化成社)40質量部、ジアクリレート(ライトエステル3EG、共栄社化学社)40質量部、ポリエステル系ポリウレタン(ニッポラン3113、日本ポリウレタン工業社)10質量及び過酸化ベンゾイル(日本油脂社)3質量部と、樹脂固形分が50質量%となるような量の酢酸エチルとトルエンとの混合溶媒(1:1(容量比))とを均一に混合し、接着剤組成物を得た。
メタノール100質量部に代えてエタノール100質量部を使用する以外は、実施例1と同様の操作を繰り返すことにより、N−(メタクロイルオキシエチル)カルバミン酸エチルエステルのエタノール溶液を調製し、更に接着剤組成物を得た。
メタノール100質量部に代えてエトキシエタノール100質量部を使用する以外は、実施例1と同様の操作を繰り返すことにより、N−(メタクロイルオキシエチル)カルバミン酸エトキシエチルエステルのエトキシエタノール溶液を調製し、更に接着剤組成物を得た。
メタノール100質量部に代えてブタノール100質量部を使用する以外は、実施例1と同様の操作を繰り返すことにより、N−(メタクロイルオキシエチル)カルバミン酸ブチルエステルのブタノール溶液を調製し、更に接着剤組成物を得た。
メタノール100質量部に代えてヘキサノール100質量部を使用する以外は、実施例1と同様の操作を繰り返すことにより、N−(メタクロイルオキシエチル)カルバミン酸ヘキシルエステルのヘキサノール溶液を調製し、更に接着剤組成物を得た。
メタノール100質量部に代えてフェノール100質量部を使用する以外は、実施例1と同様の操作を繰り返すことにより、N−(メタクロイルオキシエチル)カルバミン酸フェニルエステルのフェノール溶液を調製し、更に接着剤組成物を得た。
2官能ウレタンアクリレート(U−ZPPA、新中村化学社)10質量部を、フェノキシ樹脂(YP50、東都化成社)40質量部、ジアクリレート(ライトエステル3EG、共栄社化学社)40質量部、ポリエステル系ポリウレタン(ニッポラン3113、日本ポリウレタン工業社)10質量及び過酸化ベンゾイル(日本油脂社)3質量部と、樹脂固形分が50質量%となるような量の酢酸エチルとトルエンとの混合溶媒(1:1(容量比))とを均一に混合し、接着剤組成物を得た。
フェノキシ樹脂(YP50、東都化成社)40質量部、ジアクリレート(ライトエステル3EG、共栄社化学社)40質量部、ポリエステル系ポリウレタン(ニッポラン3113、日本ポリウレタン工業社)10質量及び過酸化ベンゾイル(日本油脂社)3質量部と、樹脂固形分が50質量%となるような量の酢酸エチルとトルエンとの混合溶媒(1:1(容量比))とを均一に混合し、接着剤組成物を得た。
実施例及び比較例の接着剤組成物を、厚さ50μmの剥離処理したポリエチレンテレフタレートフィルムに、乾燥厚が50μmとなるように塗布し、80℃のオーブン中で5分間乾燥させ、接着フィルムを作成した。得られた接着フィルムを用いて、以下に説明するように接着強度を測定した。
0.7mm厚のガラス基板にITO膜を成膜したITOガラス基板と、50μmピッチ(銅配線幅25μm、銅配線厚8μm)のポリイミドフレキシブル配線基板(テープ幅40mm)とを用意し、それぞれの配線の電極を対向させ、その間に接着フィルムを挟持させ、160℃で4Mpaで4秒間という条件で熱圧着した。熱圧着後、ポリイミドフレキシブル配線基板に10mm幅で接着フィルムまで切り込みを入れ、引張試験装置(テンシロン、オリエンテック社)で50mm/minの速度で90度剥離を行った。その際に得られて接着強度値を表1に示す。なお、実用上、接着強度は5N/cm以上であることが望まれる。
Claims (9)
- 該単官能ウレタンアクリレートを樹脂固形分中に2〜20質量%含有する請求項1記載の接着剤組成物。
- R1が、アルキレン基である請求項1又は2記載の接着剤組成物。
- アルキレン基が、エチレン基である請求項3記載の接着剤組成物。
- R2が、メチル基、エチル基、エトキシエチル基、ブチル基又はヘキシル基である請求項1〜3のいずれかに記載の接着剤組成物。
- R2が、メチル基又はエチル基である請求項5記載の接着剤組成物。
- 異方性導電接続用導電粒子を含有する請求項1〜6のいずれかに記載の接着剤組成物。
- 相対向する電極が、その間に挟持された請求項7記載の接着剤組成物を介して電気的に接続されてなる接続構造体。
- 相対向する電極の一方が、半導体素子の電極パッドである請求項8記載の接続構造体。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007154966A JP5135564B2 (ja) | 2007-06-12 | 2007-06-12 | 接着剤組成物 |
US12/312,000 US8221880B2 (en) | 2007-06-12 | 2008-06-09 | Adhesive composition |
CN2008800196096A CN101679811B (zh) | 2007-06-12 | 2008-06-09 | 粘结剂组合物 |
PCT/JP2008/060525 WO2008152998A1 (ja) | 2007-06-12 | 2008-06-09 | 接着剤組成物 |
KR1020097013369A KR101098204B1 (ko) | 2007-06-12 | 2008-06-09 | 접착제 조성물 |
TW97121635A TWI414576B (zh) | 2007-06-12 | 2008-06-11 | Adhesive composition |
HK10105174A HK1139170A1 (en) | 2007-06-12 | 2010-05-26 | Adhesive composition |
US13/137,141 US8319222B2 (en) | 2007-06-12 | 2011-07-22 | Adhesive composition |
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JP2015140409A (ja) * | 2014-01-29 | 2015-08-03 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
JP2017141337A (ja) * | 2016-02-09 | 2017-08-17 | 日華化学株式会社 | 粘着剤組成物、粘着剤及び粘着材 |
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JP6417675B2 (ja) * | 2014-03-03 | 2018-11-07 | 日立化成株式会社 | 接着剤組成物及び接続体 |
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JP6583991B2 (ja) * | 2015-05-18 | 2019-10-02 | 藤森工業株式会社 | 接着性樹脂層及び接着性樹脂フィルム |
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JP2018184607A (ja) * | 2018-06-27 | 2018-11-22 | 日立化成株式会社 | 接着剤組成物及び接続体 |
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WO2023054500A1 (ja) * | 2021-09-30 | 2023-04-06 | 東亞合成株式会社 | 医療用コーティング剤及び医療機器 |
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JP5135564B2 (ja) | 2013-02-06 |
US8319222B2 (en) | 2012-11-27 |
CN101679811B (zh) | 2012-09-05 |
KR20090099062A (ko) | 2009-09-21 |
US20110281119A1 (en) | 2011-11-17 |
TW200904929A (en) | 2009-02-01 |
HK1139170A1 (en) | 2010-09-10 |
CN101679811A (zh) | 2010-03-24 |
US20090280332A1 (en) | 2009-11-12 |
TWI414576B (zh) | 2013-11-11 |
WO2008152998A1 (ja) | 2008-12-18 |
US8221880B2 (en) | 2012-07-17 |
KR101098204B1 (ko) | 2011-12-23 |
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