JP2008306037A5 - - Google Patents

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Publication number
JP2008306037A5
JP2008306037A5 JP2007152604A JP2007152604A JP2008306037A5 JP 2008306037 A5 JP2008306037 A5 JP 2008306037A5 JP 2007152604 A JP2007152604 A JP 2007152604A JP 2007152604 A JP2007152604 A JP 2007152604A JP 2008306037 A5 JP2008306037 A5 JP 2008306037A5
Authority
JP
Japan
Prior art keywords
interposer
semiconductor chip
terminal
region
passive component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007152604A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008306037A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007152604A priority Critical patent/JP2008306037A/ja
Priority claimed from JP2007152604A external-priority patent/JP2008306037A/ja
Publication of JP2008306037A publication Critical patent/JP2008306037A/ja
Publication of JP2008306037A5 publication Critical patent/JP2008306037A5/ja
Withdrawn legal-status Critical Current

Links

JP2007152604A 2007-06-08 2007-06-08 半導体モジュール及びその製造方法 Withdrawn JP2008306037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007152604A JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152604A JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008306037A JP2008306037A (ja) 2008-12-18
JP2008306037A5 true JP2008306037A5 (enExample) 2010-07-22

Family

ID=40234466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007152604A Withdrawn JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Country Status (1)

Country Link
JP (1) JP2008306037A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230152450A (ko) * 2022-04-27 2023-11-03 삼성전자주식회사 반도체 패키지 및 이를 포함하는 전자 장치

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