JP2008306037A - 半導体モジュール及びその製造方法 - Google Patents

半導体モジュール及びその製造方法 Download PDF

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Publication number
JP2008306037A
JP2008306037A JP2007152604A JP2007152604A JP2008306037A JP 2008306037 A JP2008306037 A JP 2008306037A JP 2007152604 A JP2007152604 A JP 2007152604A JP 2007152604 A JP2007152604 A JP 2007152604A JP 2008306037 A JP2008306037 A JP 2008306037A
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Japan
Prior art keywords
interposer
semiconductor chip
terminal
region
passive component
Prior art date
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Withdrawn
Application number
JP2007152604A
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English (en)
Japanese (ja)
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JP2008306037A5 (https=
Inventor
Yoshihide Nishiyama
佳秀 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007152604A priority Critical patent/JP2008306037A/ja
Publication of JP2008306037A publication Critical patent/JP2008306037A/ja
Publication of JP2008306037A5 publication Critical patent/JP2008306037A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007152604A 2007-06-08 2007-06-08 半導体モジュール及びその製造方法 Withdrawn JP2008306037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007152604A JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152604A JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008306037A true JP2008306037A (ja) 2008-12-18
JP2008306037A5 JP2008306037A5 (https=) 2010-07-22

Family

ID=40234466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007152604A Withdrawn JP2008306037A (ja) 2007-06-08 2007-06-08 半導体モジュール及びその製造方法

Country Status (1)

Country Link
JP (1) JP2008306037A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023163141A (ja) * 2022-04-27 2023-11-09 三星電子株式会社 半導体パッケージ及びそれを含む電子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023163141A (ja) * 2022-04-27 2023-11-09 三星電子株式会社 半導体パッケージ及びそれを含む電子装置
JP7816265B2 (ja) 2022-04-27 2026-02-18 三星電子株式会社 半導体パッケージ及びそれを含む電子装置

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