JP2008306037A5 - - Google Patents
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- Publication number
- JP2008306037A5 JP2008306037A5 JP2007152604A JP2007152604A JP2008306037A5 JP 2008306037 A5 JP2008306037 A5 JP 2008306037A5 JP 2007152604 A JP2007152604 A JP 2007152604A JP 2007152604 A JP2007152604 A JP 2007152604A JP 2008306037 A5 JP2008306037 A5 JP 2008306037A5
- Authority
- JP
- Japan
- Prior art keywords
- interposer
- semiconductor chip
- terminal
- region
- passive component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007152604A JP2008306037A (ja) | 2007-06-08 | 2007-06-08 | 半導体モジュール及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007152604A JP2008306037A (ja) | 2007-06-08 | 2007-06-08 | 半導体モジュール及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008306037A JP2008306037A (ja) | 2008-12-18 |
| JP2008306037A5 true JP2008306037A5 (https=) | 2010-07-22 |
Family
ID=40234466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007152604A Withdrawn JP2008306037A (ja) | 2007-06-08 | 2007-06-08 | 半導体モジュール及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008306037A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230152450A (ko) * | 2022-04-27 | 2023-11-03 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 전자 장치 |
-
2007
- 2007-06-08 JP JP2007152604A patent/JP2008306037A/ja not_active Withdrawn
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