JP2008291161A5 - - Google Patents
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- Publication number
- JP2008291161A5 JP2008291161A5 JP2007139979A JP2007139979A JP2008291161A5 JP 2008291161 A5 JP2008291161 A5 JP 2008291161A5 JP 2007139979 A JP2007139979 A JP 2007139979A JP 2007139979 A JP2007139979 A JP 2007139979A JP 2008291161 A5 JP2008291161 A5 JP 2008291161A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- dispersion solvent
- resin
- particle size
- insulating particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000002904 solvent Substances 0.000 claims description 19
- 239000006185 dispersion Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000004840 adhesive resin Substances 0.000 claims description 4
- 229920006223 adhesive resin Polymers 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- 125000005641 methacryl group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007139979A JP2008291161A (ja) | 2007-05-28 | 2007-05-28 | 接着剤の製造方法、電気部品の接続方法 |
| PCT/JP2008/059382 WO2008146688A1 (ja) | 2007-05-28 | 2008-05-21 | 接着剤の製造方法、電子部品の接続方法及び接合体 |
| TW097119584A TW200902607A (en) | 2007-05-28 | 2008-05-27 | Method of producing adhesive, method of connecting electronic component, and connected structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007139979A JP2008291161A (ja) | 2007-05-28 | 2007-05-28 | 接着剤の製造方法、電気部品の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008291161A JP2008291161A (ja) | 2008-12-04 |
| JP2008291161A5 true JP2008291161A5 (enrdf_load_stackoverflow) | 2011-12-08 |
Family
ID=40074943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007139979A Pending JP2008291161A (ja) | 2007-05-28 | 2007-05-28 | 接着剤の製造方法、電気部品の接続方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008291161A (enrdf_load_stackoverflow) |
| TW (1) | TW200902607A (enrdf_load_stackoverflow) |
| WO (1) | WO2008146688A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5841371B2 (ja) * | 2011-07-29 | 2016-01-13 | 藤森工業株式会社 | 接着フィルム |
| WO2023276792A1 (ja) * | 2021-07-01 | 2023-01-05 | 日東電工株式会社 | 接合シートおよび電子部品の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2895872B2 (ja) * | 1989-09-26 | 1999-05-24 | 触媒化成工業株式会社 | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
| JP4344966B2 (ja) * | 1999-08-25 | 2009-10-14 | 日立化成工業株式会社 | 配線板とその製造方法 |
| JP2005071817A (ja) * | 2003-08-25 | 2005-03-17 | Asahi Kasei Electronics Co Ltd | 異方導電性フィルム |
| JP4380327B2 (ja) * | 2004-01-07 | 2009-12-09 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP2007287654A (ja) * | 2006-03-23 | 2007-11-01 | Alps Electric Co Ltd | 接続装置 |
| JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
-
2007
- 2007-05-28 JP JP2007139979A patent/JP2008291161A/ja active Pending
-
2008
- 2008-05-21 WO PCT/JP2008/059382 patent/WO2008146688A1/ja active Application Filing
- 2008-05-27 TW TW097119584A patent/TW200902607A/zh unknown
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