CN106782758B - 导电粒子及其制造方法和各向异性导电胶 - Google Patents

导电粒子及其制造方法和各向异性导电胶 Download PDF

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Publication number
CN106782758B
CN106782758B CN201710006930.1A CN201710006930A CN106782758B CN 106782758 B CN106782758 B CN 106782758B CN 201710006930 A CN201710006930 A CN 201710006930A CN 106782758 B CN106782758 B CN 106782758B
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resin layer
conducting particles
inner core
layer
rigid inner
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CN201710006930.1A
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CN106782758A (zh
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倪欢
吕凤珍
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority to US15/697,631 priority patent/US10508225B2/en
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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Abstract

本发明公开了一种导电粒子及其制造方法和各向异性导电胶，属于导电胶领域。所述导电粒子包括：刚性内核；所述刚性内核外部包裹有树脂层；所述树脂层外部包裹有导电层。本发明通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。

Description

导电粒子及其制造方法和各向异性导电胶
技术领域
本发明涉及导电胶领域，特别涉及一种导电粒子及其制造方法和各向异性导电胶。
背景技术
各向异性导电胶(英文：Anisotropic Conductive Adhesive；简称：ACA)是一种在一个方向上导电，而在其他方向上电阻很大或几乎不导电的导电胶。各向异性导电胶被广泛应用在显示面板的制造领域，示例性的，各向异性导电胶可以用于粘接阵列基板和彩膜基板或者粘接管脚。
相关技术中有一种各向异性导电胶，该各向异性导电胶中包括粘合剂和分散在粘合剂中的导电粒子，该导电粒子包括树脂球以及形成树脂球外部的导电层。在通过各向异性导电胶粘接第一粘接面和第二粘接面时，首先可以在第一粘接面上涂敷该各向异性导电胶，然后将第二粘接面压在各向异性导电胶上，并施加压力与热量，这样各向异性导电胶中散布的导电粒子就会在垂直于第一粘接面的方向上的压力作用下接触，从而使两个粘接面在垂直于第一粘接面的方向上导通，而其他方向上电阻很大或几乎不导电。
在实现本发明的过程中，发明人发现相关技术至少存在以下问题：对相关技术中的各向异性导电胶施加的压力过小时，由于导电粒子之间接触不够紧密，两个粘接面之间的电阻会较大，而施加的压力过大时，大量的导电粒子会被压坏，从而造成断路，因此，施加在各向异性导电胶上的压力的精度要求较高。
发明内容
为了解决相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题，本发明实施例提供了一种导电粒子及其制造方法和各向异性导电胶。所述技术方案如下：
根据本发明实施例的第一方面，提供了一种导电粒子，所述导电粒子包括：
刚性内核；
所述刚性内核外部包裹有树脂层；
所述树脂层外部包裹有导电层。
可选的，所述树脂层和所述导电层之间还设置有热缩树脂层。
可选的，所述热缩树脂层的材料包括聚乙烯和聚乙烯醇中的至少一种。
可选的，所述导电层包括由内向外依次设置的第一导电层和第二导电层。
可选的，所述第一导电层为镍层，所述第二导电层为金层。
可选的，所述第二导电层外部还包裹有抗氧化膜。
可选的，所述刚性内核由无机复合材料构成。
可选的，所述无机复合材料包括碳酸钙、二氧化硅和硼酸锌中的至少一种。
根据本发明实施例的第二方面，提供一种导电粒子的制造方法，所述方法包括：
获取刚性内核；
在所述刚性内核外部形成包裹所述刚性内核的树脂层；
在所述树脂层的外部形成包裹所述树脂层的导电层。
可选的，所述在所述刚性内核外部形成包裹所述刚性内核的树脂层之后，所述方法还包括：
在所述树脂层的外部形成包裹所述树脂层的热缩树脂层；
所述在所述树脂层的外部形成包裹所述树脂层的导电层，包括：
在所述热缩树脂层的外部形成包裹所述热缩树脂层的所述导电层。
可选的，所述在所述树脂层的外部形成包裹所述树脂层的热缩树脂层，包括：
通过接枝或包覆的方式在所述树脂层的外部形成包裹所述树脂层的所述热缩树脂层。
可选的，所述刚性内核由无机复合材料构成，所述获取刚性内核，包括：
通过原位聚合法、溶胶凝胶法或共混法制造所述无机复合材料构成的所述刚性内核。
根据本发明的第三方面，提供一种各向异性导电胶，所述各向异性导电胶包括粘合剂和所述粘合剂中散布的导电粒子，所述导电粒子包括：刚性内核，所述刚性内核外部包裹有树脂层，所述树脂层外部包裹有导电层。
可选的，所述树脂层和所述导电层之间还设置有热缩树脂层。
本发明实施例提供的技术方案带来的有益效果是：
通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例示出的一种导电粒子的结构示意图；
图2-1是本发明实施例示出的另一种导电粒子的结构示意图；
图2-2是相关技术中各向异性导电胶的电阻与压缩率的关系示意图；
图3是本发明实施例提供的一种导电粒子的制造方法的流程图；
图4-1是本发明实施例提供的一种导电粒子的制造方法的流程图；
图4-2是图4-1所示实施例中形成热缩树脂层的流程图；
图4-3是图4-1所示实施例中形成导电层的流程图；
图5-1是本发明实施例提供的一种各向异性导电胶的结构示意图；
图5-2是图5-1所示实施例中各向异性导电胶的使用方法流程图；
图5-3是图5-2所示方法流程中一种结构示意图；
图5-4是图5-2所示方法流程中另一种结构示意图；
图5-5是图5-2所示方法流程中另一种结构示意图。
通过上述附图，已示出本发明明确的实施例，后文中将有更详细的描述。这些附图和文字描述并不是为了通过任何方式限制本发明构思的范围，而是通过参考特定实施例为本领域技术人员说明本发明的概念。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
图1是本发明实施例示出的一种导电粒子的结构示意图。该导电粒子可以包括：
刚性内核11。
刚性内核11外部包裹有树脂层12。
树脂层12外部包裹有导电层13。
综上所述，本发明实施例提供的导电粒子，通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
进一步的，请参考图2-1，其示出了本发明实施例提供的另一种导电粒子的结构示意图，该导电粒子在图1所示的导电粒子的基础上增加了更优选的部件，从而使得本发明实施例提供的导电粒子具有更好的性能。
可选的，树脂层12和导电层13之间还设置有热缩树脂层14。例如：热缩树脂层14的材料包括聚乙烯(英文：polyethylene；简称：PE)和聚乙烯醇(英文：polyvinyl alcohol；简称：PVA)中的至少一种。热缩树脂层14在受热后会收缩，并向热缩树脂层内的树脂12层施加压力，这样就能够降低导电粒子制成的各向异性导电胶对于压力下限的要求(因为热缩树脂层已经对内部施加了一定的压力)，使施加在各向异性导电胶上的压力更容易达到该压力下限，进而降低对各向异性导电胶施加压力的精度要求。
各向异性导电胶的电阻与对各向异性导电胶施加压力后各向异性导电胶的压缩率在一定程度下是正相关的。如图2-2所示，其为相关技术中各向异性导电胶的电阻与各向异性导电胶的压缩率(该压缩率为压缩后缩小的体积与压缩前的体积的比值，示例性的，压缩前体积为1立方米，压缩后缩小为0.8立方米，缩小了0.2立方米，压缩率就为20％)的关系示意图，其中，横轴为压缩率，纵轴为电阻(单位为欧姆)，压缩率在30％-50％之间是一个较为合适的压缩率，压缩率小于30％时电阻过大，压缩率大于50％时，各向异性导电胶中的导电粒子可能会被压碎，导电粒子弹性消失，当由该导电粒子制成的各向异性导电胶在高温环境下工作时，各向异性导电胶膨胀造成两个粘接面之间的距离增大，两个粘接面之间会出现断路。而对应于压缩率，在通过各向异性导电胶粘连两个粘接面时，施加给各向异性导电胶的压力也对应有一个范围，示例性的，该范围为大于等于m牛顿小于等于n牛顿(其中m小于n)，本发明实施例提供的导电粒子，通过给树脂层外设置热缩树脂，使得热缩树脂在受热(向各向异性导电胶施加压力的同时也会进行加热)后会收缩，进而可以使向各向异性导电胶施加的压力更容易到达m牛顿。类似的，在树脂层内部设置刚性内核可以增大导电粒子能够承受的压力的上限，进而各向异性导电胶所能承受的压力的上限也会增大，即增大了n的数值，这样就增加了向各向异性导电胶施加压力时的压力的范围，降低了对各向异性导电胶施加压力的精度要求。
在图2-1中，导电层13包括由内向外依次设置的第一导电层131和第二导电层132。两层导电层能够确保一层导电层损坏后，导电粒子仍能够通过另一层导电层导电。
可选的，第一导电层131为镍(Ni)层，第二导电层132为金(Au)层。
可选的，第二导电层132外部还包裹有抗氧化膜15。抗氧化膜15用于在各向异性导电胶不使用时保护金层，而在各向异性导电胶受压后，该抗氧化膜15会破裂，不影响导电层13导电。
可选的，刚性内核11由无机复合材料构成。无机复合材料可以包括碳酸钙、二氧化硅和硼酸锌中的至少一种。此外，刚性内核11还可以由其他无机复合材料构成，本发明实施例不做出限制。无机复合材料兼具无机粒子的机械强度、模量、热稳定性和聚合物的弹性和易加工特性，是现今材料科学中具有发展前景的一种材料。
综上所述，本发明实施例提供的导电粒子，通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
图3是本发明实施例提供的一种导电粒子的制造方法的流程图，该方法可以应用于制造图1所示的导电粒子，该方法包括：
步骤301、获取刚性内核。
步骤302、在刚性内核外部形成包裹刚性内核的树脂层。
步骤303、在树脂层的外部形成包裹树脂层的导电层。
综上所述，本发明实施例提供的导电粒子的制造方法，通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
图4-1是本发明实施例提供的另一种导电粒子的制造方法的流程图，该方法可以应用于制造图2-1所示的导电粒子，该方法包括：
步骤401、通过原位聚合法、溶胶凝胶法或共混法制造无机复合材料构成的刚性内核。
在使用本发明实施例提供的导电粒子的制造方法时，首先可以通过原位聚合法、溶胶凝胶法或共混法制造无机复合材料构成的刚性内核。这几种方法的实施过程可以参考相关技术，在此不再赘述。
在树脂层内部设置刚性内核可以增大导电粒子能够承受的压力的上限，进而各向异性导电胶所能承受的压力的上限也会增大，这样就增加了向各向异性导电胶施加压力时的压力的范围，降低了对各向异性导电胶施加压力的精度要求。
步骤402、在刚性内核外部形成包裹刚性内核的树脂层。
在得到无机复合材料构成的刚性内核后，可以在刚性内核外部形成包裹刚性内核的树脂层。该树脂层的形成方式可以参考相关技术，在此不再赘述。
步骤403、在树脂层的外部形成包裹树脂层的热缩树脂层。
在刚性内核外部形成包裹刚性内核的树脂层后，可以在树脂层的外部形成包裹树脂层的热缩树脂层。
如图4-2所示，本步骤还可以包括：
子步骤4031、通过接枝或包覆的方式在树脂层的外部形成包裹树脂层的热缩树脂层。
可以通过接枝或包覆的方式在树脂层的外部形成包裹树脂层的热缩树脂层。接枝是指大分子链上通过化学键结合适当的支链或功能性侧基的反应，所形成的产物称作接枝共聚物，可以通过这种方式来将热缩树脂层包裹在树脂层外。或者直接通过包覆的方式来将热缩树脂层包裹在树脂层外。
热缩树脂层的材料包括聚乙烯和聚乙烯醇中的至少一种。热缩树脂层在受热后会收缩，并向热缩树脂层内的树脂层施加压力，这样就能够降低导电粒子制成的各向异性导电胶对于压力下限，进而降低对各向异性导电胶施加压力的精度要求。
步骤404、在热缩树脂层的外部形成包裹热缩树脂层的导电层。
在树脂层外包裹了热缩树脂层之后，可以在热缩树脂层的外部形成包裹热缩树脂层的导电层。
如图4-3所示，本步骤可以包括：
子步骤4041、在热缩树脂层外部形成包裹热缩树脂层的镍层。
在热缩树脂层外形成导电层时，首先可以在热缩树脂层外部形成包裹热缩树脂层的镍层。
子步骤4042、在镍层外部形成包裹镍层的金层。
在热缩树脂层外部形成包裹热缩树脂层的镍层，可以在镍层外部形成包裹镍层的金层。
综上所述，本发明实施例提供的导电粒子的制造方法，通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
图5-1是本发明实施例提供的一种各向异性导电胶的结构示意图，该各向异性导电胶50包括：粘合剂51和粘合剂51中散布的导电粒子52，导电粒子52包括：刚性内核，刚性内核外部包裹有树脂层，树脂层外部包裹有导电层。树脂层和导电层之间还可以设置有热缩树脂层。
本发明实施例提供的各向异性导电胶中的导电粒子52可以为图1所示的导电粒子或者图2-1所示的导电粒子。
本发明实施例提供的各向异性导电胶可以应用于在外引脚绑定(英文：outerleader bonding；简称：OLB)工程中和液晶滴注(英文：one drop filling；简称：ODF)工程的对盒工艺中。
在OLB工艺中，本发明实施例提供的各向异性导电胶可以用于将卷带接合(英文：Table automatic bonding；简称：TAB)集成电路(英文：Integrated Circuit；简称：IC)上的管脚(英文：Pin)和显示屏端子的连接。
如图5-2所示，该连接过程可以包括下面三个步骤：
步骤501、将各向异性导电胶贴附在第一粘接面上。
首先可以在第一粘结面上贴附各向异性导电胶，第一粘接面可以为TAB-IC上的粘接面，也可以为显示屏端子上的粘接面，该粘接面上可以有导电引脚。
本步骤结束时，第一粘接面和各向异性导电胶贴的结构可以如图5-3所示，其中，各向异性导电胶50贴附在第一粘接面61上。
步骤502、将第二粘接面设置在各向异性导电胶上。
在第一粘接面上贴附各向异性导电胶后，可以将第二粘接面设置在各向异性导电胶上。该粘接面上也设置有导电引脚。在设置第二粘接面时，可以将第二粘接面上的导电引脚和第一粘结面上的导电引脚对位。
本步骤结束时，第二粘接面、第一粘接面和各向异性导电胶的结构可以如图5-4所示第二粘接面62设置在各向异性导电胶50上。
步骤503、通过第一粘接面和第二粘结面向各向异性导电胶加压加热。
在设置好第二粘结面后，可以通过第一粘接面和第二粘结面向各向异性导电胶加压加热。使各向异性导电胶中的导电粒子被压扁，并将两个粘接面中的导电引脚连接。
本步骤结束时，第二粘接面、第一粘接面和各向异性导电胶的结构可以如图5-5所示，各向异性导电胶50将第一粘接面61中的导电引脚和第二粘结面62上的导电引脚在垂直于第一粘接面61的方向上连接，而在其他方向上绝缘。
在本发明实施例提供的各向异性导电胶50应用于ODF工艺中的使用方法可以参考步骤501至步骤503，与步骤501至步骤503不同的是，在对各向异性导电胶加压加热前可以对各向异性导电胶进行紫外光固化。
在应用于ODF工艺中时，本发明实施例提供的各向异性导电胶，可以通过控制导电粒子的压缩率波动范围(通过刚性内核以及热缩树脂来控制)来减少因为压力不均而导致的粘接区域的高度波动，进而可以提高显示面板厚度的一致性，饼减少显示面板周边的不良。
综上所述，本发明实施例提供的导电粒子的制造方法，通过在树脂层中设置刚性内核，以提高导电粒子的耐压程度，增大了该导电粒子制成的各向异性导电胶承受压力的上限。解决了相关技术中施加在各向异性导电胶上的压力的精度要求较高的问题。达到了降低对各向异性导电胶施加压力的精度要求的效果。
本发明中术语“A和B的至少一种”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和B的至少一种，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。同理，“A、B和C的至少一种”表示可以存在七种关系，可以表示：单独存在A，单独存在B，单独存在C，同时存在A和B，同时存在A和C，同时存在C和B，同时存在A、B和C这七种情况。同理，“A、B、C和D的至少一种”表示可以存在十五种关系，可以表示：单独存在A，单独存在B，单独存在C，单独存在D，同时存在A和B，同时存在A和C，同时存在A和D，同时存在C和B，同时存在D和B，同时存在C和D，同时存在A、B和C，同时存在A、B和D，同时存在A、C和D，同时存在B、C和D，同时存在A、B、C和D，这十五种情况。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (11)

1.一种导电粒子，其特征在于，所述导电粒子包括：
刚性内核；
所述刚性内核外部包裹有树脂层；
所述树脂层外部包裹有导电层；
所述树脂层和所述导电层之间还设置有热缩树脂层。
2.根据权利要求1所述的导电粒子，其特征在于，所述热缩树脂层的材料包括聚乙烯和聚乙烯醇中的至少一种。
3.根据权利要求1所述的导电粒子，其特征在于，所述导电层包括由内向外依次设置的第一导电层和第二导电层。
4.根据权利要求3所述的导电粒子，其特征在于，所述第一导电层为镍层，所述第二导电层为金层。
5.根据权利要求4所述的导电粒子，其特征在于，所述第二导电层外部还包裹有抗氧化膜。
6.根据权利要求1所述的导电粒子，其特征在于，所述刚性内核由无机复合材料构成。
7.根据权利要求6所述的导电粒子，其特征在于，所述无机复合材料包括碳酸钙、二氧化硅和硼酸锌中的至少一种。
8.一种导电粒子的制造方法，其特征在于，所述方法包括：
获取刚性内核；
在所述刚性内核外部形成包裹所述刚性内核的树脂层；
在所述树脂层的外部形成包裹所述树脂层的热缩树脂层；
在所述热缩树脂层的外部形成包裹所述热缩树脂层的导电层。
9.根据权利要求8所述的方法，其特征在于，所述在所述树脂层的外部形成包裹所述树脂层的热缩树脂层，包括：
通过接枝或包覆的方式在所述树脂层的外部形成包裹所述树脂层的所述热缩树脂层。
10.根据权利要求8所述的方法，其特征在于，所述刚性内核由无机复合材料构成，所述获取刚性内核，包括：
通过原位聚合法、溶胶凝胶法或共混法制造所述无机复合材料构成的所述刚性内核。
11.一种各向异性导电胶，其特征在于，所述各向异性导电胶包括粘合剂和所述粘合剂中散布的导电粒子，所述导电粒子包括：刚性内核，所述刚性内核外部包裹有树脂层，所述树脂层外部包裹有导电层；所述树脂层和所述导电层之间还设置有热缩树脂层。
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