JP2008288438A - Method for horizontalizing rotation tool, and bonding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for horizontalizing a rotation tool and bonding equipment which can carry out stably the horizontalization of the rotation tool. <P>SOLUTION: A bonding head is lowered until it contacts with the holding plane of a flip tool and a landing sensor starts on-operation (S4), after a coordinate at this time of a Z-axis motor which drives the bonding head is stored as data A (S5), the head moves to a home position (S6). The flip tool is turned clockwise (S7), the bonding head is moved in a Y direction (S8). The bonding head is lowered to the data A (S9), the flip tool is turned anti-clockwise (S10), when the landing sensor has started on-operation, the turning is stopped (S11), the rotation angle of the flip tool at this time is stored as a horizontal position (S12). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a leveling method and a bonding apparatus for a rotary tool for horizontally aligning a holding surface.

  Conventionally, a bonding apparatus is used when bonding a chip to a workpiece.

  As this bonding apparatus, an apparatus that vertically arranges a picked-up chip and performs bonding is known, and such a bonding apparatus includes a rotating tool that changes the direction of the chip.

  The rotary tool includes a holding surface on which a chip picked up by a bonding head is placed, and the tip is rotated by 90 degrees by rotating the rotary tool in a state where the chip is placed on the holding surface. The chip is vertically arranged and can be delivered to the bonding head.

  However, in such a die bonding apparatus, for example, it is necessary to adjust the holding surface to be horizontal when the rotary tool is replaced.

  Examples of this adjustment method include a method using visual observation using a microscope and a method using a leveling jig. In either case, adjustment is difficult and takes a lot of time.

  In addition, an adjustment error occurs for each operator, resulting in adjustment variations.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a leveling method and a bonding apparatus for a rotary tool that can stably level the rotary tool. It is.

  In order to solve the above problems, in the leveling method of the rotary tool of the present invention, the chip transferred by the bonding head is held on the holding surface of the rotary tool, and the rotary tool is set on the holding surface. In a leveling method of a rotary tool that rotates around a rotation axis to change the orientation of the chip held on the holding surface, the bonding head is moved toward the rotation axis and abuts on the holding surface. The rotating tool is rotated in a direction in which the holding surface is close to the bonding head in a state where the bonding head is moved horizontally to a predetermined position and held at a height position in contact with the holding surface. The state in which the holding surface is in contact with the bonding head is horizontal.

  That is, when it is necessary to adjust the holding surface of the rotary tool to be horizontal when changing the tool, first, the bonding head is moved toward the rotation axis set on the holding surface. Abutting on the holding surface, the bonding head is moved laterally to a predetermined position and held at a height position in contact with the holding surface.

  Then, the rotating tool is rotated in a direction in which the holding surface is close to the bonding head, and a state where the holding surface is in contact with the bonding head is horizontal.

  Thereby, the holding surface of the rotating tool becomes horizontal.

  Further, in the bonding apparatus of the present invention, the chip transferred by the bonding head is held on the holding surface of the rotating tool, and the rotating tool is rotated around the rotation axis set on the holding surface to In a bonding apparatus having a function of changing the orientation of the chip held on a holding surface, a rotating shaft abutting means for moving the bonding head toward the rotating shaft and abutting the holding surface, and the bonding head A horizontal movement means for moving the holding tool in a horizontal direction to a predetermined position and holding it at a height position in contact with the holding surface, and rotating the rotating tool in a direction in which the holding surface is close to the bonding head, Leveling means for leveling a state in which the holding surface is in contact with the bonding head.

  That is, when it is necessary to adjust the holding surface of the rotary tool to be horizontal when changing the tool, first, the bonding head is moved toward the rotation axis set on the holding surface to Contact the holding surface.

  Next, the bonding head is moved laterally to a predetermined position and held at a height position in contact with the holding surface.

  Then, the rotating tool is rotated in a direction in which the holding surface is close to the bonding head, and a state where the holding surface is in contact with the bonding head is horizontal.

  Accordingly, the holding surface of the rotating tool is leveled.

  As described above, in the leveling method and bonding apparatus of the rotary tool of the present invention, the bonding head is brought into contact with the rotary shaft set on the holding surface of the rotary tool, and the bonding head is moved in the lateral direction. The holding surface of the rotating tool is brought into contact with the bonding tool maintained at the height position when the holding surface is in contact, whereby the holding surface can be leveled.

  For this reason, when the holding surface is adjusted horizontally, the adjustment becomes easier and the adjustment time can be reduced as compared with the case of using a method using a microscope and a method using a leveling jig. Shortening can be achieved and workability is improved.

  Further, it is possible to eliminate an adjustment error that occurs for each operator as compared with the conventional case. Thereby, adjustment variation can be eliminated and the leveling of the rotary tool can be performed stably.

  In a bonding apparatus in which a sensor for detecting contact is provided in the bonding head, leveling can be realized without providing a new mechanism by using the sensor.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a bonding apparatus 1 according to the present embodiment, and the bonding apparatus 1 has a function of executing a leveling method for a rotary tool according to the present invention.

  That is, the bonding apparatus 1 includes an XY table 11, and the XY table 11 is configured to support the wafer 12. The XY table 11 is connected to the control unit 13 and is configured to be able to move the chip 14 to be picked up to the pickup position by operating according to a control signal from the control unit 13.

  A bonding head 21 for picking up the chip 14 disposed at the pickup position is provided on the XY table 11, and a bonding tool for adsorbing and holding the chip 14 is attached to the bonding head 21. 22 is provided. The bonding head 21 is also connected to the control unit 13 and is configured to operate in the XYZ directions in accordance with a control signal from the control unit 13.

  As a result, the bonding head 21 picks up the chip 14 on the XY table 11 and delivers it to the flip tool 31 as a rotary tool provided on the XY table 11 and is rotated by the flip tool 31. The chip 14 is received, transferred to the lead frame 33 on the feeder 32, and bonded to the lead frame 33 in a standing state.

  The bonding head 21 includes a landing sensor (not shown). The landing sensor is configured to be turned on when the bonding tool 22 abuts on a target portion and retracts by a predetermined amount, and this on signal is configured to be transmitted to the control unit 13. ing. Accordingly, the control unit 13 is configured to detect that the bonding head 21 has come into contact with the target portion.

  As shown in FIG. 2, the flip tool 31 is formed in a fan shape in cross section, a planar holding surface 41 on which the chip 14 is placed, and a planar shape depending from one edge of the holding surface 41. And an arcuate curved surface 43 connecting the edge of the drooping surface 42 and the other edge of the holding surface 41.

  The flip tool 31 is configured to be rotated by a rotation mechanism (not shown), and the rotation mechanism is connected to the control unit 13. Further, the holding surface 41 has a rotating shaft 51 set closer to the one edge, and the flip tool 31 is configured to be rotated around the rotating shaft 51 by the rotating mechanism. .

  The holding surface 41 is provided with a vacuum hole (not shown) through which negative pressure is supplied so that the chip 14 placed on the holding surface 41 can be adsorbed and held by the negative pressure from the vacuum hole. It is configured. An air circuit for supplying a negative pressure to the vacuum hole is also connected to the control unit 13. As a result, a negative pressure is supplied to the vacuum hole in accordance with a control signal from the control unit 13 so that the flip tool 31 is rotated clockwise CW by the rotating mechanism while the chip 14 is held on the holding surface 41. By rotating 90 degrees to 90 degrees, the chip 14 arranged horizontally can be rotated 90 degrees to change its orientation.

  As shown in FIG. 1, a rear camera 55 for obtaining an image of the rear surface of the chip 14 transferred by the bonding head 21 is disposed on the side of the flip tool 31. 55 is connected to the control unit 13.

  A first upper camera 61 for obtaining an image of the chip 14 held by the flip tool 31 is disposed above the flip tool 31 and above the bonding position to the lead frame 33. The second upper camera 62 for obtaining an image of the bonding position is disposed, and both the cameras 61 and 62 are also connected to the control unit 13.

  And this control part 13 is comprised centering on the microcomputer incorporating ROM and RAM. The ROM stores a program indicating a processing procedure, a predetermined set value, and the like, and the RAM is configured to store data in a process. Thus, the bonding apparatus 1 is configured to operate when the microcomputer operates according to a program stored in the ROM.

  The operation of the present embodiment according to the above configuration will be described with reference to the flowchart shown in FIG.

  That is, when the control unit 13 operates according to a program stored in the ROM and executes leveling processing, the control unit 13 outputs a control signal to the rotation mechanism, and as shown in FIG. The flip tool 31 is rotated to an origin position where the holding surface 41 is slightly inclined (S1), and a pickup load by the bonding head 21 is set (S2).

  Then, by outputting a control signal from the control unit 13 and driving the Z-axis motor of the bonding head 21, 0.5 mm above the pickup position of the chip 14 from the flip tool 31, that is, the flip tool 31. After the bonding head 21 is lowered until the tip of the bonding tool 22 reaches 0.5 mm above the position of the rotary shaft 51 set on the holding surface 41 (S3), a landing sensor provided on the bonding head 21 The bonding head 21 is lowered until is turned on (S4).

  At this time, when the tip of the bonding tool 22 abuts on the holding surface 41 at the position of the rotary shaft 51 and retracts by a predetermined amount, the landing sensor is turned on, and the control unit 13 detects this. Therefore, after the descent of the bonding head 21 is stopped, the coordinates of the Z-axis motor that drives the bonding head 21 at this time are stored in the RAM as data A (S5), and then the Z-axis motor is driven. The bonding head 21 is moved to the home position (S6).

  Then, the control unit 13 outputs a control signal to the rotation mechanism and rotates the flip tool 31 clockwise CW so as to be displaced below the free end of the holding surface 41. After tilting (S7), by outputting a control signal to the bonding head 21, the bonding head 21 is moved by a predetermined amount of 1.5 mm in the Y direction which is the free end side of the holding surface 41. (S8).

  Next, the Z-axis motor of the bonding head 21 is operated to lower the bonding head 21 to the height position of the data A stored in the RAM (S9), and then the CCW of the flip tool 31 is counterclockwise. The rotation in the direction is started (S10). At this time, when the holding surface 41 of the flip tool 31 comes into contact with the bonding tool 22 of the bonding head 21 and the landing sensor is turned on, the rotation of the flip tool 31 is stopped at that time. (S11) For example, the rotation angle of the flip tool 31 at this time is stored in the RAM as a horizontal position (S12).

  At this time, the flip tool 31 has the same height in both the part where the holding surface 41 is set to the rotation shaft 51 and the part where the holding surface 41 is deviated in the 1.5 mm Y direction from the part. The holding surface 41 is horizontal.

  As a result, the holding surface 41 of the flip tool 31 is leveled.

  Then, after moving the bonding head 21 to the origin position (S13), the process returns to the main routine.

  In this way, the bonding head 21 is brought into contact with the rotary shaft 51 set on the holding surface 41 of the flip tool 31, the bonding head 21 is moved in the Y direction, and the height when the holding surface 41 is brought into contact is increased. The holding surface 41 can be leveled by bringing the holding surface 41 of the flip tool 31 into contact with the bonding tool 21 held in the vertical position.

  For this reason, when the holding surface 41 is adjusted horizontally, the adjustment becomes easier and the adjustment time can be compared with the case of using a method using visual observation using a microscope or a method using a leveling jig. Can be shortened and workability is improved.

  Further, it is possible to eliminate an adjustment error that occurs for each operator as compared with the conventional case. Thereby, adjustment variation can be eliminated and the flip tool 31 can be leveled stably.

  In the bonding apparatus 1 in which the landing sensor for detecting contact is provided in the bonding head 21, leveling can be easily realized without using a new mechanism by using the landing sensor. Can do.

It is a block diagram which shows one embodiment of this invention. It is explanatory drawing which shows operation | movement of the embodiment. It is a flowchart which shows the operation | movement of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 13 Control part 14 Chip 21 Bonding head 31 Flip tool 33 Lead frame 41 Holding surface 51 Rotating shaft

Claims (2)

The chip transferred by the bonding head is held on the holding surface of the rotary tool, and the direction of the chip held on the holding surface is changed by rotating the rotary tool around the rotation axis set on the holding surface. In the leveling method of the rotating tool to
In a state where the bonding head is moved toward the rotating shaft and is in contact with the holding surface, and the bonding head is moved in a lateral direction to a predetermined position and held at a height position in contact with the holding surface. A method for leveling a rotating tool, characterized in that the rotating tool is rotated in a direction in which the holding surface is close to the bonding head and the state in which the holding surface is in contact with the bonding head is leveled. The chip transferred by the bonding head is held on the holding surface of the rotary tool, and the direction of the chip held on the holding surface is changed by rotating the rotary tool around the rotation axis set on the holding surface. In the bonding equipment with the function to
Rotating shaft contact means for moving the bonding head toward the rotating shaft and contacting the holding surface;
A lateral movement means for moving the bonding head laterally to a predetermined position and holding the bonding head at a height position in contact with the holding surface;
Leveling means for rotating the rotating tool in a direction in which the holding surface is close to the bonding head and leveling the state in which the holding surface is in contact with the bonding head;
A bonding apparatus comprising:

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