JP2008277388A - Manufacturing method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic components capable of restraining a used amount of conductive paste. <P>SOLUTION: In the manufacturing method of electronic components, an electrode joined to a lid member is provided on the side of electronic component bodies, and an assembly of electronic component bodies is divided along division lines 44, 45 for formation. The manufacturing method of electronic components comprises: a process for punching a first hole 46 surrounded by an insulating substrate 42 at a position separated from the division line 44 to the insulating substrate 42 before baking; a process for filling conductive paste 48 into the first hole 46; and a process for punching a second hole 60 by punching the insulating substrate 42 within the formation range of the electrode on the division line 44 while including one portion of the first hole 46 to form the electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component composed of a plurality of insulating substrates.

  This type of electronic component is configured by laminating insulating substrates, and wiring patterns are provided at appropriate positions on the substrate. Various mounting parts are mounted on the pattern to form a desired electric circuit.

  In addition, this substrate is covered with a shield cover, and this cover protects the wiring pattern and mounted components from noise and the like. Therefore, an electronic component to which this cover is attached is disclosed (for example, see Patent Document 1). Specifically, the electronic component is formed by dividing an assembly of electronic component main bodies along a dividing line, and a rectangular joining electrode is formed on a side surface of each electronic component main body. And this electrode and the leg part of a cover are joined by solder, and a cover is fixed to an electronic component main body.

Japanese Patent Laid-Open No. 2003-1778928

  By the way, in the conventional technique described above, the bonding electrode is formed by the following steps. First, an imaginary dividing line is specified on the substrate before firing to partition an assembly of electronic component bodies. Next, a rectangular through hole is provided on the dividing line, and the conductive paste is filled in the through hole. Then, each board | substrate is laminated | stacked and the through-hole is divided into 2 by the parting line. In other words, the through hole filled with the paste is punched on the dividing line, and the laminated substrate has a quadrangular through hole extending over the dividing line. And the joining electrode is formed in the side surface of an electronic component main body by exposing the inner surface of this through-hole outside.

However, the conventional technique has a problem that the amount of conductive paste used is increased. This is because in forming the bonding electrode, the conductive paste is punched within the bonding electrode forming range on the dividing line. In this technique, a configuration in which the conductive paste is partially applied to the periphery of the through hole is described. However, even in this configuration, the conductive paste and the space are punched out within the formation range of the joining electrode on the dividing line. However, there is still a problem that the amount of conductive paste used is increased.
Then, the objective of this invention is providing the manufacturing method of the electronic component which can eliminate the said subject and can suppress the usage-amount of an electrically conductive paste.

According to a first aspect of the present invention for achieving the above object, there is provided an electronic device comprising an electrode joined to a lid member on a side surface of an electronic component body, and an assembly of electronic component bodies formed by dividing along a dividing line A method of manufacturing a component, comprising: a step of forming a first hole surrounded by an insulating substrate at a position separated from a dividing line with respect to an insulating substrate before firing; A step of filling the paste, and a step of forming a second hole by punching the insulating substrate within a range where the electrode is formed on the parting line and including a part of the first hole in order to form an electrode. It has.
According to the first invention, the periphery of the first hole is surrounded by the insulating substrate, and the first hole is formed in the insulating substrate at a position away from the dividing line. Subsequently, the first hole is filled with a conductive paste.
Next, when forming an electrode to be bonded to the lid member, a second hole including a part of the first hole is formed, and this second hole is within the electrode formation range on the dividing line. Then, the insulating substrate is punched out instead of the conductive paste. Therefore, the amount of conductive paste used can be reduced as compared with the conventional manufacturing method, so that the manufacturing cost of the electronic component can be reduced.

A second aspect of the invention is a method of manufacturing an electronic component having an electrode bonded to a lid member on a side surface of the electronic component main body, and forming an assembly of the electronic component main body along a dividing line. A step of forming a first hole surrounded by the insulating substrate at a position away from the dividing line with respect to the insulating substrate before firing, a step of filling the first hole with a conductive paste, A step of disposing an insulating substrate filled with a conductive paste as an upper layer and laminating a plurality of insulating substrates; including a part of a first hole for forming an electrode on the laminated insulating substrate; and A step of punching out the insulating substrate and forming a second hole within the range of formation of the electrode on the dividing line, and the inner surface of the second hole of the insulating substrate disposed in the lower layer is formed on the first hole. The filled conductive paste is glazed.
According to the second invention, since the upper conductive paste is plated on the lower insulating substrate, the amount of the conductive paste used can be further reduced as compared with the conventional manufacturing method.

A third invention is characterized in that, in the structure of the second invention, the insulating substrate filled with the conductive paste is disposed only on the uppermost layer of the plurality of stacked insulating substrates.
According to the third invention, in addition to the operation of the second invention, the insulating substrate filled with the conductive paste is arranged only in the uppermost layer, and the insulating substrate not charged with the conductive paste is arranged in the lower layer. Therefore, the amount of conductive paste used can be minimized.

According to a fourth invention, in the configuration of the second or third invention, the insulating substrate disposed in the lower layer has a via at a position below the first hole filled with the conductive paste.
According to the fourth invention, in addition to the effects of the second and third inventions, since the curved via is further provided, the bonding area with the substrate is larger than that of the square hole, and the electrode and This contributes to improving the bonding strength with the substrate.

According to a fifth invention, in the structure of the fourth invention, the via is filled with a conductive paste.
According to the fifth invention, in addition to the action of the fourth invention, the conductive paste filled in the first hole can be easily stroked on the inner surface of the second hole, and the conduction between the upper and lower layers is improved. .

A sixth invention is characterized in that, in the structure of the fifth invention, the lower surface of the insulating substrate arranged in the lowermost layer has an electrode pad connected to the via.
According to the sixth invention, in addition to the action of the fifth invention, this electronic component can be applied even when electrodes are required on the upper and lower surfaces.

According to a seventh aspect, in the configurations of the second to sixth aspects, the second hole is formed by a punch having a taper that expands upward.
According to the seventh invention, in addition to the operations of the second to sixth inventions, when the punch having the shape is used, the conductive paste filled in the first hole can be reliably applied to the inner surface of the second hole. It can be put on with a paddle.

An eighth aspect of the invention is a method of manufacturing an electronic component which has an electrode bonded to a lid member on a side surface of the electronic component main body, and is formed by dividing an assembly of the electronic component main body along a dividing line. A step of forming a first hole surrounded by the insulating substrate at a position away from the dividing line with respect to the insulating substrate before firing, a step of filling the first hole with a conductive paste, Arranging an insulating substrate filled with a conductive paste as an upper layer and laminating a plurality of insulating substrates; compressing the laminated insulating substrates to form an assembly of electronic component bodies; and a compressed insulating substrate And forming a second hole by including a part of the first hole and punching out the insulating substrate within the formation range of the electrode on the dividing line in order to form an electrode with respect to In the process, the inner surface of the second hole of the insulating substrate disposed in the lower layer has a first The conductive paste filled in the holes of the first and second holes is brazed, and then the step of firing the assembly of electronic component bodies having the second holes and the step of dividing the assembly of electronic component bodies along the dividing line And a step of mounting the mounted component on the electronic component main body, and a step of covering the mounted component by bonding the lid member to the electrode.
According to the eighth invention, since the upper conductive paste is plated on the lower insulating substrate, the amount of the conductive paste used can be further reduced as compared with the conventional manufacturing method.

According to a ninth aspect of the invention, there is provided a method of manufacturing an electronic component having an electrode bonded to the lid member on a side surface of the electronic component main body, and forming an assembly of the electronic component main body along a dividing line. A step of forming a first hole surrounded by the insulating substrate at a position away from the dividing line with respect to the insulating substrate before firing, a step of filling the first hole with a conductive paste, A step of laminating a plurality of insulating substrates filled with a conductive paste, and a part of the first hole for forming electrodes on the laminated insulating substrates, and within a range of forming electrodes on the dividing line Then, a step of punching the insulating substrate and forming the second hole is provided.
According to the ninth invention, since the second hole punches the insulating substrate within the electrode formation range on the dividing line, the amount of conductive paste used can be reduced as compared with the conventional manufacturing method.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic component which suppressed the usage-amount of the electrically conductive paste can be provided.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.
The electronic component 1 of this form is mounted on, for example, a mobile phone device, and includes an electronic component main body 10 and a shield cover (lid member) 30 as shown in FIG.

  The main body 10 of this embodiment is formed by laminating ceramic substrates (LTCC substrates) obtained by low-temperature firing, and is formed in a substantially rectangular plate shape. Specifically, as shown in the figure, it has an upper surface 12 and a lower surface 18 whose peripheral edges are formed by four sides. Four side surfaces 22 and 24 are formed on the peripheral edges of the upper surface 12 and the lower surface 18, the side surfaces 22 and 24 are adjacent to each other, and the side surfaces 24 and 24 are configured to face each other.

  A desired wiring pattern 14 is provided at an appropriate position on the upper surface 12, and various mounting components 16 are mounted on the pattern 14 to form a desired electric circuit. On the other hand, an electrode pad 20 is bonded to an appropriate position on the lower surface 18.

  On the other hand, rectangular recesses 26 are formed in the main body 10 in plan view. Specifically, the recess 26 is formed to be recessed toward the inside of the main body 10 at a substantially central portion of the side surface 24. A bonding electrode (electrode) 28 is formed in the recess 26, and is connected to the pad 20 on the lower surface of the electrode 28. The pad 20 is configured to be able to be joined to the cover 30 as well.

  The cover 30 has a metal box shape and has a substantially rectangular upper surface 31. The upper surface 31 is formed in a similar shape to the upper surface 12 of the main body 10, and four side surfaces 32, 34 are formed on the periphery of the upper surface 31, and the side surface 32 and the side surface 34 are adjacent to each other. Configured. Further, leg portions 36 are respectively extended downward at substantially central portions of the side surfaces 34. When the cover 30 is placed on the main body 10, the inner surfaces of the leg portions 36 are brought into contact with the electrodes 28, The lower end portion of the inner surface is in contact with the pad 20. As a result, the wiring pattern 14 and the mounted component 16 are covered and can be protected from noise and the like.

The electronic component 1 is manufactured through the steps shown in FIG.
Specifically, in step S201 in the figure, a through hole (first hole) 46 is formed in the raw insulating substrate (green sheet) before firing. Specifically, as shown in FIG. 3, first, an insulating substrate 42 before firing is prepared, and this substrate 42 has a size capable of forming a plurality of the main bodies 10 and has a size of about 0.1 mm. It is comprised with the thickness of.

The main body 10 of the present embodiment is configured by stacking six LTCC substrates, and the substrate 42 is a substrate disposed in the uppermost layer.
The substrate 42 is partitioned by virtual dividing lines 44 and 45 (indicated by a one-dot chain line in the figure) intersecting vertically and horizontally, and the size defined by these dividing lines 44 and 45 is a plan view of one main body 10. Corresponds to the size of. That is, the substrate 42 is composed of an aggregate 40 in which a plurality of main bodies 10 are collected. The dividing lines 44 and 45 may be grooves formed on the substrate 42.

  The through hole 46 described above is formed through the substrate 42 at a position corresponding to the electrode 28 in order to form the electrode 28. Specifically, as shown in FIG. 3, the through hole 46 is formed in a substantially rectangular shape having a long side along the dividing line 44 and a short side along the dividing line 45. Each of the through holes 46 is surrounded by a substrate 42.

The through holes 46 facing each other across the dividing line 44 are formed at positions symmetrical to the dividing line 44, and the substrate 42 is also formed between the opposing through holes 46, 46. In order to facilitate understanding, the size of the through hole 46 is emphasized.
Next, in step S202, the conductive paste is filled into each through hole 46 by a predetermined method. Specifically, as shown in FIG. 4 showing a part of the aggregate 40, the through holes 46 of the substrate 42 are completely filled with a conductive paste 48 mainly composed of silver (Ag) and palladium (Pd), for example. ing.

On the other hand, five insulating substrates are arranged below the substrate 42. Specifically, as shown in FIG. 5, in this embodiment, five more insulating substrates 52 before firing are prepared.
The substrate 52 has a circular via 56, and the via 56 is connected to an internal wiring pattern (not shown) formed on the substrate 52. The via 56 has a diameter substantially equal to the length of the short side of the through hole 46, and is formed through the substrate 52 at a position facing the through hole 46. The via 56 is also filled with a conductive paste 58 containing, for example, silver (Ag) and palladium (Pd) as main components. For these through holes 46 and vias 56, a conductive paste having a well-known conductive component can be used in addition to a silver-only conductive paste that is easy to extend.

Subsequently, in step S203, the substrates 42 and 52 are stacked. That is, as shown in FIG. 6 showing a part of the assembly 40, the substrate 42 having the through holes 46 is disposed in the uppermost layer, and the five substrates 52 having the vias 56 are disposed below the substrates 42, respectively. The pastes 48 and 58 are arranged continuously in the thickness direction of the main body 10.
In step S204, the stacked substrates 42 and 52 are compressed. In this embodiment, a WIP (Warm Isostatic Press) method is used. The substrates 42 and 52 are sealed in a vacuum state, and isotropic pressure is applied to the assembly 40 of the main body 10. Is molded.

Next, in this embodiment, the electrode 28 is formed on the molded assembly 40 (step S205). That is, as shown in FIG. 7 showing a part of the aggregate 40, the molded aggregate 40 is penetrated by the through hole (second hole) 60.
Specifically, the through hole 60 is formed through the assembly 40 at a position corresponding to the recess 26 so as to form the recess 26. More specifically, the through hole 60 is configured by a substantially rectangular shape having a long side along the dividing line 44 and a short side along the dividing line 45, and the long side is a part of the through hole 46. In other words, it arrange | positions so that the long side of the through-hole 46 located in the side near the dividing line 44 of the through-hole 46 may be included.

The through holes 60 are formed across the dividing lines 44 with respect to the through holes 46 facing each other with the dividing lines 44 interposed therebetween. Within the formation range of the electrodes 28 on the illustrated dividing lines 44, the through holes 60 are formed. The assembly 40 is formed by punching from above.
The through hole 60 is formed using a punch 70 (FIG. 8). The punch 70 of the present embodiment is configured to have a substantially rectangular cross section having a long side along the dividing line 44 and a short side along the dividing line 45. Of the long sides facing each other, one long side is configured to have a taper 72 that gradually expands upward as viewed from the side of the punch 70 as compared to the other long side, and is substantially rectangular. The maximum outer shape of the punch 70 having the cross-section is defined to be approximately half the size of the through hole 60.

  More specifically, when the long side having the taper 72 of the punch 70 is arranged toward the through hole 46 and this punch 70 moves downward from above the assembly 40, the tip of the punch 70 is first moved to the substrate 42. The substrate portion existing between the dividing line 44 of the substrate 42 and the paste 48 is pressed downward.

  Subsequently, when the tip of the punch 70 reaches the substrate 52, the side surface of the punch 70 that gradually expands grips a part of the paste 48 and moves toward the lower surface 18 (FIG. 9). In other words, the paste 48 of the through-hole 46 is applied to the side surface of each substrate 52 (the inner surface of the through-hole 60) with a scissors. As a result, an electrode 28 is formed in one concave portion 26 of the main body 10.

Further, in this embodiment, when the paste 48 is squeezed downward, the tip of the punch 70 moves downward while scraping a part of the via 56, so that the paste 48 and the via 56 in the through hole 46 are moved. The inner paste 58 is mixed.
Thereafter, when the direction of the punch 70 is changed to the opposite side and the paste 48 of the adjacent through holes 46 is squeezed downward, the electrodes 28 are also formed in the concavities 26 facing each other. Thereafter, each through hole 60 is formed in the molded assembly 40. In this embodiment, one punch 70 is used twice and one through hole 60 is formed. However, by changing the shape of the punch, one punch 70 is used once and 1 is used. Two through holes 60 may be formed.

Next, in step S206, the aggregate 40 having each through-hole 60 is fired and the process proceeds to step S207, where the fired aggregate 40 is divided along the dividing lines 44 and 45. As a result, as shown in FIG. 10, an electrode 28 made of the paste 48 is formed in each recess 26 from the upper surface 12 to the lower surface 18, and a via 56 is disposed on the back side of the paste 48.
Subsequently, in step S <b> 208, the mounting component 16 is mounted on the pattern 14 on the upper surface 12, and the electrode pad 20 is bonded to an appropriate position on the lower surface 18. As a result, the pad 20 is connected to the via 56 as shown in FIG.

In step S209, the inner surface of the leg portion 36 is brought into contact with the electrode 28, and the lower end portion of the inner surface is joined to the pad 20 with solder, so that the pattern 14 and the mounted component 16 are covered.
In this embodiment, the mounting component 16 is mounted after the assembly 40 is divided. However, the assembly 40 may be divided after the mounting component 16 is mounted, or the mounting component 16 is mounted and the cover 30 is mounted. The assembly 40 may be divided after mounting.

As described above, the present invention focuses on reducing the amount of conductive paste used when forming a bonding electrode.
According to the present embodiment, the through hole 46 is surrounded by the insulating substrate 42 and is formed in the substrate 42 at a position separated from the dividing line 44. Subsequently, the through hole 46 is completely filled with a conductive paste 48 mainly composed of silver (Ag) and palladium (Pd).

  Next, when forming the electrode 28 to be joined to the cover 30, a through hole 60 including a part of the through hole 46 is formed. This through hole 60 is a range in which the electrode 28 is formed on the dividing line 44. Inside, not the conductive paste or the paste and space, but the substrates 42 and 52 are punched out. Therefore, the conductive paste mainly composed of silver (Ag) and palladium (Pd), which are expensive compared to the conventional manufacturing method, is not easily wasted, and the amount of the paste 48 used can be reduced. As a result, the manufacturing cost of the electronic component 1 can be reduced.

In addition, since the paste 48 of the substrate 42 is brazed on the side surface of each substrate 52, the amount of paste used can be further reduced as compared with the conventional manufacturing method.
Further, since each substrate 52 has a via 56 formed by a curve, the bonding area with the substrate 52 is increased as compared with the case where the substrate 52 is formed with a square, and the bonding strength between the electrode 28 and the substrate 52 is improved. Contribute.

Furthermore, if the vias 56 are filled with the paste 58, the paste 48 filled in the through holes 46 can be easily applied to the inner surface of the through hole 60, and the conduction between the upper and lower layers is improved.
If the electrode pad 20 is provided on the lower surface 18, the electronic component 1 can be applied even when electrodes are required on the upper and lower surfaces.

Further, when the punch 70 having the taper 72 is used, the paste 48 filled in the through hole 46 can be surely applied to the inner surface of the through hole 30.
The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the claims.

For example, in the above embodiment, the substrate 42 having the through holes 46 is disposed only in the uppermost layer, but the present invention is not necessarily limited to this form. That is, the substrate 42 having the through holes 46 may be provided in the first to third layers among the six layers, and the substrate 52 having the vias 56 may be used in the fourth to sixth layers.
The vias 56 may not be filled with the paste 58, and these 2 to 6 layers may be substrates without vias. This is because the electrode 28 can be appropriately changed according to the length of the leg portion 36 of the cover 30 and the arrangement of the internal wiring pattern, and the pad 20 is not an essential configuration. In these cases, the effect of using the least amount of paste is obtained.

  On the other hand, in the above embodiment, the paste 48 of the uppermost substrate 42 is stretched to the inner surface of the through hole 60, but the embodiment is not necessarily limited to this form. That is, as long as the through-hole 60 punches out the insulating substrate 42 instead of the conductive paste or space within the range where the electrode 28 is formed on the dividing line 44, the through-hole 46 is filled with the paste 48. The through hole 60 may be formed by laminating six substrates. Also in this case, as described above, there is an effect that the amount of the conductive paste used is smaller than that of the conventional manufacturing method.

  Further, the present invention can naturally be applied to PCs, portable information terminals, terminal adapters, digital cameras, printers, and other peripheral devices in addition to the above-described cellular phone device.

It is a disassembled perspective view of the electronic component of a present Example. It is a flowchart which shows the manufacturing method of the electronic component of FIG. It is explanatory drawing of the through-hole formation process of FIG. It is explanatory drawing of the paste filling process of FIG. It is explanatory drawing of the paste filling process of FIG. It is explanatory drawing of the lamination process of FIG. It is explanatory drawing of the through-hole formation process of FIG. It is explanatory drawing of the through-hole formation process of FIG. It is explanatory drawing of the through-hole formation process of FIG. It is explanatory drawing of the joining electrode in the electronic component main body of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 10 Electronic component main body 20 Electrode pad 24 Side surface 28 Joining electrode (electrode)
30 Cover (lid member)
36 Leg 40 Assembly 42 Upper layer (insulating substrate)
44, 45 Dividing line 46 Through hole (first hole)
48 Conductive paste 52 Lower layer (insulating substrate)
56 Via 58 Conductive paste 60 Through hole (second hole)
70 punch 72 taper

Claims (9)

It has an electrode to be bonded to the lid member on the side surface of the electronic component main body, and is an electronic component manufacturing method in which an assembly of electronic component main bodies is divided and formed along a dividing line,
Forming a first hole surrounded by the insulating substrate at a position spaced from the dividing line with respect to the insulating substrate before firing;
Filling the first hole with a conductive paste;
Forming a second hole so as to form a part of the first hole and punching the insulating substrate within a range of the electrode on the dividing line to form the electrode. An electronic component manufacturing method characterized by the above. It has an electrode to be bonded to the lid member on the side surface of the electronic component main body, and is an electronic component manufacturing method in which an assembly of electronic component main bodies is divided and formed along a dividing line,
Forming a first hole surrounded by the insulating substrate at a position spaced from the dividing line with respect to the insulating substrate before firing;
Filling the first hole with a conductive paste;
Arranging an insulating substrate filled with the conductive paste as an upper layer and laminating a plurality of insulating substrates;
In order to form the electrode with respect to the laminated insulating substrate, a part of the first hole is included, and the insulating substrate is punched out within the formation range of the electrode on the dividing line to form a second hole. And a step of drilling
A method for manufacturing an electronic component, wherein an inner surface of the second hole of the insulating substrate disposed in a lower layer is plated with a conductive paste filled in the first hole. It is a manufacturing method of the electronic component according to claim 2,
The method of manufacturing an electronic component, wherein the insulating substrate filled with the conductive paste is disposed only on an uppermost layer of the plurality of stacked insulating substrates. It is a manufacturing method of the electronic component according to claim 2 or 3,
The method of manufacturing an electronic component, wherein the insulating substrate disposed in the lower layer has a via at a position below the first hole filled with the conductive paste. A method for manufacturing an electronic component according to claim 4,
An electronic component manufacturing method, wherein the via is filled with a conductive paste. It is a manufacturing method of the electronic component according to claim 5,
A method of manufacturing an electronic component, comprising an electrode pad connected to the via on a lower surface of an insulating substrate disposed in a lowermost layer. A method for producing an electronic component according to any one of claims 2 to 6,
The method of manufacturing an electronic component, wherein the second hole is formed by a punch having a taper that expands upward. It has an electrode to be bonded to the lid member on the side surface of the electronic component main body, and is an electronic component manufacturing method in which an assembly of electronic component main bodies is divided and formed along a dividing line,
Forming a first hole surrounded by the insulating substrate at a position spaced from the dividing line with respect to the insulating substrate before firing;
Filling the first hole with a conductive paste;
Arranging an insulating substrate filled with the conductive paste as an upper layer and laminating a plurality of insulating substrates;
Compressing the laminated insulating substrate to form an assembly of the electronic component bodies;
In order to form the electrode with respect to the compressed insulating substrate, a portion of the first hole is included, and the insulating substrate is punched out within the range where the electrode is formed on the dividing line, so that the second hole is formed. And in this step, the inner surface of the second hole of the insulating substrate disposed in the lower layer is brazed with the conductive paste filled in the first hole,
Next, firing the assembly of the electronic component main body having the second hole;
Dividing the assembly of the electronic component main bodies along the dividing line;
Mounting a mounting component on the electronic component body;
And a step of joining the lid member to the electrode to cover the mounted component. It has an electrode to be bonded to the lid member on the side surface of the electronic component main body, and is an electronic component manufacturing method in which an assembly of electronic component main bodies is divided and formed along a dividing line,
Forming a first hole surrounded by the insulating substrate at a position spaced from the dividing line with respect to the insulating substrate before firing;
Filling the first hole with a conductive paste;
Laminating a plurality of insulating substrates filled with the conductive paste;
In order to form the electrode with respect to the laminated insulating substrate, a part of the first hole is included, and the insulating substrate is punched out within the formation range of the electrode on the dividing line to form a second hole. And a method of manufacturing an electronic component.

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