JP2008263205A5

JP2008263205A5 -

Info

Publication number: JP2008263205A5
Application number: JP2008104747A
Authority: JP
Filing date: 2008-04-14
Publication date: 2012-06-07

Claims

A lower metal layer separated into a first region and a second region;
A support layer located on top of the lower metal layer,
A light reflecting layer located on top of the support layer,
Mounted on the chip mounting portion, which is a portion from which a part of the support layer and the light reflecting layer located above the first region of the lower metal layer is removed, and the lower metal layer portion where the first region of the lower metal layer is exposed A surface mount type light emitting diode lamp including a light emitting diode chip in which each pole of the diode is electrically connected to the first region and the second region of the lower metal layer.

A lower metal layer separated into a first region and a second region;
A support layer located on top of the lower metal layer,
A light reflecting layer located on top of the support layer,
A chip mounting portion which is a portion from which a part of the support layer and the light reflection layer located above the first region of the lower metal layer is removed; and a support layer and a light reflection layer located above the second region of the lower metal layer The second region exposed portion from which a part has been removed, and the first region and second region of the lower metal layer exposed at the portion from which the support layer and the light reflection layer have been removed, and the exposed first region of the lower metal layer A surface-mounted light-emitting diode lamp including a light-emitting diode chip mounted on a portion and exposed to a first region and a second region of a lower metal layer, each of which is electrically connected to each pole of the diode.

The light-emitting diode lamp according to claim 1 or 2,
The light reflecting layer located above the support layer is made of a metal layer,
The first region of the lower metal layer in a portion where the support layer and the metal layer located above the first region, and the support layer and the metal layer located above the second region are respectively removed. And a second region exposed, mounted on the first region of the exposed lower metal layer, and electrically connected to the first region and the second region of the exposed lower metal layer, respectively. Surface mount type light emitting diode lamp including chip.

The surface-mounted light-emitting diode lamp according to any one of claims 1 to 3, wherein the part from which the support layer and the light reflection layer are partially removed is formed by laser drilling.

5. The light reflecting structure formed by plating with a light reflecting metal such as Cu or Ag is included in the region where the support layer and the upper metal layer are removed and the light emitting diode chip is mounted. A surface mount type light emitting diode lamp according to claim 1.

The surface-mount light-emitting diode lamp according to claim 1, further comprising a light extraction unit on which the light-emitting diode chip is covered.

The surface-mounted light-emitting diode lamp according to claim 6, wherein the light extraction unit further includes an additive for converting light emitted from the chip, such as a fluorescent agent, a diffusing agent, and a dye.

The surface-mount type light emitting diode lamp according to claim 1, further comprising a peeling prevention engagement portion in the support layer and the light reflection layer.

Removing a part of the metal layer of the substrate provided with the metal layer on one surface of the support layer and separating the first layer and the second region;
A part of the support layer located above the first region of the metal layer and a part of the support layer located above the second region of the metal layer are respectively removed by irradiating with a laser, and the first region of the lower metal layer is removed. And exposing a part of the second region and mounting the light emitting diode chip on the exposed first region of the lower metal layer to electrically connect each electrode of the diode to the first region and the second region, respectively. A method of manufacturing a surface mount light emitting diode lamp comprising steps.

The method of claim 9, further comprising applying a light reflecting material on top of the support layer.

Removing a part of the lower metal layer of the substrate provided with metal layers on both sides of the support layer to separate the first region and the second region;
Forming a laser mask on the upper metal layer located above the first region;
Irradiating the inside of the region indicated by the laser mask with a laser to remove the support layer and exposing a part of the lower metal layer; and a light emitting diode chip in the first region of the exposed lower metal layer. A method of manufacturing a surface-mounted light-emitting diode lamp, the method comprising mounting and electrically connecting each electrode of the diode to a first region and a second region, respectively.

The method according to claim 11, wherein the laser mask is formed by etching away a portion of the upper metal layer.

The method according to claim 9, further comprising forming a reflective structure in a region where the chip is mounted on the exposed lower metal layer.