JP2008262877A - Manufacturing method of back plate for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a back plate for a PDP capable of obtaining a back plate for a PDP with stepped ribs by a simple method. <P>SOLUTION: The manufacturing method of the back plate for a PDP comprises a blast mask forming process forming a sand blast mask composed of a mask pattern for longitudinal ribs formed in the same pattern shapes as longitudinal ribs in an area in which longitudinal ribs on a rib material layer are formed, a lateral rib pattern in an area in which lateral ribs on the rib material layer are formed, and a mask pattern for lateral ribs formed in shapes of different non-continuous patterns by forming, exposing and developing a resist layer on the rib material layer of a member for back plate formation having formed a substrate, address electrodes formed on the substrate, a dielectric layer formed so as to cover the address electrodes, and the rib material layer formed on the dielectric layer, and a sand blast treatment process forming the longitudinal ribs and the lateral ribs by carrying out sand blast treatment on the rib material layer on which the sand blast mask is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a back plate for a plasma display panel having a stepped rib (hereinafter sometimes referred to as “PDP back plate”), and a PDP back plate forming substrate used in the manufacturing method.

  As shown in FIG. 4, a back plate used for a plasma display panel (hereinafter sometimes referred to as “PDP”) is usually a substrate 10, an address electrode 20 formed on the substrate 10, and an address electrode 20. It has a dielectric layer 30 formed thereon, a rib 40 formed on the dielectric layer 30, and a phosphor layer 80 (80R, 80G, 80B) formed in a region surrounded by the rib 40. . In addition, the conventional PDP back plate has a mainstream having striped ribs 40 as shown in FIG. 5 (a). However, in recent years, as shown in FIG. In addition, a PDP back plate having matrix ribs 41 having longitudinal ribs and lateral ribs has been proposed.

  The PDP back plate having matrix ribs can increase the amount of phosphor per unit area as compared with the PDP back plate having striped ribs, so that the luminance can be improved. Have advantages. In addition, among PDP back plates having such matrix ribs, a technology related to a PDP back plate having ribs (stepped ribs) having different heights between vertical ribs and horizontal ribs is known. By providing the step ribs, the phosphor screen can be easily formed in the manufacturing process. In addition, there is an advantage that the exhaust during the panel sealing is smooth.

  As a method of manufacturing a PDP back plate having such a step rib, for example, Patent Document 1 discloses a method of forming a step rib by performing dry film resist (DFR) lamination, plate making, and sandblasting twice. ing. However, particularly in this method, there is a problem that the second DFR lamination is difficult. That is, after forming the matrix rib by the first sand blasting and further laminating DFR on the upper bottom surface of the matrix rib, there is a problem that the end of the rib is chipped by the roller pressure. Further, when the laminating pressure is high, DFR enters into the holes of the already formed matrix ribs, making it difficult to make the DFR film thickness uniform, and there is a problem that exposure and development cannot be performed properly. It was. Furthermore, there is a risk that the DFR that has entered the hole of the matrix rib is not completely removed in the peeling process. On the other hand, when the laminating pressure is low, there is a problem that adhesion failure occurs and the DFR is peeled off during development or blasting.

  Another problem is that alignment of the second exposure is difficult. The exposure position accuracy of the DFR of the first layer is sufficient if the relative position accuracy of the rib with respect to the address electrode can be ensured, and the pad portion of the address electrode (substantially rectangular or substantially hexagonal formed at the position corresponding to the discharge portion). It is sufficient if the accuracy of the level that the portion) enters between the vertical ribs is obtained. However, if the DFR exposure of the second layer is performed with this degree of alignment accuracy, the DFR is displaced from the vertical rib, and the edge portion of the vertical rib is ground during blasting. In addition, since two DFRs are used, there is a problem that costs increase in both the equipment and the material. Therefore, a method for manufacturing a back plate for PDP that can solve these problems has been desired.

  Patent Document 2 discloses a method for manufacturing a plasma display panel, which includes a pre-process for forming barrier ribs having the same height and a post-process for providing a height difference in the barrier ribs.

Japanese Patent No. 3440907 JP 2001-236891 A

  The present invention has been made in view of the above circumstances, and a PDP back plate having a vertical rib and a horizontal rib having a height lower than the vertical rib can be obtained by a simple method. The main purpose is to provide a manufacturing method.

  The present invention includes a substrate, an address electrode formed on the substrate, a dielectric layer formed so as to cover the address electrode, a longitudinal rib formed on the dielectric layer, and the longitudinal rib. A method of manufacturing a back plate for a plasma display having a step rib composed of a low lateral rib, wherein the substrate, the address electrode formed on the substrate, and the address electrode are formed to cover the substrate. The rib material layer is formed by forming a resist layer on the rib material layer of the back plate forming member in which the dielectric layer and the rib material layer are formed on the dielectric layer, and exposing and developing the resist layer. The vertical rib mask pattern formed in the same pattern as the vertical rib in the region where the vertical rib is formed, and the pattern of the horizontal rib in the region where the horizontal rib is formed on the rib material layer Different A blast mask forming step for forming a sand blast mask composed of a lateral rib mask pattern formed in a discontinuous pattern, and a sand blast treatment for the rib material layer on which the sand blast mask is formed, thereby performing the vertical blast treatment. And a sandblasting process for forming the ribs and the lateral ribs.

  In the present invention, the rib material layer is sandblasted using the sandblast mask composed of the vertical rib mask pattern and the horizontal rib mask pattern. In the region where the vertical rib is formed, a vertical rib mask pattern having the same pattern as the vertical rib pattern is formed, and in the region where the vertical rib mask pattern is formed, the rib material layer is formed when sandblasting is performed. Can be prevented from being cut away. On the other hand, since the lateral rib mask pattern is formed in the region where the lateral rib is formed, the rib material layer in the region where the lateral rib is formed is removed when sandblasting is performed. Can be controlled. Thereby, when the sandblasting process is completed, a horizontal rib having a height lower than that of the vertical rib can be formed, and a back plate for a plasma display panel having a step rib can be manufactured. In the present invention, vertical ribs and horizontal ribs having different heights can be formed by a single sandblasting process using the same resist layer, which is preferable from the viewpoint of manufacturing efficiency and the like. Can do.

  In the invention described above, the lateral rib mask pattern is preferably an aggregate of floating island-like fine patterns. This is because it is possible to accurately control how the rib material layer in the lateral rib mask pattern region is cut, and the lateral rib can be formed at a target height.

  In the above invention, the pattern interval between the fine patterns adjacent to each other in the length direction of the horizontal rib mask pattern in the inner region of the horizontal rib mask pattern is the pattern in the side region of the horizontal rib mask pattern. It is preferable that the interval is wider. Furthermore, it is preferable that an area of the fine pattern in an inner region of the lateral rib mask pattern is smaller than an area of the fine pattern in a side region of the lateral rib mask pattern. Still further, the pattern spacing of the fine pattern in the inner region of the lateral rib mask pattern is wider than the pattern spacing of the fine pattern in the side region of the lateral rib mask pattern, and The area of the fine pattern in the inner region is preferably smaller than the area of the fine pattern in the side region of the lateral rib mask pattern. By making the shape of the lateral rib mask pattern the above pattern shape, when sandblasting is performed, the rib material layer in the lateral rib mask pattern region is shaved in the inner region and the side region. Can do. Therefore, it is possible to form the lateral ribs at a target height and a uniform height.

  Further, the present invention provides a lateral rib for adjusting the pattern interval or area of the fine pattern according to the height of the lateral rib to be formed and determining the shape of the lateral rib mask pattern before the resist layer forming step. It is preferable to have a mask pattern determining step. This is because the horizontal rib can be accurately formed at the intended height.

  The present invention also provides a substrate, an address electrode formed on the substrate, a dielectric layer formed so as to cover the address electrode, a rib material layer formed on the dielectric layer, and the rib A substrate for forming a back plate for a plasma display panel, which is formed on a material layer and has a sandblast mask for sandblasting the rib material layer, wherein the sandblast mask includes a plurality of vertical ribs formed in a line shape. A back plate for a plasma display panel, comprising: a mask pattern for horizontal ribs; and a mask pattern for horizontal ribs formed in a discontinuous pattern on a line connecting adjacent mask patterns for vertical ribs A forming substrate is provided.

  According to the present invention, since it has a sandblast mask composed of the mask pattern for vertical ribs and the mask pattern for horizontal ribs, the vertical ribs formed by sandblasting the substrate for forming a back plate for plasma display panel are provided. The height and the height of the lateral rib can be made different, and the substrate for forming a back plate for a plasma display panel having a step rib can be formed efficiently.

  In the present invention, a back panel for a plasma display panel having a step rib can be efficiently manufactured by a simple process.

  The present invention relates to a method for manufacturing a back plate for a plasma display panel having stepped ribs, and a substrate for forming a back plate for a PDP used in the manufacturing method. This will be described in detail below with reference to the drawings.

1. Back plate forming member forming step The back plate forming member forming step in this embodiment will be described. The back plate forming member forming step in the present embodiment includes a substrate, the address electrode formed on the substrate, the dielectric layer formed to cover the address electrode, and the dielectric layer. This is a step of forming a back plate forming member formed with the formed rib material layer. FIG. 2 is a perspective view showing a process of forming a back plate forming member in the present embodiment. First, an address electrode forming step (FIG. 2A) for forming the address electrode 20 on the substrate 10 is performed, and then a dielectric layer forming step for forming the dielectric layer 30 so as to cover the address electrode 20 (FIG. 2). (B)) is performed. Next, the back plate forming member 100 can be formed by performing a rib material layer forming step (FIG. 2C) for forming the rib material layer 42 on the dielectric layer 30. FIG. 2 shows a part of the member for forming the back plate, and the dimensional ratio is different from the actual one to help understanding.
Hereinafter, each of the above steps for forming the back plate forming member will be described in detail.

(1) Address Electrode Formation Step First, the address electrode formation step in this embodiment will be described. The address electrode forming step in the present embodiment is a step of forming the address electrode 20 on the substrate 10.

  The material of the substrate 10 used in the present embodiment is not particularly limited as long as it has a predetermined heat resistance, and the same material as the substrate used for a general PDP back plate is used. can do. Specific examples include glass and the like. Among them, high strain point glass that generates a small amount of distortion during firing of a dielectric or rib material is preferable.

  The material of the address electrode 20 used in the present embodiment is not particularly limited as long as it has conductivity, and the same material as that of the address electrode used for a general PDP back plate is used. can do. Specific examples include metals such as Ag. Further, the address electrode 20 used in the present embodiment may be a laminate of metal thin films, and specifically includes an electrode having a three-layer metal thin film such as Cr / Cu / Cr. it can.

  Examples of a method for forming the address electrode 20 on the substrate 10 include a photo paste method, a screen printing method, a thin film method, and the like. Among these, the photo paste method is preferable. Specifically, as the photo paste method, Ag paste containing a photosensitive resin is applied to the entire surface of the substrate by a screen printing method, dried, then exposed and developed in a predetermined pattern, and finally fired. The method etc. can be mentioned. On the other hand, as the thin film method, specifically, a Cr / Cu / Cr three-layer metal thin film is formed on the entire surface of the substrate by a sputtering method, a resist is applied to the outermost layer of the metal thin film, and then dried. Examples include a method of performing exposure and development with a predetermined pattern, etching the exposed metal thin film, and finally removing the resist.

(2) Dielectric Layer Formation Step Next, the dielectric layer formation step in this embodiment will be described. In the present embodiment, the dielectric layer forming step is a step of forming the dielectric layer 30 so as to cover the address electrodes 20.

  The material of the dielectric layer 30 used in the present embodiment is not particularly limited as long as it has a desired dielectric constant, and is the same as the material of the dielectric layer used for a general PDP back plate. Can be used.

  Examples of the method of forming the dielectric layer 30 include a screen printing method and the like. In addition, a slit die coating method or a film in which a dielectric layer is laminated on a base film is covered with the address electrode 20. The laminating method which laminates is mentioned. In the present embodiment, the dielectric layer is formed and then dried, but the dielectric layer may be fired as necessary.

(3) Rib material layer formation process Next, the rib material layer formation process in this embodiment is demonstrated. The rib material layer forming step in the present embodiment is a step of forming the rib material layer 42 on the dielectric layer 30. Examples of the method for forming the rib material layer 42 include a method in which a rib material layer forming material is applied onto the dielectric layer by a slit die coater method and dried. Application may be performed by a roll coater method or the like.

The film thickness of the rib material layer 42 formed by this step is appropriately selected according to the intended height of the longitudinal rib, and is usually about 100 μm to 300 μm, and more preferably about 120 μm to 160 μm. Further, as the rib material layer forming material for forming the rib material layer 42, for example, glass paste or the like is used. The glass paste is usually a glass frit having an average particle diameter of about 3 μm such as BiO ₂ , ZnO, B ₂ O ₃ , a filler composed of an inorganic component such as TiO ₂ , Al ₂ O _3, a resin component for making a paste, and Contains solvent.

  The configuration of the back plate forming member in the present embodiment is not particularly limited as long as it has a substrate, an address electrode, a dielectric layer, and a rib material layer. Depending on the situation, other members may be appropriately provided.

2. Blast Mask Formation Step Next, the blast mask formation step in this embodiment will be described. In the blast mask forming step in the present embodiment, a resist layer is formed on the rib material layer of the back plate forming member, exposed to light and developed, so that the vertical rib on the rib material layer is formed in the region. The mask pattern for vertical ribs formed in the same pattern as the vertical ribs and the discontinuous pattern different from the pattern of the horizontal ribs in the region where the horizontal ribs are formed on the rib material layer It is a step of forming a sandblast mask composed of a lateral rib mask pattern.

  The blast mask forming process in this embodiment will be described with reference to the drawings. 1A to 1C are perspective views showing a manufacturing method in the blast mask forming process of the present embodiment. First, as shown in FIG. 1A, a substrate 10, an address electrode 20 formed on the substrate 10, a dielectric layer 30 formed so as to cover the address electrode 20, and formed on the dielectric layer 30. The back plate forming member 100 having the rib material layer 42 containing the rib material is prepared.

Next, as shown in FIG. 1B, a step of coating the rib material layer 42 with a resist layer 50 by bonding a dry film resist onto the rib material layer 42 is performed. Subsequently, the resist layer 50 is subjected to mask exposure and development, and as shown in FIG. 1 (c), the vertical rib mask pattern 51x formed in the same pattern as the vertical rib and the horizontal rib are formed in the region. A step of forming a sandblast mask 51 composed of a lateral rib mask pattern 51y formed in a discontinuous pattern different from the rib pattern is performed. 1A to 1C show a part of the back plate forming member, and the dimensional ratio is different from the actual one to help understanding.
Hereinafter, each process for forming the sandblast mask 51 will be described in detail.

  A method for forming a resist layer in the present embodiment will be described. In the present embodiment, the step of forming a resist layer includes the substrate 10, the address electrode 20 formed on the substrate, the dielectric layer 30 formed so as to cover the address electrode 20, and the dielectric In this step, a resist layer 50 is formed on the rib material layer of the back plate forming member 100 in which the rib material layer 42 is formed on the layer 30.

  In this embodiment, as a method of forming the resist layer 50 on the rib material layer 42, a dry film resist in which a negative alkali-soluble resist or the like is laminated on a base film is laminated on the rib material layer. Although there is a method, it is not particularly limited, and a coating method or the like may be used. The resist layer 50 formed on the rib material layer 42 may be any resist layer that can be exposed and developed as will be described later, and the same one as that used when manufacturing a general plasma display is used. Can do. The film thickness of the resist can be the same as that in manufacturing a general plasma display.

  The mask pattern for vertical ribs formed in this step is formed on the rib material layer in the region where the vertical ribs are formed, and the shape of the mask pattern for vertical ribs is the target vertical rib pattern and The same, that is, a plurality of lines. The width of each line is usually about 30 μm to 120 μm, especially about 50 μm to 80 μm. The plurality of lines are usually formed in parallel.

  Further, the horizontal rib mask pattern formed in this step is formed in the rib material layer in the region where the horizontal rib is formed, and the shape of the horizontal rib mask pattern is the same as the pattern of the desired horizontal rib. Are different discontinuous patterns. Forming in a discontinuous pattern different from the pattern of the horizontal ribs referred to in the present embodiment means forming the target horizontal rib pattern into a shape divided into two or more fine patterns.

  The shape of the fine pattern constituting the mask pattern for the horizontal rib is not particularly limited as long as it can form a horizontal rib having a height lower than that of the vertical rib when sandblasting described later is performed. Many floating island-like fine patterns can be formed in the region where the lateral ribs are formed. Thereby, in the sandblasting process, it is possible to suppress variations in how the fine pattern described later disappears. As the shape of the floating island-shaped fine pattern, a circular shape, an elliptical shape, a square shape, a rectangular shape, a rounded rectangular shape, a trapezoid shape, or the like can be used. Also, a horizontal rib mask pattern may be formed by combining a plurality of these fine pattern shapes. In the present embodiment, it is particularly preferable that the fine pattern constituting the horizontal rib mask pattern is not in contact with the vertical rib mask pattern. If they are in contact, the resist of the horizontal rib mask pattern that is in contact with the vertical rib mask pattern will remain when sandblasting, which will be described later, and the horizontal rib of that portion will have the same height as the vertical rib Because.

  Each of the horizontal rib mask patterns may be an aggregate of fine patterns having the same shape, or may be an aggregate of fine patterns having different shapes. As one aspect of the mask pattern for horizontal ribs in this embodiment, as shown in the plan view of FIG. 3A, the side area of the mask pattern 51y for horizontal ribs (in the figure, p surrounded by a dotted line) The area of the fine pattern formed in the inner area (area indicated by q in the figure) of the lateral rib mask pattern 51y is smaller than the area of the fine pattern formed in the area shown in FIG. It is what. The lateral region of the lateral rib mask pattern refers to two regions outside the lateral rib mask pattern adjacent to the region without the sandblast mask pattern 51 (the region indicated by o in the figure). The inner region of the lateral rib mask pattern is a region sandwiched between the side regions of the lateral rib mask pattern. FIGS. 3A and 3B show a part of the PDP back plate forming substrate. In order to facilitate understanding, the dimensional ratio is different from the actual one, and hatching is also omitted.

  As another aspect of the horizontal rib mask pattern in the present embodiment, as shown in the plan view of FIG. 3B, the inner area of the horizontal rib mask pattern 51y (the area indicated by q in the figure). ) In the length direction of the lateral rib mask pattern 51y in the length direction (distance indicated by s in the figure) is a side region (in the figure, The pattern interval (the distance indicated by r in the figure) in the region indicated by p surrounded by a dotted line is larger. Here, the length direction of the mask pattern for horizontal ribs means a direction orthogonal to the mask pattern for vertical ribs.

  According to still another aspect of the lateral rib mask pattern in the present embodiment, the pattern interval of the fine pattern in the inner region of the lateral rib mask pattern is the same as that in the side region of the lateral rib mask pattern. The area of the fine pattern in the inner area of the lateral rib mask pattern is smaller than the area of the fine pattern in the side area of the lateral rib mask pattern. Is.

  The reason why the horizontal rib having a height lower than that of the vertical rib can be formed by making the horizontal rib mask pattern discontinuous will be described. Since a general resist layer used in manufacturing a plasma display is not ground by blasting, a rib material layer in a region where a vertical rib is formed is not ground. On the other hand, if the shape of the mask pattern for the lateral ribs is a discontinuous pattern, the abrasive enters between the fine patterns during the blasting process, and the rib material layer below is slightly ground. Even if each fine pattern itself is not ground, the grinding of the rib material layer between the fine patterns proceeds, and as a result, the fine pattern disappears from the rib material layer, and thereafter, the region where the lateral rib is formed is The entire rib material layer is ground. Accordingly, by combining the line-shaped vertical rib mask pattern and the discontinuous pattern horizontal rib mask pattern, the vertical rib and the horizontal rib having a height lower than the vertical rib are formed by one blasting process. It becomes possible.

  Next, the effect of changing the fine pattern in the region where the lateral rib is formed will be described. If the area of the fine pattern is equal, the fine pattern resist layer is more easily peeled off by sandblasting when the adjacent fine patterns are far from each other, that is, when the pattern interval is wider. This is probably because the wider the pattern interval, the easier it is for the abrasive to come off, so that the new abrasive easily enters between the fine patterns and the rib material layer is easily ground. When one fine pattern has a wide space and a narrow space between adjacent fine patterns, it tends to be affected by the narrow space. It is considered that the fine pattern is difficult to peel off when the interval is narrow and the rib material layer is difficult to be ground. Further, for one fine pattern, the length of the horizontal rib mask pattern is determined by the distance between the fine pattern adjacent in the length direction of the horizontal rib mask pattern and the fine pattern adjacent in the vertical rib mask pattern direction. There is a tendency to be affected by the distance in the vertical direction. This is because the normally used blast nozzle has a slit shape, and the longitudinal direction of the nozzle is perpendicular to the direction of the longitudinal rib, so that the blast jet flows into the direction along the longitudinal rib after colliding with the substrate. The tendency to flow is strong, the peeling of the resist fine pattern is affected by this air flow direction, and the longer the gap in the length direction of the mask pattern for the lateral ribs, the more easily the resist is beaten from the edge of the fine pattern by this air flow. This is probably because of this.

  On the other hand, if the fine pattern intervals are equal, the resist layer having a small pattern with a small area is weaker to external force than the fine pattern having a large area, and is easily peeled off by sandblasting. This is probably because the smaller the area, the smaller the adhesion with the rib material layer. As described above, the influence of the change in the fine pattern interval and the influence of the change in the area of the fine pattern on the ease of peeling of the fine pattern have different mechanisms. Therefore, by combining the change in the fine pattern interval and the change in the area of the fine pattern, it becomes possible to control the ease of peeling of the fine pattern more precisely. Therefore, the height of the lateral rib can be adjusted by adjusting the area of the fine pattern and the pattern interval.

  In addition, when the region where the lateral rib is formed is sandblasted, the side region of the lateral rib mask pattern is more easily ground than the inner region of the lateral rib mask pattern. This is presumably because the abrasive tends to enter the region surrounded by the vertical rib mask pattern and the horizontal rib mask pattern (the region where the sandblast mask is not formed). Since the tops of the horizontal ribs are preferably formed flat, the area of the fine pattern is increased in the side area compared to the inner area of the mask pattern for the horizontal ribs, and the pattern interval of the fine pattern is increased. It is preferable that the side region is narrower than the inner region.

  The size, shape, density, etc. of the individual fine patterns constituting the lateral rib mask pattern are appropriately selected according to the intended height of the lateral rib, the type of resist, and the like. The pattern spacing of the fine pattern on the side of the lateral rib mask pattern is preferably about 15 μm to 70 μm, more preferably about 25 μm to 40 μm. The pattern spacing of the fine pattern inside the lateral rib mask pattern Is preferably about 15 μm to 80 μm, more preferably about 25 μm to 60 μm.

The size of each fine pattern constituting the lateral rib mask pattern is usually 80 μm or less, particularly about 60 μm to 30 μm, and particularly about 50 μm to 40 μm. Moreover, 900μm ² ~4900μm ² approximately in the area of the upper bottom surface side portion, among them 900 .mu.m it is preferred to be a ^{2 ~2500μm 2} approximately, 900μm ² ~6400μm ² about inside, is a inter alia 900μm ² ~3600μm ² about It is preferable. The area of the upper bottom surface means the area of the surface opposite to the rib material layer of each fine pattern.

  Here, as a method of exposing and developing the resist in this step and forming a sandblast mask composed of the horizontal rib mask pattern and the vertical rib mask pattern having the above-mentioned shape, the resist is formed using a general photomask or the like. After the exposure, a method of developing, etc. can be used, and it can be the same as a general resist exposure and development method.

(Substrate for forming the back plate for plasma display panels)
Next, a substrate for forming a back plate for a plasma display panel in the present embodiment will be described with reference to FIG.
The PDP back plate forming substrate 101 of this embodiment includes a substrate 10, an address electrode 20 formed on the substrate 10, a dielectric layer 30 formed so as to cover the address electrode 20, and a dielectric layer 30. It has a rib material layer 42 formed thereon and containing a rib material, and a sandblast mask 51 formed on the rib material layer 42. The sandblast mask 51 includes a plurality of vertical rib mask patterns 51x formed in parallel, and the adjacent vertical rib masks on a line orthogonal to the vertical rib mask pattern 51x. The horizontal rib mask pattern 51y is formed in a discontinuous pattern so as to connect the 51x.

  When the back plate forming substrate for plasma display panel in the present embodiment is sandblasted, the rib material layer can be prevented from being scraped in the region where the vertical rib is formed. On the other hand, in the region where the horizontal rib is formed, the mask pattern for the horizontal rib is formed in a discontinuous pattern, so that the grinding is suppressed and the horizontal rib is removed after the mask pattern for the horizontal rib disappears. The area to be formed can be ground entirely. As a result, when the sandblasting process for the regions other than the vertical ribs and the horizontal ribs is completed, the rib material layer can be cut to some extent in the region where the horizontal ribs are formed. PDP rear plates having different heights can be manufactured. In addition, by using the PDP back plate forming substrate of the present embodiment, there is an advantage that it is possible to collectively form vertical ribs and horizontal ribs having different heights by a simple process.

3. Sandblasting process Next, the sandblasting process in the present embodiment will be described. The sand blasting process in the present embodiment is a process of forming the vertical ribs and the horizontal ribs by performing a sand blasting process on the rib material layer on which the sand blast mask is formed.

  1D to 1E are perspective views showing the sandblasting process of the present embodiment. As shown in FIG. 1 (d), the rib material layer 42 having the sandblast mask 51 composed of the longitudinal rib mask pattern 51x and the lateral rib mask pattern 51y is uniformly sandblasted using an abrasive. Sand blasting process is performed. Thereby, the rib material layer 42 in the region where the sandblast mask is not formed is completely removed. Further, the rib material layer 42 in the region where the vertical rib mask pattern 51x is formed is not ground by the sandblasting process, and can be formed into the vertical rib 43x. On the other hand, the region where the lateral rib mask pattern 51y has been formed can be the lateral rib 43y in which the lateral rib mask pattern is eliminated by sandblasting and the rib material layer 42 is partially ground. Thereafter, when the vertical rib mask pattern 51x is peeled off, a plasma display panel back plate 102 having stepped ribs 43 composed of vertical ribs 43x and horizontal ribs 43y as shown in FIG. 1E is obtained. . The horizontal ribs 43y are formed in a line shape so as to connect two adjacent vertical ribs 43x, and the vertical ribs 43x and the horizontal ribs 43y are normally formed to be orthogonal to each other.

  In the present embodiment, the rib material layer is sandblasted using the sandblast mask composed of the vertical rib mask pattern and the horizontal rib mask pattern. In the region where the vertical rib mask pattern is formed, the rib material layer is not affected by the sandblasting process, and the rib material layer remains at the initial film thickness. In the area where the sandblast mask is not formed, the rib material layer is immediately ground and the rib material layer is completely removed. Further, in the region where the lateral rib mask pattern is formed, grinding is suppressed due to the presence of the lateral rib mask pattern, and after the lateral rib mask pattern disappears, the rib material layer in the region where the lateral rib is formed Will be ground as a whole. That is, since the grinding start time of the rib material layer in the region where the lateral rib is formed is slower than the region where the sandblast mask is not formed, the rib material layer remains at a predetermined thickness when the sandblasting process is finished. It can be. This is because the lateral rib mask pattern is formed in a discontinuous pattern, that is, in a fine pattern, so that it is weak against physical external force and can be peeled and scattered during the sandblasting process. is doing. From the above, according to the present embodiment, it is possible to collectively form the vertical rib and the horizontal rib having a height lower than that of the vertical rib by a single sandblasting process, and efficiently in a simple process. A back plate for PDP can be manufactured.

  In this step, grinding is usually performed until no rib material layer is left in the region where the sandblast mask is not formed, but the end time may be appropriately adjusted according to the intended height of the lateral rib.

  As a sandblasting method in this step, a method of spraying an abrasive on the rib material layer from a substantially vertical direction and grinding the rib material layer can be generally used. The material of the abrasive is the same as that used for general sandblasting, and examples thereof include diamond, alumina, silicon carbide, calcium carbonate, glass beads, and stainless steel. Further, the processing conditions such as the blast pressure of the abrasive are the same as those in general sand blasting.

  In this embodiment, usually, after the sandblasting process is finished, a peeling process for peeling the vertical rib mask pattern from the rib material layer is performed. This stripping treatment can be performed using a general stripping solution.

4). Next, the firing process in this embodiment will be described. The firing step in the present embodiment is a step of firing the vertical ribs and the horizontal ribs after the sandblasting process. As a result, the rib material is melted and united to form a vitreous rib, and at the same time, organic substances contained in the rib are burned out, and a rib substantially made of an inorganic substance is formed.

  Since the shape is substantially maintained even if the rib dimensions are changed by firing, a step rib as shown in FIG. 1E is provided by performing a firing step of firing the vertical rib 43x and the horizontal rib 43y. A back plate 102 for a plasma display panel is obtained.

  The conditions such as the firing temperature, firing time, firing method, and the like are the same as those for a general PDP back plate, and thus the description thereof is omitted here.

5. Other Steps The present embodiment may have other steps as appropriate in addition to the above-described back plate forming member manufacturing step, blast mask forming step, sand blasting step, and firing step as appropriate. After the firing step, a phosphor layer forming step of forming a phosphor layer in a region surrounded by the step ribs is provided. Examples of the method for forming the phosphor layer include a screen printing method and a dispensing method. Moreover, in this embodiment, you may perform the washing | cleaning process which wash | cleans the surface after each process mentioned above.

  Further, in the present embodiment, in particular, before the blast mask forming step, a lateral rib mask for determining the shape of the lateral rib mask pattern by adjusting the shape and density of the fine pattern constituting the lateral rib mask pattern. It is preferable to have a pattern determination process. Hereinafter, the mask pattern determining step for the lateral rib will be described.

(Mask pattern determination process for horizontal ribs)
The lateral rib mask pattern determining step in the present embodiment is a step performed before the blast mask forming step, adjusting the area of fine patterns constituting the lateral rib mask pattern, the pattern interval, etc. This is a step of determining the shape of the mask pattern.

  As a method of determining the shape of the mask pattern for the lateral rib, a test pattern comprising a micropattern arranged at various pattern intervals on the same layer as the rib material layer or a micropattern having various areas is used. A pattern or the like is created, and the sandblasting process is performed in the same manner as the sandblasting process performed in the sandblasting process. The substrate is taken out every 10% of the normal blasting time, and it is confirmed at which timing the pattern is lost. Moreover, it can be set as the process of determining the area and pattern space | interval of the fine pattern which comprise the mask pattern for horizontal ribs in consideration of the height of the horizontal rib finally formed. In addition, the thickness of the resist pattern by the dry film and the exposure machine to be used, the pattern shape, the edge part, and the pattern gap part depending on the developing machine method and development conditions are different. Determine the area and pattern spacing.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to experimental examples and examples.

[Experiment 1]
A composition for forming a rib material layer was produced on a substrate by the following method.
(1) Preparation of frit mixture The frit mixture was prepared in the following manner.
Glass frit MB-10A (manufactured by Matsunami Glass Industry, d ₅₀ = 2.6 μm) ... 80 parts Filler (α-alumina RA-30 (manufactured by Iwatani Chemical Industry, d ₅₀ = 1.0 μm))
... 10 parts-Pigment (Dypyroxide Black # 9510 (manufactured by Dainichi Seika Kogyo)) ... 10 parts These are put in a fluororesin container and mixed for 15 minutes with a paint conditioner RC-5000 (manufactured by Red Devil). A frit mixture was made.

(2) Production of Rib Material Layer Composition A rib material layer composition was produced by adding the following additives to the frit mixture.
・ The above frit mixture: 80 parts ・ Etocel STD-100FP (manufactured by Dow Chemical Co., Ltd.) ... 1.44 parts ・ Diethylene glycol monobutyl ether acetate (manufactured by Junsei Kagaku) 9 parts Were uniformly mixed, and then kneaded by a three roll mill (manufactured by Inoue Seisakusho, C-4 · 3/4 × 10) to prepare a rib material layer composition.

  The above rib material layer composition is diluted with screen oil 759 (Okuno Pharmaceutical Co., Ltd.), adjusted to a viscosity of 500 poise at a shear rate of 15 [1 / sec] and 22 ° C., coated and dried with a blade coater, and film thickness A 160 μm solid film was prepared. The substrate on which the solid film was formed was heated to 80 ° C., and a 40 μm dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., OSBR film BF-605) was laminated on the solid film.

  Thereafter, the resist layer was subjected to pattern exposure using a proxy exposure machine, and then spray development was performed at a temperature of 35 ° C. using a 0.5% aqueous solution of anhydrous sodium carbonate. The exposure was performed using a framed exposure mask pattern (test pattern) 111 as shown in FIGS. The test pattern was a 30 μm square, a 40 μm square, a 50 μm square, and a 60 μm square square pattern with a fine pattern interval of 30 μm. As a result, a blast mask was obtained in which square fine patterns each having a side of 33 μm, 43 μm, 53 μm, and 63 μm and a frame surrounding them were formed. In this experimental example, since the film thickness of the resist layer is 40 μm, one side of the square pattern is set to 30 μm or more in consideration of the aspect ratio.

Next, sandblasting was performed with a large chamber blasting device for electronic display manufactured by Fuji Seisakusho using fused alumina A- # 800 (Fujimi Abrasives Industries Co., Ltd.) having an average particle size of 8 μm. The pressure was set to 0.7 kgf / cm ² , and the nozzle was reciprocated perpendicularly to the substrate feeding direction at a moving speed of 400 mm / second to set the substrate feeding speed to 500 mm / min. Table 1 shows the result of observing the state of the test pattern of the blast mask every time the substrate passes through the sandblasting apparatus once (one pass).

  From the results of Experimental Example 1, it was confirmed that the smaller the area of the fine pattern, the easier the fine pattern to fly (easy to peel) during the sandblast treatment.

[Experiment 2]
In the same manner as in Experimental Example 1, a blast mask was obtained on the solid film of the composition for the rib material layer. The exposure was performed using a framed exposure mask pattern (test pattern) 111 as shown in FIG. The test patterns were arranged so that the intervals between the square patterns of 40 μm square and the adjacent square patterns were 3 μm, 5 μm, 10 μm, 15 μm, 20 μm, 30 μm, 50 μm, and 100 μm. As a result, a blast mask in which square fine patterns arranged at the intervals and a frame surrounding them was formed was obtained. Each fine pattern had a side of 43 μm. In this experimental example, since the film thickness of the resist layer is 40 μm, one side of the square pattern is set to 40 μm in consideration of the aspect ratio.

  Next, sandblasting was performed in the same manner as in Experimental Example 1. Table 2 shows the result of observing the state of the test pattern of the blast mask every time the substrate passes through the sand blasting device once (one pass).

  From the results of Experimental Example 2, it was confirmed that the fine pattern was more likely to fly (easy to be peeled off) during the sandblast treatment as the fine pattern interval was wider.

[Production example]
A member for forming a back plate having a substrate, an address electrode, a dielectric layer, and a rib material layer was prepared by the following method, and a resist layer was formed on the rib material layer by the following method.
(1) Preparation of frit mixture The frit mixture was prepared in the following manner.
Glass frit MB-10A (manufactured by Matsunami Glass Industry, d ₅₀ = 2.6 μm) ... 80 parts Filler (α-alumina RA-30 (manufactured by Iwatani Chemical Industry, d ₅₀ = 1.0 μm))
... 10 parts-Pigment (Dypyroxide Black # 9510 (manufactured by Dainichi Seika Kogyo)) ... 10 parts These are put in a fluororesin container and mixed for 15 minutes with a paint conditioner RC-5000 (manufactured by Red Devil). A frit mixture was made.

(2) Production of Rib Material Layer Composition A rib material layer composition was produced by adding the following additives to the frit mixture.
・ The above frit mixture: 80 parts ・ Etocel STD-100FP (manufactured by Dow Chemical Co., Ltd.) ... 1.44 parts ・ Diethylene glycol monobutyl ether acetate (manufactured by Junsei Kagaku) 9 parts Were uniformly mixed, and then kneaded by a three roll mill (manufactured by Inoue Seisakusho, C-4 · 3/4 × 10) to prepare a rib material layer composition.

(3) Production of member for forming back plate with resist layer D-590-HV-MOD (manufactured by LS Japan Co., Ltd.) is printed in an electrode pattern on a 1030 × 1600 mm glass substrate as an address electrode by screen printing. Then, an electrode having a film thickness of 2 μm, a line width of 45 μm, and a pitch of 170 μm was formed. Next, PLS-3232 (manufactured by Nippon Electric Glass) was printed on the address electrodes as a dielectric layer by screen printing, dried and fired to form a dielectric layer having a thickness of 10 μm. Next, the rib material layer composition is diluted with screen oil 759 (Okuno Pharmaceutical Co., Ltd.), adjusted to a viscosity of 500 poise at a shear rate of 15 [1 / sec] and 22 ° C., coated with a die coater, and dried. A solid film having a thickness of 160 μm was prepared. The substrate on which the solid film was formed was heated to 80 ° C., and a 40 μm-thick dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., OSBR film BF-605) was laminated on the solid film.

[Example 1]
The resist layer-attached back plate forming member obtained in the production example was subjected to pattern exposure using a proxy exposure machine. As shown in FIG. 8A, the exposure pattern is a rectangular pattern having a pitch between vertical ribs of 330 μm, a vertical rib width of 60 μm, and a fine pattern of an exposure area corresponding to a mask pattern for horizontal ribs. The width of the space between the fine patterns adjacent in the length direction was 30 μm. FIG. 8A shows a part of the exposure pattern. After completion of the exposure, spray development was performed at a temperature of 35 ° C. using a 0.5% aqueous solution of anhydrous sodium carbonate. As a result, a blast mask having a rectangular floating island-shaped lateral rib mask pattern with a side of 53 μm was formed as the lateral rib mask pattern.
Next, using fused alumina A- # 800 (manufactured by Fujimi Abrasive Co., Ltd.) with an average particle size of 8 μm, the pressure was set to 0.5 kgf / cm ² , and a large chamber blast apparatus for electronic display made by Fuji Seisakusho was used. The sandblast treatment was performed. When grinding was performed until there was no rib material layer in the portion without the blast mask between the vertical ribs, the rib material layer in the portion corresponding to the vertical ribs remained completely. On the other hand, the portion corresponding to the horizontal ribs was peeled off from the rib material layer during blasting, and the mask pattern for horizontal ribs made in a floating island shape was ground, and grinding by blasting was performed in the middle, making the height lower than the vertical ribs. . Thereby, a step rib shape was formed. Subsequently, the blast mask was peeled off using a 1% aqueous solution of sodium hydroxide at a liquid temperature of 30 ° C. Thereafter, firing was performed at a peak temperature of 575 ° C., a holding time of 20 minutes, and a total firing time of 2 hours. The difference in height between the vertical rib and the horizontal rib of the obtained step rib was about 35 μm. The variation in height within one horizontal rib was 20 μm in range.

[Example 2]
The resist layer-attached back plate forming member obtained in the production example was subjected to pattern exposure using a proxy exposure machine. As shown in FIG. 8B, the exposure pattern was such that the pitch between vertical ribs was 330 μm and the vertical rib width was 60 μm. Of the exposure area corresponding to the lateral rib mask pattern, the fine pattern in the side region is a rectangle with a side of 50 μm, and the pattern interval is 30 μm. The fine pattern in the inner region was a rectangle having a side of 36 μm, and the pattern interval was about 25 μm. FIG. 8B shows a part of the exposure pattern. After the exposure was completed, development was performed in the same manner as in Example 1. As a result, a blast mask having a rectangular floating island-shaped horizontal rib mask pattern with sides of 53 μm and 38 μm was formed.
Next, sandblasting, peeling of the blast mask, and baking were performed in the same manner as in Example 1. The difference in height between the vertical rib and the horizontal rib of the obtained step rib was approximately 40 μm. The variation in height within one horizontal rib was 10 μm in range. Compared with Example 1, the top of the lateral rib could be formed flat.

[Example 3]
The resist layer-attached back plate forming member obtained in the production example was subjected to pattern exposure using a proxy exposure machine. As shown in FIG. 9A, the pattern of exposure was such that the pitch between vertical ribs was 330 μm and the vertical rib width was 60 μm. Of the exposure area corresponding to the mask pattern for lateral ribs, the fine pattern in the side region has a side of 50 μm and a pattern interval of 30 μm. The fine pattern in the inner region was 50 μm on a side and the pattern interval was about 57 μm. FIG. 9A shows a part of the exposure pattern. After the exposure was completed, development was performed in the same manner as in Example 1. As a result, a blast mask having a mask pattern for floating island-shaped horizontal ribs having a fine pattern of 53 μm and 38 μm on each side was formed.
Next, sandblasting, peeling of the blast mask, and baking were performed in the same manner as in Example 1. The difference in height between the vertical rib and the horizontal rib of the obtained step rib was approximately 40 μm. The variation in height within one horizontal rib was 10 μm in range. Compared with Example 1, the top of the lateral rib could be formed flat.

[Example 4]
The resist layer-attached back plate forming member obtained in the production example was subjected to pattern exposure using a proxy exposure machine. As shown in FIG. 9B, the exposure pattern has a pitch between the vertical ribs of 160 μm, the vertical rib width of 50 μm, the fine pattern of the exposure area corresponding to the horizontal rib is 50 μm on one side, and the gap width between the fine patterns is 30 μm. did. FIG. 9B shows a part of the exposure pattern. After the exposure was completed, development was performed in the same manner as in Example 1. As a result, a blast mask having a fine island-shaped floating island pattern with a side of 53 μm was formed.
Next, sandblasting, peeling of the blast mask, and baking were performed in the same manner as in Example 1. The difference in height between the vertical rib and the horizontal rib of the obtained step rib was about 30 μm. The variation in height within one horizontal rib was 10 μm in range. Even in the case of a relatively narrow pitch between vertical ribs, a step rib can be formed by using a mask pattern for horizontal ribs.

It is process drawing which shows an example of the manufacturing method of the backplate for PDP of this invention. It is process drawing which shows the manufacturing method of the member for backplate formation used for the manufacturing method of the backplate for PDP of this invention. It is explanatory drawing for demonstrating the mask pattern for horizontal ribs used for this invention. It is explanatory drawing for demonstrating the conventional back plate for PDP. It is explanatory drawing for demonstrating the conventional back plate for PDP. It is the schematic which shows the exposure mask pattern of the experiment example of this invention. It is the schematic which shows the exposure mask pattern of the experiment example of this invention. It is the schematic which shows the exposure mask pattern of the Example of this invention. It is the schematic which shows the exposure mask pattern of the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Board | substrate 20 ... Address electrode 30 ... Dielectric layer 42 ... Rib material layer 43 ... Step rib 43x ... Vertical rib 43y ... Horizontal rib 50 ... Resist 51 ... Sandblast mask pattern 51x ... Mask pattern for vertical ribs 51y ... Mask for horizontal ribs Pattern 100 ... Back plate forming member for plasma display panel 101 ... Back plate forming substrate for plasma display panel 102 ... Back plate for plasma display panel 111 ... Exposure mask pattern

Claims (7)

A substrate, an address electrode formed on the substrate, a dielectric layer formed so as to cover the address electrode, a longitudinal rib formed on the dielectric layer, and a height higher than the longitudinal rib A method of manufacturing a back plate for a plasma display having a step rib made of a low lateral rib,
For forming a back plate in which the substrate, the address electrode formed on the substrate, the dielectric layer formed to cover the address electrode, and a rib material layer are formed on the dielectric layer By forming a resist layer on the rib material layer of the member, exposing and developing, a vertical rib formed in the same pattern as the vertical rib in a region where the vertical rib is formed on the rib material layer A blast mask for forming a sandblast mask comprising a mask pattern for a rib and a mask pattern for a lateral rib formed in a discontinuous pattern different from the pattern of the lateral rib in a region where the lateral rib is formed on the rib material layer Forming process;
A sandblasting process for forming the vertical ribs and the horizontal ribs by performing a sandblasting process on the rib material layer on which the sandblast mask is formed;
A method for manufacturing a back plate for a plasma display panel.   2. The method for manufacturing a back plate for a plasma display panel according to claim 1, wherein the lateral rib mask pattern is an aggregate of floating island-shaped fine patterns.   The pattern interval between the fine patterns adjacent in the length direction of the lateral rib mask pattern in the inner region of the lateral rib mask pattern is wider than the pattern interval in the side region of the lateral rib mask pattern. The manufacturing method of the back plate for plasma display panels of Claim 2 characterized by the above-mentioned.   3. The plasma display panel according to claim 2, wherein an area of the fine pattern in an inner region of the lateral rib mask pattern is smaller than an area of the fine pattern in a side region of the lateral rib mask pattern. Method for manufacturing a back plate.   The pattern interval of the fine pattern in the inner region of the lateral rib mask pattern is wider than the pattern interval of the fine pattern in the side region of the lateral rib mask pattern, and in the inner region of the lateral rib mask pattern. 3. The method of manufacturing a back plate for a plasma display panel according to claim 2, wherein an area of the fine pattern is smaller than an area of the fine pattern in a side region of the lateral rib mask pattern.   Before the blast mask forming step, the pattern spacing and area of the fine pattern are adjusted according to the height of the lateral rib to be formed, and the shape of the lateral rib mask pattern is determined. 6. The method for manufacturing a back plate for a plasma display panel according to claim 2, further comprising a step. A substrate, an address electrode formed on the substrate, a dielectric layer formed to cover the address electrode, a rib material layer formed on the dielectric layer, and formed on the rib material layer And a back plate forming substrate for a plasma display panel having a sand blast mask for sand blasting the rib material layer,
The sandblast mask includes a plurality of vertical rib mask patterns formed in a line, and a horizontal rib mask pattern formed in a discontinuous pattern on a line connecting adjacent vertical rib mask patterns. A substrate for forming a back plate for a plasma display panel, comprising:

Images