JP2000215795A - Manufacture of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a plasma display panel with a reduced electric cost in burning and with a simple process, without wasting expensive low melting- point glass paste. SOLUTION: This manufacturing method comprises a process for executing a barrier rib pattern formation on a glass substrate 1 other than low melting- point glass, such as soda glass or the like, by a sand blast resistive photosensitive resist layer 9, and for grinding directly the glass substrate 1 of a back plate by sand blasting finish, to thereby form the barrier ribs, and an electrode formation process for forming an electrode pattern by forming the photosensitive resist layer 9 between the barrier ribs after the former process and for exposing and developing it, to thereby form an electric pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel, and more particularly to a method for manufacturing a back plate of a plasma display panel in which address electrodes are formed between partition walls. In particular, using a glass substrate other than low-melting glass as the back plate, forming a partition pattern with a sandblast-resistant photosensitive resist layer on the surface of this glass substrate A step of forming an electrode pattern by directly sandblasting a glass substrate, peeling a photosensitive resist layer to form a partition, forming a photosensitive resist layer at least between the partitions, and performing exposure and development to form an electrode pattern. And a method of manufacturing a plasma display panel including the same.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a back plate of a plasma display panel by sandblasting, a method of pattern-printing an electrode material by screen printing on a glass substrate to form an electrode, and a method of vacuum-depositing metal on the entire surface of a glass substrate. A method of forming an electrode by etching according to an electrode pattern, and a method of forming an electrode by forming an electrode pattern by exposing to light using a photosensitive electrode material are performed.

After the electrodes are formed as described above, a low-melting glass layer is formed on the glass substrate by applying a low-melting glass to the entire surface of the glass substrate by, for example, screen printing or a coater. Thereafter, a photosensitive dry film was laminated on the low-melting glass and exposed and developed to form a partition pattern. After that, portions other than the dry film were ground by sandblasting and the low-melting glass was fired to form the partition.

[0004]

A conventional method of processing using low-melting glass is to form an electrode by screen printing or a photo method on a flat surface to form an electrode on a glass substrate before forming a partition. After that, in the method of processing the low-melting glass by sandblasting, the low-melting glass is applied to the entire surface of the glass substrate and is shaved by sandblasting, and the shaved low-melting glass is discarded. Therefore, at present, expensive low-melting glass paste is discarded. In forming a partition as a high-definition rib of a plasma display panel, about 75% of the applied low-melting glass is discarded, and 25% is used as a plasma display panel.

[0005] Regarding disposal or recycling, the ground low-melting glass is mixed with the crushed abrasive during the grinding process, and it is difficult to separate and recycle the glass.

Further, since low-melting glass contains lead glass, it poses a problem of generating pollution and has a drawback that disposal processing is costly, which is an obstacle to the cost reduction of plasma display panels in the future.

Further, since low melting point glass is used, it is necessary to fire at a high temperature of about 550 ° C. in the final step, and at present, firing is carried out in an electric furnace, and the electric cost for firing is large. In addition, when the plasma display panel is disposed after use, harmful lead glass is used, so that it cannot be easily disposed of by burying.

[0008]

According to the present invention, in order to solve the above-mentioned problems, a partition wall is formed by directly sandblasting a glass made of lead-free glass or soda glass other than a low-melting glass serving as a back plate. Forming, then forming electrodes in the grooves between the partition walls, forming a partition pattern with a sandblast-resistant photosensitive resist layer on a glass substrate other than the low melting point glass, the back plate by sandblasting A step of grinding the glass substrate and stripping the resist to form a partition, and after this step, forming a photosensitive resist layer between the partitions and performing exposure and development to form an electrode pattern, and forming an electrode between the partitions. And forming an electrode. Then, in the electrode forming step, after forming a photosensitive resist layer at least between the partition walls, exposure and development are performed to form an electrode pattern for inserting an electrode between the partition walls, and an electrode coating is formed by screen printing, vapor deposition, or the like. After forming between the partition walls, the photosensitive resist layer is removed, or at least an electrode coating is formed between the partition walls by screen printing or vapor deposition, etc., and after forming the photosensitive resist layer on this electrode coating, exposure is performed. After the development and the formation of the electrode pattern by the photosensitive resist layer, it is performed by removing a portion other than the electrode pattern of the photosensitive resist layer by etching or sandblasting, and the photosensitive resist layer in the electrode forming step The step of forming between the partition walls,
A step of laminating a photosensitive dry film on a glass substrate on which the partition walls are formed and then heating to soften the photosensitive dry film and adhere the photosensitive dry film between the partition walls or a liquid photosensitive resin between the partition walls. To form a photosensitive resist layer between the partition walls.

In the electrode forming step, a photosensitive conductive resist layer is formed between the partition walls by using a photosensitive conductive dry film or a liquid photosensitive conductive resin in which a conductive material is cross-linked and then exposed and developed. To form an electrode pattern between the partition walls by the photosensitive conductive resist layer, and then bake off the resin in the photosensitive resist layer to leave only the electrode material, thereby forming electrodes between the partition walls.

Since the present invention does not use low-melting glass, it is the cheapest method in terms of material cost, and because it does not use harmful lead glass, it can be recycled, and there is no concern about pollution problems in disposal. .

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Partition wall forming step and electrode forming step Partition wall forming step A pattern is formed on a glass substrate other than low-melting glass with a photosensitive resist layer composed of a sandblast-resistant photosensitive resin, and the back plate is sandblasted. After forming a pattern by grinding the glass substrate, the photosensitive resist layer is peeled off to form a partition. As the photosensitive resist layer composed of a photosensitive resin, a method of forming a photosensitive resist layer by drying a dry film or a liquid on a glass substrate by screen printing, a roll coater, a spinner, or the like, followed by drying can be adopted.

Electrode Forming Step First, a pattern for forming an electrode is formed.
An electrode is formed after a photosensitive resist layer is formed on the entire surface of the partition on the glass substrate (the surface of the glass substrate on which the partition is formed) or between the partitions (the bottom of the groove between the partition and the partition and the opposing wall or the top of the partition including them). Exposure and development are performed by irradiating parallel light with a pattern (negative pattern) in which only the resist is lost, and an electrode pattern is formed. Then, the electrode material is inserted between partition walls by screen printing or a dispenser, or the electrode is formed by vacuum evaporation. An electrode is formed by depositing a material on the entire surface and removing the photosensitive resist layer.

As another method of forming the electrodes, an electrode material is deposited by screen printing, a dispenser or the like or by vacuum deposition to form an electrode coating, and a photosensitive resist layer having etching resistance or sand blast resistance is formed. A method in which an electrode is formed between partition walls by performing exposure and development with light to form an electrode pattern on an electrode material with a photosensitive resist layer, and then removing portions other than the resist by etching or sandblasting. Alternatively, as another electrode forming method, a photosensitive resist layer in which an electrode material is cross-linked and mixed in a photosensitive resist layer is formed, exposed and developed using parallel light to form an electrode pattern, and then baked. In this method, the resin is decomposed and removed by heat to bake an electrode material on the electrode pattern to form an electrode.

As a method of forming a photosensitive resist layer between the partition walls, a photosensitive dry film-like one or a liquid photosensitive resin is used. When using a photosensitive dry film, take advantage of the fact that the photosensitive dry film is easily softened by heat. Laminate the dry film on a glass substrate and then heat it to soften the dry film and allow it to flow down into the partition walls. A photosensitive film is formed by welding a dry film. When a liquid photosensitive resin is used, the photosensitive resin is diluted with a solvent to have a low viscosity state, and is poured between screen walls by screen printing or a dispenser and dried to volatilize the solvent to form a photosensitive resist layer. .

Partition Forming Step The case where the partition is formed by using the photosensitive dry film 7 will be described with reference to FIG. 1. In the first step, the photosensitive dry film 7 is formed as a photosensitive resist layer by the laminator 10. Is laminated on the glass substrate 1.
Since the photosensitive resist layer made of a sandblast-resistant dry film is generally a negative photosensitive resist film, a glass mask or a film mask 18 having a partition pattern in which light is applied to a portion that is not sandblasted is used. On the photosensitive dry film 7, ultraviolet light exposure is performed in the second step. After the exposure, as a third step, the development is performed by removing the glass mask or the film mask 18 and spraying a developing solution 16 of an alkaline aqueous solution with a shower to wash out the unexposed portions of the photosensitive resist layer. After development, drying is performed to form a resist mask 9 in which a partition pattern is patterned. As the fourth step, the partition wall 2 is formed by spraying an abrasive 15 from a nozzle 25 using a high-pressure air with a direct-pressure sandblasting device to grind a portion other than the resist mask 9 and peeling and removing the photosensitive resist layer. It is formed (fifth step).

Example 1 Photosensitive dry film for sandblasting: NIT650 manufactured by Nippon Synthetic Chemical Co., Ltd. Exposure during patterning: 300 mJ Sandblasting device: SC-5ADNH-404H (manufactured by Fuji Seisakusho) Nostle internal pressure: 2 kg / cm2 Working substrate size: 300 mm × 400 mm pattern (partition wall) width: 50 μm pitch between partition walls: 200 μm processing depth (partition height): 130 μm abrasive used: carborundum # 600 Partition formation processing was performed under the above conditions.

Next, an electrode pattern is formed between the partition walls formed by directly processing the glass substrate performed in Example 1.

Electrodes were formed on the glass substrate 1 on which the partition walls were formed in Example 1 by the following three methods.

Electrode forming method 1: FIG. 2 Step 11-1 The photosensitive dry film 7 is laminated on the entire surface of the glass substrate 1 using the laminator 10. 1-2 When a liquid photosensitive resist is used, the liquid photosensitive resist is applied to the entire surface of the glass substrate 1 or between the partition walls by screen printing or a dispenser.

Step 2 2-1 A protective film (not shown) adhered to the surface of the photosensitive dry film 7 is peeled off and heated. The photosensitive dry film 7 is softened by heating, and the photosensitive dry film 7 is caused to flow down between the partition walls by gravity to form a photosensitive dry film layer 8 welded to the surface between the partition walls. 2-2 The liquid photosensitive resist is dried and the solvent 8 is blown off to form a photosensitive resist film 8.

Step 3 Exposure is performed with a parallel light beam with the glass mask 18 placed. Here, the pattern of the glass mask used was a pattern in which only the electrodes were blackened.

Step 4 Since light is not applied only to the electrode portion, development with an alkaline aqueous solution developer 16 causes the photosensitive resist (photosensitive dry film) to be washed out only at the electrode portion, and the electrode to be exposed on the photosensitive resist layer. The pattern is patterned 9. The developing solution used was a 0.2% aqueous solution of sodium carbonate.

Step 5 An electrode material 5 made of a silver paste that can be fired at about 400 to 450 ° C. is poured between the partition walls 2 by using a screen printing squeegee 11 to form a patterned photosensitive resist layer 9.
To form an electrode. In addition, 12 is a plate frame of a screen printing machine. An electrode coating may be formed between the partition walls 2 by vacuum-depositing a conductive metal material such as copper. Generally, when an address electrode is formed by vacuum deposition on a plasma display panel, a structure of Cr-Cu-Cr is used.

Step 6 The glass substrate 1 on which the electrode coating is formed is immersed in an alkaline bath to swell and peel off the photosensitive resist 9, whereby the photosensitive resist layer 9 is washed out and the photosensitive resist layer 9 is removed. Only the silver paste remains, and the electrode 6
Was formed (Step 7).

In step 5, when a conductive paste such as a silver paste is used, 400
Baking at ~ 450 ° C to remove the binder resin and the like in the silver paste.

Electrode forming method 2: FIG. 3 A description of the same device configuration as that of FIG. 2 will be omitted.

Steps 1 and 2 A conductive paste flows between the partition walls 2 by screen printing and is applied. An electrode coating of a conductive metal material may be formed on the entire surface of the partition by vacuum evaporation. In the case of a conductive paste, it is dried.

Step 3 A photosensitive dry film is laminated as a photosensitive resist layer on the glass substrate 1 on which the partition walls 2 are formed. In this case, when sandblasting is used last, a sandblast-resistant photosensitive resin is used, and when etching is performed, an etching-resistant photosensitive resin is used.

Step 4 The photosensitive dry film is softened so that the photosensitive dry film flows down, and the photosensitive dry film is closely adhered between the partition walls. When a liquid photosensitive resin is used as the photosensitive resist layer, the liquid photosensitive resin is applied to the entire surface or between the partition walls by screen printing, a dispenser, or the like. This is dried and the solvent is blown off to form a photosensitive resist layer (Step 5).

Step 5 Exposure is performed with a parallel light beam while placing the glass mask 18. In the pattern of the glass mask, only the center between the partitions is exposed and the electrode material is introduced. In steps 1 and 2, when the conductive paste flows between the partitions 2 and is applied, the electrode material adheres to the upper portions of the partitions. Therefore, a pattern is used in which light is applied only to the portion where the electrodes are formed, that is, the center between the partitions and the upper portion of the partitions, and the other portions are shielded from light. A resist layer is formed on the head of the partition wall to prevent damage in a sandblasting process.

When the electrode material is present on the entire surface, a pattern is used in which light is applied only to the portion where the electrode is to be formed and the other portions are shielded.

Step 6 Since light is applied only to the portion of the pattern as an electrode, development with an alkaline aqueous solution developer 26 protects the electrode portion with a photosensitive resist (photosensitive dry film) layer 9 patterned as an electrode pattern. Is done.

As a developing solution, a 0.2% aqueous solution of sodium carbonate was used. When a conductive paste is used, the conductive paste attached to portions other than the electrode portions is removed by sandblasting. When a conductive metal is deposited by vacuum deposition, the conductive metal other than the electrodes is removed by etching (Step 7). When a conductive paste is used, it must be fired as a final step.

Thus, an electrode is formed inside the partition (step 8).

Electrode forming method 3: FIG. 4 A description of the same device configuration as in FIGS. 2 and 3 is omitted.

As a method for forming an electrode using a photosensitive electrode material, a step 1 is to apply a photosensitive conductive paste 3 between the partition walls 2 by screen printing. A photosensitive conductive dry film obtained by converting a photosensitive conductive paste into a dry film may be used. In this case, similarly to the photosensitive dry film, the photosensitive conductive dry film is softened, the photosensitive conductive dry film flows down by its own weight, and the photosensitive conductive film is brought into close contact between the partition walls. The silver paste of Dupont FODEL K3486 is used as the photosensitive conductive paste.

Step 2 The photosensitive conductive paste or the softened photosensitive conductive dry film is dried.

Step 3 A glass mask 18 is placed on the partition 2 to perform exposure with parallel light. The pattern of the glass mask 18 is such that light is applied only to the portion where the electrode is to be formed and the other portion is shielded from light.

Step 4 The photosensitive conductive dry film other than the electrode portion is removed by performing shower development, and baking is performed to remove resin, and the electrode is baked in the partition. Thus, an electrode is formed inside the partition (Step 5).

Sandblasting device A known suction type sandblasting device is preferably used as a sandblasting device used for forming a partition wall by grinding a glass substrate or removing an electrode material. A pressure sandblasting device is used.

In the embodiment of the present invention, the partition wall was processed by a direct pressure type sand blasting device, and the electrode was removed by a suction type sand blasting device because the electrode material was thin and a high grinding force was not required.

[Brief description of the drawings]

FIG. 1 is a view showing a partition forming step.

FIG. 2 is a view showing a step of forming an electrode after forming a photosensitive resist pattern between partition walls;

FIG. 3 is a view showing another step of forming an electrode in which an electrode material is poured between the partition walls and patterned with a photosensitive resist, and then the other than the resist is processed by sandblasting.

FIG. 4 is a diagram showing a step of forming a still another electrode by forming a photosensitive resist mixed with an electrode material between partition walls to form an electrode;

[Explanation of symbols]

Reference Signs List 1 glass substrate 2 partition 3 photosensitive conductive paste 4 patterned photosensitive conductive paste 5 conductive paste 6 patterned conductive paste 7 photosensitive dry film 8 photosensitive dry film (softened by heat and welded to partition) Layer 9 Photosensitive resist layer (comprising a patterned photosensitive dry film) or photosensitive resist mask 10 (Dry film) laminator 11 Screen printing squeegee 12 Screen printing frame 15 Mixed fluid of high-pressure air and abrasive 16 Developer 18 Glass mask or film mask 21 Injection nozzle (for suction type abrasive) 25 Injection nozzle (for direct pressure type abrasive)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4G059 AA07 AB06 AB07 AB11 AC01 AC11 BB08 DA01 DB08 5C027 AA02 AA09 5C040 GA02 GA03 GA09 GB08 GC19 GF19 JA02 JA07 JA15 JA17 JA21 KA16 MA22 MA26

Claims (6)

[Claims] 1. A partition pattern is formed on a glass substrate other than a low-melting glass with a photosensitive resist layer having sand blast resistance, and the glass substrate on the back plate is ground by sand blasting to peel off the photosensitive resist layer to form a partition. A plasma display comprising the steps of: forming a photosensitive resist layer between the partition walls after this step, and performing exposure and development to form an electrode pattern, and forming an electrode between the partition walls. Panel manufacturing method. 2. The electrode forming step comprises: forming a photosensitive resist layer between at least the partition walls; performing exposure and development to form an electrode pattern for inserting electrodes between the partition walls; and performing screen printing, vapor deposition, or the like. 2. The method according to claim 1, wherein the photosensitive resist layer is removed after forming an electrode coating between the partition walls. 3. The electrode forming step comprises: forming an electrode coating by screen printing or vapor deposition at least between the partition walls; forming a photosensitive resist layer on the electrode coating;
After performing exposure and development to form an electrode pattern by a photosensitive resist layer, the electrode pattern of the photosensitive resist layer is removed after removing a portion other than the electrode pattern of the photosensitive resist layer by etching or sandblasting. A method for manufacturing a plasma display panel according to claim 1. 4. The step of forming a photosensitive resist layer between the partition walls in the electrode forming step includes laminating a photosensitive dry film on a glass substrate on which the partition walls are formed, and then heating the photosensitive dry film. 4. The method for manufacturing a plasma display panel according to claim 2, comprising a step of softening the photosensitive dry film between the partition walls. 5. The method according to claim 2, wherein said step of forming a photosensitive resist layer between said partition walls in said electrode forming step comprises applying a liquid photosensitive resin between said partition walls by screen printing. Of manufacturing a plasma display panel. 6. The step of forming an electrode comprises forming a photosensitive conductive resist layer between the partition walls by using a photosensitive conductive dry film or a liquid photosensitive conductive resin in which a conductive material is cross-linked and then exposed and developed. Forming an electrode pattern by the photosensitive conductive resist layer between the partition walls, and then forming an electrode between the partition walls by baking off the resin component in the photosensitive resist layer and leaving only the electrode material. The method for manufacturing a plasma display panel according to claim 1.