JP2000277011A - Manufacture of back board for discharge type display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a groove having a sufficient depth and a barrier having sufficient width by forming barrier ribs having a predetermined height with two-stage sand blasting or etching, and baking the conductive paste so as to form the barrier ribs and electrodes at the same time. SOLUTION: A plate glass of a back board 2 is coated with a photosensitive film 3, and irradiated with the exposing light 1 through a pattern mask 4, and exposure and development are performed so as to form a pattern. The plate glass 2 is etched by chemical etching or sand blasting 7 using ceramic polishing agent. A top surface and side surfaces of the barrier 6 are coated with the protecting resin 8. After coating the protecting resin material 8, the plate glass 2 is deeply etched again by sand blasting 7 or chemical etching so as to form a second groove 9, and the barrier ribs 6 having a desirable height can be obtained. Conductive paste 10 is coated so as to be pushed into the groove 6 and the barrier ribs 6. The protecting resin material 8 is eliminated by the peeling agent, and baking is performed so as to complete the barrier 6 and an electrode 11. The number of man-hours and the number of baking can be remarkably reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a discharge type display device, a so-called plasma display panel, hereinafter referred to as a PDP.
In which a partition and an electrode are formed on the rear substrate.

[0002]

2. Description of the Related Art Partition walls of a PDP not only have a role of separating discharge for each pixel, but also are important parts that influence the luminance characteristics of a panel in order to apply a phosphor to the wall surface to emit light. . Therefore, the shape of the partition wall must be as narrow as possible, and the height of the partition wall must be about 100 μm or more in consideration of discharge characteristics. At the bottom of the groove between the partition walls, there is an address electrode extending in parallel with the partition walls. Usually, a dielectric layer is applied to cover the electrodes, and a fluorescent material is applied to the upper surface and the inner wall surface of the partition walls. Therefore, in consideration of the thickness due to these multilayer structures, it is necessary to ensure the interval from the upper surface of the phosphor to the front electrode to a sufficient depth required for discharge, that is, about 100 μm or more as described above.

Conventionally, the most common partition wall forming method is to form an address electrode and a dielectric layer by a screen printing method or the like, and then apply a low-melting glass serving as a partition wall material to a required thickness on the entire surface. Is applied in close contact, a pattern is formed, a groove is carved by sand blasting or the like, and then the photosensitive film is peeled off and gradually removed to bake the partition wall material.

A method has also been proposed in which grooves and partition walls are formed directly on the rear glass without using the above-described partition material. An example of this method is shown in FIG. The photosensitive film 4 is directly adhered onto the glass sheet 2 to form a pattern, and the groove 5 and the partition wall 6 are formed by sandblasting or chemical etching 7. Thereafter, in order to form the electrode 11 in the groove 5, the conductive paste 10 is pressed and baked, and the conductive paste 10 on the upper surface of the partition wall is removed together with the photosensitive film 3. After the electrodes 11 are formed in this manner, a low-melting glass serving as a dielectric layer is similarly applied and baked. The phosphor is generally applied on the bottom surface and the wall surface inside the groove 5 by screen printing.

As a method of securing a sufficient groove depth when forming a groove, an invention (Japanese Patent Application No. Hei 10 (1994) -19783), which becomes the same person as the present invention, has been proposed.
0-123839), there is a two-step partition wall forming method in which sandblasting is stopped halfway, a resin or the like is applied so as to coat the upper surface and side wall surface of the formed partition walls, and then sandblasting is performed again. As a method of forming the electrodes and the phosphor layer after the grooves are formed first, there is a proposal by the same person as the present invention (Japanese Patent Application No. 9-148386) to use a metal wire as an electrode.

[0006]

By the way, the partition wall 6 formed as described above must have a width as small as possible, particularly a top portion, and a height of about 100 μm or more. In a high-resolution PDP for a high-definition TV or the like, formation of the partition walls is regarded as one of extremely difficult steps. Because, in the chemical etching process, it is difficult to increase the etching depth only in the height direction of the partition walls, and the photosensitive film 3 is likely to peel off with the etching time during the process. In the sandblasting method, heat is generated during the process, so that the photosensitive film 3 is peeled off. These problems become more conspicuous as the partition width decreases. Therefore, the limit of the partition width in the conventional partition formation method is about 60 μm, and usually 80 to 100 μm.
It was stopped to the extent.

Further, in the method of forming a groove by directly engraving glass, as shown in the figure, the cross-sectional shape of the groove is almost U because there is no dielectric layer under the partition material which is present in the method using the partition material. It becomes a character shape. Therefore, it has been difficult to make the partition wall width narrow and to dig deep the groove. When the cross-sectional shape is U-shaped, conductive paste having fluidity,
All of the dielectric paste, the phosphor paste, and the like easily flow and accumulate at the bottom, and there is a problem that a sufficient discharge space cannot be secured because the groove is filled.

[0008]

SUMMARY OF THE INVENTION In view of the above problems, the present invention aims to realize a partition forming method which can cope with a higher resolution of a PDP in the future. However, a partition having a sufficiently small width is formed. Thereafter, a material such as a resin agent that is resistant to sand blasting is formed again on the upper and side surfaces of the partition wall by a method such as screen printing. Thereafter, the partition walls having a desired height are formed by performing sand blasting again. Further, a method in which a conductive paste is applied to the inside of the groove while the resin material is left and baked, the resin material is removed, and the groove and the electrode are simultaneously formed.

[0009]

FIG. 1 is a cross-sectional view of a back glass substrate 2 and members formed thereon for explaining the steps of the present invention. First, in step A, a photosensitive film 3 is applied on the rear glass substrate 2, and is exposed to exposure light 1 through a pattern mask 4, and is subjected to a photolithography process of exposure and development to form a pattern as in step B. Do. Subsequently, in step C,
The back glass substrate 2 is engraved by chemical etching using hydrofluoric acid or the like or sandblasting method 7 using a ceramic abrasive to once terminate the groove formation. In the cross section at this time, the depth of the U-shaped groove 5 is not sufficiently deep, although the upper part of the partition wall 6 is sufficiently thin. In this state, a protective resin 8 such as a resin is applied to the upper surface and side surfaces of the partition 6 already formed. For this coating method, for example, a thick film screen printing method is suitable. The material of the protective resin 8 does not necessarily need to be photosensitive, and may be any resin material that is resistant to sandblasting and that can be peeled off with a suitable chemical or has the property of leaving no residue after firing.
Also, the photosensitive film 2 remaining as the first pattern
May be removed as in step D, but may be left as it is.

After the protective resin 8 is applied, it is dried and, as shown in step F of FIG. 2, the back glass substrate 2 is deeply carved again by sandblasting 7 to form a second groove 9 and a desired height. Obtain a partition. In the subsequent step G, conductive paste 1 of silver, aluminum, nickel, etc.
0 is pressed into the inside of the grooves 5 and 6. In this case, it is not necessary to apply a pattern in accordance with the partition walls, so that the application may be performed directly without using a screen or the like.

In the step H, the protective resin 8 is removed by a method such as using a release agent and baked to complete the partition 1.
It is also possible to burn off the protective resin 8 simultaneously with the firing of the conductive paste 10.

[0012]

According to the partition wall forming method of the present invention, when a partition wall, that is, a groove is directly carved in a glass substrate in the conventional method, a predetermined depth is ensured because the sectional shape becomes U-shaped. Was difficult, but it was possible to form grooves of sufficient depth and partition walls of sufficient width, and also possible to form electrodes in the same process, enabling a significant reduction in the number of steps and firing times. Become. By using the thus formed narrow and sufficiently high partition walls for the PDP, the discharge characteristics are improved by providing a sufficiently large discharge space, and further, the luminance is improved by increasing the phosphor application area. To contribute.

[0013]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a process according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional process.

[0014]

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Exposure light 2 Plate glass 3 Photosensitive film 4 Pattern mask 5 Groove 6 Partition wall 7 Sandblast or chemical etching 8 Protective resin material 9 Second groove 10 Conductive paste 11 Electrode A, B, ------ H Each process

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[Procedure amendment]

[Submission date] June 14, 1999 (1999.6.1
4)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] All figures

[Correction method] Change

[Correction contents]

FIG.

FIG. 2

Claims (1)

[Claims] As a manufacturing method for forming a back-side substrate of a discharge type display device, a so-called PDP, a photosensitive film is applied to a plate glass and patterned into a partition shape by an exposure method, and the partition wall is formed by a method such as chemical etching or sand blast. Forming a plurality of stripe-shaped grooves for formation, and then a material such as a resilient resin material that can withstand sand blasting in accordance with the groove pattern, such as a screen printing method, the upper surface of the grooves, that is, the upper surfaces of the partition walls, and After coating on the side wall of the partition wall and drying the resin material, the sheet glass is cut until the depth of the groove, that is, the partition wall height reaches a predetermined size, by performing chemical etching or sand blasting again, and then silver, aluminum, nickel, etc. When the conductive paste of the above is applied to the inside of the groove and the resin material is removed together with the conductive paste on the surface. A discharge type display device in which a conductive paste is simultaneously fired and an electrode and a partition are simultaneously formed, so-called PD
A method for manufacturing a rear substrate of P.