JP3436211B2 - Method for manufacturing rear substrate of plasma display and method for manufacturing plasma display panel - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a back substrate of a plasma display and a plasma display panel.

[0002]

2. Description of the Related Art Conventionally, a CRT has been widely used as an image display device. However, the CRT has drawbacks such as a large outer volume and a large weight, and a high voltage is required. Diode (LED), liquid crystal display (LCD), plasma display panel (PDP),
Alternatively, flat-panel image display devices such as plasma addressed liquid crystal (PALC) have been developed, and the range of use thereof is expanding.

Above all, with the spread of multimedia,
The PDP used as a color display device for a large screen as an information interface has a simple structure utilizing plasma emission, and has a great potential as an image display device with a large screen, high image quality, light weight and thin shape and no restrictions on installation location. Is attracting attention.

Such a PDP is composed of two flat substrates, that is, a front substrate and a rear substrate, and a partition for partitioning the space, an electrode, a dielectric and a phosphor layer are formed between them. The minute space constituted by is used as a discharge display cell.

That is, each discharge display cell is generally provided with a pair of discharge electrodes on the front substrate and an address electrode for switching light emission of the discharge display cell on the rear substrate, and these electrodes are made of a dielectric material. Is covered with. Then, a dischargeable gas such as a rare gas is sealed in the cell, plasma is generated by discharge generated by selectively applying a voltage between the discharge electrodes, and vacuum ultraviolet rays emitted from the plasma The phosphor layer formed in the discharge display cell is caused to emit light and is used as a light emitting element of an image display device.

Here, the barrier ribs for constructing the discharge display cell are made of an insulating material, and in general, those in which metallic inorganic oxides are connected by lead glass are used.

Various methods are known for forming the partition walls, but at present, the sandblast method is predominant.
(See August issue, page 57, etc.). In this method, a rib is formed by applying a rib-forming material on a substrate to a predetermined thickness, masking a necessary portion, and blowing sand onto the mask to scrape off the unnecessary rib-forming material. .

In general, barrier ribs, dielectrics, and electrodes, which are components of a discharge display cell, are formed on a back substrate. In the current manufacturing process, (1) a step of forming an electrode on a glass substrate (2) a step of forming a dielectric layer thereon (3) a step of forming partition walls thereon, that is, electrode → dielectric → By forming the barrier ribs in this order, a back substrate as shown in FIG. 1 is manufactured. Since each process includes a substrate baking process, the substrate size varies for each process.

Therefore, if the dimensional accuracy becomes strict due to the demand for higher definition and the like, there arises a problem that it becomes difficult to align the electrode and the partition wall due to the dimensional change of the substrate due to the baking of the substrate.

Further, when the pixel pitch is narrowed, there arises a problem that a defect such as a short circuit between electrodes is likely to occur in the electrode forming process.

By the way, the partition walls are generally formed as independent pillars, but it is required to make the partition wall width narrower in order to increase the aperture ratio as the display becomes finer and brighter.

In this case, if the partition walls are formed as independent pillars, the thinner the partition walls are, the more likely the partition walls are to collapse.

Further, in order to increase the light emission brightness of each pixel, the light emission brightness of the phosphor itself may be increased. However, as another means, the light emitted from the phosphor is reflected to increase the brightness. Light may be taken out.

For this reason, the barrier ribs formed on the rear substrate are formed of a white material having a high reflectance, and a white dielectric material is also formed on the electrodes between the barrier ribs to maximize the reflectance of the substrate. It is preferable to raise it.

Further, it is desirable that the dielectric has a thickness that can suppress transmission of visible light to the back surface of the substrate. However, the thickness of the dielectric is generally about 10 to 15 μm because of the limitation of the drive voltage, that is, when the thickness of the dielectric increases, the drive voltage increases accordingly.

Therefore, in a plasma display manufactured using such a back substrate, there is a problem that a large amount of emitted light is transmitted to the back surface of the back substrate and sufficient brightness cannot be obtained.

[0017]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and its problems are (1) to (2) below.

(1) To provide a back substrate of a plasma display and a plasma display panel having a partition wall that does not collapse even if the partition wall width becomes narrow. (2) To provide a back substrate of a plasma display and a plasma display panel in which light emitted to the back surface of the back substrate is small.

[0019]

According to claim 1 - Summary of the inventors consists structures barrier ribs formed on the rear substrate has a concave shape, the rear substrate, visible light reflectance, the phosphor Is 50% or more in the state where is not applied,
The thickness of the structure bottom of the concave constituting the partition wall, before
Filling method of manufacturing a rear substrate of the serial structure der pulp plasma display more than the width of the barrier ribs of, as a means of partition wall forming, with intaglio reverse shape is formed in advance bulkhead, which in the rib paste Then, a method of manufacturing the rear substrate of the plasma display is characterized by using means for transferring the paste to a predetermined substrate.

[0020] According to a second aspect of the invention, using the rear substrate manufactured by the manufacturing method according to claim 1, is a manufacturing method of a plasma display panel, characterized in that bonded to the front substrate.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. Although only three columns of partition walls are shown in the drawing, the substrate is actually configured by a predetermined number of partition walls arranged according to the specifications of the rear substrate of the plasma display.

According to the first aspect of the present invention, the partition walls are not formed as independent columns, but as shown in FIG. 2, the partition walls have a common bottom, that is, the partition walls have a concave shape. It consists of structures. For this reason, even if the partition wall width becomes narrow, it does not easily fall. Further, the partition wall has a shape in which the bottom portion is common to other partition walls, that is, the partition wall is formed of a structure having a concave shape, and the visible light reflectance is 50% or more. In addition, as shown in FIG. 7, the thickness D of the bottom of the concave structure constituting the partition is
Is greater than the width d of the upper part of the partition wall . For this reason, the layer one general plasma display septum say at the partition wall width equal to or greater than the thickness of the is present at the bottom of the concave structure of the present invention. Therefore, the light transmission to the back surface of the substrate is equal to or less than the light transmission of the partition wall, that is, to the extent that there is practically no problem.

[0023]

EXAMPLES The present invention will be described below with reference to examples.

<Reference Example 1> Rib paste for sandblasting (PL made by Nippon Electric Glass Co., Ltd.)
S-3550) was coated on a glass substrate by screen printing to a thickness of 200 μm.

Thereafter, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated.

The dry film resist was exposed through a photomask having a stripe pattern with a pitch of 150 μm and an opening width of 50 μm to 200 using a high pressure mercury lamp.
Exposure was performed at [mJ / cm2].

After exposure, a 0.2% aqueous sodium carbonate solution was used to resolve a resist pattern having a pitch of 150 μm and a width of 50 μm.

A rib paste was formed into a concave shape on the substrate having the resist pattern formed thereon by using a sandblasting machine.

Then, the resist was stripped using a BF stripping solution (manufactured by Tokyo Ohka Kogyo Co., Ltd.), washed with water and dried.

The resist-peeled substrate was baked in a hot air baking furnace at 580 ° C. for 20 minutes to obtain a concave partition wall as shown in FIG.

Photosensitive silver paste (FODEL DC202 manufactured by DuPont) was applied to the partition walls by screen printing.
Was applied to the entire surface of the substrate. During the application, the attack angle of the squeegee was 20 degrees.

After the silver paste was dried, a high pressure mercury lamp was used as the dry film resist through a photomask having a stripe pattern having an opening width of 150 μm and an opening width of 30 μm and a terminal pattern for drawing out electrodes for forming an electrode pattern. Exposure at 200 [mJ / cm2].

After the exposure, a 0.2% sodium carbonate aqueous solution was used to resolve a stripe pattern having an electrode pitch of 150 μm and a width of 30 μm, and a terminal pattern extracted therefrom.

Thereafter, the substrate on which the electrode pattern was formed was fired in a hot air firing furnace at 550 ° C. for 20 minutes to obtain an electrode.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the entire surface of the substrate by screen printing. During the application, the attack angle of the squeegee was 20 degrees.

Thereafter, the substrate coated with the dielectric is
Firing was performed for 20 minutes at 530 ° C. in a hot air firing furnace to obtain a substrate having partition walls, electrodes and dielectrics as shown in FIG.

When the obtained substrate was evaluated, no short circuit between the electrodes occurred. Moreover, the partition walls could not be twisted or collapsed.

Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

Reference Example 2 Titanium oxide 90 was used as a rib paste for sandblasting.
By weight, 10 parts by weight of glass frit and 10 parts by weight of ethyl cellulose solution were kneaded with a roll mill to prepare a paste, which was coated to a thickness of 200 μm by a screen printing method.

This was subjected to the same steps as in Reference Example 1,
An electrode and a dielectric were prepared. The thickness of the bottom of the concave partition wall is 20
μm, and the reflectance of visible light other than the electrode portion was 50%.

By screen printing on this substrate, red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

<Reference Example 3> Rib paste for sandblasting (PL manufactured by Nippon Electric Glass Co., Ltd.)
S-3550) was coated on a glass substrate by screen printing to a thickness of 20 μm.

After that, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated.

A pitch of 150 μ for forming the electrode arrangement portion
The dry film resist was exposed at 200 [mJ / cm 2] using a high pressure mercury lamp through a photomask having a stripe pattern with an opening width of m and a width of 30 μm and a terminal pattern for drawing out electrodes.

After the exposure, a 0.2% aqueous sodium carbonate solution was used to resolve a stripe pattern having an electrode pitch of 150 μm and a width of 30 μm, and a terminal pattern.

On the substrate on which the resist pattern was formed on the rib paste, a sandblasting rib paste (PLS-3550 manufactured by Nippon Electric Glass) was further coated by 180 μm by a screen printing method.

Thereafter, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated.

A pitch of 150 μ for forming the partition pattern
The dry film resist was exposed at 200 [mJ / cm 2] using a high pressure mercury lamp through a photomask having a stripe pattern with an opening width of m and a width of 50 μm. In this exposure, the exposure was performed by shifting the pitch in the width direction of the stripe by 75 μm from the exposure of the above electrode pattern.

After the exposure, a 0.2% sodium carbonate aqueous solution was used to resolve a resist pattern having a pitch of 150 μm and a width of 50 μm.

The substrate having the resist pattern formed thereon is
Using a sandblasting machine (manufactured by Fuji Manufacturing Co., Ltd.), unnecessary rib paste was scraped off to the dry film resist where the pattern was formed first, and the rib paste was formed into a concave shape.

Thereafter, the resist was stripped using a BF stripping solution (manufactured by Tokyo Ohka Kogyo Co., Ltd.), washed with water and dried.

By the resist peeling, the resist which was patterned first is also peeled off. As a result, a concave portion as an electrode arrangement portion was formed at the bottom inside the concave portion of the concave structure forming the partition wall.

The substrate from which the resist has been peeled off is baked in a hot air baking oven at 580 ° C. for 20 minutes to form a concave shape and a partition wall in which a concave portion as an electrode arrangement portion is further formed on the bottom inside the concave portion. Got

Photosensitive silver paste (FODEL DC202 manufactured by DuPont) was applied to the partition wall by screen printing.
Was applied to the entire surface of the substrate. During the application, the attack angle of the squeegee was 20 degrees.

After the silver paste was dried, a photomask having a stripe pattern having an opening width of 150 μm and an opening width of 30 μm and a terminal pattern for drawing out an electrode was aligned with the electrode arrangement portion to form an electrode pattern, and then a high pressure mercury lamp was used. Was used for exposure at 200 [mJ / cm 2].

After exposure, a 0.2% sodium carbonate aqueous solution was used to resolve a stripe pattern having an electrode pitch of 150 μm and a width of 30 μm, and a terminal pattern extracted from the stripe pattern.

After that, the substrate on which the electrode pattern was formed was fired in a hot air firing furnace at 550 ° C. for 20 minutes to obtain an electrode.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the inside of the partition wall recesses by screen printing on the substrate on which the electrodes were formed. During the application, the attack angle of the squeegee was 20 degrees.

After that, the substrate coated with the dielectric is
The substrate was fired at 530 ° C. for 20 minutes in a hot air firing furnace to obtain a substrate having partition walls, electrodes, and a dielectric material as shown in FIG.

By screen printing on this substrate, red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

When the obtained panel was evaluated, no short circuit between the electrodes occurred. Moreover, the partition walls could not be twisted or collapsed. The relative positional relationship between the electrode and the partition wall is constant over the entire surface, and is 75 μm in the width direction of the stripe from the midpoint in the width direction of the partition wall.
The middle point in the width direction of the electrode was arranged at a position separated by only.

<Reference Example 4> Rib paste for sandblasting (PL manufactured by Nippon Electric Glass Co., Ltd.)
S-3550) was coated on a glass substrate by screen printing to a thickness of 20 μm.

Thereafter, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated.

A pitch of 150 μ for forming the electrode arrangement portion
The dry film resist was exposed at 200 [mJ / cm <2>] using a high pressure mercury lamp through a photomask having a stripe pattern having an opening width of m and a width of 100 [mu] m and a terminal pattern for drawing out electrodes.

After exposure, a 0.2% aqueous sodium carbonate solution was used to resolve a stripe pattern having an electrode pitch of 150 μm and a width of 100 μm, and a terminal pattern.

The rib paste was coated again by screen printing to a thickness of 25 μm.

Then, only the portion inside the terminal pattern was coated again with the rib paste to a thickness of 160 μm by the screen printing method.

Then, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated on the entire surface of the substrate.

A pitch of 150 μ for forming the partition pattern
The dry film resist was exposed at 200 [mJ / cm 2] using a high pressure mercury lamp through a photomask having a stripe pattern with an opening width of m and a width of 50 μm. In this exposure, the exposure was performed by shifting the pitch in the width direction of the stripe by 75 μm from the previous exposure.

After exposure, a 0.2% sodium carbonate aqueous solution was used to resolve a resist pattern having a pitch of 150 μm and a width of 50 μm.

The substrate on which the resist pattern is formed is
Using a sandblasting machine (manufactured by Fuji Manufacturing Co., Ltd.), unnecessary rib paste was scraped off to the dry film resist where the pattern was formed first, and the rib paste was formed into a concave shape.

After that, the resist was stripped using a BF stripping solution (manufactured by Tokyo Ohka Kogyo Co., Ltd.), washed with water and dried.

The substrate from which the resist had been peeled off was baked in a hot air baking oven at 580 ° C. for 20 minutes to obtain partition walls having a concave shape and terminal portion concave portions as shown in FIG.

An ink jet printer was used to fill the partition with silver paste.

After that, the substrate on which the electrode pattern was formed was fired in a hot air firing furnace at 550 ° C. for 20 minutes to obtain an electrode.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the recesses of the partition wall by screen printing on the substrate on which the electrodes were formed. During the application, the attack angle of the squeegee was 20 degrees.

After that, the substrate coated with the dielectric is
Baking was performed at 530 ° C. for 20 minutes in a hot air baking furnace to obtain a substrate as shown in FIG.

Reference Example 5 By the same steps as in Reference Example 1, a partition wall made of a concave structure was produced.

After that, a 42-6 alloy wire (42 wt% Ni-6 wt% Cr-52% wt% having a wire diameter of 30 μm) was used.
Fe) was used as an electrode and was arranged at the bottom inside the recess.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the inside of the partition wall recesses by screen printing on the substrate on which the electrodes were arranged. During the application, the attack angle of the squeegee was 20 degrees.

Thereafter, the substrate coated with the dielectric is
The back substrate of the plasma display as shown in FIG. 5 was obtained by firing at 530 ° C. for 20 minutes in a hot air firing furnace.

Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Next, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum evacuation and gas filling are performed according to a conventional method to form a plasma display panel. It was made.

Reference Example 6 By the same steps as in Reference Example 3, a partition wall having a recess formed in the bottom of the recess of the recessed structure was produced.

Thereafter, a 42-6 alloy wire (42 wt% Ni-6 wt% Cr-52% wt%) having a wire diameter of 30 μm was prepared.
Fe) was used as an electrode and was fitted into the recess formed in the bottom inside the recess.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the inside of the partition wall recesses by screen printing on the substrate on which the electrodes were formed. During the application, the attack angle of the squeegee was 20 degrees.

After that, the substrate coated with the dielectric is
The back substrate of the plasma display as shown in FIG. 6 was obtained by firing at 530 ° C. for 20 minutes in a hot air firing furnace.

Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Next, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum evacuation and gas filling are performed according to a conventional method to form a plasma display panel. It was made.

Reference Example 7 Rib paste for sandblasting (PL made by Nippon Electric Glass Co., Ltd.)
S-3550) was coated on a glass substrate by screen printing to a thickness of 70 μm.

Thereafter, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated.

A pitch of 150 μ for forming the electrode arrangement portion
The dry film resist was exposed at 200 [mJ / cm <2>] using a high pressure mercury lamp through a photomask having a stripe pattern having an opening width of m and a width of 100 [mu] m and a terminal pattern for drawing out electrodes.

After the exposure, a 0.2% sodium carbonate aqueous solution was used to resolve a stripe pattern having an electrode pitch of 150 μm and a width of 100 μm, and a terminal pattern.

The rib paste was coated again by screen printing to a thickness of 25 μm. Then, only the portion inside the terminal pattern was coated again with the rib paste to a thickness of 160 μm by the screen printing method.

Thereafter, a dry film resist having a thickness of 25 μm (BF-703 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having sandblast resistance was laminated on the entire surface of the substrate.

150 μm pitch for forming partition pattern
The dry film resist was exposed at 200 [mJ / cm 2] using a high pressure mercury lamp through a photomask having a stripe pattern with an opening width of m and a width of 50 μm. In this exposure, the exposure was performed by shifting the pitch in the width direction of the stripe by 75 μm from the previous exposure.

After exposure, a 0.2% aqueous sodium carbonate solution was used to resolve a resist pattern having a pitch of 150 μm and a width of 50 μm.

The substrate having the resist pattern formed thereon is
Using a sandblasting machine (manufactured by Fuji Manufacturing Co., Ltd.), unnecessary rib paste was scraped off to the dry film resist where the pattern was formed first, and the rib paste was formed into a concave shape.

Thereafter, the resist was stripped using a BF stripping solution (manufactured by Tokyo Ohka Kogyo Co., Ltd.), washed with water and dried.

The substrate from which the resist had been peeled off was baked in a hot air baking oven at 580 ° C. for 20 minutes. As a result, the partition wall thickness,
The width is about 80% of that before firing, and the thickness of the bottom of the recess is about 5
A recess-shaped partition wall having a width of 5 μm and an upper width of the recess of 40 μm was obtained.

Photosensitive silver paste (FODEL DC202 manufactured by DuPont) was applied to the partition walls by screen printing.
Was applied to the entire surface of the substrate. During the application, the attack angle of the squeegee was 20 degrees.

After the silver paste was dried, a photomask having a stripe pattern having an opening width of 150 μm and an opening width of 30 μm and a terminal pattern for drawing out electrodes was aligned with the electrode arrangement portion to form an electrode pattern, and then a high pressure mercury lamp was used. Was used for exposure at 200 [mJ / cm 2].

Thereafter, the substrate on which the electrode pattern was formed was baked in a hot air baking furnace at 550 ° C. for 20 minutes to obtain an electrode.

A dielectric paste (NP-7972J manufactured by Noritake Co., Ltd.) was applied to the inside of the partition wall by screen printing on the substrate on which the electrodes were formed.

During the application, the attack angle of the squeegee was 20 degrees.

Thereafter, the substrate coated with the dielectric is
Baking was performed at 530 ° C. for 20 minutes in a hot air baking furnace to obtain a substrate as shown in FIG. 7.

Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

When the obtained panel was evaluated, no short circuit occurred between the electrodes. Moreover, the partition walls could not be twisted or collapsed.

<Example 1> As a means for forming partition walls, an intaglio plate having an inverted shape of the partition walls was used in advance, and rib paste was filled therein,
The paste was transferred to a predetermined substrate. As a result, concave
The upper width of the partition wall of the structure is 50 μm, and the bottom of the concave structure
A molded body having a thickness of 70 μm was obtained.

Then, when this was baked, the width,
Both thickness becomes about 80% before firing, upper portion width bulkhead and ing is 40 [mu] m, the thickness of the bottom portion of the concave structure is to obtain a partition wall of the concave shape of about 55 .mu.m.

[0109] Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

<Example 2> As a means for forming partition walls, an intaglio plate in which the reverse shape of the partition walls was previously formed was used, and rib paste was filled in this intaglio plate, and the paste was transferred to a predetermined substrate. As a result, the concave
A molded body was obtained in which the upper width of the partition wall of the structure was 50 μm and the thickness of the bottom of the concave structure was 50 μm.

Then, when this was fired, the width,
The thickness was about 80% before firing, the upper width of the partition wall of the concave structure was 40 μm, and the thickness of the bottom portion of the concave structure was about 40 μm.
A μm concave partition wall was obtained.

Screen printing of red, green,
The blue phosphor was poured and baked to complete the back substrate.
Then, prepare a front substrate in which a transparent electrode, a bus electrode, a transparent dielectric, and a MgO protective film are sequentially formed on a glass substrate, and after bonding the two together, vacuum exhaust and gas filling are performed according to a conventional method to produce a plasma display panel. did.

[0113]

As described above, according to the present invention,
(1) To provide a rear substrate of a plasma display and a plasma display panel having a partition wall that does not collapse even if the partition wall width becomes narrow. (2) To provide a back substrate of a plasma display and a plasma display panel in which light emitted to the back surface of the back substrate is small.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a back substrate of a general plasma display.

FIG. 2 is a cross-sectional view of a back substrate of a plasma display according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a back substrate of a plasma display according to a reference example of the present invention.

FIG. 4 is a cross-sectional view of a back substrate of a plasma display according to a reference example of the present invention.

FIG. 5 is a cross-sectional view of a back substrate of a plasma display according to a reference example of the present invention.

FIG. 6 is a cross-sectional view of a back substrate of a plasma display according to a reference example of the present invention.

FIG. 7 is a cross-sectional view of a back substrate of a plasma display according to an example and a reference example of the present invention.

FIG. 8 is a plasma display according to a modification of the first embodiment of the present invention.
It is sectional drawing of the back substrate of a display.

FIG. 9 is a plasma display according to a modification of the second embodiment of the present invention.
It is sectional drawing of the back substrate of a display.

FIG. 10 is a plasma display in one reference example of the present invention.
It is sectional drawing of the back substrate of a ray.

[Explanation of symbols]

10 ... Board 20 ... 30 ... Electrode 40..Dielectric 50 ... Metal wire

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01J 11/02

Claims (2)

(57) [Claims] 1. A partition wall formed on the rear substrate made of a structure having a concave shape, the rear substrate, and the visible light reflectance is 50% or more in a state not applied in the phosphor, the thickness of the structure bottom of the concave constituting the partition wall, before
Filling method of manufacturing a rear substrate of the serial structure der pulp plasma display more than the width of the barrier ribs of, as a means of partition wall forming, with intaglio reverse shape is formed in advance bulkhead, which in the rib paste Then, a method of manufacturing the back substrate of the plasma display, characterized in that means for transferring the paste to a predetermined substrate is used. 2. Using the rear substrate manufactured by the manufacturing method according to claim 1, a method of manufacturing a plasma display panel, characterized in that bonded to the front substrate.