KR100289651B1 - Method of Forming Phosphor Layer in Plasma Display Panel - Google Patents

Abstract

The present invention discloses a method for forming a phosphor layer of a plasma display panel, the method of the present invention comprises the steps of forming electrode patterns on the glass substrate in which the electrode bus, the resistance and the dot electrode are sequentially stacked; Applying a dielectric layer to a thickness of the electrode pattern on a portion of the glass substrate on both sides of the electrode pattern; Forming a partition on the dielectric layer; Printing a negative photosensitive phosphor paste on the barrier surface and the dielectric layer so that the surface of the electrode pattern is covered, and drying the negative photosensitive phosphor paste; Performing a back exposure process using the electrode pattern as a mask on the phosphor paste, and performing a development process on the exposed phosphor paste to form a phosphor pattern exposing the surface of the electrode pattern; And firing the phosphor pattern.

Description

Phosphor layer formation method of plasma display panel

The present invention relates to a plasma display panel, and more particularly, to a method of forming a phosphor layer for improving light emission luminance.

Plasma Display Panel (PDP), which is one of the flat panel display devices, consists of an array of discharge cells that can be discharged independently, and discharges each discharge cell independently according to an electrical signal applied from the outside. The desired video signal is reproduced.

Since the overall thickness of the PDP can be less than 10 cm, the thickness and weight of the PDP can be significantly reduced compared to the CRT display apparatus using an electron gun, and the narrow viewing angle of the liquid crystal display can be improved. . In addition, the PDP has a structure in which two light-transmitting substrates each having electrodes are bonded to each other. A barrier is formed between the pixels to define independent discharge spaces and to suppress crosstalk between pixels. By making the spacing of Rib wide, a large display apparatus can be manufactured easily.

1 is a cross-sectional view of a conventional direct current type PDP. As shown in the drawing, the direct current type PDP includes a rear glass substrate 1 having an anode 2 and a partition wall 6 formed thereon, and a front cage having a cathode 12 formed thereon. The substrate 11 is bonded to each other, and a discharge gas 20 such as argon (Ar), neon (Ne), or xenon (Xe) is sealed between the glass substrates 1 and 11.

Here, the anode 2 formed on the rear glass substrate 1 is composed of a resistor 2b connecting the dot electrode 2a and the electrode busbar 2c, wherein the resistor 2b and the electrode busbar 2c is covered by a dielectric layer 4 applied on the back glass substrate 1, and on the dot electrode 4, the upper surface of the dot electrode 2a is exposed in the discharge cell. . Further, red (R), green (G) and blue (B) phosphors for colorization within the range where the upper surface of the dot electrode 2a is not covered on the side surface of the partition 6 and the dielectric layer 4. 5) is applied.

However, in manufacturing the DC-type PDP as described above, the phosphor is usually coated by a printing method. When the phosphor is coated using the printing method, the phosphor is printed on the partition surface due to the flowability of the phosphor paste. In addition, when a large amount of phosphor paste is printed in order to apply phosphor on the partition surface, the phosphor paste printed on the partition surface flows down to cover the upper surface of the anode, thereby lowering luminance and decreasing manufacturing yield. There is a problem.

Accordingly, an object of the present invention is to provide a method for forming a phosphor layer of a PDP capable of obtaining high luminance.

1 is a cross-sectional view showing a conventional DC plasma display panel.

2A to 2E are cross-sectional views of a series of steps for explaining a phosphor layer forming method according to an embodiment of the present invention.

(Explanation of symbols on the main parts of drawing

21: glass substrate 22: electrode pattern

22a: electrode bus 22b: resistance

22c dot electrode 23 dielectric layer

24 partition wall 25 photosensitive phosphor paste

25a: phosphor pattern 26: phosphor layer

The phosphor layer forming method of the present invention for achieving the above object comprises the steps of forming electrode patterns on the glass substrate in which the electrode bus and the resistance and the dot electrode are sequentially stacked; Applying a dielectric layer to a thickness of the electrode pattern on a portion of the glass substrate on both sides of the electrode pattern; Forming a partition on the dielectric layer; Printing a negative photosensitive phosphor paste on the barrier surface and the dielectric layer so that the surface of the electrode pattern is covered, and drying the negative photosensitive phosphor paste; Performing a back exposure process using the electrode pattern as a mask on the phosphor paste, and performing a development process on the exposed phosphor paste to form a phosphor pattern exposing the surface of the electrode pattern; And firing the phosphor pattern.

According to the present invention, since the surface of the dot electrode can be prevented from being covered by the phosphor while increasing the coating area of the phosphor, high brightness can be obtained and the production yield can be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A through 2E are cross-sectional views illustrating a method of forming a phosphor layer according to an exemplary embodiment of the present invention.

First, as shown in FIG. 2A, electrode buses 22a are formed on the glass substrate 21, and a resistor 22b and a dot electrode 22c are sequentially formed thereon to form electrode patterns 22. Do it. Then, the dielectric layer 23 is applied to the thickness of the electrode pattern 22 on the glass substrates on both sides of the electrode pattern 22 within the range not covering the upper surfaces of the dot electrodes 22c. Here, the electrode pattern 22 is formed in a stacked form so that a back exposure process performed in a subsequent process is easily performed.

Next, as shown in FIG. 2B, a partition wall 24 defining a discharge space at a predetermined height is formed on the dielectric layer 23, and a screen mask is formed on the side surface of the partition wall 24 and the dielectric layer 23. By using the photosensitive phosphor paste 25, a negative type is used, and the photosensitive phosphor paste 25 is printed with a thickness sufficient to cover the upper surface of the dot electrode 22c.

Next, as shown in FIG. 2C, an electrode pattern 22 is formed by performing a back exposure process using the electrode pattern 22 on which the electrode bus line 22a, the resistor 22b, and the dot electrode 22c are stacked as an exposure mask. ) The photosensitive phosphor paste portions on both sides are cured.

Subsequently, as shown in FIG. 2B, an unexposed photosensitive phosphor paste portion, that is, a portion disposed on the electrode pattern 22 in the drawing is developed with an alkaline solution to expose the electrode pattern 22 ( 25a).

Then, as shown in FIG. 2E, the firing process is performed in a state where the above-described processes are repeatedly performed to form red, green, and blue phosphor patterns 25a exposing electrode patterns in each discharge cell. The phosphor layer 26 is formed in each of the discharge cells.

At this time, shrinkage of the phosphor pattern occurs during the firing process, thereby ensuring sufficient discharge space, and the phosphor layer 26 has a maximum coating area within a range not covering the electrode pattern 22. do.

As described above, the present invention uses a negative photosensitive phosphor paste as a phosphor paste, and further exposes such a photosensitive phosphor paste to form a phosphor layer, thereby increasing the application area of the phosphor layer. Can be obtained. In addition, since the surface of the electrode can be prevented from being covered by the phosphor layer, the production yield can also be improved. In addition, since the phosphor layer is formed by the back exposure process, the design of the screen mask used for printing the photosensitive phosphor paste can be made very easy.

In the meantime, although the specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (2)

Forming electrode patterns on the glass substrate in which electrode buses, resistors, and dot electrodes are sequentially stacked; Applying a dielectric layer to a thickness of the electrode pattern on a portion of the glass substrate on both sides of the electrode pattern; Forming a partition on the dielectric layer; Printing a negative photosensitive phosphor paste on the barrier surface and the dielectric layer so that the surface of the electrode pattern is covered, and drying the negative photosensitive phosphor paste; Performing a back exposure process using the electrode pattern as a mask on the phosphor paste, and performing a development process on the exposed phosphor paste to form a phosphor pattern exposing the surface of the electrode pattern; And Firing the phosphor pattern; and forming a phosphor layer of the plasma display panel. The method for forming a phosphor layer of a plasma display panel according to claim 1, wherein the developing step is performed with an alkaline solution.