JP2001155625A - Dielectric material, method for forming electrode of plasma display panel, substrate for plasma display panel and plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive dielectric material which can induce a thinner line width of a bus electrode, the method for forming an electrode of the plasma display panel, the substrate for plasma display panel, and the plasma display panel. SOLUTION: The method for forming the electrode of the plasma display panel comprises a first step (figure 1 (b)) for applying photosensitive dielectric material 51 on a glass substrate 11 with formed transparent electrode 12a, a second step (figure 1 (c)) for partially removing the dielectric material 51 in a bus electrode forming site 52 by exposure and development, a third step (figure 1 (d)) for forming a bus electrode 12b by plating the bus electrode forming site 52, a fourth step for forming a first dielectric layer 14a by burning the dielectric material 51 along with the bus electrode 12b and a fifth step (figure 1 (e)) for forming a second dielectric layer 14b on the first dielectric layer 14a and the bus electrode 12b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric material used in a process of manufacturing a substrate for a plasma display panel, and a metal bus electrode formed on a transparent electrode formed on a transparent substrate using the dielectric material. The present invention relates to a plasma display panel electrode forming method, a plasma display panel substrate, and a plasma display panel.

[0002]

2. Description of the Related Art Plasma display panels (PDPs)
Various researches have been made on thin televisions or display monitors. Among them, a surface discharge type AC-PDP is one of the AC-PDPs having a memory function.
There is DP. Hereinafter, the structure of the AC-PDP will be described with reference to FIG.

FIG. 2 is a block diagram showing an AC-type power supply according to the background art of the present invention.
It is a perspective view which extracts and shows a part of structure of PDP. FIG.
As shown in the figure, the AC-PDP is a display-side front substrate (P
A DP substrate 1) and a rear substrate 3 disposed opposite to the front substrate 1 with the discharge space 2 interposed therebetween. The substrates 1 and 3 are arranged such that the top of the partition wall 33 of the rear substrate 3 is in contact with the surface of the front substrate 1, but FIG. 2 shows a state in which the substrates 1 and 3 are separated for convenience of explanation. Is illustrated.

The front substrate 1 is a glass substrate (transparent substrate) 1
1 and a plurality of row electrodes 12 provided in pairs.
And a dielectric layer 14 and a protective film 15. The row electrodes 12 of each pair extend in parallel with each other on the surface of the glass substrate 11 on the side of the discharge space 2. Each row electrode 12 includes a transparent electrode (SnO ₂ , ITO film or the like) 12 a formed on a glass substrate 11 and a transparent electrode 12 a.
a low-resistance metal bus electrode 12b formed on a part of the surface of a. The dielectric layer 14
A light-transmitting layer provided on the surface of the glass substrate 11 so as to cover the row electrodes 12. The protective film 15
MgO which is a dielectric formed on the surface of the dielectric layer 14
The protective film 15 and the dielectric layer 14 are sometimes collectively referred to as a dielectric layer.

The back substrate 3 includes a glass substrate 31, a plurality of column electrodes 32, partition walls 33, and a phosphor layer 34. The plurality of column electrodes 32 extend on the surface of the glass substrate 31 on the side of the discharge space 2 so as to be orthogonal to the row electrodes 12 (three-dimensional intersection), and a partition wall 33 is provided between adjacent column electrodes 32. It is formed to extend in parallel with the column electrode 32. The partition walls 33 serve to separate the discharge cells and also serve as columns for supporting the PDP so as not to be crushed by the atmospheric pressure. Then, the glass substrate 31
The phosphor layer 34R for red (R) emission and the green (G) emission for the U-shaped groove defined by the surface of Phosphor layer 34G or phosphor layer 34B for blue (B) emission
Any of the phosphor layers (collectively referred to as “phosphor layers 34”) is arranged in a stripe in a predetermined order so as to cover the column electrodes 32.

In the PDP thus configured, since the metal bus electrode 12b formed on the transparent electrode 12a is opaque, when the ratio of the bus electrode 12b to the area of the transparent electrode 12a increases, The light emitting area of each pixel is reduced, which causes a decrease in luminance. The decrease in luminance due to the increase in the area occupancy of the bus electrode 12b is caused by the PD
It becomes more remarkable as the definition of P increases. For this reason, PDP
In the formation of the bus electrode 12b, how to reduce the line width of the bus electrode 12b is an issue.

In the PDP constructed as described above, in order to effectively exert the function of the partition walls 33 for separating the discharge cells, the partition walls 33 of the front substrate 1 and the rear substrate 3 are required to seal the panel. Of the front substrate 1 (that is, the surface of the dielectric layer 14) needs to be flat.

On the other hand, there are mainly the following two methods for forming an electrode of a conventional PDP for forming the bus electrode 12b.

In the first method, as shown in FIG. 3, a conductive paste is applied by screen printing using a printing screen 41 and a squeegee 42 on a glass substrate 11 on which a transparent electrode 12b is formed. Electrode 12
b. The second method is to use a dry process method such as sputtering or vacuum deposition to form the bus electrode 1.
2b.

In both the first and second methods, after the formation of the bus electrode 12b, the transparent electrode 1 is placed on the glass substrate 11.
After applying a dielectric glass paste from above 2a and the bus electrode 12b, firing the dielectric glass paste,
A dielectric layer 14 is formed.

[0011]

However, in the first method using screen printing, the printing screen 4 is not used.
2 opening width and paste characteristics (for example, viscosity and solid content ratio,
There is a limit in thinning the line width of the bus electrode 12b due to the particle size of silver powder, etc., so that the opaque bus electrode 12b tends to occupy a large area with respect to the area of the transparent electrode 12a. There is a problem that resolution cannot be handled.

In the first method, a dielectric glass paste is applied to a glass substrate 11 having a bus electrode 12b having a large thickness and an uneven shape formed with the bus electrode 12b. There is a problem that the surface of the dielectric layer 14 is likely to have irregularities due to the formation of 14. As a method for preventing the irregularities on the surface of the dielectric layer 14,
There is a method in which the dielectric layer 14 is formed of low softening point glass and fired at a high temperature. However, depending on the material of the bus electrode 12b (for example, when silver is used), a diffusion reaction such as migration of the electrode material proceeds. And the glass substrate 11 is deformed. For this reason, as a result, the dielectric layer 14 cannot be fired at a high temperature, so that it is difficult to improve the uneven shape of the surface of the dielectric layer 14 by forming electrodes, and the surface of the front substrate 1 after panel sealing is difficult. There is a problem that interference with the top of the partition wall 33 of the rear substrate 3 occurs unevenly.

Further, the second method using the dry process method is excellent in thinning and thinning the line width of the bus electrode 12b, but requires the use of a vacuum apparatus.
There is a problem that it is difficult to reduce costs in terms of maintenance of production equipment and mass productivity.

Also, in the second method, when the thickness of the bus electrode 12b is increased, the dielectric layer 14 is formed on the glass substrate 11 having an uneven shape. A similar problem occurs in that the surface is likely to have irregularities.

In view of the above problems, the present invention provides
It is a first object of the present invention to provide a low-cost dielectric material capable of reducing the line width of a bus electrode, a method for forming an electrode of a plasma display panel, a substrate for a plasma display panel, and a plasma display panel.

Further, the present invention provides a method for forming an electrode of a plasma display panel, a substrate for a plasma display panel, and a plasma display panel capable of obtaining a flat dielectric layer surface without firing the dielectric layer at a high temperature. The second purpose is to provide.

Further, the present invention provides a method for forming an electrode of a plasma display panel, a substrate for a plasma display panel, and a plasma display panel in which characteristics such as a resistance value and a film thickness of a bus electrode can be easily adjusted. As a third object.

[0018]

According to a first aspect of the present invention, in a manufacturing process of a substrate for a plasma display panel, a transparent electrode is formed on a transparent substrate on which a transparent electrode is formed, and the transparent electrode is formed by firing. A dielectric material for forming a dielectric layer having the following formula: and having photosensitivity in a state before the firing.

According to a second aspect of the present invention, there is provided a plasma display panel using the dielectric material according to the first aspect, wherein a metal bus electrode is formed on a transparent electrode formed on a transparent substrate. An electrode forming method, comprising: a first step of applying the dielectric material according to claim 1 on a transparent substrate on which the transparent electrode is formed, from above the transparent electrode, and forming the bus electrode. A second step of partially removing the dielectric material of the bus electrode formation location to be exposed by exposure and development, and a second step of forming the bus electrode by plating on the bus electrode formation location from which the dielectric material has been removed. 3 steps.

According to a third aspect of the present invention, there is provided a method for forming an electrode of a plasma display panel, the method comprising: sintering the dielectric material together with the bus electrode to form a first dielectric layer. Further comprising:
And in the third step, the film thickness of the dielectric material and the bus electrode is substantially equal to the surface of the first dielectric layer and the surface of the bus electrode after the subsequent fourth step. It is set to form a plane.

According to a fourth aspect of the present invention, there is provided a method for forming an electrode of a plasma display panel, comprising the step of forming a second dielectric material having a light transmitting property on the fired dielectric material and the bus electrode. The method further includes a fifth step of forming a body layer.

According to a fifth aspect of the present invention, in the third step, the bus electrode is formed by laminating at least one kind of metal by electroless plating using the dielectric material as a plating resist. Is formed.

According to a sixth aspect of the present invention, in the third step, the exposed portion of the transparent electrode at the bus electrode forming portion from which the dielectric material has been removed is used as a plating electrode. Thus, at least one kind of metal is laminated by electrolytic plating to form the bus electrode.

According to a seventh aspect of the present invention, there is provided a plasma display panel substrate manufactured using the dielectric material according to the first aspect, wherein the substrate is formed on a transparent substrate and the transparent substrate. A transparent electrode, a bus electrode formed on the transparent electrode so as to cover a part of the transparent electrode, and the bus formed by sintering the dielectric material according to claim 1. A light-transmitting first dielectric layer formed on the transparent substrate so as to fill between the electrodes; and a light-transmitting second dielectric layer formed on the bus electrode and the first dielectric. A dielectric layer.

According to an eighth aspect of the present invention, there is provided a plasma display panel substrate according to the seventh aspect.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 (a) to 1 (e) are views showing a manufacturing process of a PDP substrate to which a PDP electrode forming method according to Embodiment 1 of the present invention is applied. Front substrate (PDP substrate) 1 to which electrode forming method according to this embodiment is applied (see FIG. 1E)
Is characterized in the method and structure of forming the bus electrode 12b and the dielectric layers 14a and 14b. The portions corresponding to those of the PDP in FIG. 2 described above are denoted by the same reference numerals, and redundant description is omitted. In this embodiment, as shown in FIG. 1E, the first and second dielectric layers 14a and 14b
This constitutes the dielectric layer 14.

The electrode forming method according to this embodiment includes first to fifth steps. In the first step, as shown in FIG. 1B, a photosensitive dielectric material (here, photosensitive dielectric material) is formed on the glass substrate 11 on which the transparent electrode 12b shown in FIG. Body glass paste) 5
1 is applied from above the transparent electrode 12b. The dielectric material 51 is a paste-like material including a dielectric glass powder, a photosensitive resin, and a solvent, and forms the dielectric layer 14a (see FIG. 14E) by firing. At the same time, in a state before baking, it has a photosensitivity that becomes insoluble or soluble in a developer by light irradiation.

Here, as an example of the photosensitive resin, a resin containing a photosensitive monomer such as methyl acrylate and ethyl acrylate and a polymerization initiator such as benzophenone is used. As the dielectric glass powder, a lead borosilicate glass mixture or the like is used, and as the solvent, terpineol, butyl carbitol acetate (BC
A) is used.

In the subsequent second step, as shown in FIG. 1C, the dielectric material 51 applied on the glass substrate 11 is used.
The portion of the bus electrode formation portion 52 where the bus electrode 12b is to be formed is partially removed by exposure and development to partially expose the transparent electrode 12a. Thereby, a mask pattern for plating is formed by the dielectric material 51 remaining without being removed by the exposure and the development.

In the subsequent third step, as shown in FIG. 1D, at least one type (here, a plurality of types) is formed in the bus electrode forming portion 52 where the dielectric material 51 is removed in a groove shape. (For example, copper, chromium, etc.) are laminated by electroless plating to form the bus electrode 12b.

More specifically, first, the glass substrate 11 after the second step is immersed in a palladium chloride solution after a predetermined treatment, and the dielectric material 51 remaining on the substrate 11 functions as a mask pattern. Then, palladium chloride serving as a catalyst for electroless plating is added only to the exposed transparent electrode 12b at the bus electrode formation location 52, and then the glass substrate 11 is immersed in an electroless plating solution (cyan in the presence of formalin). Bath) to deposit a metal for forming a bus electrode only on the transparent electrode 12a at the bus electrode formation location 52. Here, in order to form the bus electrode 12b by laminating a plurality of types of metals, it is necessary to sequentially change the electroless plating solution for immersing the glass substrate 11.

Here, in the first and third steps, the thickness of the dielectric material 51 and the thickness of the bus electrode 12b are
The surface of the first dielectric layer 14a obtained by sintering the dielectric material 51, taking into account the contraction rate of the dielectric material 51 when the dielectric material 51 is baked in a fourth step described later, The surface of the electrode 12b is set so as to form a substantially flat surface. Therefore, after the fourth step,
The surface of the first dielectric layer 14a and the surface of the bus electrode 12b are substantially flat.

In a subsequent fourth step, the dielectric material 51 used as a plating resist is fired together with the formed bus electrode glass 12b to form a first dielectric layer 14a having light transmittance (FIG. 14 ( e)). At the time of firing, there is no need to perform high-temperature firing as in the past,
The firing does not cause deterioration of the bus electrode 12b and the like.

In the subsequent fifth step, as shown in FIG. 14E, the first dielectric layer 14a and the bus electrode 12b
Light-transmitting second dielectric layer 1 covering the top
4b is formed. More specifically, the first dielectric layer 14
A second dielectric layer 14b is formed by applying a dielectric material (here, a dielectric glass paste) so as to cover the surfaces of the a and the bus electrode 12b and baking it.
In the fifth step, the protective layer 15 (see FIG. 2) may be formed.

Then, the front substrate 1 thus formed
2 (see FIG. 2) is combined with the rear substrate 3 formed in another process to constitute a PDP as exemplified in FIG.

As described above, according to this embodiment,
Dielectric material 51 for forming first dielectric layer 14a
Is a low-cost film-forming method using the dielectric material 51 applied on the glass substrate 11 as a plating resist for forming the bus electrode 12b by patterning by exposure and development because of having photosensitivity. The bus electrode 12b can be formed by plating, which is a method, and the line width of the bus electrode 12b can be easily reduced.

After the bus electrode 12b is formed by using the dielectric material 51 as a resist film, the dielectric material 51 is baked to form the first dielectric layer 14a. Therefore, there is an advantage that it is not necessary to remove it like a general resist film, and an increase in the number of steps in the manufacturing process can be suppressed.

The portion 52 of the bus electrode where the dielectric material 51 applied on the glass substrate 11 has been removed by exposure and development is formed in a groove-like shape.
Has been removed, and the bus electrode 12b is formed so as to fill the bus electrode formation location 52. Therefore, the thickness of the applied dielectric material 51 and the thickness of the bus electrode 12 are fired as described above. By firing the dielectric material 51 in consideration of the shrinkage due to the first dielectric material after firing, even if the film thickness of the bus electrode 12b is set large in order to realize a low resistance value. The surfaces of the layer 14a and the bus electrode 12b can be made substantially flat. As a result, when the second dielectric layer 14b is further formed thereon, it is sufficient to form the second dielectric layer 14b on a substantially already flat surface. The surface of the second dielectric layer 14b can be easily flattened without forming the second dielectric layer 14b by performing high-temperature baking with a dielectric material at a point. Display characteristics,
Life) can be improved and the bus electrode 1
The film thickness is set large while reducing the line width of 2b,
The bus electrode 12b having a low resistance value can be formed.

Further, in forming the second dielectric layer 14b,
Not only conventional dielectric materials with low softening point,
Dielectric materials having a relatively high softening point can also be used, which can extend the range of dielectric materials that can be used.

Since the bus electrode 12b is formed by laminating a plurality of kinds of metals by electroless plating, characteristics such as the resistance value and the film thickness of the bus electrode 12 can be easily adjusted.

Further, according to this embodiment, it is possible to provide front substrate 1 having a thin line width, a large film thickness (large aspect ratio), and low-resistance bus electrode 12b.

Further, by realizing a thinner line width and a lower resistance value of the bus electrode 12b, it is possible to provide a PDP capable of withstanding high brightness and high definition and efficiently driving pixels. Can be.

Embodiment 2 P according to the second embodiment
In the above-described third step, the DP electrode is formed not by electroless plating but by electrolytic plating in the third step.
The method is the same as that of the electrode forming method according to the first embodiment except for the formation of

In the third step according to this embodiment, as shown in FIG. 1D, at least one type (here, at least one type) is formed in the bus electrode forming portion 52 where the dielectric material 51 is removed in a groove shape. , A plurality of types) of metals (for example, copper, chromium, etc.) are laminated by electrolytic plating to form the bus electrode 12b.

More specifically, the exposed portion 52 of the bus electrode where the transparent electrode 12a is exposed is used as a plating electrode, and the dielectric material 51 remaining on the crow substrate 11 is used as a mask pattern to form a glass pattern. Substrate 11
Is immersed in an electrolytic plating solution (plating bath using copper sulfate or the like) to deposit a metal for forming a bus electrode only on the transparent electrode 12a at the bus electrode formation location 52. Here, in order to form the bus electrode 12b by laminating a plurality of kinds of metals, it is necessary to sequentially change the electrolytic plating solution for immersing the glass substrate 11.

As described above, also in this embodiment, the same effect as in the first embodiment can be obtained.

[0047]

Since the dielectric material according to the first aspect of the present invention has photosensitivity, the dielectric material applied on a transparent substrate on which a transparent electrode is formed is exposed to light. ,
It can be used as a resist film when forming a bus electrode by patterning by development. By forming a mask pattern for forming a bus electrode with this dielectric material, a low-cost film forming method such as plating is used for forming the bus electrode. Can be used, and the line width of the bus electrode can be easily reduced.

After a bus electrode is formed by using this dielectric material as a resist film, the dielectric material is baked to form a dielectric layer. Thus, there is an advantage that it is not necessary to remove as described above, and an increase in the number of steps in the manufacturing process can be suppressed.

According to the second aspect of the present invention, the use of a dielectric material as a plating resist makes it possible to reduce the line width of the bus electrode at low cost, as in the first aspect of the present invention. Effects can be obtained.

Further, as a further effect, the portion of the bus electrode where a part of the dielectric material applied on the transparent substrate is removed by exposure and development has a groove-shaped dielectric material removed therefrom. In order to form the bus electrode so as to fill the electrode formation location, the thickness of the applied dielectric material and the thickness of the bus electrode are made to correspond in consideration of shrinkage due to firing, and the dielectric material is fired. By forming the dielectric layer (first dielectric layer) as described above, even if the thickness of the bus electrode is set large to realize a low resistance value, the first dielectric layer after firing and the bus The surface with the electrode can be made substantially flat. As a result, when the second dielectric layer is further formed thereon, it is sufficient to form the second dielectric layer on a substantially already flat surface. The surface of the second dielectric layer can be easily flattened without forming the second dielectric layer by performing high-temperature baking with a dielectric material. Etc.) can be improved, and the bus electrode having a low resistance value can be formed by increasing the film thickness while reducing the line width of the bus electrode.

Further, not only a conventional dielectric material having a low softening point but also a dielectric material having a relatively high softening point can be used for forming the second dielectric layer.
The range of usable dielectric materials can be expanded.

According to the third aspect of the present invention, in the first and third steps, the thickness of the dielectric material and the thickness of the bus electrode are changed to the surface of the first dielectric layer after the subsequent fourth step. And the surface of the bus electrode are set so as to form a substantially flat surface, so that the flatness of the surface of the second dielectric layer formed thereon can be further improved.

According to the fourth aspect of the present invention, the first dielectric layer and the second dielectric layer are formed on the surfaces of the bus electrodes which are substantially already flat. The surface of the dielectric layer can be easily flattened without setting the baking temperature to a high temperature as in the prior art.
DP characteristics (display characteristics, lifetime, etc.) can be improved.

In forming the second dielectric layer, not only a conventional dielectric material having a low softening point but also a dielectric material having a relatively high softening point can be used. The range of suitable dielectric materials can be expanded.

According to the fifth aspect of the present invention, since at least one kind of metal is laminated by electroless plating to form a bus electrode, characteristics such as resistance and film thickness of the bus electrode can be easily adjusted. be able to.

According to the sixth aspect of the present invention, since at least one kind of metal is laminated by electrolytic plating to form a bus electrode, it is easy to adjust characteristics such as a resistance value and a film thickness of the bus electrode. Can be.

According to the plasma display panel substrate according to the seventh aspect of the present invention, since it can be manufactured by using the plasma display panel electrode forming method according to the first to sixth aspects, the line width is small. It is possible to provide a PDP substrate having a bus electrode having a large resistance (large aspect ratio) and a low resistance value.

According to the eighth aspect of the present invention, by realizing the thinning of the line width of the bus electrode and the low resistance value, it is possible to endure high brightness and high definition and to drive the pixels efficiently. PDP that can be provided.

[Brief description of the drawings]

FIGS. 1 (a) to 1 (e) are views showing a manufacturing process of a PDP substrate to which a PDP electrode forming method according to a first embodiment of the present invention is applied.

2 is a diagram illustrating a PDP to which the electrode forming method of the PDP of FIG. 1 is applied;
It is a perspective view showing an example of DP.

FIG. 3 is a diagram showing a conventional PDP electrode forming method.

[Explanation of symbols]

1 front board (PDP board), 3 back board, 11
Glass substrate (transparent substrate), 12 row electrode, 12a transparent electrode, 12b bus electrode, 14 dielectric layer, 14a first dielectric layer, 14b second dielectric layer, 15 protective layer, 51 dielectric material, 52 Bus electrode formation location.

Claims (8)

[Claims] In a manufacturing process of a plasma display panel substrate, a dielectric material is applied on a transparent substrate on which a transparent electrode is formed, and forms a dielectric layer having a light transmitting property by firing. A dielectric material having photosensitivity in a previous state. 2. A method for forming an electrode of a plasma display panel, comprising forming a metal bus electrode on a transparent electrode formed on a transparent substrate using the dielectric material according to claim 1, wherein the transparent electrode is A first step of applying the dielectric material according to claim 1 on the formed transparent substrate from above the transparent electrode; and applying the dielectric material at a bus electrode formation location where the bus electrode is to be formed. The second is partially removed by exposure and development
And the step of forming the bus electrode from which the dielectric material has been removed,
A third step of forming the bus electrode by plating. A method of forming an electrode for a plasma display panel, comprising: 3. The method for forming an electrode of a plasma display panel, further comprising: a fourth step of firing the dielectric material together with the bus electrode to form a first dielectric layer. In the step, the thickness of the dielectric material and the thickness of the bus electrode are substantially equal to the surface of the first dielectric layer and the surface of the bus electrode after the subsequent fourth step. 3. The method according to claim 2, wherein the electrodes are set as follows. 4. The method for forming an electrode of a plasma display panel according to claim 1, wherein:
The method according to claim 3, further comprising a fifth step of forming a second dielectric layer having optical transparency. 5. The bus electrode in the third step, wherein the bus electrode is formed by laminating at least one kind of metal by electroless plating using the dielectric material as a plating resist. 5. The method for forming an electrode of a plasma display panel according to any one of items 4 to 4. 6. In the third step, at least one kind of metal is subjected to electrolytic plating by using the exposed portion of the transparent electrode at the bus electrode forming portion from which the dielectric material has been removed as a plating electrode. 5. The method according to claim 2, wherein the bus electrodes are formed by lamination. 7. A substrate for a plasma display panel manufactured using the dielectric material according to claim 1, wherein: a transparent substrate; a transparent electrode formed on the transparent substrate; A bus electrode formed so as to cover a part of the transparent electrode; and a bus electrode formed by sintering the dielectric material according to claim 1, on the transparent substrate so as to fill a space between the bus electrodes. A first dielectric layer having a light transmitting property formed on the bus electrode and a second dielectric layer having a light transmitting property formed on the bus electrode and the first dielectric. Substrates for plasma display panels. 8. A plasma display panel comprising the plasma display panel substrate according to claim 7.