KR20000004389A - Method of fabricating rear substrate of plasma display panel - Google Patents

Abstract

PURPOSE: A method of fabricating rear substrate of plasma display panel is provided to prevent a misalign between electrode and barrier rib and to reduce the number of the baking. CONSTITUTION: The method of fabricating rear substrate of plasma display panel comprises the steps of: forming barrier ribs on a glass substrate; forming a electrode layer between the barrier ribs; forming a dielectric layer on the paste for electrode; baking the dielectric layer and the electrode layer; and after printing a fluorescent substance on the dielectric layer between the barrier ribs, drying and baking the fluorescent substance to form a fluorescent substance layer.

Description

Back substrate manufacturing method of plasma display panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a method for manufacturing a back substrate of a plasma display panel which can simplify the manufacturing process.

Plasma Display Panel (PDP), which is one of flat panel display devices, is a display device using gas discharge.

Since the PDP can be manufactured with a relatively thin thickness, the thickness and weight of the PDP can be remarkably reduced compared to the CRT display device using an electron gun. In addition, the PDP has emerged as a next-generation display device due to the advantage of easily manufacturing a large screen display device. .

A typical example of the PDP as described above is shown in FIG. 1, which will be described below. 1 is a cross-sectional view showing an AC PDP.

As shown, the back substrate and the front substrate fabricated through independent processes are bonded to face the arrangement surface of the electrodes formed on each of them, and in the space between the back substrate and the front substrate, argon (Ar), neon (Ne) ) Or a discharge gas (not shown) such as xenon (Xe) is sealed.

In the case of the back substrate, a plurality of address electrodes 2 are formed on the back glass substrate 10, and the address electrodes 2 are covered by the first dielectric layer 4, and the first dielectric layer ( 4) Barrier ribs 6 are formed on the barrier ribs 6 to limit independent discharge spaces and to suppress crosstalk between adjacent discharge spaces, and to realize colorization between adjacent barrier ribs 6. The phosphor layer 8 for this purpose is formed.

In the case of the front substrate, a plurality of discharge sustaining electrodes 14 collectively referred to as X electrodes and Y electrodes are formed on the front glass substrate 20, and the discharge sustaining electrodes 14 are formed on the second dielectric layer 16. ) And a protective layer 18 is formed on the second dielectric layer 16.

At this time, the discharge sustaining electrode 14 is composed of a transparent electrode 11 made of a transparent metal such as indium tin oxide (ITO) and an opaque metal bus electrode 12 formed thereon. The discharge sustaining electrodes called the X electrode 14a and the Y electrode 14b are arranged in pairs.

However, in the case of the back substrate of the conventional PDP as described above, since the electrode and the partition wall are formed through independent processes, the overall manufacturing process time is long, and several times during the printing process for forming the electrode and the partition wall. Since the process is performed, deformation of the substrate occurs, which causes a misalignment between the electrode and the partition wall.

In addition, there is a problem that the high definition of the pattern becomes more difficult to finer.

Accordingly, an object of the present invention is to provide a method for fabricating a back substrate of a PDP that can prevent misalignment between electrodes and partition walls and reduce the number of firings.

1 is a cross-sectional view for explaining a conventional AC plasma display panel.

2A to 2C are cross-sectional views illustrating a method of manufacturing a back substrate of a plasma display panel according to an exemplary embodiment of the present invention.

Figure 3 is a perspective view showing a back substrate according to an embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

21: glass substrate 22: bulkhead

23 electrode paste 24 electrode

25 Dielectric 26 Dielectric Layer

28: phosphor layer 30: black low melting glass

In order to achieve the above object, a method of manufacturing a back substrate of a PDP according to the present invention includes forming partitions on a glass substrate; Forming an electrode layer between the barrier ribs; Forming a dielectric layer on the electrode paste; Firing the dielectric layer and the electrode layer; and printing a phosphor on the dielectric layer between the barrier rib surface and the barrier ribs, and drying and firing the phosphor to form the phosphor layer.

According to the present invention, since the electrode is formed after the partition wall is formed, misalignment between the partition wall and the electrode can be prevented even if the substrate deformation caused by the firing process occurs.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2C are cross-sectional views illustrating a method of manufacturing a back substrate of a PDP according to an embodiment of the present invention.

First, as shown in FIG. 2A, the barrier ribs 22 are formed by repeatedly performing printing and drying processes on the glass substrate 21 to form the barrier rib patterns arranged at equal intervals and then firing to form the barrier ribs 22. . At this time, the shape of the partition wall 22 allows the intaglio pattern to be formed in consideration of the shape of the electrode to be formed later. In addition, when printing for forming the partition wall, a black paste is printed on the upper layer so that the contrast can be improved.

In addition, the process for forming a partition can also use the sandblasting method which is easy to adjust a pattern form instead of the printing process.

Next, the electrode paste 23 is printed between the partition walls 22 and dried. At this time, the electrode paste 23 uses a paste containing a solvent, an electrode material and a filler without adding a binder. In addition, the viscosity of the paste is made low so that the paste is not printed on the partition walls.

On the other hand, since the electrode paste used in the formation of a conventional electrode contains a binder, a firing step must be performed after the printing and drying of the paste. However, in the case of using an electrode paste containing no binder as in the embodiment of the present invention It is possible to prevent contamination and deterioration of film quality by the binder even if a firing step is performed after the subsequent step, for example, printing of the dielectric, without firing after drying.

Subsequently, as shown in FIG. 2B, a white dielectric 25 is printed and a drying process is performed to improve the visible light reflectivity of the phosphor layer to be formed later between the partition walls 22.

Subsequently, in the panel including the display area A in which the discharge cells are arranged and the non-display area B in which the electrode terminal parts are arranged, the terminal portions of the electrodes disposed in the non-display area B are connected to an external circuit. A predetermined thickness of the upper part of the partition wall 22 disposed in the non-display area B is polished so as to be easily formed (see FIG. 3).

Next, as shown in FIG. 2C, a firing process is performed to form the electrode 24 and the dielectric layer 26 between the partition walls 22. Then, after the phosphor is printed on the dielectric layer 26 between the barrier rib surface and the barrier ribs 22, the phosphor layer 28 is formed by sequentially performing a drying and firing process.

At this time, when the phosphor is printed, a sealing paste (not shown) for bonding with the front substrate is printed together and then fired simultaneously with the phosphor to reduce the number of firing processes in the manufacturing process of the entire back substrate.

Subsequently, black low melting glass 30 is applied to the upper surface of the partition 22 to complete the production of the back substrate. At this time, since the black low melting glass 30 is applied to the upper surface of the partition 22, the contrast of the PDP can be improved, and crosstalk between adjacent discharge cells can be more effectively prevented. . In addition, when bonding with the front substrate it is possible to improve the adhesion.

On the other hand, in the manufacturing process of the back substrate described above, the step of polishing a predetermined thickness of the partition wall disposed in the non-display area may be performed after forming the phosphor layer, and after forming the phosphor layer, bonding with the front substrate and In consideration of the prevention of crosstalk, the upper surface of the partition wall disposed in the display area may be polished.

In the formation of the electrode, instead of the printing step, the photosensitive electrode paste may be used to form the exposure and development step using the partition as an exposure mask.

As described above, in the present invention, since the electrode is formed after the partition wall is formed, alignment between the electrode and the partition wall can be easily achieved, and since the width of the electrode can be widened, the discharge voltage drop effect can be obtained. have.

In addition, since the electrode paste and the dielectric are baked at the same time, the firing process of the phosphor layer and the sealing paste can be performed at the same time, so that the overall manufacturing process can be simplified.

Meanwhile, although specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (8)

Forming barrier ribs on the glass substrate; Forming an electrode layer between the barrier ribs; Forming a dielectric layer on the electrode paste; Firing the dielectric layer and the electrode layer: and And printing a phosphor on the dielectric layer between the barrier rib surface and the barrier ribs, and drying and firing the phosphor to form a phosphor layer. The method of claim 1, wherein the partition wall is formed by a printing process. The method of claim 1, wherein the electrode layer is formed of a solvent, an electrode material, and a filler. The method of claim 1, wherein the electrode layer is formed by an exposure and development process using a photosensitive electrode paste. The method of claim 4, wherein the exposing step is performed by a back exposure step using a partition as an exposure mask. The method of manufacturing a back substrate of a plasma display panel according to claim 1, further comprising an etching process of removing a predetermined thickness of a portion of the partition wall disposed on the electrode terminal part after forming the dielectric layer. The method of claim 1, further comprising an etching process of removing a predetermined thickness of the partition wall disposed in the electrode terminal part after the phosphor layer is formed. The method of claim 1, further comprising applying a black low melting glass to the upper surface of the partition after the phosphor layer is formed.