KR20000004392A - Method forming barrier rib of plasma display panel - Google Patents

Abstract

PURPOSE: A method forming barrier rib of plasma display panel is provided to achieve simplification of process. CONSTITUTION: The method comprises the steps of: deposing barrier rib on a back of substrate, forming exposure layer pattern to expose predetermined parts of the barrier rib, removing the exposed barrier rib by sand blast method, forming first barrier ribs on the back of substrate by removing the exposure layer pattern, forming second barrier rib on the first barrier rib by printing method, and burning the first and second barrier ribs.

Description

Partition wall formation method of plasma display panel

The present invention relates to a method of manufacturing a plasma display panel, and more particularly, to a method of forming a partition wall.

Plasma Display Panel (PDP), which is one of the flat panel display devices, is composed of an array of discharge cells capable of independently discharging, and discharges each discharge cell independently according to an electrical signal applied from the outside. To reproduce the image.

Since the overall thickness of the PDP can be less than 10 cm, the thickness and weight of the PDP can be remarkably reduced compared to the CRT display device using an electron gun. There is this.

In addition, the PDP has a structure in which a pair of glass substrates are bonded to each other through a barrier rib defining a discharge cell. In this case, a large display device can be easily manufactured by forming a wide gap between the barrier ribs. Have.

FIG. 1 is a view showing a conventional AC PDP. As illustrated, the AC PDP includes a rear substrate 1 having an address electrode 2 and a front substrate 6 having a discharge sustaining electrode 7. These are bonded to face each other, and the discharge space 10 such as argon (Ar), neon (Ne), or xenon (Xe) is sealed in the discharge space between the substrates 1 and 6.

Here, the address electrode 2 and the first dielectric layer 3 covering the address electrode 2 are formed on the rear substrate 1, and the independent discharge spaces are defined on the first dielectric layer 3, and the adjacent discharge spaces are formed. The barrier ribs 4 are formed to prevent crosstalk from each other, and the phosphor layer 5 is formed between the barrier ribs 4.

At this time, the address electrode 2 and the partition wall 4 are formed using a printing method, a sand blast method (Sand Blast), or a lift-off method (Lift-Off).

In addition, on the front substrate 6, two discharge sustaining electrodes 7 including a transparent electrode 7a and a bus electrode 7b are formed to be disposed in each discharge space, and the discharge sustaining electrodes 7 are formed. A second dielectric layer 8 is formed on the entire surface of the substrate 6 so as to be covered, and a protective film 9 made of a material such as MgO is formed thereon.

However, in the case of forming the address electrode by the printing method, the sand blasting method or the lift-off method as described above, it is generally easy, but in the case of forming a pattern having a large height such as a partition wall, there are the following problems.

First, in the case of forming the partition wall using the printing method, the printing and drying processes must be repeatedly performed, and thus, the processing time is not only high, but also difficult to align. In addition, the partition wall is due to the flowability of the printing paste. There is a disadvantage that it is difficult to obtain a high definition.

In addition, when the partition wall is formed using the sand blast method, it is advantageous for high definition of the pattern. However, since the pattern is formed by spraying the abrasive on the etching target, the glass substrate is damaged by the abrasive when the process is performed for a long time. There is a problem, and there is a problem that the cost of equipment investment is high.

In addition, when the partition wall is formed using the lift-off method, similarly to the sand blasting method, the pattern can be obtained with high definition. However, due to the height of the partition wall, it is difficult to peel off the photosensitive film. There was a problem that the lower side of the.

Accordingly, an object of the present invention is to provide a method for forming a partition wall of a PDP capable of achieving a simplified process and a high definition of a partition wall pattern.

1 is a cross-sectional view showing a conventional AC plasma display panel.

2A to 2C are cross-sectional views illustrating a method of forming a partition wall of a plasma display panel according to a first embodiment of the present invention using a sand blasting method and a printing method.

3A to 3C are cross-sectional views illustrating a method of forming a partition wall of a plasma display panel according to a second embodiment of the present invention using a lift-off method and a printing method.

4A to 4C are cross-sectional views illustrating a method of forming a partition wall of a plasma display panel according to a third embodiment of the present invention using a photosensitive paste as a partition material.

(Explanation of symbols for the main parts of the drawing)

11,21,31: back substrate 12: bulkhead material

12a, 23, 32a: foundation partition 13, 22 photosensitive film pattern

14,24,33: Remaining bulkhead 15,25,34: Bulkhead

32 photosensitive paste

According to an embodiment of the present invention, a barrier rib forming method includes: applying a barrier material on a rear substrate; Forming a photoresist pattern on the barrier material to expose predetermined portions thereof; Removing the exposed partition material portions by sand blasting; Removing the photoresist pattern to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And firing the stacked first and second partition walls.

In addition, the barrier rib forming method of the PDP according to another embodiment of the present invention for achieving the above object, the step of applying a photosensitive film on the back substrate; Exposing and developing the photoresist to form photoresist patterns that expose barrier rib regions; Embedding a barrier material between the photoresist patterns; Removing the photoresist patterns to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And firing the stacked first and second partition walls.

In addition, the barrier rib forming method of the PDP according to another embodiment of the present invention for achieving the above object comprises the steps of applying a photosensitive paste on the back substrate; Exposing and developing the photosensitive paste to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And firing the stacked first and second partition walls.

According to the present invention, since the second partition is further formed at a desired height on the first partition after forming the first partition having a predetermined height, the process can be simplified and the definition of the partition can be achieved. have.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2C are cross-sectional views illustrating a method of forming a partition wall of a PDP according to a first embodiment of the present invention using a sand blasting method and a printing method.

First, as shown in FIG. 2A, the barrier material 12 is coated on the back substrate 11 to a thickness of 20 to 60 μm, and then a drying process for the barrier material 12 is performed. Then, in a state where a photoresist film is applied on the partition material 12, the photosensitive film is exposed and developed to form a photoresist pattern 13 exposing predetermined portions of the partition material 12.

Subsequently, as shown in FIG. 2B, portions of the partition material exposed by the sand blasting method are removed to form first partitions 12a (hereinafter, referred to as foundation partitions) on the rear substrate 11.

Next, as shown in FIG. 2C, in a state in which the photoresist pattern is removed, the second partition wall is formed on the foundation partition wall part 12a by performing a repeating printing process about 5 to 10 times to reach a normal partition height. 14, hereinafter referred to as the remaining partition wall portion).

Here, the printing process is carried out using a screen mask for β-printing having a large number of meshes of about # 325 or # 400, or a screen mask having a large pattern width. In addition, the printing paste has a low viscosity but a high shrinkage ratio, Use what can build up well in the foundation bulkhead.

After the printing process is completed, a firing process is performed to make the partition wall 15 composed of the foundation partition wall portion 12a and the remaining partition wall portion 14 have a predetermined strength.

As described above, when the partition wall is formed by using the sand blasting method and the printing method, the problem that occurs when the partition wall is formed by the sand blast method and the problem that occurs when the partition wall is formed by the printing method are complementary to each other. I can solve it.

That is, since the use of the sand blasting method is to form the base partition wall portion having a height lower than the general partition wall height, damage to the back substrate can be minimized due to the shortening of the process time. In addition, since the remaining barrier ribs are formed on the basic barrier rib portion by a printing process using a β-screen mask, the characteristic of the β-printing method, that is, the paste is printed on the entire surface of the substrate, is controlled by controlling the viscosity of the paste. Due to the property that the paste remains only on the pattern formed on the surface, it is possible to easily print the remaining partition wall on the foundation partition wall, thereby reducing the time and process required for pattern alignment, As a result, high definition of the partition wall can be achieved.

3A to 3C are cross-sectional views illustrating a method of forming a partition wall of a PDP according to a second embodiment of the present invention using a lift-off method and a printing method.

First, as shown in FIG. 3A, in a state in which a photoresist film is coated on the back substrate 21 with a thickness of 20 to 60 μm, photoresist pattern patterns exposing the predetermined barrier regions by performing exposure and development processes on the photoresist film. To form (22).

Then, as shown in FIG. 3B, the barrier material is buried between the photoresist patterns 22 and then dried to form the base barrier parts 23.

Then, as shown in FIG. 3C, with the photoresist patterns removed, a β-screen mask or a screen mask having a large pattern width, as in the previous embodiment, on the base partition walls 23 to form a partition wall having a desired height. The remaining partition wall part 24 is formed by performing a printing process about 5 to 10 times using.

Thereafter, a firing process is performed to make the partition wall 25 formed of the foundation partition portion 23 and the remaining partition wall portion 24 to have a predetermined strength.

When the partition wall is formed by using the lift-off method and the printing method as described above, the problem of each method may be complementarily solved, as in the previous embodiment, to obtain a high definition of the partition and simplify the process.

That is, the process using the lift-off method can be easily peeled off due to the low height of the foundation partition wall, and the process using the printing method can reduce the number of printing processes as described above. As a result, process simplification and high definition of partition walls can be achieved.

4A to 4C are cross-sectional views illustrating a method of forming a partition wall of a PDP according to a third embodiment of the present invention using a photosensitive paste as the partition material.

First, as shown in FIG. 4A, the photosensitive paste 32 is applied to the back substrate 31 as a partition material in a thickness of 20 to 60 탆.

Then, as shown in FIG. 4B, the photosensitive paste 32 is exposed and developed to form the base partition portions 32a made of the photosensitive paste on the back substrate 31.

Then, as shown in FIG. 4C, the base bulkhead portion 32a is repeatedly subjected to five to ten printing processes using a β-screen mask or a screen mask having a large pattern width as in the previous embodiments. After the remaining partition wall portion 33 is formed on the surface, a baking process is performed to make the partition wall 34 composed of the foundation partition wall portion 32a and the remaining partition wall portion 33 have a predetermined strength.

As described above, when the photosensitive paste is used as the barrier material, the process can be simplified. In addition, during the printing process for forming the remaining partition wall part, as described in the above embodiments, the process is simplified and the definition of the partition wall is very high. It is advantageous.

As described above, according to the present invention, after forming the base partition wall part at a predetermined height on the back substrate by using the sand blast method, the lift-off method or the photosensitive paste, the partition wall of the remaining height is formed by the printing method. It can be advantageously applied to the process, and at the same time, the process can be simplified.

Meanwhile, although specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (12)

Applying a partition material on the back substrate; Forming a photoresist pattern on the barrier material to expose predetermined portions thereof; Removing the exposed partition material portions by sand blasting; Removing the photoresist pattern to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And And firing the stacked first and second partition walls. The method of claim 1, wherein the barrier material is applied to a thickness of 20 to 60㎛. The method of claim 1, wherein the second partition wall is formed by a repeated printing process 5 to 10 times. 4. The method of claim 3, wherein the printing process is performed using a # -screen mask or a screen mask having a large pattern width of # 325 or # 400. Applying a photoresist film on the back substrate; Exposing and developing the photoresist to form photoresist patterns that expose barrier rib regions; Embedding a barrier material between the photoresist patterns; Removing the photoresist patterns to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And And firing the stacked first and second partition walls. The method of claim 5, wherein the photosensitive film is coated with a thickness of 20 to 60 μm. The method of claim 5, wherein the second partition wall is formed by a repeated printing process 5 to 10 times. 8. The method of claim 7, wherein the printing process is performed using a # 325 or # 400 β-screen mask or a screen mask having a large pattern width. Applying a photosensitive paste on the back substrate; Exposing and developing the photosensitive paste to form first barrier ribs on a rear substrate; Forming a second partition on the first partition by a printing method; And And firing the stacked first and second partition walls. 10. The method of claim 9, wherein the photosensitive paste is applied in a thickness of 20 to 60 µm. 10. The method of claim 9, wherein the second partition wall is formed by a repeated printing process 5 to 10 times. 12. The method of claim 11, wherein the printing process is performed using a β-screen mask of # 325 or # 400 or a screen mask having a large pattern width.