JP3411628B2 - Method for manufacturing surface discharge type plasma display panel - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a matrix display type surface discharge type plasma display panel (PDP). 2. Description of the Related Art With the improvement in quality of video media including high-definition broadcasting, large-screen display devices are becoming popular in ordinary households. Surface discharge type PDPs suitable for color display using phosphors are attracting attention as flat type display devices replacing CRTs because of their excellent visibility, large size and high-speed display. There is a demand for improvement. FIG. 6 is an exploded perspective view of a general surface discharge type PDP, and shows a basic structure of a portion corresponding to one pixel EG. [0006] The PDP 10 illustrated in FIG. 6 is a PDP having a three-electrode structure, which is called a reflection type in terms of classification according to the arrangement of phosphors. , A pair of display electrodes X, Y,
Dielectric layer 17 for AC driving, protective film 18 made of MgO, address electrode A orthogonal to display electrodes X and Y, stripe-shaped partition wall 29 parallel to address electrode A, and phosphor layer for full color display 28 and the like. The internal discharge space 30 is divided by the partition walls 29 in the unit light emitting area EU in the direction in which the display electrodes X and Y extend, and the gap size is defined. The discharge space 30 is filled with a discharge gas for exciting the phosphor layer 28 with ultraviolet rays. [0006] In the PDP 10, three unit light emitting areas E corresponding to one pixel (dot) EG as shown in the figure.
In each of U, a selected discharge cell for selecting display or non-display is defined at the intersection of one display electrode Y and address electrode A, and a main discharge cell is provided between display electrodes X and Y near the selected discharge cell. Discharge cells (surface discharge cells) are defined. The phosphor layer 28 is provided between the partition walls 29 on the glass substrate 21 opposite to the display electrodes X and Y to avoid ion bombardment due to surface discharge, and is generated by surface discharge of the main discharge cell. It emits light when excited by ultraviolet light. The light emitted on the surface layer (the surface in contact with the discharge space) of the phosphor layer 28 passes through the dielectric layer 17 and the glass substrate 11 and is emitted to the outside. That is, in the PDP 10, the glass substrate 1
1 is the display surface H. The emission colors of the respective phosphor layers 28 corresponding to the three unit emission regions EU are red (R), green (G), and blue (B) in this order (the alphabet R in the figure). , G, and B indicate emission colors). Also, the display electrodes X, Y
Is disposed on the display surface H side with respect to the phosphor layer 28 that emits display light, so that a wide transparent film made of a Nesa film or the like is used to make the surface discharge wide and minimize the shielding of the display light. It is composed of a conductive film 41 and a narrow metal film (bus electrode) 42 for supplementing the conductivity. In the PDP 10 having the above-mentioned structure, predetermined components are separately provided for each of the glass substrates 11 and 21, and then the glass substrates 11 and 21 are arranged to face each other to seal the periphery of the gap. It is manufactured by a series of processes for exhausting and filling discharge gas. At this time, in the manufacture of the glass substrate 21, the partition walls 29 are formed by firing a low-melting glass paste. That is, using a screen mask having a stripe-shaped opening pattern, a low-melting glass paste is applied on the glass substrate 21 on which the address electrodes A are provided.
It is applied several times so as to have a thickness (height) of about 200 μm. Then, heat treatment is performed at a temperature of about 500 to 600 ° C., and the partition wall 29 having a height of about 100 to 150 μm is formed. The phosphor layer 28 is formed by forming a partition 29, applying a phosphor paste by using a screen mask between the partitions 29 in order for each color, and firing the phosphor paste. Thus, not only the surface of the glass substrate 21 including the address electrode A but also the partition 2
The phosphor is also provided on the side surface of the phosphor layer 9, so that the surface area of the phosphor layer 28 increases and the luminance increases. In the above-described formation of the partition wall 29, the address electrodes A are present on the glass substrate 21 at the time of the first application of the paste. A gap corresponding to the thickness of the address electrode A is generated between the semiconductor device and the surface of the semiconductor device. That is, the paste is applied while the screen mask is raised with respect to the application surface (the surface of the glass substrate 21). For this reason, the paste spreads in the arrangement direction of the address electrodes A, and in particular, in a case of high definition, a part of the address electrodes A may be covered with the paste. When the low melting point glass layer partially exists on the address electrode A, a correct display cannot be performed due to a difference in characteristics from a portion where the low melting point glass layer does not exist. So, usually,
Inspection of the paste application state is performed at a stage before the paste is baked, and when there is an application failure, the entire paste is removed by a solvent or the like, and the paste is reapplied. In the prior art, since the incidence rate of paste application failure increases with the size of the display surface, the partition wall 29 cannot be efficiently formed, especially in the case of manufacturing a large, high-definition PDP. There was a problem that was damaged. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to increase the yield of forming the partition walls defining the gap size of the discharge space and improve mass productivity. According to the present invention, a flat surface is provided.
On the upper surface of the low-melting glass paste layer in a dry state,
The second low-melting glass page is patterned according to the shape of the wall.
Apply a strike. According to a first aspect of the present invention, there is provided a method for manufacturing a first substrate, comprising:
A display electrode for surface discharge on the second substrate;
Address electrode that intersects the indicator electrode and emits light due to surface discharge.
Between the phosphor layer and the discharge space and the gap between the discharge spaces
A surface discharge type plasma device having a partition for defining dimensions.
A method of manufacturing a display panel, comprising:
After forming the pole, the surface of the second substrate is formed in the shape of the partition wall.
And the entire surface including the address electrodes.
The first low melting glass paste so as to cover the
Drying with a cloth, and drying evenly over the entire forming surface.
On the upper surface of the dried low-melting glass paste layer,
Second low melting point glass paste in a pattern corresponding to the shape
And fired simultaneously with the low melting point glass paste layer.
Forming the partition wall by using the above method. [0018] [0019] [act] When the pattern printing using a screen mask (partial coating) forming the partition wall 29, the low-melting glass paste layer 50b is printed state in the dry state provided on forming surface of the partition walls 29 Is a base layer for improving the surface roughness . FIG. 1 is a sectional view showing the structure of a main part of a PDP 1 according to the present invention, and FIG. 2 is a sectional view showing an example of a method of manufacturing the PDP 1 of FIG. The PDP 1 is a reflection-type PDP having a three-electrode structure, and covers the display electrodes X, Y and the display electrodes X, Y, which are composed of the glass substrate 11 on the display surface side, the transparent conductive film 41 and the metal layer 42 overlapping therewith. Dielectric layer 17, protective film 18, rear glass substrate 21, address electrodes A orthogonal to display electrodes X and Y, stripe-shaped barrier ribs 29 defining gap size of discharge space 30, and fluorescent light of a predetermined emission color It is composed of a body 28. The partition walls 29 are arranged between the address electrodes A so as to partition the discharge space 30 in the line direction for each unit light emitting area. The arrangement pitch of the partition walls 29, that is, the size of the unit light emitting region in the line direction is about 200 μm. The PDP 1 is structurally different from the PDP 10 shown in FIG. 6 in that the partition 29 is formed on a partition base layer (low-melting glass layer) 50 that covers the address electrodes A. The provision of the partition base layer 50 facilitates formation of the partition 29 as described later. Note that the thickness of the partition underlayer 50 on the address electrode A is sufficiently smaller than the gap size of the discharge space 30, so that there is no trouble in the selective discharge. As shown in FIG. 2, when the PDP 1 is manufactured, a thickness of 5 to 30 μm is formed on a glass substrate 21 by a thick film method.
After forming the address electrode A having a thickness of about 1 μm, first, a low-melting glass paste 50 a serving as a partition base layer 50 is applied to the glass substrate 21 so as to uniformly cover the glass substrate 21 including the address electrode A.
It is applied to a thickness of about 5 to 40 μm and dried [FIG.
(A)]. As the low-melting glass paste 50a, for example, a paste having the same composition as that of the dielectric layer 17 is used. Next, at a predetermined position on the low-melting glass paste layer 50b in a dry state, a low-melting glass paste 29a for a partition wall containing a large amount of an inorganic filler for preventing shape collapse during firing is applied, for example, 180. It is applied several times by a screen printing method so as to form a striped wall having a height of about 200 μm (FIG. 2B). At this time, since the upper surface of the paste layer 50b is flat, the screen mask is applied to the coating surface (paste 29).
(a surface to which a is applied) is applied in each state. In addition, since the paste layer 50b is not as dense as the glass layer after firing, the solvent in the paste 29a is absorbed by the paste layer 50b particularly at the first application, and the fluidity of the paste 29a immediately decreases after the application. From these facts, the spread and deformation of the paste 29a in the line direction are suppressed.
Can be applied in a desired shape, and the yield of the paste application step for forming the partition wall 29 can be increased. Thereafter, the paste layer 50b and the paste 29a are simultaneously fired by a heat treatment at a predetermined temperature to form the partition walls 29 having a height of about 130 μm on the partition base layer 50 (FIG. 2C). Then, a phosphor layer 28 is provided between the partition walls 29, and the display electrodes X,
PDP with glass substrate 11 provided with Y
Complete 1 FIG. 3 is a sectional view showing another example of the method of manufacturing the PDP 1 of FIG. In the figure, the same reference numerals are given to the components corresponding to FIGS. 1 and 2 irrespective of differences in shape and material. The partition 29 can be formed by using a photolithography method. That is, first, a low-melting glass paste 29a for a partition is applied to the entire surface of the low-melting glass paste layer 50b in a dry state that covers the address electrodes A (FIG. 3A). As the paste 29a, a paste containing glass powder having a composition different from that of the paste layer 50b is used. In addition, as a coating method, a screen printing method,
A blade coating method, a roll coating method, or the like can be used. Subsequently, the paste 29a is baked together with the paste layer 50b to form a low-melting glass layer 29c, and then a photosensitive resin is applied to perform pattern exposure and development to form a predetermined pattern on the low-melting glass layer 29c. A resist layer 61 is provided (FIG. 3B). Then, using the resist layer 61 as a mask, the low melting point glass layer 29c is partially removed to form the partition wall 29. At this time, in the case of, for example, a wet etching method, an etchant (such as nitric acid) having selectivity with respect to the partition wall base layer 50 and the low melting point glass layer 29c obtained by baking the paste layer 50b is used. Thereby, the partition 29 can be easily obtained without damaging the address electrode A. In the case of physical patterning such as a sandblast method, a material having excellent cutting resistance may be used for the partition wall base layer 50. FIG. 4 shows a PDP 2 according to another embodiment of the present invention.
5 is a cross-sectional view showing a method of manufacturing the PDP 2 of FIG. In FIG. 4, PDP2
Is a surface discharge type PDP having a three-electrode structure called a transmission type. That is, in the PDP 2, the outer surface of the glass substrate 21 having the address electrodes A and the phosphors 28 becomes the display surface H, and the display is performed by the light transmitted through the phosphor layer 28. The partition 2 for defining the gap size of the discharge space 30
9 is provided on a glass substrate 11 on the back side having display electrodes X and Y for surface discharge and a dielectric layer 17 for accumulating wall charges. Since the display electrodes X and Y do not need to be transparent, they are made of a metal thin film having excellent conductivity and adhesion to the substrate. A protective film (MgO) (not shown) is provided on the surface of the dielectric layer 17 at a stage after the partition 29 is formed. When manufacturing the PDP 2, the glass substrate 1
After the display electrodes X and Y are provided on the substrate 1, first, a low-melting glass paste is applied and baked to form a lower dielectric layer 171 having a flat surface which becomes a part of the dielectric layer 17 [FIG. 5 (a)]. Next, a low-melting glass paste 17a having the same composition as the lower dielectric layer 171 is applied to the entire surface of the lower dielectric layer 171 and dried (FIG. 5B). The thickness of the coating layer is determined in consideration of the volume reduction during firing, and the dielectric layer 1 having a predetermined thickness is formed.
7 is obtained. Subsequently, using the low-melting-point glass paste layer 17b in a dry state as a base layer, a low-melting-point glass paste 29a for a partition is applied in a stripe shape by screen printing so as to have a predetermined height [FIG. )]. At this time, the low melting point glass paste layer 17b
Is flat and in a porous state before firing,
As in the case of FIG. 2, the spread and shape collapse of the paste 29a are suppressed. However, especially when PDP2 is large,
Poor application of the paste 29a may occur. In this case, the paste 29a can be removed together with the paste layer 17b by a wiping operation using a solvent or the like, and the process can be restarted from the step of applying the paste 17a. In the wiping operation, the thin display electrodes X and Y are protected by the lower dielectric layer 171 and are not damaged. Thereafter, the paste layer 17b and the paste 29a are simultaneously fired, and the dielectric layer 17 and the partition 29
(FIG. 5D). Then, a protective film is provided on the surface of the dielectric layer 17, and the glass substrate 11 and a glass substrate 21 provided with an address electrode A or the like are separately superimposed to form a
Complete DP1. According to the present invention, the yield of forming the partition walls defining the gap size of the discharge space can be increased, and the mass productivity can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a structure of a main part of a PDP according to the present invention. FIG. 2 is a sectional view showing an example of a method of manufacturing the PDP of FIG. FIG. 3 is a cross-sectional view illustrating another example of a method of manufacturing the PDP of FIG. FIG. 4 is a cross-sectional view illustrating a structure of a main part of a PDP according to another embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a method of manufacturing the PDP in FIG. FIG. 6 is an exploded perspective view of a general surface discharge type PDP. DESCRIPTION OF SYMBOLS 1, 2 PDP (plasma display panel) 11, 21 Glass substrate (substrate) 17a, 50a First low-melting glass paste 17b, 50b Dry low-melting glass paste layer 28 Phosphor layer 29 Partition wall 29a Second low melting point glass paste 30 Discharge space A Address electrode X, Y Display electrode

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tetsuyoshi Tomioka 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-61-248338 (JP, A) JP-A-3-3 20926 (JP, A) JP-A-58-54534 (JP, A) JP-A-61-227344 (JP, A) JP-A-62-195829 (JP, A) (58) Fields investigated (Int. ⁷ , DB name) H01J 9/02 H01J 11/02

Claims (1)

(57) Claims 1. A display electrode for surface discharge is provided on a first substrate, and an address electrode intersecting with the display electrode and light is emitted by surface discharge on a second substrate. dividing a discharge space and a phosphor layer
And a partition defining the gap size of the discharge space , wherein the surface of the second substrate after forming the address electrode is provided.
Is the surface on which the partition wall is formed, and includes the address electrodes.
As evenly cover the entire area of the forming surface, and a step of drying by applying a first low melting point glass paste on the upper surface of the low melting point glass paste layer flat dry across said forming surface, said Applying a second low-melting glass paste in a pattern corresponding to the shape of the partition wall, and firing the low-melting glass paste layer simultaneously with the low-melting glass paste layer to form the partition wall. Panel manufacturing method.