JP3558043B2 - Manufacturing method of plasma display device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a plasma display panel used for a display device or the like.
[0002]
[Prior art]
At present, there are many display panels using a thick film represented by a plasma display, a field emission display, an electroluminescence display, etc., some of which are commercially available, and some of which are under development. Among them, the AC type plasma display panel is expected as a large-sized display which can realize a size of 40 inches or more.
[0003]
FIG. 4 shows an example of a general PDP.
[0004]
In this plasma display panel, a front panel 110 and a back panel 120 are arranged to face each other, and the outer peripheral edge (not shown) is sealed with a sealing material made of low-melting glass to form a space for gas discharge. A rare gas (mixed gas of helium and xenon) is sealed at a pressure of about 300 Torr to 500 Torr (40 to 66.6 kPa) in a sealed space 140 formed between the two substrates. .
[0005]
The front panel 110 has a pair of display electrodes 112a and 112b formed on a surface facing the front glass plate 111 (a surface facing the back panel), and a dielectric layer 113 made of dielectric glass and a MgO layer covering the display electrode pairs 112a and 112b. And a protective layer 114 made of the same.
[0006]
On the other hand, in the back panel 120, an address electrode 122 is pattern-formed on a surface (a surface facing the front panel) of the back glass plate 121, and a back dielectric layer 123 is formed so as to cover the address electrode 122. Partition walls 124 are formed thereon, and RGB phosphor layers 131 are formed between the partition walls 124.
[0007]
The space 140 divided by the partition 124 becomes a light emitting region (discharge cell), and the phosphor layer 131 is applied to each discharge cell. The partition 124 and the address electrode 122 are formed in the same direction, and the display electrode pair 112 a and 112 b are orthogonal to the address electrode 122.
[0008]
The plasma display panel applies an address pulse between the address electrode 122 and the display electrode 112a based on image data to be displayed, and then applies a sustain pulse between the pair of the display electrode 112a and the display electrode 112b. As a result, a sustain discharge is selectively generated in the discharge cell. As a result, in the discharge cells having undergone the sustain discharge, ultraviolet light is generated, and visible light is emitted from the RGB phosphor layers 131 excited by the ultraviolet light, thereby displaying an image.
[0009]
Next, a method for manufacturing such a gas discharge panel will be described.
[0010]
As for the front panel 110, display electrode pairs 112a and 112b are formed in the shape of a front glass plate 111, a dielectric glass is coated and baked to form a dielectric layer 113, and a MgO layer is formed thereon by EB vapor deposition. Is formed to form the protective layer 114.
[0011]
As for the back panel 120, an address electrode 122 is formed on a back glass plate 121, a back dielectric layer 123 is formed so as to cover the address electrode 122, and a partition wall 124 is formed thereon.
[0012]
For the partition 124, for example, after a partition material is formed on the surface of the back dielectric layer 123, a resist is applied. Then, the resist film can be formed by patterning the resist film into a stripe shape, shaving off unnecessary portions of the partition wall material by sandblasting, and firing.
[0013]
Then, a phosphor paste is filled between the partitions 124 by a printing method or the like, and baked to form the phosphor layer 131, whereby the back panel 120 is manufactured.
[0014]
The front panel 110 and the back panel 120 thus manufactured are coated with low-permittivity glass as a sealing material around them, sealed by stacking and firing, and the inside is evacuated. By enclosing, a plasma display panel is manufactured.
[0015]
Recently, a main partition formed on a back plate in a direction parallel to an address electrode and a back wall in a direction parallel to a bus electrode for the purpose of increasing luminance when a phosphor screen emits light by enlarging a phosphor application area. It has been proposed to provide an auxiliary partition formed on the face plate, and to make the height of the auxiliary partition lower than the height of the main partition for the purpose of facilitating the formation of the fluorescent screen (Japanese Patent Laid-Open No. 10-32148). ).
[0016]
[Problems to be solved by the invention]
As a method for forming the main partition and the auxiliary partition having different heights, a method using a transfer sheet has been proposed. In this method, a concave transfer sheet corresponding to a partition shape is filled with a partition material, and the partition material is transferred to a glass substrate. However, this method has a problem that the production cost is increased because one transfer sheet is required in one partition formation step. Regarding the reuse of the transfer sheet, there is a problem that the partition wall material remains on the transfer sheet in the transfer step, and these must be removed by washing, which complicates the process. Further, the problem of the residual adhesion of the partition wall material to the transfer sheet also causes a defect in the transferred partition wall shape. In particular, in the case of processing of a complicated shape of two types of partition walls having different heights, the problem becomes even more serious than the formation of a linear partition wall. For these reasons, at present, the transfer sheet method has not been mass-produced as a partition wall method for a plasma display device, and a method of easily forming partition walls having different heights has been desired.
[0017]
In view of the above problems, an object of the present invention is to provide a method for manufacturing a plasma display device having a main partition and an auxiliary partition having a height lower than the main partition simply or at low cost.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is a method for manufacturing a plasma display device having a main partition wall part parallel to each other and an auxiliary partition wall part lower in height than the main partition part and perpendicular to the main partition part, A first step of coating a first material containing a photosensitive material and an inorganic powder on at least a first base material, and exposing and developing a photosensitive resin to form a mold having a line-shaped uneven portion on the surface of the first material. A second step of forming the top of the main partition and the top of the auxiliary partition by press-molding thereon; and a third step of exposing, developing, and firing the first material through a photomask having openings in a grid pattern. It is intended to provide a method of manufacturing a plasma display device characterized by including a step.
[0019]
In the present invention, by combining the pressing method and the photosensitive material, only the difference in height between the main partition and the auxiliary partition is processed by the pressing method, and the cross-shaped processing is performed with the photosensitive material. A complicated partition shape having different main partitions and auxiliary partitions can be easily manufactured.
[0020]
According to another aspect of the present invention, there is provided a method for manufacturing a plasma display device having a main partition parallel to each other and an auxiliary partition perpendicular to the main partition and having a height lower than that of the main partition. A first step of applying a first material containing a photosensitive material and an inorganic powder on at least a first base material; and a second step of exposing the first material through a photomask having an opening in a grid pattern. A third step of forming a top portion of the main partition portion and a top portion of the auxiliary partition portion by press-molding a mold having a line-shaped uneven portion on the surface by exposure and development of the photosensitive resin onto the first material; It is another object of the present invention to provide a method for manufacturing a plasma display device, comprising a fourth step of developing and firing the first material.
[0021]
In the present invention, by combining the pressing method and the photosensitive material, after performing the cross-shaped work with the photosensitive material, only the difference in height between the main partition and the auxiliary partition is processed by the pressing method. A complicated partition shape having a main partition and an auxiliary partition having different sizes can be easily manufactured.
[0023]
In the present invention, by combining the pressing method and the photosensitive material, it becomes possible to easily manufacture a complicated partition shape having a main partition and an auxiliary partition having different heights, and in addition, a black material is used for the second material. By using a material, the reflectance on the display surface can be reduced, and a partition having high contrast can be formed at the time of image display.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0027]
(Embodiment 1)
FIG. 1 is a process chart for explaining a first embodiment of the partition wall forming method of the present invention.
[0028]
(First process: partition material coating process)
A partition paste containing a photosensitive material is uniformly applied on the entire surface of the substrate 11 on which the electrodes, the electrode protection layers, and the like are formed as necessary, to form a coating film 12. The partition wall paste contains 65 to 85% of glass powder, a photosensitive organic component which is cured by ultraviolet rays as an essential component, and is composed of an organic component such as a resin and a solvent. As a coating method, a printing method, a roll coater method, a blade coater method, or the like is used, and the film thickness after coating is preferably 100 to 300 μm. The coating film is dried if necessary (FIG. 1A).
[0029]
It is not always necessary to use a partition paste as the coating film. For example, a method of attaching a film containing a glass component and a photosensitive organic component by a lamination method or the like may be used.
[0030]
(Second step: Step forming step)
A photosensitive film containing an acrylic photosensitive resin as a main component is applied on a mold substrate 13 made of an acrylic resin by a printing method and dried. The photosensitive resin is cured by exposing through a photomask having a line-shaped opening, and is patterned by developing with an aqueous solution of sodium carbonate to form a mold material 10 (FIG. 1B).
[0031]
The mold material is not limited to an acrylic resin as long as it is a material that is exposed to light and forms a three-dimensional shape. The mold substrate is not limited to an acrylic resin as long as it retains the shape of the photosensitive material and can be separated from the substrate as described later.For example, a glass substrate such as soda glass, titanium It does not matter the material and the film thickness, such as a metal substrate such as a substrate and a resin film such as polyethylene.
[0032]
The mold substrate 13 is arranged on the coating film produced in the first step so that the mold material is in contact with the coating film, and the coating film is pressed by, for example, a laminator (FIG. 1C). After that, the mold is peeled off, and the uneven film 14 having the uneven surface shape of the coating film is obtained (FIG. 1D).
[0033]
(Third step: Uneven film exposure and development step)
The uneven film 14 formed in the second step is exposed in a grid pattern using an exposure device to form an exposure film 17. The exposure is performed by irradiating ultraviolet rays with a predetermined energy through a mask for a predetermined time. By this step, the photosensitive material contained in the uneven film 14 in the ultraviolet irradiation area is cured, and an exposure film is formed (FIG. 1D).
[0034]
An example of curing a negative-type material by irradiating it with ultraviolet light as a photosensitive material has been described, but any material that can react with actinic rays such as visible light and electron beams to change its solubility in a developing solution is used. It is not limited.
[0035]
The exposure film is developed using a developing device to form a partition group precursor 20 including a linear main partition 18 and an auxiliary partition 19 lower in height than the main partition. The development is performed by using the difference in solubility between the exposed portion and the non-exposed portion where the photosensitive material is cured in the developing solution. The development includes a method of spraying a developing solution, a method of dipping a substrate in the developing solution, and the like, but is not limited to the developing method.
[0036]
The partition wall group precursor 20 thus obtained is preferably heated and baked at a temperature of 400 ° C. or more to burn off the organic component and melt the glass component to obtain a partition wall group. . The partition group has the same shape as the partition group precursor 20 and is not shown.
[0037]
The pattern of the step forming step in the second step and the pattern of the exposure step in the third step are aligned by, for example, the following method. Prior to the second step, an alignment mark is formed on a glass substrate in advance. The mold substrate in the second step is formed on glass with reference to this alignment mark. Also, the alignment in the third step may be referred to in the same manner. Further, for example, the exposure in the third step may be performed with reference to a part of the uneven film formed in the second step.
[0038]
(Embodiment 2)
FIG. 2 is a process chart for explaining a second embodiment of the partition wall forming method of the present invention.
[0039]
(First process: partition material coating process)
As in the first embodiment, a coating film 12 is formed on a substrate 11 (FIG. 2A).
[0040]
(Second step: coating film exposure step)
The coating film 12 formed in the first step is exposed in a grid pattern using an exposure device to form an exposure film 21. Exposure is performed by irradiating ultraviolet rays from a light source with a predetermined energy through a mask 15 for a predetermined time. By this step, the photosensitive material contained in the coating film in the lattice-shaped ultraviolet irradiation area is cured (FIG. 2B).
[0041]
Although an example in which a negative-type material is irradiated with ultraviolet rays and cured as a photosensitive material has been described, the present invention is not limited thereto.
[0042]
(Third step: exposure film processing step)
On the exposure film 21 formed in the second step, using the mold substrate 13 on which the mold material 10 used in the first embodiment is formed, the mold is arranged so as to be in contact with the exposure film, and coating is performed by, for example, a laminator. The film is pressed (FIG. 2 (c)). After that, the mold is peeled off, so that the uneven film 22 having the uneven surface shape of the coating film is obtained (FIG. 2D).
[0043]
(Fourth step: uneven film developing step)
The uneven film 22 formed in the third step is developed using a developing device, and a partition group precursor 20 including a linear main partition portion 18 and an auxiliary partition portion 19 having a height lower than the main partition. To form The development is performed by using the difference in solubility between the exposed portion and the non-exposed portion where the photosensitive material is cured in the developing solution. The development includes a method of spraying a developing solution, a method of dipping a substrate in the developing solution, and the like, but is not limited to the developing method.
[0044]
The partition wall group precursor 20 thus obtained is preferably heated and baked at a temperature of 400 ° C. or more to burn off the organic component and melt the glass component to obtain a partition wall group. (FIG. 2 (e)).
[0045]
(Embodiment 3)
FIG. 3 is a process chart for explaining a third embodiment of the partition wall forming method of the present invention.
[0046]
(First step: transfer material forming step)
A photosensitive film containing an acrylic photosensitive resin as a main component is applied on a transfer substrate 30 made of an acrylic resin by a printing method, and dried. The photosensitive resin is cured by exposing through a photomask having an opening in a line shape, and is patterned by developing with an aqueous solution of sodium carbonate to form a mold material 10.
[0047]
The mold material is a material that is exposed to light and forms a three-dimensional shape, and is not limited to an acrylic resin unless significant deformation or the like is caused by insertion of a transfer material described later. The material for the mold and the thickness of the glass, metal, resin, etc. are not limited as long as the shape of the photosensitive material is maintained and the mold can be separated from the substrate as described later.
[0048]
The concave portion of the mold is filled with a transfer material paste 31 made of at least an inorganic material and a solvent by sweeping over the mold material with, for example, a squeegee 33 (FIG. 3A) and, if necessary, drying. Then, a transfer substrate filled with the transfer material 32 is obtained (FIG. 3B).
[0049]
(Second step: coating film exposure step)
In the same manner as in the second embodiment, the coating film 12 coated with the partition wall material is exposed in a grid pattern through the mask 15 using an exposure device to form an exposure film 21 (FIG. 3C). .
[0050]
(Third step: Top material transfer step)
Using the transfer material-filled substrate used in the first embodiment, the transfer material 32 is placed on the exposure film 21 formed in the second step so as to be in contact with the exposure film, and is pressed from both sides or one side by a laminator, for example. (FIG. 3D). Thereafter, the transfer material 32 is transferred onto the coating film by peeling the mold substrate (FIG. 3E).
[0051]
(4th process: exposure and baking process)
The exposure film 21 to which the transfer material 32 has been transferred in the third step is developed by using a developing device, and a partition including a linear main partition 18 and an auxiliary partition 19 lower in height than the main partition. A group precursor 20 is formed. The development is performed by using the difference in solubility between the exposed portion and the non-exposed portion where the photosensitive material is cured in the developing solution. The development includes a method of spraying a developing solution, a method of dipping a substrate in the developing solution, and the like, but is not limited to the developing method.
[0052]
The partition wall group precursor 20 thus obtained is preferably heated and baked at a temperature of 400 ° C. or more to burn off the organic component and melt the glass component to obtain a partition wall group. (FIG. 3 (f)).
[0053]
The inorganic material contained in the top material is not particularly limited as long as the material softens at the temperature at the time of baking in the fourth step, but is not particularly limited. By selecting this, the display surface side when manufactured as a plasma display panel has a black color, which has the effect of expanding the contrast, which is more desirable.
[0054]
In the third embodiment, the transfer of the top material is performed after the exposure of the partition wall material. However, the transfer of the top material is not necessarily performed after the exposure. Is possible. However, after firing, it may be necessary to fire the top material again.
[0055]
Also, in this case, the effect of improving the display quality by including the black material in the top material is the same as described above.
[0056]
【The invention's effect】
As described above, according to the present invention, it is possible to manufacture a plasma display device having a main partition and an auxiliary partition having a height lower than that of the main partition very easily or at low cost. The effect is extremely large.
[Brief description of the drawings]
FIG. 1 is a process chart showing a method of forming a partition of a plasma display device according to a first embodiment of the present invention; FIG. 2 is a method of forming a partition of a plasma display device according to a second embodiment of the present invention; FIG. 3 is a process diagram showing a method of forming a partition wall of a plasma display device according to a third embodiment of the present invention. FIG. 4 is a perspective view of a main part of a conventional AC type plasma display panel. Description]
REFERENCE SIGNS LIST 10 mold material 12 coating film 15 mask 18 main partition 19 auxiliary partition

Claims (2)

A method for manufacturing a plasma display device having an auxiliary partition portion, which is lower in height than the main partition portion and the main partition portion which are parallel to each other and which is perpendicular to the main partition portion,
A first step of applying a first material containing a photosensitive material and an inorganic powder on at least a first base material, and a mold material having on its surface a line-shaped uneven portion produced by exposure and development of a photosensitive resin Forming the top of the main partition and the top of the auxiliary partition by press-forming the first material on a first material, and exposing, developing, and firing the first material through a mask having an opening in a grid pattern. A method of manufacturing a plasma display device, comprising: A method for manufacturing a plasma display device having an auxiliary partition portion, which is lower in height than the main partition portion and the main partition portion which are parallel to each other and which is perpendicular to the main partition portion,
A first step of applying a first material containing a photosensitive material and an inorganic powder on at least a first base material, a second step of exposing the first material through a mask having cross-shaped openings, A third step of forming a top of the main partition and a top of the auxiliary partition by pressing a mold material having a line-shaped uneven portion formed on the surface by exposure and development of the resin onto the first material; And a fourth step of developing and firing the first material.

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