JP2009170166A - Manufacturing method of back plate for plasma display panel, back plate for plasma display panel, and laminate used for manufacture of back plate for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method capable of manufacturing a back plate for plasma display panel having level difference matrix ribs easily and accurately. <P>SOLUTION: The manufacturing method comprises a process to form a rib layer 40 on a rib-forming substrate 20, a process to form a rib layer with concavo-convex 45 from the rib layer by injecting a blast material 75, and a process to form a level difference matrix rib 30 from the rib layer with concavo-convex 45 by injecting the blast material 75. The rib layer with concavo-convex 45 includes a plurality of linear projection parts 46 extending along a first direction. The level difference matrix rib 30 includes a plurality of first ribs 34 which include the linear projection parts and extend along the first direction and a plurality of second ribs 38 which extend along a second direction between the first ribs and are lower than the first ribs. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a back plate for a plasma display panel having a plurality of first ribs and a matrix rib including a plurality of second ribs extending between the first ribs. The present invention relates to a manufacturing method that can easily and accurately manufacture a back plate for a plasma display panel having a stepped matrix rib that is low.

  Moreover, this invention relates to the laminated body used for manufacture of the backplate for plasma display panels, and the backplate for plasma display panels.

  A back plate used in a plasma display panel (hereinafter also referred to as PDP) is formed on a rib forming substrate, ribs arranged in a predetermined pattern on the rib forming substrate, and the rib forming substrate and rib side surfaces. A phosphor layer. In general, a rib forming substrate includes a glass substrate, electrodes arranged on the glass substrate (also referred to as address electrodes), and a dielectric layer laminated on the glass substrate so as to cover the electrodes. It is out.

  The back plate is overlapped with the front plate having electrodes to form a PDP. The space between the back plate and the front plate is once evacuated and then filled with a rare gas such as xenon and functions as a discharge space. When plasma discharge occurs in this discharge space, ultraviolet rays are generated, and visible light is generated when the ultraviolet rays reach the phosphor. By controlling the discharge in the discharge space, the PDP functions as a display device.

  As a conventional PDP back plate, a back plate having striped ribs or a back plate having matrix-shaped ribs composed of a plurality of first ribs and a plurality of second ribs intersecting with the first ribs is used. Has been. Among these, the matrix rib can increase the area for supporting the phosphor as compared with the stripe rib. For this reason, the back plate having matrix ribs is excellent in terms of improving luminance.

On the other hand, in recent years, back plates having stepped matrix ribs in which the second ribs are lower than the first ribs have attracted attention (for example, Patent Documents 1 and 2). The back plate having the step matrix ribs has an advantage that not only the support area of the phosphor can be increased, but also the exhaust process after being superimposed on the front plate can be easily performed.
JP-A-7-282730 Japanese Patent No. 3440907

  By the way, in the entire manufacturing process of the plasma display panel including the manufacturing of the back plate, the manufacturing of the front plate and the combination of the back plate and the front plate, it is the most difficult process to form the rib within the predetermined dimensional accuracy. It has become one of In addition, the production of the stepped matrix rib is extremely complicated and difficult as compared with the production of the stripe rib and the normal matrix rib. For this reason, in manufacturing the PDP, how to easily form the step matrix ribs is an extremely important technical issue.

  In the third embodiment of Patent Document 1, application of paste having fluidity and drying of the paste (formation of resist layer), resist patterning (plate making), blasting using the patterned resist as a blast mask, and blast mask The step matrix ribs are formed on the rib forming substrate by repeating a series of operations such as removal of the ribs twice. According to this method, the paste having fluidity can be spread and spread on the layer to be processed in which the irregularities are formed by the first blasting. However, although the surface of the resist layer can be flattened, the thickness of the resist layer is not constant due to the unevenness of the layer to be processed. For this reason, the patterning precision of the formed resist layer will fall. In the first place, forming a resist layer by applying a paste and drying the paste is extremely complicated as compared to using a dry film resist (DFR), and the apparatus becomes large and complicated. As a result, the manufacturing cost of the back plate for PDP increases. This is a very serious problem in today's market where there is a strong demand for lower prices in all flat panel displays.

  On the other hand, as in the first embodiment of Patent Document 2, a blast mask for the second blasting process is formed on the processed layer on which the irregularities are formed by the first blasting process by DFR lamination and plate making. Also when forming, various malfunctions may occur. For example, the DFR is partially crushed due to the unevenness formed by the first blasting. Moreover, the thickness of DFR will differ between the recessed part and convex part of a to-be-processed layer by lamination pressure. As a result, DFR plate making cannot be performed with high accuracy.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a manufacturing method capable of easily and accurately manufacturing a back panel for a plasma display panel having stepped matrix ribs.

  Another object of the present invention is to provide a back plate for a plasma display panel that can be easily and accurately manufactured.

  Furthermore, the present invention relates to a laminate used for manufacturing a display panel back plate, which can easily and accurately manufacture a plasma display panel back plate.

  A first method for manufacturing a back plate for a plasma display panel according to the present invention includes a step of forming a rib layer on a rib forming substrate, a step of laminating a first dry film resist on the rib layer, Patterning one dry film resist to form a first blast mask including a plurality of linear portions extending along a first direction on the rib forming substrate on the rib layer; A blast material is sprayed from the blast mask side to the rib layer, and a portion of the rib layer that is not covered with the first blast mask is shaved by a thickness less than the total thickness, along the first direction. Forming a concavo-convex rib layer including a plurality of linear protrusions extending, a step of removing the first blast mask from the concavo-convex rib layer, and a second dry film on the concavo-convex rib layer. Laminating a photoresist, patterning the second dry film resist, a plurality of first pattern portions extending along the first direction, and a first pattern on the rib forming substrate intersecting the first direction. A step of forming a second blast mask including a plurality of second pattern portions extending between the first pattern portions along two directions on the uneven rib layer, and the rib layer from the second blast mask side. A plurality of first ribs including the linear protrusions and extending along the first direction, and extending between the first ribs along the second direction, and the rib forming substrate. Forming a step matrix rib including a plurality of second ribs having a height from the first rib lower than the first rib, and the width of the first pattern portion of the second blast mask is set to 1 blast mask Characterized in that narrower than the width of the serial linear portion.

  In the step of laminating the second dry film resist of the first method for manufacturing a back plate for a plasma display panel according to the present invention, two linear shapes that are in contact with and adjacent to the linear protrusions of the uneven rib layer. The second dry film resist may be laminated on the uneven rib layer so as to be in contact with the uneven rib layer even between the protrusions.

  A second method for manufacturing a back plate for a plasma display panel according to the present invention includes a step of forming a rib layer on a rib forming substrate, a step of laminating a first dry film resist on the rib layer, Patterning one dry film resist to form a first blast mask including a plurality of linear portions extending along a first direction on the rib forming substrate on the rib layer; A blast material is sprayed from the blast mask side to the rib layer, and a portion of the rib layer that is not covered with the first blast mask is shaved by a thickness less than the total thickness, along the first direction. Forming a concavo-convex rib layer including a plurality of linear protrusions extending in a step, removing the first blast mask from the concavo-convex rib layer, and forming the ridge protrusion on the concavo-convex rib layer. Contact And laminating a second dry film resist on the uneven rib layer so as to be in contact with the uneven rib layer between two adjacent linear protrusions, and the second dry The film resist is patterned to extend between the first pattern portions extending along the first direction and between the first pattern portions along the second direction on the rib forming substrate that intersects the first direction. A step of forming a second blast mask including a plurality of second pattern portions on the uneven rib layer; and jetting a blast material from the second blast mask side to the rib layer to form the linear protrusion A plurality of first ribs including a portion extending along the first direction, and extending between the first ribs along the second direction, the height from the rib forming substrate being lower than the first rib. A plurality of second ribs and Forming a stepped matrix rib comprising, characterized in that it comprises a.

  In the first or second method for manufacturing a back plate for a plasma display panel according to the present invention, the second pattern portion of the second blast mask is at an intermediate portion between both ends connected to the first pattern portion. You may make it contact the said uneven | corrugated rib layer.

  Further, in the first or second method for manufacturing a back plate for a plasma display panel according to the present invention, the injection amount of the blast material injected per unit time in the step of forming the uneven rib layer is the step matrix rib. You may make it be 1/100 or more and 1/5 or less of the injection quantity of the blast material injected in unit time in the process to form.

  Furthermore, in the first or second method for manufacturing a back plate for a plasma display panel according to the present invention, the step of forming the rib layer includes the step of forming the first rib layer on the rib forming substrate, Forming a second rib layer having a lower blast workability than the first rib layer on the first rib layer; and a third having a higher blast workability than the second rib layer on the second rib layer. Forming a rib layer, and in the step of forming the uneven rib layer, the third rib layer is shaved and the second dry film resist is laminated on the uneven rib layer. The second dry film may be disposed so as to contact the second rib layer between the two adjacent linear protrusions.

  In the first or second plasma display panel manufacturing method according to the present invention, the blast workability of the first rib layer may be higher than the blast workability of the third rib layer. . In the first or second method for manufacturing a back plate for a plasma display panel according to the present invention, the blast workability of the first rib layer is 1.5 times the blast workability of the second rib layer. It may be 100 times or less. Further, in the first or second method for manufacturing a back plate for a plasma display panel according to the present invention, the blasting property of the third rib layer is 1.1 times or more and 20 times the blasting property of the second rib layer. You may make it be the following.

  The back plate for a plasma display panel according to the present invention is manufactured by any one of the manufacturing methods described above.

  A first laminate according to the present invention is a laminate used when manufacturing a back panel for a plasma display panel using blasting, and is formed on a rib forming substrate and the rib forming substrate, The dry film resist comprising: an uneven rib layer including a plurality of linear protrusions extending along a first direction on the rib forming substrate; and a dry film resist laminated on the uneven rib layer. Is in contact with the linear protrusion of the uneven rib layer, and is also in contact with the uneven rib layer between two adjacent linear protrusions.

  The second laminate according to the present invention is a laminate used when manufacturing a back plate for a plasma display panel using blasting, and is formed on a rib forming substrate and the rib forming substrate, An uneven rib layer including a plurality of linear protrusions extending along a first direction on the rib forming substrate, and a blast mask formed on the uneven rib layer, the blast mask comprising: In addition to being in contact with the linear protrusions of the uneven rib layer, the uneven rib layer is also in contact between two adjacent linear protrusions.

  In the second laminate according to the present invention, the blast mask extends along a second direction on the rib forming substrate that intersects the first direction with a plurality of first pattern portions extending along the first direction. A plurality of second pattern portions extending between the first pattern portions, wherein the first pattern portions are disposed on the linear protrusions of the uneven rib layer, and the second pattern portions are You may make it contact the said uneven | corrugated rib layer in the intermediate part between the both ends connected to a 1st pattern part.

  In the second laminate according to the present invention, the blast mask has a plurality of first pattern portions extending along the first direction, and a second direction on the rib forming substrate that intersects the first direction. A plurality of second pattern portions extending between the first pattern portions along the first and second pattern portions, wherein the width of the first pattern portion may be narrower than the width of the flat end surface of the linear protrusion.

  According to the present invention, the width of the first pattern portion of the second blast mask is narrower than the width of the linear portion of the first blast mask. For this reason, the 2nd blast mask patterned accurately can be formed on an uneven | corrugated rib layer. As a result, it is possible to easily and accurately manufacture a back panel for a plasma display panel having a stepped matrix rib having a desired shape.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale and vertical / horizontal dimension ratios are appropriately changed and exaggerated as appropriate.

  FIG. 1 to FIG. 16 are views for explaining an embodiment of a method for manufacturing a back plate for a plasma display panel according to the present invention.

<Back plate for PDP>
Among these, FIG. 1 and FIG. 2 are a perspective view and a sectional view showing an example of a back plate for a plasma display panel that can be manufactured by a method for manufacturing a back plate for a plasma display panel. FIG. 3 is a view for explaining a rib forming substrate of the back plate for the plasma display panel shown in FIGS. 1 and 2. FIG. 1 is a partial perspective view showing a part of the central portion of the plasma display panel back plate. Moreover, the cross section shown by FIG. 2 respond | corresponds to the cross section along the II-II line | wire of FIG. First, a plasma display panel back plate (hereinafter also referred to as a PDP back plate) that can be manufactured using the manufacturing method according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 1 and FIG. 2, the PDP back plate 10 includes a plate-shaped rib forming substrate (back plate substrate) 20 that is a member that supports the ribs, and one of the rib forming substrates 20. Step matrix ribs 30 formed on the surface 20a. As shown in FIG. 2, the PDP back plate 10 further includes a phosphor layer 18 formed on one surface 20 a of the rib forming substrate 20 and on the side surface of the step matrix rib 30. .

  First, the rib forming substrate 20 will be described. As the rib forming substrate 20, various known rib forming substrates that can be used for the back plate for PDP can be used.

  As an example, as shown in FIGS. 3A and 3B, the rib forming substrate 20 is formed in a plate-like support substrate 22 and a predetermined region on one surface of the support substrate 22. An electrode 24 and a dielectric layer 26 laminated on one surface of the support substrate 22 are included. The support substrate 22 is made of a heat-resistant material, for example, glass in consideration of heating in the firing process. As shown in FIG. 3A, the electrodes 24 can be arranged in a striped form on one surface of the support substrate 22 so as to function as so-called address electrodes. Such an electrode 24 may be composed of various conductive materials such as silver. The dielectric 26 can be formed by depositing a material having a predetermined dielectric constant on one surface of the support substrate 22 so as to cover the address electrodes 24.

  The rib forming substrate 20 shown in FIG. 3 can be manufactured as follows. First, a support substrate 22 made of glass or the like is prepared, and a layer made of a conductive paste containing a photosensitive material is formed on one surface of the support substrate 22. As the coating device at this time, known devices such as a screen printing machine and various coaters can be employed. Thereafter, exposure and development using a photolithography technique are performed, and the conductive paste layer is patterned into a desired pattern. Next, the electrode 24 is formed on the support substrate 22 by sintering the silver paste by firing (see FIG. 3A).

  Thereafter, a material having a desired dielectric constant is applied on one surface of the support substrate 22 so as to cover the electrode 24. At this time, the film can be formed on the support substrate 22 using various known devices such as a screen printing machine and various coaters. Thereafter, the dielectric layer 26 is formed from a material having a desired dielectric constant by firing. As described above, the rib forming substrate 20 shown in FIG. 3B is obtained.

  Next, the step matrix rib 30 will be described. The step matrix rib 30 can take various known configurations that can be used for the PDP back plate. The step matrix ribs 30 are formed on one surface 20 a of the rib forming substrate 20, in the illustrated example, on the dielectric layer 26. As shown in FIG. 1, the step matrix rib 30 includes a first rib 34 extending along a first direction on the plate surface of the rib forming substrate 20 and a plate surface of the rib forming substrate 20 intersecting the first direction. And a second rib 38 extending along the second direction. A plurality of first ribs 34 are formed at substantially constant intervals along a direction orthogonal to the first direction. The second rib 38 extends between the two adjacent first ribs 34 in the second direction. A plurality of second ribs 38 are formed at substantially constant intervals along a direction orthogonal to the second direction.

  Although not essential in the present invention, in the illustrated example, the first direction and the second direction are orthogonal to each other. In the present application, “intersection” includes both intersecting at right angles (perpendicular) and intersecting at an angle other than 90 °.

  1 and 2, the height of the second rib 38 from the rib forming substrate 20 (more precisely, the second rib 38 along the normal of the plate surface of the rib forming substrate 20). The length from the base end part to the top part of the first rib 34 is lower than the height of the first rib 34 from the rib forming substrate 20. The difference between the height of the first rib 34 and the height of the second rib 38 is, as described above, between the two adjacent first ribs 34 after combining the completed PDP back plate 10 with the PDP front plate. The entire region can be set to such an extent that it can be exhausted from one side or both sides in the first direction. In addition, the height of the second rib 38 can be set so as to make it possible to sufficiently increase the support area of the phosphor. As an example, the height of the second rib 38 can be set to about 1/5 to 95/100 of the height of the first rib 34.

  Moreover, about the specific shape and dimension of the 1st rib 34 and the 2nd rib 38, the various known structure which can be used for the backplate for PDP can be taken. For example, the first rib 34 and the second rib 38 can have a quadrangular shape, more strictly a trapezoidal shape, more strictly an isosceles trapezoidal shape, in a cross section orthogonal to the longitudinal direction. Moreover, the width | variety of the top part (part on the side away from the board | substrate 20 for rib formation) after baking of the 1st rib 34 and the 2nd rib 38 can be 5 micrometers-120 micrometers. Furthermore, the arrangement pitch of the 1st rib 34 and the 2nd rib 38 can be 50 micrometers-2000 micrometers. Furthermore, the height after baking of the 1st rib 34 and the 2nd rib 38 can be 20 micrometers-300 micrometers.

  Such a step matrix rib 30 corresponds to a manufacturing method described later, and is composed of, for example, a mixture containing glass frit and inorganic powder.

  The phosphor layer 18 is formed on the one surface 20a of the rib forming substrate 20 surrounded by the two adjacent first ribs 34 and the two adjacent second ribs 38, on the side surface of the first rib 34, and on the first surface. 2 is supported on the side surface of the rib 38. As the structure of the phosphor layer 18, various known structures that can be used for the back plate for PDP can be adopted.

<Method for manufacturing back plate for PDP>
Next, with reference mainly to FIG. 4 thru | or FIG. 16, the manufacturing method of the back plate for plasma display panels is demonstrated with an example of the manufacturing apparatus used for implementation of this manufacturing method.

  In the present embodiment, the manufacturing method of the PDP back plate includes a rib layer forming step (see FIG. 4A) for forming a rib layer (rib forming material layer) 40 on the rib forming substrate 20, and a rib layer. A first blasting step (see FIG. 4D) of cutting 40 to form an uneven rib layer 45 including a plurality of linear protrusions 46 extending in the first direction on the rib forming substrate 20; A plurality of first ribs 34 extending along the first direction including at least a part of the linear protrusion 46 by cutting the uneven rib layer 45 and a plurality of extending between the first ribs 34 along the second direction. And a second blasting step (see FIG. 5D) for forming the step matrix ribs 30 including the second ribs 38. More specifically, the PDP back plate manufacturing method includes a first resist lamination step (see FIG. 4B) of laminating a first dry film resist 54 on the rib layer 30, and a first dry film resist. The first blast mask forming step (see FIG. 4C) for patterning 54 to form the first blast mask 50 on the rib layer 30 is further provided before the first blasting step, and the formed irregularities A step of removing the first blast mask 50 from the ribbed layer 45 is further provided after the first blasting step. In addition, the method for manufacturing the PDP back plate includes a second resist layering step (see FIG. 5B) for stacking a second dry film resist 59 on the uneven rib layer 45, and a second dry film resist 59. And a second blast mask forming step (see FIG. 5C) for forming a second blast mask 55 on the uneven rib layer 45 by patterning and forming a second blast mask 55 before the second blast processing step. A step of removing the second blast mask 55 from the step matrix rib 30 is further provided after the second blasting step.

  Further, a PDP back plate manufacturing apparatus 70 that can be used in the execution of this manufacturing method includes a rib layer forming apparatus 71 that forms the rib layer 40 on the rib forming substrate 20 and a dry film corresponding to the manufacturing method. A laminating device 72 for laminating resists 54 and 59, a mask forming device for patterning the dry film resists 54 and 59 to form blast masks 50 and 55, and a blast mask 50 to the rib layer 40 on the rib forming substrate 20 A blasting device 80 for spraying the blast material 75 from the 55 side and a removing device for removing the blast mask 50 are provided. Hereinafter, each process will be described together with devices (means) used in each process.

(Rib layer forming process)
First, the rib layer forming step will be described. In the rib layer forming step, first, the rib forming substrate 20 is prepared, and then the rib layer that forms the first rib 34 and the second rib 38 on the dielectric layer 26 of the rib forming substrate 20. (Rib forming material layer) 40 is formed.

  In the present embodiment, the rib layer forming step includes a step of forming the first rib layer 41 on the rib forming substrate 20 and a blast processability on the first rib layer 41 as compared with the first rib layer 41. A step of forming a low second rib layer 42 and a step of forming a third rib layer 43 having a higher blast workability than the second rib layer 42 on the second rib layer 42. That is, as shown in FIG. 6, the formed rib layer 40 has a three-layer structure including a first rib layer 41, a second rib layer 42, and a third rib layer 43.

  Here, the blast workability is evaluated by the amount of cutting when the blast material 75 is injected to the layer to be compared under the same blasting conditions. In the evaluation, the cutting amount is measured by the same method (for example, confirmation of a cross-sectional image by a scanning electron microscope (SEM)) between the comparison target layers. When the cutting amount under the same condition is large, the blast workability is evaluated as high (good), and when the cutting amount under the same condition is small, the blast workability is evaluated as low (bad). Moreover, when comparing blast workability between two or more layers, it compares using the cutting amount (cutting depth) on the same conditions. For example, when the cutting depth of one layer is 30 μm and the cutting depth of the other layer under the same blasting conditions is 10 μm, the blasting property of one layer is three times the blasting property of the other layer. Evaluate that there is.

  The inventors of the present invention have conducted intensive research, whereby the blast workability of the first rib layer 41 is 1.5 times or more and 100 times or less, more preferably 2 times or more of the blast workability of the second rib layer 42. It has been found that it is preferable to be 25 times or less. That is, while the second rib layer 42 is cut by 10 μm, the first rib layer 41 is preferably cut by 15 μm to 1000 μm, more preferably 20 μm to 250 μm, under the same blasting conditions. Further, the blast workability of the third rib layer 43 is preferably 1.1 to 20 times the blast workability of the second rib layer 42, and more preferably 1.5 to 10 times. It was also found to be preferable. The reason for these will be described in detail later.

  The first to third rib layers 41, 42, 43 are formed by, for example, applying a rib layer forming composition 48 containing a solvent, drying the rib layer forming composition 48, and removing the solvent. Can be done. As a coating method and a coating apparatus for the rib layer forming composition 48, various conventionally known methods and apparatuses can be used. For example, the rib layer forming device 71 includes a die coater (see FIG. 6), a screen printing machine or the like as the coating device 71a, and the first to third rib layers 41, 42, 43 are formed by the coating device 71a. The rib layer forming composition 48 to be formed may be applied onto the rib forming substrate 20. According to such a method, the first to third rib layers 41, 42, 43 having uniform film thicknesses are formed on the rib forming substrate 20, respectively. The rib layer 40 having a uniform film thickness on the plate surface can be obtained.

  As the rib layer forming composition 48, various known compositions used for the ribs of the PDP back plate 10 are selected according to the method for forming the rib layer 40 (the method for applying the rib layer forming composition 48). It can be selected appropriately. As an example, the rib layer forming composition 48 may include the glass frit and inorganic powder described above, a resin component, and a solvent. The glass frit is fused to an inorganic powder functioning as an aggregate in a firing process described later to form the first rib 34 and the second rib 38. The resin component functions as a binder in the rib layer forming composition 48. The solvent can be omitted depending on the coating method of the rib layer forming composition 48. Further, the rib layer forming composition 48 may further include other components such as an inorganic pigment.

  For example, the blast processability of the first to third rib layers 41, 42, 43 formed from the rib layer forming composition 48 can be adjusted by adjusting the content ratio of the resin component. Specifically, by increasing the resin component content, the blast processability of the rib layer formed from the rib layer forming composition 48 can be lowered, and by reducing the resin component content. The blasting property of the rib layer formed from the rib layer forming composition 48 can be increased. However, it is not restricted to this, You may make it operate the blast workability of each rib layer 41,42,43 using another method.

  By the way, each thickness of the 1st thru | or 3rd rib layer 41,42,43 can be set variously. However, from the viewpoint of controlling the height of the second rib 38 with high accuracy as will be described later, the second rib 38 excludes the portion formed of the third rib layer 43 and the second rib 38 and the second rib 38. It is preferable to be constituted by a portion made of the rib layer 42. In this case, the height difference between the first rib 34 and the second rib 38 is determined by the thickness of the third rib layer 43. In addition, if the thickness of the second rib layer 42 that is relatively difficult to cut by blasting is large, the time required for the blasting process becomes long. Considering these points, the thickness of the first rib layer 41 after drying is set to about 10 μm to 250 μm, the thickness of the second rib layer 42 after drying is set to about 1 μm to 30 μm, and the third rib layer 43 The thickness after drying may be about 5 μm to 150 μm.

(First resist laminating step and first blast mask forming step)
Next, a 1st resist lamination process and a 1st blast mask formation process are demonstrated. By these two steps, the first blast mask 50 having a predetermined pattern is formed on the rib layer 40 formed on the rib forming substrate 20.

  Specifically, as shown in FIG. 4B, as a first resist laminating step, a dry film resist (DFR) having blasting resistance is formed on the rib layer 40 formed on the rib forming substrate 20. ) 54 is laminated. As the method and apparatus for laminating the first dry film resist 54, various conventionally known methods and apparatuses can be used. For example, the laminating device 72 includes a pressing roller 72a (see FIG. 7) or the like as a laminator, and the laminator causes the first dry film resist 54 to be laminated on the rib layer 40 by, for example, thermocompression bonding. Also good. Such a laminating apparatus can also be used in the second resist layer laminating step described later.

  According to such a method, the resist-forming composition containing a solvent is applied onto the rib layer 40, and then the resist-forming composition is dried to form a resist layer, which is extremely simple. In addition, the resist layer can be formed in a short time. In addition, as the 1st dry film resist 54, the various known thing which has blast-proof property can be used.

  Next, the first dry film resist 54 is made to form a blast mask 50 having a predetermined pattern. Specifically, as the first blast mask forming step, exposure and development using a photolithography technique are performed to pattern the first dry film resist 54 into a desired pattern. As a result, as shown in FIG. 4C, a first blast mask 50 including a plurality of linear portions 51 extending along the first direction is formed. The width of the linear portion 51 is set to a constant value without changing at each position along the first direction. As will be described later, each linear portion 51 of the first blast mask 50 is formed on a portion of the rib layer 40 where the first rib 34 is to be formed.

  In accordance with such a method of forming the first blast mask 50, a mask forming apparatus (not shown) includes an exposure apparatus and a developing apparatus used for patterning the dry film resist 54. As these devices, various conventionally known devices can be used. Such a mask forming apparatus can also be used in a second blast mask forming process to be described later.

(First blasting process)
Next, the 1st blasting process in which the blast material 75 is sprayed to the rib layer 40 from the formed 1st blast mask 50 side, and the uneven | corrugated rib layer 45 is formed from the rib layer 40 is demonstrated. In the first blasting process, a portion of the rib layer 40 that is not covered with the first blast mask 50 is cut by a thickness less than the total thickness of the rib layer 40.

  First, a blasting apparatus 80 used in the first blasting process will be described mainly with reference to FIGS. 13 to 16. In addition, the blasting apparatus 80 demonstrated here can be used also in the 2nd blasting process mentioned later.

  As shown in FIG. 13 and FIG. 14, the blasting device 80 includes a blast nozzle 85 for injecting a blast material 75, a pipe 81 connected to the blast nozzle 85, a compressed gas source 82 and a blast connected to the pipe 81. A material supply source 83 and a holding device 88 that holds the workpiece W are provided. In this blast processing apparatus 80, gas is supplied from a compressed gas source 82 and blast material 75 is supplied from a blast material supply source 83. The supplied blast material 75 is jetted from the blast nozzle 85 together with the compressed gas, and collides with the workpiece W held by the holding device 88. As a result, the workpiece W is cut by the blast material 75. Here, the workpiece W in the present embodiment is a laminate of the rib forming substrate 20, the rib layer 40, and the blast mask 50 (55), and it is the rib layer 40 that is actually cut. .

  The blast nozzle 85 is held via holding means (not shown). The holding means can adjust the relative position of the blast nozzle 85 with respect to the workpiece W. As a result, the height position of the blast nozzle 85 with respect to the workpiece W (position along the normal of the plate surface of the rib forming substrate 20) and the planar position with respect to the workpiece W (plate surface of the rib forming substrate 20). (Position on) can be controlled.

  The form of the discharge port 86 of the blast nozzle 85 is not particularly limited, and various known forms such as a slit shape, a circular shape, an elliptical shape, and a polygonal shape can be employed. Among these, since the workpiece W can be processed at once at a wide range, and thereby uniform and efficient processing can be realized, the blast nozzle 85 has a slit shape as shown in FIG. It is preferable to have the opening 86. In this case, the width of the discharge port 86 (opening width in the direction orthogonal to the longitudinal direction of the discharge port 86) can be set in the range of 50 μm to 10000 μm, preferably in the range of 100 μm to 5000 μm, for example. Further, as shown in FIG. 16, the nozzle 85 may be configured by arranging a plurality of discharge mechanisms having substantially circular discharge ports 86 in parallel. Also with such a nozzle 85, the workpiece W can be processed at once at a wide range, whereby uniform and efficient processing can be realized.

  Next, the 1st blasting process performed using such a blasting apparatus 80 is demonstrated.

  In the first blast processing step, the blast material 75 is sprayed from the blast nozzle 85 to cut the rib layer 40. At this time, the holding means for holding the blast nozzle 85 holds the blast nozzle 85 in the holding device 88 so that the blast material 75 is jetted along the substantially normal line NL of the plate surface of the rib forming substrate 20. Positioning is performed with respect to the laminate W of the rib forming substrate 20, the rib layer 40, and the blast mask 50. The blast material 75 is ejected from the blast nozzle 85 with a certain width, but here, the central direction of the certain width is approximately the normal of the plate surface of the rib forming substrate 20. This means that the position of the blast nozzle 85 is adjusted so as to be parallel.

  The blast material 75 used in the first blasting is not particularly limited, and examples thereof include diamond, alumina, silicon carbide, calcium carbonate, glass beads, stainless steel, and the like. The particle size of the blast material 75 is not particularly limited, but can be, for example, in the range of 3 μm to 200 μm, preferably in the range of 7 μm to 100 μm.

  Also, in the first blasting process, the blasting conditions such as the injection pressure when the blasting material 75 is injected from the blast nozzle 85 and the injection amount of the blasting material 75 are the normal blasting conditions when the rib layer 40 is blasted. A set value can be adopted. Further, in the first blasting process, a normal setting value when blasting the rib layer can be adopted as the separation distance between the discharge port 86 of the blast nozzle 85 and the rib layer 40 to be cut.

  In the first blasting process, the relative position between the blast nozzle 85 and the workpiece (laminate) W held by the holding device 88 is changed on the plate surface of the rib forming substrate 20, The blast material 75 is injected over the entire area of the workpiece W. For example, when observed from the normal direction of the plate surface of the rib forming substrate 20, the blast nozzle 85 moves along the path indicated by the dotted line in FIG. The rib layer 40 on the blast nozzle 85 and the rib forming substrate 20 moves relative to each other. As described above, the blast material 75 is sprayed to the entire area of the rib layer 40 from the normal direction of the plate surface of the rib forming substrate 20.

  As used herein, “directly above” means an upper side (normally to the blast mask (dry film resist) side of the rib forming substrate 20) along the normal of the plate surface of the rib forming substrate 20, and “directly below”. The term “below” means a downward direction along the normal line of the plate surface of the rib forming substrate 20 (the rib forming substrate 20 side relative to the blast mask (dry film resist)).

  Thus, the blast material 75 sprayed along the direction of the normal line NL of the rib forming substrate 20 is not covered by the first blast mask 50 or the first blast mask 50 of the rib layer 40. Collide with part. As a result, a portion of the rib layer 40 that is not covered by the first blast mask 50 is scraped by the blast material 75. However, in the first blasting step, the portion of the rib layer 40 that is not covered by the first blast mask 50 is cut by a thickness less than the total thickness of the rib layer 40. That is, the portion of the rib layer 40 that is not covered by the first blast mask 50 is not scraped off and the one surface 20a of the rib forming substrate 20 is not exposed. More specifically, as shown in FIG. 8, in the first blasting process, the portion made of the third rib layer 43 is scraped off, and the second rib layer 42 is exposed. Here, FIG. 8 shows one state during the first blasting process in a cross section along the normal line NL and the second direction of the rib forming substrate 20.

  As described above, the blast workability of the second rib layer 42 is lower than the blast workability of the third rib layer 43 that forms the surface layer of the rib layer 40. Therefore, when the portion made of the third rib layer 43 is removed and the portion made of the second rib layer 42 is exposed, the machinability by blasting changes greatly. If the blasting conditions are constant, the second rib layer 42 It takes a longer time to cut. For this reason, it is extremely easy to stop the injection of the blast material 75 in the first blasting process in a state in which the portion made of the third rib layer 43 is removed and the portion made of the second rib layer 42 is exposed. It has become.

  As described above, the portion of the rib layer 40 that is not covered with the first blast mask 50 is removed while the portion of the rib layer 40 that is covered with the first blast mask 50 is left. In other words, the thickness of the rib layer 40 other than directly below the linear portion 51 of the first blast mask 50 is reduced. Thereby, as shown in FIG. 4D and FIG. 8, the uneven rib layer 45 having the linear protrusions 46 located immediately below the linear part 51 of the first blast mask 50 is formed.

  By the way, as shown in FIG. 8, the blast material 75 that has moved (flyed) along the normal direction of the rib forming substrate 20 collides with the rib layer 40 and bounces back in an irregular direction. Part of the bounced blast material 75a, 75b collides with a portion of the rib layer 40 located immediately below the linear portion 51 of the first blast mask 50. At this time, if the blast materials 75a and 75b have a sufficient moving speed, the portion of the rib layer 40 that is located immediately below the linear portion 51 of the first blast mask 50 that is not originally cut is removed. It will be done. That is, a portion of the rib layer 40 that is located immediately below the linear portion 51 of the first blast mask 50 is also scraped from the side by the blast material 75 that has bounced off the rib layer 40 and bounced (hereinafter referred to as the “blank layer”). In this case, this side cutting is also called side etching). That is, “to cut a portion of the rib layer 40 that is not covered with the first blast mask 50” means to cut only a portion of the rib layer 40 that is not covered with the first blast mask 50. is not. It does not exclude at least side cutting into a portion immediately below the linear portion 51 of the first blast mask 50.

  In particular, in the present embodiment, as described above, below the third rib layer 43 forming the surface layer of the rib layer 40, the second rib layer 42 having low blast workability, that is, difficult to be scraped by blast work. Is arranged. Therefore, during the period from the exposure of the second rib layer 42 to the end of the first blasting process, the blast materials 75a and 75b that are incident on and reflected by the second rib layer 42 are, as shown in FIG. The third rib layer 43, which is located above the second rib layer 42 and is more easily scraped than the second rib layer 42, is cut from the side. That is, the side cutting makes it easy for the portion of the rib layer 40 that is located immediately below the linear portion 51 of the first blast mask 50 to proceed.

  As shown in FIGS. 4D and 8, the linear portion 51 of the first blast mask 50 remains disposed on the uneven rib layer 45 formed as described above. Yes. The linear portion 51 of the first blast mask 50 is removed before the second dry film resist 59 is laminated on the uneven rib layer 45. As a method for removing the linear portion 51 of the first blast mask 50, various known methods that can be used in the manufacture of the PDP back plate can be employed. For example, the linear portion 51 of the first blast mask 50 can be removed using caustic soda. The blast mask removing apparatus in this case includes an injection mechanism for injecting caustic soda or a caustic soda storage tank for storing caustic soda. In this way, the uneven rib layer 45 is exposed on the one surface 20a of the rib forming substrate 20 (see FIG. 5A).

(Second resist lamination step and second blast mask formation step)
Next, a 2nd resist lamination process and a 2nd blast mask formation process are demonstrated. Through these two steps, the second blast mask 55 having a predetermined pattern is formed on the uneven rib layer 45 formed on the rib forming substrate 20.

  First, as shown in FIG. 5B, as a second resist laminating step, a second dry film resist having blasting resistance (on the uneven rib layer 45 formed on the rib forming substrate 20). DFR) 59 is laminated. As described above, the uneven rib layer 45 has a plurality of linear protrusions 46 extending along the first direction. Accordingly, the second dry film resist 59 is disposed on the uneven surface of the uneven rib layer 45. Specifically, as shown in FIG. 9, the second dry film resist 59 is in contact with the uneven rib layer 45 at the linear protrusion 46 and at least a portion between two adjacent linear protrusions 46. In FIG. 5, it is arranged on the uneven rib layer 45 so as to be in contact with the uneven rib layer 45.

  4 and 5 are diagrams showing a portion corresponding to the portion shown in FIG. 1, and are schematic views for schematically explaining a method of manufacturing a PDP back plate. In FIG. 5B, the purpose is to explain the relative positional relationship between the second dry film resist 59 and the uneven rib layer 45, and the second dry film resist 59 and the uneven rib layer 45. The contact state is not shown precisely. Refer to FIG. 9 for the contact state between the second dry film resist 59 and the uneven rib layer 45. Here, FIG. 9 is a diagram showing one state of the workpiece after the formation of the second blast mask in the cross section corresponding to FIG.

  Such lamination of the second dry film resist 59 can be performed by the same method using the same apparatus as the lamination of the first dry film resist 54 described above.

  According to such a method, the uneven rib layer 45 is formed without applying a resist-forming composition containing a solvent on the rib layer 40 and then drying the resist-forming composition to form a resist layer. It becomes possible to make the thickness of the resist layer (second dry film resist 59) above constant.

  Next, the second dry film resist 59 is made to form a blast mask 50 having a predetermined pattern. Specifically, as the second blast mask forming step, exposure and development using a photolithography technique are performed to pattern the second dry film resist 59 into a desired pattern. As a mask forming apparatus used for forming the second blast mask 55, an apparatus that can be used for forming the first blast mask 50 can be used.

  Here, the shape of the second blast mask 55 formed in the second blast mask forming step will be described mainly with reference to FIGS. 10 and 11. 10 and 11 are a cross-sectional view and a partial plan view showing a laminated body W of the second blast mask 55, the uneven rib layer 45, and the rib forming substrate 20 after the second blast mask is formed. 8, 9, 10, and 12 correspond to the cross section taken along the line AA in FIG. 11.

  As shown in FIG. 11, the obtained second blast mask 55 corresponds to the shape of the step matrix rib 30 to be formed in plan view (view from the direction along the normal line NL of the rib forming substrate 20). Thus, it is formed in a matrix in a plan view. That is, the second blast mask 55 is disposed so as to correspond to the plurality of first pattern portions 56 corresponding to the first ribs 34 and the second rib 38, and two adjacent first pattern portions. A plurality of second pattern portions 57 extending between 56. As shown in FIGS. 10 and 11, the first pattern portion 56 extends on the linear protruding portion 46 of the rib layer 45 with unevenness in parallel with the first direction on the rib forming substrate 20. On the other hand, as shown in FIG. 11, the second pattern portion 57 extends in parallel with the second direction on the rib forming substrate 20.

  In particular, in the present embodiment, as shown in FIG. 9, the second dry film resist 59 is in contact with the uneven rib layer 45 in the linear protrusion 46 and the two adjacent linear protrusions 46. At least a part of the rib is disposed on the uneven rib layer 45 so as to be in contact with the uneven rib layer 45. As a result, the second dry film resist 59 has a substantially constant thickness on the uneven rib layer 45. Therefore, as shown in FIG. 17, the second blast mask having a desired pattern is formed by photolithography, compared with the case where the second dry film resist 59 does not have a constant thickness on the uneven rib layer 45. Can be manufactured with high accuracy.

  In the present embodiment, as shown in FIGS. 8, 10, and 11, the width w <b> 2 of the first pattern portion 56 of the second blast mask 55 is the width of the linear portion 51 of the first blast mask 50. It is narrower than w1. Here, in FIG. 11, the linear portion 51 of the first blast mask 50 in a state before being removed from the uneven rib layer 45 is indicated by a two-dot chain line. According to this embodiment, as shown in FIG. 8, the width w3 of the end surface of the linear protrusion 46 of the uneven rib layer 45 is set to the first brass and the mask by side cutting (side etching). Even if it is narrower than the width w1 of the 50 linear portions 51, as shown in FIG. 10, the first blast mask 55 first is formed on the flat end surface of the linear protrusion 46 of the uneven rib layer 45. The pattern portion 56 can be formed. That is, the first pattern portion 56 of the second blast mask 55 is formed from a portion of the second dry film resist 59 located on the flat end surface of the linear protrusion 46 of the uneven rib layer 45. It becomes like this. For this reason, it becomes possible to form the 1st pattern part 56 accurately using a photolithographic technique.

  Further, as described above, the second dry film resist 59 is in contact with the uneven rib layer 45 not only at the linear protrusion 46 but also at least at a part between the two adjacent linear protrusions 46. Accordingly, as shown in FIG. 10, the second pattern portion 57 of the second blast mask 55 is fixed to the uneven rib layer 45 at an intermediate portion 57 b between both end portions 57 a and 57 a connected to the first pattern portion 56. Is done. That is, the second blast mask 55 formed on the uneven rib layer 45 having unevenness is fixed to the uneven rib layer 45 not only in the first pattern portion 56 but also in the second pattern portion 57 portion. For this reason, the second blast mask 55 is firmly fixed to the uneven rib layer 45 as a whole.

  As described above, the surface of the rib layer 45 with unevenness on which the second dry film resist 59 is laminated has unevenness. However, the irregularities are formed by the linear projections 46 of the rib layer 45 with irregularities, and the arrangement of the linear projections 46 is very simple and the projection height of the linear projections 46 is large. There is no. Therefore, when the second blast mask 55 is formed by removing a part of the second dry film resist 59, the second dry film resist is formed between the formed second blast mask 55 and the uneven rib layer 45. The possibility that the unnecessary part removed from 59 remains is very low.

(Second blasting process)
Next, a second blasting process in which the blast material 75 is sprayed from the formed second blast mask 55 side to the uneven rib layer 45 to form the step matrix rib 30 from the uneven rib layer 45 will be described. In the second blasting process, a portion of the uneven rib layer 45 that is not covered with the second blast mask 55 is shaved.

  The blasting apparatus used in the second blasting process can be the same as the blasting apparatus 80 used in the first blasting process described above. Further, in the second blasting process, the blasting conditions such as the injection pressure when the blasting material 75 is injected from the blast nozzle 85 and the injection amount of the blasting material 75 can be selected in the same manner as in the first blasting process. . Further, in the second blasting process, the distance between the discharge port 86 of the blast nozzle 85 and the uneven rib layer 45 to be cut can be selected in the same manner as in the first blasting process.

  However, with respect to the injection amount of the blast material 75, the injection amount per unit time of the blast material 75 in the second blast processing step may be larger than the injection amount per unit time of the blast material 75 in the first blast processing step. preferable. Specifically, the injection amount per unit time of the blast material 75 in the first blast processing step is 1/100 or more and 1/5 or less of the injection amount per unit time of the blast material 75 in the second blast processing step. It is preferable. In the second blasting step, the second rib layer 42 having a relatively low blasting property that was not actively cut in the first blasting step is cut. In addition, by reducing the injection amount in the first blasting process, it is possible to effectively prevent the second rib layer 42 from being cut, and the uneven rib layer 45 having a desired shape can be stably accurate. It can be manufactured well. On the other hand, if the injection amount in the first blasting process is too small, the processing time in the first blasting process becomes longer. From the above, it is preferable to set the injection amount of the blast material 75 in the first blasting process and the blast material 75 in the second blasting process in the above ranges.

  Under such conditions, as a second blasting process, the relative position between the blast nozzle 85 and the workpiece (laminate) W held by the holding device 88 is determined on the plate surface of the rib forming substrate 20. The blast material 75 is sprayed over the entire area of the workpiece W. At this time, the blast material 75 is injected along the normal line NL of the plate surface of the rib forming substrate 20. As mentioned in the description of the first blasting process, the blast material 75 is injected from the blast nozzle 85 with a certain width. Here, it means that the center direction of a certain width is substantially parallel to the normal line of the plate surface of the rib forming substrate 20.

  The blast material 75 thus sprayed along the direction of the normal line NL of the rib forming substrate 20 is covered by the second blast mask 55 or the second blast mask 55 of the uneven rib layer 45. Collide with parts that are not. As a result, as shown in FIG. 12, the portion of the uneven rib layer 45 that is not covered with the second blast mask 55 is scraped by the blast material 75 and is located below the uneven rib layer 45. The rib forming substrate 20 is exposed. Here, “to remove a portion of the uneven rib layer 45 that is not covered with the second blast mask 55” means a portion of the uneven rib layer 45 that is not covered with the second blast mask 55. It is not excluded that the portion covered with the second blast mask 55 in the rib layer 45 with unevenness is not removed by, for example, side etching.

  As described above and as well shown in FIG. 11, the second blast mask 55 is formed in a matrix in a plan view (when observed along the normal line of the rib forming substrate 20). Has been. Therefore, the uneven rib layer 45 is cut by the second blasting process so as to have a matrix-like outline in plan view. More specifically, a plurality of first ribs 34 extending in the first direction remain immediately below the first pattern portion 56 of the second blast mask 55, and the second pattern portion 57 of the second blast mask 55 A plurality of second ribs 38 extending along the second direction remain immediately below.

  As shown in FIGS. 10 and 11, the first pattern portion 56 of the second blast mask 55 is located on the linear protrusion 46 of the uneven rib layer 45. Therefore, in the second blasting process, the linear protrusions 46 are not actively scraped from above, and remain after the second blasting process with the height before the blasting process. That is, at least a part of the linear protrusion 46 forms the first rib 34, and the height of the first rib 34 from the rib forming substrate 20 is the same as the total thickness of the rib layer 40. On the other hand, the second pattern part 57 of the second blast mask 55 extends between two adjacent linear protrusions 46 of the rib layer 45 with unevenness. That is, the second pattern portion 57 is located immediately above the region where the third rib layer 43 of the uneven rib layer 45 is scraped. Therefore, the height of the rib forming substrate 20 of the second rib 38 is a height obtained by adding the thicknesses of the first rib layer 41 and the second rib layer 42. That is, the height of the second rib 38 is lower than the height of the first rib 34 by the thickness of the third rib layer 43.

  As described above, the portion of the uneven rib layer 45 not covered by the second blast mask 55 is removed, and the portion of the uneven rib layer 45 covered by the second blast mask 55 remains. Accordingly, as shown in FIG. 5D and FIG. 12, the step matrix having the first rib 34 and the second rib 38 having a height lower than that of the first rib 34 from the uneven rib layer 45. Ribs 30 are formed.

  In particular, according to the present embodiment, as described above, the second dry film resist 59 is in contact with the uneven rib layer 45 at the linear protrusion 46 and between the two adjacent linear protrusions 46. At least a part of the rib is disposed on the uneven rib layer 45 so as to be in contact with the uneven rib layer 45. As a result, as shown in FIG. 17, the second blast having a desired pattern is formed by a photolithography technique as compared with the case where the second dry film resist 59 does not have a constant thickness on the uneven rib layer 45. The mask 55 can be manufactured with high accuracy. Furthermore, as described above, the first pattern portion 56 of the second blast mask 55 is formed on the flat end surface of the linear protrusion 46 of the uneven rib layer 45. As a result, the first pattern portion 56 can be accurately manufactured using a photolithography technique. For these reasons, the uneven rib layer 45 can be cut with high accuracy using the second blast mask 55 manufactured with high accuracy, and the stepped matrix rib 30 having a desired contour can be manufactured.

  Further, as described above, in the present embodiment, the second pattern portion 57 of the second blast mask 55 is provided with unevenness at the intermediate portion 57b between both end portions 57a and 57a connected to the first pattern portion 56. It is in contact with the rib layer 45. Therefore, the blast material 75 does not collide with the second rib 38 formed immediately below the second pattern portion 57 from above. For this reason, the 2nd rib 38 can be made to have a flat upper surface. Further, as described above, not only the first pattern portion 56 of the second blast mask 55 but also the second pattern portion 57 is fixed to the uneven rib layer 45. As a result, the second blast mask 55 is firmly fixed to the uneven rib layer 45 despite being disposed on the uneven surface of the uneven rib layer 45. Therefore, a portion of the second blast mask 55 is peeled off from the uneven rib layer 45 or moved relative to the uneven rib layer 45 by the injection of the blast material 75 during the second blasting process. And the like can be effectively prevented. As a result, the step matrix rib 30 having a desired shape can be manufactured more stably and with higher accuracy.

  Furthermore, the width w2 of the first pattern portion 56 of the second blast mask 55 covering the linear protrusion 46 of the uneven rib layer 45 during the second blast processing step is the linear portion of the first blast mask 50. 51 is narrower than the width w1. Therefore, as can be understood by comparing FIG. 10 and FIG. 12, the height of the linear protrusion 51 does not change during the second blasting process, but the width of the linear protrusion 51 becomes narrower. . That is, in the second blasting step, the width of the first rib 34 that includes the linear protrusion 46 as the tip can be blast cut. According to such a method, the first rib 34 can be formed with higher accuracy by reducing the dimensional variation of the first rib 34.

  According to the present embodiment, as described above, below the third rib layer 43 forming the surface layer of the rib layer 40, the second rib having low blast workability, that is, difficult to be cut by blast work. Layer 42 is disposed. For this reason, it takes time to cut the second rib layer 42, and in the second blasting process, the linear protrusion 46 of the uneven rib layer 45 is cut somewhat by side cutting. Therefore, as a result of extensive research by the present inventors, as described above, the blast workability of the third rib layer 43 is set to 1.1 to 20 times the blast workability of the second rib layer 42. It is preferable that it is set to 1.5 times or more and 10 times or less. If the blast workability of the second rib layer 42 is too low compared to the blast workability of the third rib layer 43, that is, the second rib layer 42 is too difficult to be cut compared to the third rib layer 43. Then, side cutting during the blasting process is promoted too much, and the portion of the obtained first rib 34 made of the third rib layer 43 is larger than the portion made of the second rib layer 42. It is cut out. As a result, as shown in FIG. 18, irregularities are formed on the outer contour of the first rib 34, which causes inconvenience as a surface for supporting the phosphor layer 18 that emits visible light.

  On the other hand, if the blast workability of the third rib layer 43 is too low with respect to the blast workability of the second rib layer 42, that is, if the third rib layer 43 is too difficult to be cut, Then, it becomes difficult to cut only the portion made of the third rib layer 43, and a part or all of the second rib layer 42 is cut. As a result, the height of the second rib 38 varies. Further, if the blast workability of the third rib layer 43 is too low with respect to the blast workability of the second rib layer 42, that is, if the third rib layer 43 is too difficult to be cut, It takes a long time to scrape off the third rib layer 43. That is, productivity is deteriorated.

  Furthermore, when the present inventors have made extensive studies on blast workability, as described above, the blast workability of the first rib layer 41 is 1.5 times to 100 times the blast workability of the second rib layer 42. It is preferably set as follows, and more preferably set at 2 times or more and 25 times or less. As a result, it is preferable that the blast workability of the first rib layer 41 is higher than the blast workability of the third rib layer 43.

  If the blast workability of the first rib layer 41 is too high compared to the blast workability of the second rib layer 42, that is, if the first rib layer 41 is too easy to be cut compared to the second rib layer 42. Further, side cutting into the first rib layer 41 during the second blasting process is promoted too much, and a portion of the first rib 34 and the second rib 38 obtained from the first rib layer 41 is obtained. Compared with the portion made of the second rib layer 42, it is greatly sharpened. As a result, irregularities are formed in the outer contour of the first rib 34 (see FIG. 18) and the outer contour of the second rib 38, which causes inconvenience as a surface for supporting the phosphor layer 18 that emits visible light.

  On the other hand, if the blast workability of the first rib layer 41 is too low with respect to the blast workability of the second rib layer 42, that is, if the first rib layer 41 is too hard to be cut, It takes a long time to scrape off the first rib layer 41. That is, productivity is deteriorated.

(Other processes)
After the step matrix ribs 30 are formed on the rib forming substrate 20 as described above, the second blast mask 55 is removed from the step matrix 30. When the second blast mask 55 is removed, the step matrix ribs 30 are exposed on one surface 20a of the rib forming substrate 20 (see FIG. 1). The second blast mask 55 is removed by using the same apparatus as the apparatus for removing the first blast mask 50 from the uneven rib layer 45 and removing the first blast mask 50 from the uneven rib layer 45. Can be done as well.

  Next, the step matrix ribs 30 on the rib forming substrate 20 are baked. Thereafter, the phosphor layer 18 is formed on the side surfaces of the step matrix ribs 30 and the one surface 20 a of the rib forming substrate 20. As a method for forming the phosphor layer 18, various known methods that can be used in the production of a PDP back plate, for example, a film formation method by screen printing can be employed.

  As described above, the plasma display panel back plate 10 shown in FIG. 2 is obtained.

<Summary of effects of the present embodiment>
According to the present embodiment as described above, as the first blasting process, the blast material 75 is sprayed toward the rib layer 40 through the striped first blast mask 50, whereby a plurality of linear protrusions 46 are formed. A concave-convex rib layer 45 is formed. Then, a second dry film resist 59 is laminated on the uneven rib layer 45. At this time, the projecting height of the linear projecting portion 46 is less than the total thickness of the rib layer 40, more specifically, the height difference between the first rib 34 and the second rib 38 formed later. Further, the plurality of linear protrusions 46 are not a complicated shape such as a matrix shape, but only a stripe shape. As a result, the second dry film resist 59 is brought into contact with the linear protrusion 46 of the uneven rib layer 45 and also in contact with the uneven rib layer 45 between two adjacent linear protrusions 46. Can be laminated on the uneven rib layer 45.

  In this case, although the second dry film resist 59 undulates on the uneven rib layer 45, it is possible to prevent the second dry film resist 59 from being crushed immediately above the linear protrusion 46. Further, the thickness of the second dry film resist 59 can be maintained substantially constant on the uneven rib layer 45. Thus, exposure and development using a photolithography technique can be performed on the second dry film resist 59, and the second blast mask 55 can be formed with high accuracy.

  The linear protrusions 46 of the uneven rib layer 45 are arranged in stripes, and the uneven rib layer 45 has a relatively simple shape although it has a step. Therefore, unlike the case of exposing and developing the DFR on the rib layer patterned in a matrix (for example, the case of the first embodiment in Japanese Patent No. 3340352), the patterning of the second dry film resist 59 is performed. It is possible to prevent a portion that is sometimes removed from remaining on the uneven rib layer 45 by being caught by the step of the uneven rib layer 45. Therefore, it is possible to effectively prevent the blast processing accuracy from being reduced due to the unnecessary portion of the second dry film resist 59.

  Further, the formed second blast mask 55 has a matrix shape including a first pattern portion 56 along the first direction and a second pattern portion 47 along the second direction intersecting the first direction. It has become. The second blast mask 55 is fixed in contact with the uneven rib layer 45 in the first pattern portion 46 and the second pattern portion 47. Therefore, the second blast mask 55 is uneven as compared with a striped blast mask (for example, the blast mask in the first embodiment of Japanese Patent No. 3340352) disposed on the uneven rib layer 45 having unevenness. On the ribbed layer 45, it is held remarkably stably. As a result, it is possible to effectively prevent the second blast mask 55 from being peeled off from the uneven rib layer 45 during the second blasting process.

  In the obtained matrix-like rib 30, the first rib including the linear protrusion 46 immediately below the first pattern portion 56 of the second blast mask 55 and having the same height as the thickness of the rib layer 40. 34 is formed. On the other hand, a second rib 38 having a height lower than that of the first rib 34 is formed immediately below the second pattern portion 57 of the second blast mask 55 by the thickness cut in the first blasting process. The In this manner, the step matrix rib 30 including the plurality of first ribs 34 and the second ribs 38 extending between the two adjacent first ribs 34 and having a height lower than that of the first ribs 34 is provided. The back plate 10 for a plasma display panel can be manufactured easily and accurately.

<Modification>
Various modifications can be made within the scope of the gist of the present invention with respect to the above-described embodiment. Hereinafter, an example of a modification will be described.

  In the above-described embodiment, the example in which the rib layer 40 includes the three layers of the first to third rib layers 41, 42, and 43 has been described. can do. For example, the rib layer 40 may be formed from a single layer. Even in such a modification, during the first blasting process, by cutting the portion of the rib layer 40 that is not covered by the first blast mask 50 by an arbitrary thickness less than the total thickness, Finally, the step matrix rib 30 can be obtained.

  In the embodiment described above, the example in which the width w2 of the first pattern portion 56 of the second blast mask 55 is narrower than the width w2 of the linear portion 51 of the first blast mask 50 has been shown. For example, the width w2 of the first pattern portion 56 may be greater than or equal to the width w2 of the linear portion 51.

  Further, in the above-described embodiment, as shown in FIG. 10, the width w2 of the first pattern portion 56 of the second blast mask 55 is equal to the flat surface of the linear protrusion 46 of the uneven rib layer 45. Although an example in which the width is smaller than the width has been shown, the present invention is not limited to this, and the width w2 of the first pattern portion 56 is not less than the width of the flat surface of the linear protrusion 46 of the uneven rib layer 45. Good.

FIG. 1 is a perspective view showing an example of a back plate for a plasma display panel. FIG. 2 is a cross-sectional view showing an example of a back plate for a plasma display panel. FIGS. 3A and 3B are diagrams for explaining a rib forming substrate incorporated in the back plate for the plasma display panel shown in FIG. 1, and FIG. FIG. 3A is a perspective view showing a substrate, and FIG. 3A is a perspective view showing a rib forming substrate in a state where a dielectric layer is omitted. FIG. 4 is a schematic view for explaining an embodiment of a method for manufacturing a back plate for a plasma display panel according to the present invention. FIG. 5 is a schematic diagram for explaining an embodiment of a method for producing a back plate for a plasma display panel according to the present invention, and is a diagram for explaining a production method after the step shown in FIG. FIG. 6 is a diagram for explaining a rib layer forming step of the method for manufacturing the back plate for a plasma display panel. FIG. 7 is a diagram for explaining a resist laminating process of the method for manufacturing the back plate for a plasma display panel. FIG. 8 is a diagram showing a state of the workpiece during the first blasting in a cross section along the second direction and the normal line of the rib forming substrate. FIG. 9 is a diagram showing a state of the workpiece after the second resist laminating process in a cross section along the second direction and the normal line of the rib forming substrate. FIG. 10 is a diagram showing a state of the workpiece after the second blast mask forming step in a cross section along the second direction and the normal line of the rib forming substrate. FIG. 11 is a plan view showing a state of the workpiece after the second blast mask forming step. FIG. 12 is a diagram illustrating a state of the workpiece after the second blasting process in a cross section along the second direction and the normal line of the rib forming substrate. FIG. 13 is a side view showing a schematic configuration of the blast processing apparatus. FIG. 14 is a plan view showing a schematic configuration of the blasting apparatus shown in FIG. FIG. 15 is a perspective view showing an example of a nozzle that can be incorporated in the blasting apparatus shown in FIGS. 13 and 14. FIG. 16 is a perspective view showing another example of a nozzle that can be incorporated in the blasting apparatus shown in FIGS. 13 and 14. FIG. 17 is a diagram for explaining an undesirable lamination state of the second dry film resist. FIG. 18 is a cross-sectional view for explaining an undesirable example of the first rib.

Explanation of symbols

10 Back plate for plasma display panel (back plate for PDP)
20 Rib forming substrate 30 Step matrix rib 34 First rib 38 Second rib 39 Tip portion 40 Rib layer 41 First rib layer 42 Second rib layer 43 Third rib layer 45 Concave rib layer 46 Linear protrusion 50 First DESCRIPTION OF SYMBOLS 1 Blast mask 51 Linear part 55 2nd blast mask 56 1st pattern part 57 2nd pattern part 70 Manufacturing apparatus 71 of the back plate for plasma display panels Rib formation apparatus 75 Blast material 80 Blast processing apparatus

Claims (14)

Forming a rib layer on the rib forming substrate;
Laminating a first dry film resist on the rib layer;
Patterning the first dry film resist to form a first blast mask including a plurality of linear portions extending along a first direction on the rib forming substrate on the rib layer;
A blast material is sprayed from the first blast mask side to the rib layer, and a portion of the rib layer that is not covered with the first blast mask is shaved by a thickness less than the total thickness, Forming an uneven rib layer including a plurality of linear protrusions extending along a direction;
Removing the first blast mask from the uneven rib layer;
Laminating a second dry film resist on the uneven rib layer;
Patterning the second dry film resist, a plurality of first pattern portions extending along the first direction, and a first along a second direction on the rib forming substrate intersecting the first direction. Forming a second blast mask including a plurality of second pattern portions extending between the pattern portions on the uneven rib layer;
A blast material is sprayed from the second blast mask side to the rib layer, a plurality of first ribs including the linear protrusions and extending along the first direction, and the first along the second direction. Forming a step matrix rib that includes a plurality of second ribs extending between the ribs and having a plurality of second ribs having a height from the rib forming substrate lower than that of the first ribs,
The method for manufacturing a back plate for a plasma display panel, wherein the width of the first pattern portion of the second blast mask is narrower than the width of the linear portion of the first blast mask. In the step of laminating the second dry film resist, it is in contact with the linear protrusions of the uneven rib layer and also in contact with the uneven rib layer between two adjacent linear protrusions. The method for producing a back plate for a plasma display panel according to claim 1, wherein a second dry film resist is laminated on the rib layer with unevenness. Forming a rib layer on the rib forming substrate;
Laminating a first dry film resist on the rib layer;
Patterning the first dry film resist to form a first blast mask including a plurality of linear portions extending along a first direction on the rib forming substrate on the rib layer;
A blast material is sprayed from the first blast mask side to the rib layer, and a portion of the rib layer that is not covered with the first blast mask is shaved by a thickness less than the total thickness, Forming an uneven rib layer including a plurality of linear protrusions extending along a direction;
Removing the first blast mask from the uneven rib layer;
The second dry film resist is made to be in contact with the linear protrusions of the uneven rib layer and in contact with the uneven rib layer between two adjacent linear protrusions, so that the second dry film resist is provided with the uneven ribs. Laminating on the layer;
Patterning the second dry film resist, a plurality of first pattern portions extending along the first direction, and a first along a second direction on the rib forming substrate intersecting the first direction. Forming a second blast mask including a plurality of second pattern portions extending between the pattern portions on the uneven rib layer;
A blast material is sprayed from the second blast mask side to the rib layer, a plurality of first ribs including the linear protrusions and extending along the first direction, and the first along the second direction. Forming a step matrix rib including a plurality of second ribs extending between the ribs and having a plurality of second ribs having a height from the rib forming substrate lower than that of the first ribs. Method for manufacturing a back plate. The said 2nd pattern part of a said 2nd blast mask is contacting the said uneven | corrugated rib layer in the intermediate part between the both ends connected to a said 1st pattern part. The manufacturing method of the backplate for plasma display panels as described in any one of. The injection amount of the blast material injected per unit time in the step of forming the uneven rib layer is 1/100 or more of the injection amount of the blast material injected per unit time in the step of forming the step matrix rib. 5. The method for manufacturing a back plate for a plasma display panel according to claim 1, wherein the number is 5 or less. The step of forming the rib layer includes a step of forming a first rib layer on the rib forming substrate, and a second rib layer having a lower blast workability than the first rib layer on the first rib layer. And forming a third rib layer having a higher blasting property than the second rib layer on the second rib layer, and
In the step of forming the uneven rib layer, the third rib layer is shaved,
In the step of laminating the second dry film resist on the uneven rib layer, the second dry film is in contact with the second rib layer between the two adjacent linear protrusions. 6. The method for manufacturing a back plate for a plasma display panel according to claim 1, wherein the back plate is disposed. The method for manufacturing a back plate for a plasma display panel according to claim 6, wherein the blasting property of the first rib layer is higher than the blasting property of the third rib layer. 8. The back plate for a plasma display panel according to claim 6, wherein the blast workability of the first rib layer is not less than 1.5 times and not more than 100 times the blast workability of the second rib layer. 9. Manufacturing method. 9. The plasma according to claim 6, wherein the blasting property of the third rib layer is 1.1 to 20 times the blasting property of the second rib layer. A manufacturing method of a back panel for a display panel. A back plate for a plasma display panel manufactured by the manufacturing method according to claim 1. A laminate used in manufacturing a back plate for a plasma display panel using blasting,
A rib forming substrate;
An uneven rib layer including a plurality of linear protrusions formed on the rib forming substrate and extending along a first direction on the rib forming substrate;
A dry film resist laminated on the uneven rib layer,
The dry film resist is in contact with the linear protrusions of the uneven rib layer and is also in contact with the uneven rib layer between two adjacent linear protrusions. . A laminate used in manufacturing a back plate for a plasma display panel using blasting,
A rib forming substrate;
An uneven rib layer including a plurality of linear protrusions formed on the rib forming substrate and extending along a first direction on the rib forming substrate;
A blast mask formed on the uneven rib layer,
The laminated body, wherein the blast mask is in contact with the linear protrusions of the uneven rib layer and is also in contact with the uneven rib layer between two adjacent linear protrusions. The blast mask includes a plurality of first pattern portions extending along the first direction and a plurality of first pattern portions extending along a second direction on the rib forming substrate intersecting the first direction. A second pattern portion,
The first pattern portion is disposed on the linear protrusion of the uneven rib layer,
The laminate according to claim 12, wherein the second pattern portion is in contact with the uneven rib layer at an intermediate portion between both end portions connected to the first pattern portion. The blast mask includes a plurality of first pattern portions extending along the first direction and a plurality of first pattern portions extending along a second direction on the rib forming substrate intersecting the first direction. A second pattern portion,
14. The laminate according to claim 12, wherein a width of the first pattern portion is narrower than a width of a flat end surface of the linear protrusion.

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