JP2010009976A - Method of manufacturing back face plate for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a back face plate for a PDP (Plasma Display Panel), capable of accurately and easily forming the back face plate for the PDP for reducing the overhang of a rib top part. <P>SOLUTION: This manufacturing method comprises a process of preparing a back face plate forming member of laminating a substrate, a pattern-shaped address electrode layer, a dielectric layer, a rib material layer and a photosensitive register layer in this order, a process of exposing the photosensitive register layer in response to a shape of a stripe-shaped rib, a process of forming a stripe-shaped photosensitive register pattern by developing the photosensitive register layer after an exposure, a process of forming a constructed part by removing an end part on the rib material layer side of the stripe-shaped photosensitive register pattern by controlling the flow direction of a developer so as to become substantially parallel to the stripe direction of the stripe-shaped photosensitive register pattern in a plan view, and a process of forming a stripe-shaped rib by performing blast processing of a rib material layer with the stripe-shaped photosensitive register pattern for forming the constructed part as a mask. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a PDP back plate capable of obtaining a back plate for a plasma display panel (hereinafter, also referred to as “PDP back plate”) with reduced overhang (overhang) of a rib top. .

  A back plate used in a plasma display panel (hereinafter sometimes referred to as “PDP”) is usually a substrate 21 and a patterned address electrode layer 22 formed on the substrate 21 as shown in FIG. A dielectric layer 23 formed on the address electrode layer 22, a rib 24 formed on the dielectric layer 23, and a phosphor layer 25 (25R, 25G, 25B) formed between the ribs 24; Have Also, some conventional PDP back plates have striped ribs 24 as shown in FIG. Note that the PDP back plate shown in FIG. 16 does not show the entire PDP back plate, but shows a part for convenience.

  As a method for forming such a patterned rib, a method as shown in FIG. 17 is conventionally known. Specifically, first, a laminate including a substrate 21, a patterned address electrode layer 22, a dielectric layer 23, and a rib material layer 24a is prepared (FIG. 17A), and then the surface of the rib material layer 24a is prepared. A photosensitive resist layer 26a such as a dry film resist (DFR) is formed thereon (FIG. 17 (b)). Next, exposure / development is performed in accordance with the target rib shape to form a photosensitive resist pattern. Next, the rib 24 is formed by performing a blasting process for grinding the rib material layer 24a using the photosensitive resist pattern 26 as a mask (FIG. 17C), Finally, the remaining photosensitive resist pattern 26 is peeled off (FIG. 17E).

  Here, it is known that an overhang is generated at the top of a rib formed by blasting. Specifically, as shown in FIG. 18, it is known that an overhang 27 is generated at the top of the rib 24 by blasting. When an overhang is generated at the rib top due to the blasting process, there is a problem that the rib top is chipped when the PDP is sealed.

  In order to solve such a problem, attempts have been made to devise the shape of a photosensitive resist pattern (mask pattern) used in blasting. For example, Patent Document 1 discloses a method of manufacturing a plasma display panel using a partition pattern mask whose upper width is wider than the bottom width during blasting. In this patent document 1, it is disclosed that the above-mentioned partition pattern mask is formed by appropriately setting the exposure amount (see paragraph 0028 of patent document 1). However, in order to adjust the exposure amount, it is necessary to use a special photomask.

  On the other hand, Patent Document 2 discloses a method of manufacturing a plasma display panel using a multilayer mask including an upper layer mask and a lower layer mask having a narrow width with respect to the upper layer mask during blasting. In this patent document 2, it is disclosed that the above-mentioned multilayer mask is formed by providing two types of photosensitive resist layers on the surface of the partition wall layer (rib material layer) (see FIG. 2 of FIG. 2). 1, FIG. 2, FIG. 4 and FIG. 5). However, since two types of photosensitive resists are used, there are problems that the work becomes complicated and costs increase.

JP 2001-319570 A JP-A-11-90827

  The present invention has been made in view of the above circumstances, and it is a main object of the present invention to provide a method for manufacturing a PDP back plate that can easily form a PDP back plate with reduced rib overhang. And

  In order to solve the above problems, in the present invention, a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric A method of manufacturing a back plate for a plasma display panel having a stripe-shaped rib formed on a layer, the substrate, the patterned address electrode layer, the dielectric layer, a rib material layer, and a photosensitive resist layer A back plate forming member preparing step for preparing a back plate forming member laminated in this order, an exposure step for exposing the photosensitive resist layer according to the shape of the striped rib, and the exposure after exposure A developing step of developing the photosensitive resist layer to form a striped photosensitive resist pattern, and the stripe direction of the striped photosensitive resist pattern in plan view. By controlling the flow direction of the developer so as to be in a row, the end portion on the rib material layer side of the striped photosensitive resist pattern is removed, and the constriction portion forming step for forming the constriction portion, and the constriction portion And a blasting process for forming the striped ribs by blasting the rib material layer using the striped photosensitive resist pattern formed with a mask as a mask. A method for producing a face plate is provided.

  According to the present invention, by providing a constricted portion at the bottom of the striped photosensitive resist pattern, it is possible to easily obtain a PDP back plate with reduced overhang of the rib top.

  In the said invention, it is preferable to perform the said image development process and the said constriction part formation process continuously on the same conditions. This is because both are processes using a developing solution, so that the number of processes can be reduced and the productivity of the back plate for PDP can be improved.

  In the above invention, the striped photosensitive resist is used in a plan view by using a spraying means having a nozzle for discharging the developer and tilting the discharge direction of the developer discharged from the nozzle with respect to the vertically downward direction. It is preferable to form the constricted portion by setting it in a direction substantially parallel to the stripe direction of the pattern. This is because the constricted portion can be formed efficiently. Further, this method (first control method described later) is a simpler method that can control the flow of the developer without requiring a complicated mechanism such as rocking described later.

  In the above invention, it is preferable that the discharge direction of the developer discharged from the nozzle is inclined within a range of 20 ° to 70 ° with respect to the vertically downward direction. This is because the constricted portion can be formed more efficiently.

  In the above invention, when the developer is sprayed, the spraying means and the striped photosensitive resist pattern are relatively horizontally moved along the forward direction or the reverse direction of the flow direction of the developer. Is preferred. This is because the constricted portion can be formed more efficiently.

  In the above invention, the developer is supplied onto the surface of the striped photosensitive resist pattern, and the gas jetting means having a nozzle for jetting gas is used, and the jetting direction of the gas jetted from the nozzle is set vertically downward. It is preferable to form the constricted portion by tilting with respect to the direction and setting it in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. This is because the constricted portion can be formed efficiently. Further, this method (second control method described later) can be easily realized by providing a gas jetting unit in a conventional developing device, and a uniform developer flow can be created.

  In the above invention, the spraying means having a nozzle for discharging the developer is used, and the nozzle of the spraying means is swung in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. Therefore, it is preferable to form the constricted portion. This is because the constricted portion can be formed efficiently. Further, this method (third control method described later) is a simple method capable of controlling the flow direction of the developing solution depending on the nozzle swing condition.

  In the above invention, the developer is supplied onto the surface of the striped photosensitive resist pattern, and the striped photosensitive resist pattern is substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. The constricted portion is preferably formed by swinging in the direction. This is because the constricted portion can be formed efficiently. In addition, this method (fourth control method described later) is a simple method capable of controlling the flow direction of the developing solution according to the swinging condition of the substrate.

  In the said invention, it is preferable to form the said narrow part by inclining the normal line direction of the said stripe-shaped photosensitive resist pattern with respect to a perpendicular upward direction. This is because the constricted portion can be formed efficiently. In addition, this method (fifth control method to be described later) allows the developer to naturally flow down on the substrate, so that a uniform developer flow can be created.

  In the above invention, the spraying means having a nozzle for discharging the developer is used, and the discharge angle of the nozzle is changed along a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. Therefore, it is preferable to form the constricted portion. This is because the constricted portion can be formed efficiently. In addition, since this method (sixth control method described later) can swing the flow direction of the developing solution to the left and right, the constricted portion can be efficiently formed without being affected by the relative position between the nozzle and the substrate. Is possible.

  According to the present invention, there is also provided a developing device used for manufacturing a back plate for a plasma display panel, wherein a photosensitive material having a rib material layer and a latent image of a striped photosensitive resist pattern formed on the rib material layer. A holding means for holding a member to be processed having a photosensitive resist layer or a striped photosensitive resist pattern formed on the rib material layer, and a spray having a nozzle for discharging developer to the member to be processed And a developing device capable of controlling the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view.

  According to the present invention, the constricted portion is formed at the bottom of the striped photosensitive resist pattern by controlling the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. Can be provided. Thereby, the backplate for PDP with which the overhang of the rib top part was reduced can be obtained.

  In this invention, there exists an effect that the backplate for PDP which reduced the overhang of the rib top part can be formed simply.

  Hereinafter, the manufacturing method of the back plate for PDP of the present invention and the developing device used for manufacturing the back plate for PDP will be described in detail.

A. Method for Manufacturing PDP Back Plate First, a method for manufacturing a PDP back plate according to the present invention will be described with reference to FIGS. FIG. 1 is a schematic cross-sectional view showing an example of a back plate forming member preparation step, an exposure step, and a development step in the present invention. In the present invention, first, a back plate forming member 10 is prepared in which a substrate 1, a patterned address electrode layer 2, a dielectric layer 3, a rib material layer 4a and a photosensitive resist layer 5a are laminated in this order (FIG. 1). (A) Back member forming member preparation step). Next, the photosensitive resist layer 5a is exposed and developed in accordance with the desired stripe-shaped rib shape to form a stripe-shaped photosensitive resist pattern 5 to obtain a member 11 (FIG. 1 (b), exposure step). And development step).

Here, FIG. 2A is a schematic plan view of FIG. 1B, and FIG. 2B is a YY cross-sectional view of FIG. 2A. Note that FIG. 1B corresponds to the XX cross-sectional view of FIG. Further, the member 11 shown in FIGS. 2A and 2B does not show the entire member 11 but shows a part for convenience (also in FIGS. 3 and 6 to 13). The same). Further, the “stripe direction of the striped photosensitive resist pattern” in the present invention refers to a direction along the stripe of the striped photosensitive resist pattern. Specifically, it refers to the direction represented by reference numeral D _s in FIG. 2 (a).

FIG. 3A is a schematic plan view showing an example of the constricted portion forming step in the present invention, and FIG. 3B is a schematic plan view showing an example of the constricted portion forming step in the present invention. In the present invention, as shown in FIG. 3 (a), a plan view, so that parallel stripe direction D _s substantially stripe-shaped photoresist pattern 5, controls the flow direction of the developer. An example of the control, as shown in FIG. 3 (b), using a spraying means 13 with nozzles 12 for discharging the developing solution, the discharge direction D _a of the developer ejected from the nozzle 12, vertically downward direction And a method of setting in a direction substantially parallel to the stripe direction D _s (see FIG. 3A) of the striped photosensitive resist pattern 5 in plan view. In the present invention, by controlling the flow direction of the developing solution, as shown in FIG. 4, the end portion on the rib material layer 4a side of the striped photosensitive resist pattern 5 is removed, and the constricted portion 6 is formed.

  FIG. 5 is a schematic sectional view showing an example of a blasting process in the present invention. As shown in FIG. 5A, in the present invention, the rib material layer 4a is blasted using the stripe-shaped photosensitive resist pattern 5 in which the constricted portion 6 is formed as a mask. Thereby, as shown in FIG.5 (b), the striped rib 4 which reduced the protrusion of the rib top part is obtained. Thereafter, the remaining striped photosensitive resist pattern 5 is peeled off and the striped ribs 4 are baked to obtain a PDP back plate.

  As described above, according to the present invention, by providing the constricted portion at the bottom of the striped photosensitive resist pattern, it is possible to easily obtain the PDP back plate in which the overhang of the rib top portion is reduced. In the present invention, a striped photosensitive resist pattern with a narrowed bottom is obtained by utilizing the flow of the developer. As described above, as a method for forming a photosensitive resist pattern whose bottom width is smaller than the top width, conventionally, a method of adjusting the exposure amount, a method of stacking two types of photosensitive resists, and the like are known. However, these methods have a problem that it is necessary to use a special photomask, a problem that work is complicated, and a problem that costs increase. In contrast, the PDP back plate manufacturing method of the present invention can easily form a photosensitive resist pattern having a bottom width smaller than an upper width by merely controlling the flow direction of the developer. Have advantages.

In the present invention, the constricted portion is formed by controlling the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. The reason why the constricted portion is formed is that when the developer flows between the striped photosensitive resist patterns, the bottom of the striped photosensitive resist pattern is more easily exposed to the developer than the top or the like. This is considered to be because directional dissolution further proceeds at the bottom. In the present invention, when a striped photosensitive resist pattern is formed using a negative photosensitive resist, the constricted portion is particularly easily formed. This is because the end of the striped photosensitive resist pattern on the rib material layer side is the hardest region to be hardened and is easily removed by the developer. The reason why the edge of the striped photosensitive resist pattern on the rib material layer side is the hardest to be cured is that the top side of the striped photosensitive resist pattern is exposed when the negative photosensitive resist is exposed from above. This is because the curing proceeds from the end, and the end portion of the striped photosensitive resist pattern is harder to cure than the central portion.
Hereinafter, the manufacturing method of the backplate for PDP of this invention is demonstrated for every process.

1. Back plate forming member preparation step First, the back plate forming member preparation step in the present invention will be described. The back plate forming member preparing step in the present invention prepares a back plate forming member in which the substrate, the patterned address electrode layer, the dielectric layer, the rib material layer, and the photosensitive resist layer are laminated in this order. It is a process (see FIG. 1A).

  The material of the substrate used in the present invention is not particularly limited as long as it has a predetermined heat resistance, and the same material as the substrate used for a general PDP back plate should be used. Can do. Specific examples include glass and the like. Among them, high strain point glass that generates a small amount of distortion during firing of a dielectric or rib material is preferable.

  The material of the address electrode layer used in the present invention is not particularly limited as long as it has conductivity, and the same material as the material of the address electrode layer used for a general PDP back plate is used. can do. Specific examples include metals such as Ag. In addition, the address electrode layer used in the present invention may be a laminate of metal thin films, and specifically includes those having a three-layer metal thin film such as Cr / Cu / Cr. .

  Examples of the method for forming the patterned address electrode layer on the substrate include a photo paste method, a printing method, a thin film method, and the like. Among these, the photo paste method is preferable. Specifically, as the photo paste method, Ag paste containing a photosensitive resin is applied to the entire surface of the substrate by a screen printing method, dried, then exposed and developed in a predetermined pattern, and finally fired. The method etc. can be mentioned. Specific examples of the printing method include a method in which an Ag paste is printed in an electrode pattern using a screen plate, dried, and then fired to obtain a desired electrode. On the other hand, as the thin film method, specifically, a Cr / Cu / Cr three-layer metal thin film is formed on the entire surface of the substrate by a sputtering method, a resist is applied to the outermost layer of the metal thin film, and then dried. Examples include a method of performing exposure and development with a predetermined pattern, etching the exposed metal thin film, and finally stripping the resist.

  The material of the dielectric layer used in the present invention is not particularly limited as long as it has a desired dielectric constant, and is the same as the material of the dielectric layer used for a general PDP back plate. Can be used.

  Examples of the method for forming the dielectric layer include a screen printing method and a slit die coating method. Further, a laminating method may be used in which a film in which a dielectric layer is laminated on a base film is laminated so as to cover the address electrode layer. In the present invention, after the dielectric layer is formed, drying is usually performed. However, the dielectric layer may be fired as necessary.

Examples of the material (rib material layer forming material) of the rib material layer used in the present invention include glass paste. Further, the glass paste is usually a glass frit having an average particle size of about 3 μm such as BiO ₂ , ZnO, B ₂ O ₃ , a filler made of an inorganic component such as TiO ₂ , Al ₂ O ₃ , and a resin for making a paste. Contains ingredients and solvent. The thickness of the rib material layer is usually in the range of 100 μm to 400 μm in the state after drying, and preferably in the range of 200 μm to 300 μm. The thickness of the rib material layer after drying is usually about 2/3 after firing.

  Examples of the method for forming the rib material layer include a method in which a rib material layer forming material is applied on the dielectric layer by a slit die coating method and dried. Application may be performed by a roll coating method or the like.

  The material of the photosensitive resist layer used in the present invention is not particularly limited as long as a photosensitive resist pattern that is not ground by blasting can be obtained. It is preferable that the material is easy. The photosensitive resist used in the photosensitive resist layer may be a dry film resist (DFR) or a liquid resist, but is preferably a dry film resist. This is because a photosensitive resist pattern that is not ground by blasting can be easily formed. The photosensitive resist may be a positive type or a negative type. The film thickness of the photosensitive resist layer is usually in the range of 10 μm to 100 μm.

  Examples of the method for forming the photosensitive resist layer include a method of laminating a dry film resist on the rib material layer and a method of applying a liquid resist on the rib material layer and drying.

2. Exposure Step Next, the exposure step in the present invention will be described. The exposure process in this invention is a process of exposing the said photosensitive resist layer according to the shape of the said stripe-shaped rib (refer FIG.1 (b)). By the exposure process, a latent image of a stripe-shaped photosensitive resist pattern described later is formed on the photosensitive resist layer.

  Various conditions in the exposure step are not particularly limited as long as a desired stripe-shaped photosensitive resist pattern can be formed, and are the same as those in manufacturing a general PDP back plate.

The photomask used in the exposure step is usually selected appropriately according to the shape of the intended stripe rib and the type of photosensitive resist used (positive photosensitive resist and negative photosensitive resist). The irradiation amount of time of exposure is not particularly limited, for example in the range of ^{100mJ / cm 2 ~500mJ / cm 2} , preferably in the range Of these the 150mJ ^/ cm ² ~450mJ ^/ cm 2 .

3. Development Step Next, the exposure step in the present invention will be described. The exposure step in the present invention is a step of developing the photosensitive resist layer after exposure to form a striped photosensitive resist pattern (see FIG. 1B).

  In the present invention, the developing step and the constricted portion forming step described later may be performed independently under different conditions, or may be performed continuously under the same conditions. Among these, in the present invention, it is preferable that the developing step and the constricted portion forming step are continuously performed under the same conditions. This is because both are processes using a developing solution, so that the number of processes can be reduced and the productivity of the back plate for PDP can be improved. As will be described later, in the constricted portion forming step, the flow direction of the developer is controlled so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. It is preferable that such control is performed from the stage of the development process, and the development process and the constricted part forming process are continuously performed under the same conditions.

  The developer used in the present invention is not particularly limited as long as it can remove the dissolved part of the positive photosensitive resist layer after exposure or the uncured part of the negative photosensitive resist layer after exposure. Alternatively, a developer used for manufacturing a general PDP back plate can be used. Examples of the developer used in the present invention include an alkali developer.

  In addition, the line width of the striped photosensitive resist pattern obtained by this step is a major factor that defines the top width of the striped rib. The line width of the striped photosensitive resist pattern is, for example, preferably in the range of 10 μm to 200 μm, and more preferably in the range of 30 μm to 150 μm. On the other hand, the interval between adjacent stripes is preferably wide enough to allow the developer to flow appropriately. This is because the constricted portion described later can be formed efficiently. The interval between adjacent stripes is, for example, preferably in the range of 20 μm to 200 μm, and more preferably in the range of 50 μm to 150 μm.

4). Next, the constricted portion forming step in the present invention will be described. In the constricted portion forming step in the present invention, the flow direction of the developer is controlled so as to be substantially parallel to the stripe direction of the stripe-shaped photosensitive resist pattern in plan view, whereby the stripe-shaped photosensitive resist pattern is formed. This is a step of removing the end on the rib material layer side and forming a constricted portion (see FIGS. 3 and 4).

In the present invention, the flow direction of the developer is controlled so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. Here, the “stripe direction of the striped photosensitive resist pattern” refers to a direction along the stripe of the striped photosensitive resist pattern as described above. Specifically, FIG. 2 (a), the refers to the direction represented by reference numeral _{D s} in FIG. 3 (a). In the present invention, the stripe direction of the striped photosensitive resist pattern and the flow direction of the developer are substantially parallel in plan view. In the present invention, “substantially parallel” means that an angle formed by two directions is 45 ° or less. In particular, the angle formed by two substantially parallel directions is preferably 20 ° or less, and more preferably 5 ° or less. Further, the developer used in this step may be the same developer as in the above-described development step, or a different developer. Among these, in the present invention, it is preferable that the developing solutions used in the developing step and the constricted portion forming step are the same.

  Here, the developer is subjected to various disturbances on the substrate such as a change in flow due to switching of a swinging direction, which will be described later, and a flow flowing down from the substrate. Therefore, “controlling the flow direction of the developing solution” means controlling the main flow of the developing solution.

  In the present invention, the method for controlling the flow direction of the developer is a method capable of controlling the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view, And if it is a method which can form a constriction part, it will not specifically limit.

  As an example of a method for controlling the flow direction of the developing solution, a spraying unit having a nozzle for discharging the developing solution is used, and the discharging direction of the developing solution discharged from the nozzle is inclined with respect to the vertically downward direction in plan view A method of forming a constricted portion by setting it in a direction substantially parallel to the stripe direction of the stripe-shaped photosensitive resist pattern (hereinafter sometimes referred to as “first control method”) can be mentioned. This control method is a method of controlling the flow direction of the developer by adjusting the discharge direction of the developer. The definition of substantially parallel and the like is as described above. In addition, the first control method is a simpler method that can control the flow of the developer without requiring a complicated mechanism such as rocking described later.

The first control method, as specifically shown in FIG. 6, the discharge direction D _a of the developer ejected from the nozzle 12, by tilting at a predetermined angle with respect to the vertical downward direction D _b, development This is a method for controlling the flow direction of the liquid. Although not shown, the discharge direction D _a developer in FIG. 6 is set as a plan view, a stripe direction and a direction substantially parallel stripes photoresist pattern 5. In the present invention, the discharge direction _{D a} of the developer ejected from the nozzle 12, with respect to the vertical downward direction _{D b,} preferably be tilted within a range of 20 ° ~70 °, 30 ° ~60 ° It is more preferable to incline within the range, and it is further preferable to incline within the range of 40 ° to 50 °. This is because the constricted portion can be formed more efficiently. This angle range corresponds to the angle range A in FIG.

  The spraying means used in the first control method has a nozzle for discharging the developer. Examples of the shape of the discharge port of the nozzle include a slit shape, a circular shape, an elliptical shape, and a polygonal shape. Of these, the slit shape is preferable. This is because the developer can be sprayed uniformly over a wide area. Moreover, the height of the nozzle outlet with respect to the stripe-shaped photosensitive resist pattern is, for example, in the range of 50 mm to 300 mm, and preferably in the range of 100 mm to 200 mm. Further, the discharge amount of the developer discharged from the nozzle is, for example, preferably in the range of 0.01 L / min to 10 L / min, and more preferably in the range of 0.1 L / min to 2 L / min.

In the first control method, when the developer is sprayed, the spraying means and the striped photosensitive resist pattern are relatively horizontally moved along the forward direction or the reverse direction of the flow direction of the developer. It is preferable. This is because the constricted portion can be formed more efficiently. As a method for relatively horizontally moving the spreading means and the striped photosensitive resist pattern, specifically, a method for fixing the spreading means and horizontally moving the striped photosensitive resist pattern, a striped photosensitive resist pattern Examples thereof include a method of fixing and horizontally moving the spreading means, a method of horizontally moving the spreading means and the striped photosensitive resist pattern in opposite directions. Further, the spreading means and the striped photosensitive resist pattern may be relatively horizontally moved along the forward direction of the developing solution flow direction, and relatively horizontally moved along the direction opposite to the developing solution flow direction. Of these, the latter is preferred. This is because the constricted portion can be formed more efficiently by relatively moving along the direction opposite to the flow direction of the developer. An example of such a horizontal movement, as shown in FIG. 7, the spraying means 13 is fixed, the member 11 having a stripe-shaped photoresist pattern 5, along the reverse flow direction D _c of the developer And a method of horizontally moving.

  On the other hand, as another example of the method for controlling the flow direction of the developing solution, the developing solution is supplied onto the surface of the striped photosensitive resist pattern, and a gas jetting unit having a nozzle for jetting gas is used, and jetted from the nozzle. The method of forming the constricted portion by tilting the gas injection direction with respect to the vertically downward direction and setting it in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view (hereinafter, “ May be referred to as “second control method”). This control method is a method of controlling the flow direction of the developing solution by moving the developing solution supplied onto the surface of the striped photosensitive resist pattern by gas jetting. Note that the definition of substantially parallel and the like is as described above. Further, the second control method can be easily realized by providing a gas jetting unit in a conventional developing device, and a uniform developer flow can be created.

Specifically, as shown in FIG. 8, the second control method inclines the injection direction D _{d of the} gas injected from the nozzle 14 of the gas injection means 15 at a predetermined angle with respect to the vertically downward direction D _b . Thus, the flow direction of the developer is controlled by inclining the discharge direction of the developer discharged from the nozzle 12 of the spraying means 13 in the vertically downward direction. Although not shown, the injection direction D _d of gas in FIG. 8 are set as the plan view, a stripe direction and a direction substantially parallel stripes photoresist pattern 5. In the present invention, the injection direction D _d of the gas ejected from the nozzle 14 of the gas injection means 15, with respect to the vertical downward direction D _b, preferably be tilted within a range of 20 ° to 70 °, 30 It is more preferable to incline within the range of 60 ° to 60 °, and further preferable to incline within the range of 40 ° to 50 °. This is because the flow of the developer can be made smoother. This angle range corresponds to the angle range B in FIG. In the present invention, the flow of the developer may be controlled by immersing a member having a striped photosensitive resist pattern in the developer, and injecting the gas in that state to move the developer.

  The gas injection means used in the second control method has a nozzle for injecting gas. Although the gas to inject is not specifically limited, For example, air etc. can be mentioned. Examples of the shape of the nozzle outlet include a slit shape, a circular shape, an elliptical shape, and a polygonal shape, and among them, the slit shape is preferable. This is because gas can be uniformly injected over a wide area. Moreover, the height of the nozzle injection port with respect to the striped photosensitive resist pattern is, for example, in the range of 0.1 mm to 300 mm, and preferably in the range of 0.5 mm to 100 mm. Moreover, it is preferable that the injection amount of the gas injected from the nozzle is, for example, in the range of 10 L / min to 1000 L / min, and particularly in the range of 200 L / min to 600 L / min.

  In the second control method, the gas jetting means may be moved horizontally along the stripe direction of the striped photosensitive resist pattern. Moreover, the spraying means used in the second control method can be the same as the spraying means used in the first control method described above. Further, the discharge direction of the developer discharged from the nozzle may be a vertically downward direction, or may be inclined at a predetermined angle from the vertically downward direction. Moreover, since the spraying conditions using this spraying means are the same as the spraying conditions in the first control method described above, description thereof is omitted here.

  On the other hand, as yet another example of the method for controlling the flow direction of the developing solution, a spraying means having a nozzle for discharging the developing solution is used, and the nozzle of the spraying means is striped in a striped photosensitive resist pattern in plan view. A method of forming a constricted portion by swinging in a direction substantially parallel to the direction (hereinafter sometimes referred to as “third control method”) can be given. This control method is a method of controlling the flow direction of the developer by swinging the nozzles of the spraying means. Note that the definition of substantially parallel and the like is as described above. The third control method is a simple method capable of controlling the flow direction of the developing solution according to the swinging condition of the nozzle.

  Specifically, as shown in FIG. 9, the third control method is a method of controlling the flow direction of the developer by swinging the nozzle 12 of the spraying means 13. Although not shown, the nozzle 12 in FIG. 9 is swung in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern 5 in plan view. In the third control method, the flow direction of the developer is reversed each time in accordance with the oscillation of the nozzle.

  The spraying means used in the third control method can be the same as the spraying means used in the first control method described above. Further, the discharge direction of the developer discharged from the nozzle may be a vertically downward direction, or may be inclined at a predetermined angle from the vertically downward direction. Moreover, since the spraying conditions using this spraying means are the same as the spraying conditions in the first control method described above, description thereof is omitted here.

  On the other hand, as another example of the method for controlling the flow direction of the developing solution, a developing solution is supplied onto the surface of the striped photosensitive resist pattern, and the striped photosensitive resist pattern is striped photosensitive in plan view. And a method of forming a constricted portion by swinging in a direction substantially parallel to the stripe direction of the conductive resist pattern (hereinafter sometimes referred to as “fourth control method”). This control method is a method of controlling the flow direction of the developer by swinging a member having a striped photosensitive resist pattern. Note that the definition of substantially parallel and the like is as described above. The fourth control method is a simple method capable of controlling the flow direction of the developing solution according to the swinging condition of the substrate.

  Specifically, as shown in FIG. 10, the fourth control method is such that the developer is discharged from the nozzle 12 of the spraying means 13 in the vertical downward direction, and the member 11 having the striped photosensitive resist pattern 5 is swung. This is a method for controlling the flow direction of the developer. Although not shown, the swing of the striped photosensitive resist pattern 5 in FIG. 10 is performed in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern 5 in plan view. In the fourth control method, the flow direction of the developer is reversed each time the nozzle is swung. In the present invention, the flow of the developer may be controlled by immersing a member having a striped photosensitive resist pattern in the developer and swinging the member in that state.

  Moreover, the spraying means used in the fourth control method can be the same as the spraying means used in the first control method described above. Further, the discharge direction of the developer discharged from the nozzle may be a vertically downward direction, or may be inclined at a predetermined angle from the vertically downward direction. Moreover, since the spraying conditions using this spraying means are the same as the spraying conditions in the first control method described above, description thereof is omitted here.

  On the other hand, as another example of the method for controlling the flow direction of the developer, a method of forming a constricted portion by tilting the normal direction of the striped photosensitive resist pattern with respect to the vertically upward direction (hereinafter, May be referred to as “fifth control method”). This control method is a method of controlling the flow direction of the developer by tilting the normal direction of the stripe-shaped photosensitive resist pattern. In the fifth control method, since the developing solution naturally flows down on the substrate, it is possible to make a uniform developing solution flow.

Fifth control method, as specifically shown in FIG. 11, the normal direction D _e of the stripe-shaped photoresist pattern 5, by inclining with respect to the vertical upward direction D _f, the flow direction of the developer It is a method to control. In the present invention, the normal direction _{D e} of the stripe-shaped photoresist pattern 5, with respect to the vertical upward direction _{D f,} preferably be tilted within a range of 20 ° ~70 °, 30 ° ~60 ° It is more preferable to incline within the range, and it is further preferable to incline within the range of 40 ° to 50 °. This is because the flow of the developer can be made smoother. This angle range corresponds to the angle range C in FIG.

  Moreover, the spraying means used in the fifth control method can be the same as the spraying means used in the first control method described above. Further, the discharge direction of the developer discharged from the nozzle may be a vertically downward direction, or may be inclined at a predetermined angle from the vertically downward direction. Moreover, since the spraying conditions using this spraying means are the same as the spraying conditions in the first control method described above, description thereof is omitted here.

  On the other hand, as yet another example of the method for controlling the flow direction of the developing solution, a spraying means having a nozzle for discharging the developing solution is used. A method of forming a constricted portion (hereinafter, may be referred to as “sixth control method”) by changing along a direction substantially parallel to the direction can be given. This control method is a method of controlling the flow direction of the developing solution by changing the nozzle angle of the spraying means. Note that the definition of substantially parallel and the like is as described above. In the present invention, the various control methods described above may be used in combination. In the sixth control method, the flow direction of the developing solution can be swung left and right, so that the constricted portion can be efficiently formed without being affected by the relative position between the nozzle and the substrate.

Specifically, the sixth control method is a method of controlling the flow direction of the developer by continuously changing the discharge angle of the nozzle 12 as shown in FIG. Although not shown, the discharge angle of the nozzle 12 in FIG. 12 changes along a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern 5 in plan view. In the sixth control method, the flow direction of the developer is reversed according to the change in the discharge angle of the nozzle. In the present invention, the discharge angle D _g of the nozzles 12 of the spraying means 13, changing with respect to the vertical downward direction D _b. At that time, the maximum inclination angle of the nozzle is preferably ± 70 ° or less, more preferably ± 60 ° or less, and further preferably ± 50 ° or less with respect to the vertically downward direction. Similarly, the maximum inclination angle of the nozzle is preferably ± 20 ° or more, more preferably ± 30 ° or more, and more preferably ± 40 ° or more with respect to the vertically downward direction. This is because the flow of the developer can be made smoother. This angle range corresponds to the angle range E in FIG. Moreover, since the spraying conditions using the said spraying means are the same as the spraying conditions in the above-mentioned 1st control method, description here is abbreviate | omitted.

  In the present invention, by controlling the flow direction of the developing solution, the end portion on the rib material layer side of the striped photosensitive resist pattern is removed, and the constricted portion is formed. The width of the bottom of the striped photosensitive resist pattern after the constriction is formed (the width of the striped photosensitive resist pattern at the interface with the rib material layer) is the width of the striped photosensitive resist pattern before the constriction is formed. Compared to the bottom width, for example, it is preferably 99% or less, more preferably 98% or less, and particularly preferably in the range of 50% to 95%. Further, the bottom width of the stripe-shaped photosensitive resist pattern after the constriction is formed varies depending on the top width of the target stripe rib. For example, the width is in the range of 70 μm to 200 μm, and particularly in the range of 50 μm to 120 μm. It is preferable to be within. Further, in the present invention, it is preferable to perform the constricted portion forming step in a time sufficient to obtain the bottom width of the stripe rib.

5). Blasting process Next, the blasting process in the present invention will be described. The blasting process in the present invention is a process of forming the striped ribs by blasting the rib material layer using the striped photosensitive resist pattern in which the constricted portion is formed as a mask (FIG. 5). reference).

  Various conditions in the blasting process are not particularly limited as long as a desired striped rib can be formed, and are the same as the conditions in manufacturing a general PDP back plate.

  The material of the abrasive used for the blasting is not particularly limited as long as it can grind the rib material layer. For example, diamond, alumina, silicon carbide, calcium carbonate, glass beads, stainless steel, etc. Can be mentioned. The particle size of the abrasive is preferably, for example, in the range of 3 μm to 50 μm, and more preferably in the range of 10 μm to 30 μm.

The blast pressure of the grinding material, for example in the range of ^{0.1kgf / cm 2 ~3.0kgf / cm 2} , preferably in the range Of these the ^{0.3kgf / cm 2 ~1.0kgf / cm 2} . The amount of spray of the abrasive is, for example, preferably in the range of 100 g / min to 6000 g / min, and more preferably in the range of 1000 g / min to 5000 g / min.

6). Other Steps After the blasting step described above, usually, a baking step is performed in which the photosensitive resist pattern remaining on the tops of the striped ribs is removed and the striped ribs are baked. The conditions such as the firing temperature, firing time, firing method, and the like are the same as those for a general PDP back plate, and thus the description thereof is omitted here. Further, after the firing step, a phosphor layer forming step for forming a phosphor layer on the side surface of the striped rib is performed. Examples of the method for forming the phosphor layer include a screen printing method and a dispensing method. Moreover, in this invention, you may perform the washing | cleaning process of wash | cleaning the surface after each process mentioned above.

B. Next, the developing device of the present invention will be described. The developing device of the present invention is a developing device used for manufacturing a back plate for a plasma display panel, and has a rib material layer and a photosensitive image having a latent image of a striped photosensitive resist pattern formed on the rib material layer. A holding means for holding a member to be processed having a photosensitive resist layer or a striped photosensitive resist pattern formed on the rib material layer, and a spray having a nozzle for discharging developer to the member to be processed And a flow direction of the developer can be controlled so as to be substantially parallel to the stripe direction of the stripe-shaped photosensitive resist pattern in plan view.

  FIG. 13 is a schematic sectional view showing an example of the developing device of the present invention. The developing device of the present invention holds a member (processed member) 11 in which a substrate 1, a patterned address electrode layer 2, a dielectric layer 3, a rib material layer 4a, and a striped photosensitive resist pattern 5 are laminated in this order. The holding mechanism 16 and the spraying means 13 having the nozzle 12 for discharging the developer to the member 11 are provided. Furthermore, the developing device of the present invention can control the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view.

According to the present invention, the constricted portion is formed at the bottom of the striped photosensitive resist pattern by controlling the flow direction of the developer so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. Can be provided. Thereby, the backplate for PDP with which the overhang of the rib top part was reduced can be obtained.
Hereinafter, the developing device of the present invention will be described for each configuration.

1. Holding means The holding means in the present invention is a photosensitive resist layer having a rib material layer and a latent image of a striped photosensitive resist pattern formed on the rib material layer, or a striped photosensitive film formed on the rib material layer. And means for holding a member to be processed having a resist pattern.

  The members to be processed used in the present invention can be roughly divided into two types. The first member to be processed used in the present invention has at least a rib material layer and a photosensitive resist layer having a latent image of a striped photosensitive resist pattern formed on the rib material layer. This is used when the developing process and the constriction forming process are continuously performed. On the other hand, the second member to be processed used in the present invention has at least a rib material layer and a striped photosensitive resist pattern formed on the rib material layer. This is used when forming a constricted portion with respect to a stripe-shaped photosensitive resist pattern formed in advance by performing a development process. Moreover, the member to be processed used in the present invention usually has a substrate, a patterned address electrode, and a dielectric layer. Since these members are the same as the contents described in “A. Manufacturing method of back plate for PDP”, description thereof is omitted here.

  The holding means in the present invention is not particularly limited as long as it can hold the member to be processed. In particular, in the present invention, it is preferable that the holding means has a mechanism capable of performing the flow control of the developer described in the above-mentioned “A. Manufacturing method of back plate for PDP”. In particular, in the present invention, it is preferable that the holding means has at least one of a horizontal movement mechanism, a swing mechanism, and an inclination imparting mechanism.

2. Spraying means The spraying means in the present invention is not particularly limited as long as it has a nozzle that discharges the developing solution to the member to be processed. In particular, in the present invention, it is preferable that the spraying means has a mechanism capable of controlling the flow of the developer as described in “A. Manufacturing method of PDP back plate”. In particular, in the present invention, it is preferable that the spraying means has at least one of a discharge direction tilt mechanism, a horizontal movement mechanism, and a swing mechanism. Furthermore, the spraying means in the present invention may have the function of the gas injection means corresponding to the second control method described above. Further, the developing device of the present invention may have a gas jetting unit separately.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples. In the examples, “parts” represents parts by weight, and “%” represents% by weight.

[Example]
(1) Back plate forming member preparation step Photosensitive silver paste (solar ink production) as an address electrode on a high strain point glass ("PD200" manufactured by Asahi Glass Co., Ltd.) having a size of 2080 mm x 1210 mm and a thickness of 1.8 mm EPH-200TR8605 manufactured by Co., Ltd. was solid-printed using a screen printing plate having an emulsion thickness of 5 μm (“T250 mesh” manufactured by Tokyo Process Service Co., Ltd.) and dried at 80 ° C. for 30 minutes. Next, it was exposed with a photomask having a pattern with an opening width of 50 μm and spray-developed with a 0.3% aqueous sodium carbonate solution at a development pressure of 1.5 kgf / cm ² to form a silver electrode pattern. Next, baking was performed at 600 ° C. to form an address electrode having a film thickness of 3 μm, a line width of 50 μm, and a pitch of 200 μm on the glass substrate. Next, PLS-3762D3 (manufactured by Nippon Electric Glass) was printed on the address electrode by screen printing, dried and fired to form a dielectric layer having a thickness of 10 μm.

Next, a rib material layer forming material having the following composition was prepared.
Glass frit (ZnO / SiO ₂ / B ₂ O ₃ / alkali metal oxide, thermal expansion coefficient 80 × 10 ⁻⁷ / ° C., softening point 550 ° C., average particle size 3 μm) 60 parts by weight Alumina (Iwatani Chemical Industry) RA-40 manufactured by Co., Ltd.) 20 parts by weight Ethylcellulose (Etocel STD-100FP manufactured by Dow Chemical Company) 2 parts by weight Terpineol 9 parts by weight Butyl carbitol acetate 9 parts by weight

  The rib material layer forming material was coated on the dielectric layer with a die coater and dried to prepare a rib material layer having a thickness of 150 μm. Next, the obtained substrate was heated to 100 ° C., and a dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., NB-235) was laminated on the rib material layer to obtain a back plate forming member.

(2) Exposure step The obtained back plate forming member was exposed through a photomask. The exposure condition was an irradiation amount of 250 mJ / cm ² . As a result, a latent image (line width: 100 μm, pitch: 200 μm) of the striped photosensitive resist pattern was formed on the dry film resist.

(3) Development process and constriction formation process The development process and the constriction formation process were continuously performed on the exposed dry film resist under the same conditions. Specifically, the developing step and the constriction forming step were performed by the method shown in FIG. In FIG. 3B, the striped photosensitive resist pattern 5 is shown. In this embodiment, the photosensitive resist layer on which the latent image of the striped photosensitive resist pattern is formed is shown. The development step and the constriction formation step were continuously performed under the same conditions. A 0.5% aqueous solution of anhydrous sodium carbonate with a liquid temperature of 30 ° C. was used as the developer, and a slit nozzle was used as the nozzle of the spraying means. The discharge direction of the developer discharged from the slit nozzle was inclined by 45 ° with respect to the vertically downward direction, and was set in a direction parallel to the stripe direction of the latent image of the striped photosensitive resist pattern in plan view. Further, the height of the slit nozzle discharge port with respect to the latent image of the striped photosensitive resist pattern was 150 mm, the discharge amount of the developer was 0.8 L / min, and the spray time of the developer was 87 seconds. As a result, a striped photosensitive resist pattern having a constricted portion (bottom width 90 μm, constricted portion height 5 μm, top width 100 μm, pitch 200 μm) was obtained.

(4) Blasting process Step S-9 (# 1200) (manufactured by Fuji Seisakusho Co., Ltd.) is used to grind the rib material layer not covered with the striped photosensitive resist pattern by sandblasting to obtain striped ribs. It was. Thereafter, the striped photosensitive resist pattern was peeled off at a liquid temperature of 30 ° C. using a 2.0% aqueous solution of sodium hydroxide. The obtained ribs before firing had a rib height of 220 μm, a rib top width of 80 μm, and a rib pitch of 200 μm. Thereafter, firing was carried out at a peak temperature of 553 ° C., a holding time of 13 minutes, and a total firing time of 2 hours to obtain a back plate for PDP. The obtained striped rib had a rib height of 110 μm, a rib top width of 20 μm, and a rib pitch of 200 μm.

[Comparative example]
As shown in FIG. 14, during the development process and the constriction formation process, the discharge direction of the developer discharged from the slit nozzle of the spraying means 13a was changed to a vertically downward direction (not shown), in plan view, The slit direction of the slit nozzle of the spreading means 13a is made substantially parallel to the stripe direction of the striped photosensitive resist pattern 5, and the spreading means 13a is orthogonal to the stripe direction of the striped photosensitive resist pattern 5 in plan view. A back plate for PDP was obtained in the same manner as in the example except that it was swung in the direction in which it was moved. The resulting striped photosensitive resist pattern had a bottom width of 100 μm, a top width of 100 μm, and a pitch of 200 μm.

[Evaluation]
The cross section of the striped rib of the back plate for PDP obtained in the examples and comparative examples was observed with SEM. As a result, it was confirmed that the stripe-shaped ribs obtained in the comparative example overhang the top. On the other hand, it was confirmed that the strip-like ribs obtained in the examples had a reduced overhang at the top and a rounded top shape was formed. Thereby, when sealing PDP, a rib top part becomes difficult to chip and a yield improves.

It is a schematic sectional drawing which shows an example of the member preparation process for backplate formation in this invention, an exposure process, and a image development process. It is explanatory drawing explaining the stripe-shaped photosensitive resist pattern after the image development process. It is explanatory drawing explaining an example of the constriction part formation process in this invention. It is a schematic sectional drawing explaining the constriction part in this invention. It is a schematic sectional drawing which shows an example of the blasting process in this invention. It is a schematic sectional drawing which shows an example of the 1st control method in this invention. It is a schematic sectional drawing which shows the other example of the 1st control method in this invention. It is a schematic sectional drawing which shows an example of the 2nd control method in this invention. It is a schematic sectional drawing which shows an example of the 3rd control method in this invention. It is a schematic sectional drawing which shows an example of the 4th control method in this invention. It is a schematic sectional drawing which shows an example of the 5th control method in this invention. It is a schematic sectional drawing which shows an example of the 6th control method in this invention. It is a schematic sectional drawing which shows an example of the image development apparatus of this invention. It is a schematic plan view explaining a comparative example. It is a schematic sectional drawing which shows the conventional back plate for PDP. It is a perspective view which shows the conventional back plate for PDP. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional back plate for PDP. It is a schematic sectional drawing explaining the overhang of a rib top part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Address electrode layer 3 ... Dielectric layer 4a ... Rib material layer 4 ... Striped rib 5a ... Photosensitive resist layer 5 ... Striped photosensitive resist pattern 6 ... Constriction part 10 ... Back plate forming member 11 ... Member having striped photosensitive resist pattern 12... Nozzle 13... Dispersing means 14... Nozzle 15.

Claims (11)

A substrate; a patterned address electrode layer formed on the substrate; a dielectric layer formed so as to cover the address electrode layer; and a striped rib formed on the dielectric layer. A method of manufacturing a back plate for a plasma display panel,
A back plate forming member preparing step of preparing a back plate forming member in which the substrate, the patterned address electrode layer, the dielectric layer, the rib material layer and the photosensitive resist layer are laminated in this order;
An exposure step of exposing the photosensitive resist layer according to the shape of the stripe ribs;
Developing the photosensitive resist layer after exposure to form a striped photosensitive resist pattern; and
The edge of the striped photosensitive resist pattern on the rib material layer side is removed by controlling the flow direction of the developer so that it is substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. And a constriction part forming step for forming the constriction part,
A blasting process for forming the striped ribs by blasting the rib material layer using the striped photosensitive resist pattern formed with the constricted portion as a mask;
A method for manufacturing a back plate for a plasma display panel.   The method for manufacturing a back plate for a plasma display panel according to claim 1, wherein the developing step and the constricted portion forming step are continuously performed under the same conditions. Using a spraying means having a nozzle for discharging the developer,
By tilting the discharge direction of the developer discharged from the nozzle with respect to the vertically downward direction and setting it in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view, the constricted portion is The method for manufacturing a back plate for a plasma display panel according to claim 1 or 2, wherein the back plate is formed.   4. The method for manufacturing a back plate for a plasma display panel according to claim 3, wherein a discharge direction of the developer discharged from the nozzle is inclined within a range of 20 [deg.] To 70 [deg.] With respect to a vertically downward direction. .   The spraying means and the striped photosensitive resist pattern are relatively horizontally moved along the forward direction or the reverse direction of the flow direction of the developer when spraying the developer. The manufacturing method of the back plate for plasma display panels of Claim 3 or Claim 4. Supplying the developer onto the surface of the striped photosensitive resist pattern;
A gas injection means having a nozzle for injecting gas is used, and the injection direction of the gas injected from the nozzle is inclined with respect to the vertically downward direction, and is substantially parallel to the stripe direction of the stripe-shaped photosensitive resist pattern in plan view. The method of manufacturing a back plate for a plasma display panel according to claim 1, wherein the constricted portion is formed by setting in the direction. Using a spraying means having a nozzle for discharging the developer,
2. The constricted portion is formed by swinging a nozzle of the spraying means in a direction substantially parallel to a stripe direction of the striped photosensitive resist pattern in a plan view. The manufacturing method of the back plate for plasma display panels of 2. Supplying the developer onto the surface of the striped photosensitive resist pattern;
The constricted portion is formed by swinging the striped photosensitive resist pattern in a direction substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view. The manufacturing method of the back plate for plasma display panels of Claim 2.   3. The back plate for a plasma display panel according to claim 1, wherein the constricted portion is formed by tilting a normal direction of the stripe-shaped photosensitive resist pattern with respect to a vertically upward direction. Manufacturing method. Using a spraying means having a nozzle for discharging the developer,
2. The constricted portion is formed by changing an ejection angle of the nozzle along a direction substantially parallel to a stripe direction of the striped photosensitive resist pattern in a plan view. Item 3. A method for producing a back plate for a plasma display panel according to Item 2. A developing device used for manufacturing a back plate for a plasma display panel,
A rib material layer, and a photosensitive resist layer having a latent image of the striped photosensitive resist pattern formed on the rib material layer, or a striped photosensitive resist pattern formed on the rib material layer. Holding means for holding the member to be processed;
Spraying means having a nozzle for discharging developer to the member to be processed;
A developing device characterized in that the flow direction of the developer can be controlled so as to be substantially parallel to the stripe direction of the striped photosensitive resist pattern in plan view.

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