JP2009170180A - Method of manufacturing back face plate for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a back face plate for a plasma display panel capable of providing a step height rib with reduced variation in dimensions. <P>SOLUTION: A first rib material layer 4a is formed on a dielectric layer 3 of a back face plate forming member 10. A stopper layer 5 is formed on the first rib material layer 4a. A first photosensitive resist pattern 6 is formed on the stopper layer 5 and in a position corresponding to a set of horizontal ribs 4y by using a photosensitive resist. Horizontal ribs forming projections 8 are formed by performing blast processing. A second rib material layer 4b is formed so as to cover the blast-processed first rib material layer 4a and a stopper layer 5y. A second photosensitive resist pattern 9 is formed on the second rib material layer 4b and in a position corresponding to a set of vertical ribs 4x by using the photosensitive resist, and the step ribs are formed by performing the blast-processing. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a back plate for a plasma display panel (hereinafter, sometimes referred to as “PDP back plate”) having step ribs having different heights of vertical ribs and horizontal ribs. The present invention relates to a method of manufacturing a back plate for a plasma display panel that can obtain a step rib with a small variation.

  As shown in FIG. 5, the back plate used in the plasma display panel (hereinafter sometimes referred to as “PDP”) is usually a substrate 21 and a patterned address electrode layer 22 formed on the substrate 21. A dielectric layer 23 formed on the address electrode layer 22, a rib 24 formed on the dielectric layer 23, and a phosphor layer 25 (25R, 25G, 25B) formed between the ribs 24; Have Further, the conventional PDP back plate has a mainstream having stripe-like ribs 24 as shown in FIG. 6A, but in recent years, as shown in FIG. In addition, a PDP back plate having a matrix rib 26 having vertical ribs 26x and horizontal ribs 26y has been proposed.

  The PDP back plate having matrix ribs can increase the amount of phosphor per unit area as compared with the PDP back plate having striped ribs, so that the luminance can be improved. On the other hand, it has the disadvantage that the ribs formed vertically and horizontally are obstructed and difficult to exhaust. In order to solve such drawbacks, a technique related to a PDP back plate having ribs (step ribs) having different heights is known.

  For example, Patent Document 1 discloses a method of forming a step rib by performing dry film resist (DFR) lamination, plate making, and blasting twice. However, this method has a problem that the second DFR lamination is difficult. That is, after forming the matrix rib by the first blasting and further laminating DFR on the upper surface of the matrix rib, there is a problem that the end of the rib is chipped by the roller pressure. Further, when the laminating pressure is high, DFR enters into the holes of the already formed matrix ribs, making it difficult to make the DFR film thickness uniform, and there is a problem that exposure and development cannot be performed properly. It was. Furthermore, there is a risk that the DFR that has entered the hole of the matrix rib is not completely removed. On the other hand, when the laminating pressure is low, there is a problem that adhesion failure occurs and the DFR is peeled off during development or blasting.

  Another problem is that alignment of the second exposure is difficult. The exposure position accuracy of the DFR of the first layer is sufficient if the relative position accuracy of the rib with respect to the address electrode can be ensured, and the pad portion of the address electrode (substantially rectangular or substantially hexagonal formed at the position corresponding to the discharge portion). It is sufficient if the accuracy of the level at which the portion) is located between the vertical ribs is obtained. However, if the DFR exposure of the second layer is performed with this degree of alignment accuracy, there is a problem that the DFR is shifted from the vertical rib, and the edge portion of the vertical rib is ground during blasting.

  In order to solve such a problem, another method for forming the step rib has been proposed. For example, in Patent Document 2, a glass paste is applied to a glass substrate on which an address electrode layer and a dielectric layer are formed to form a first glass paste layer, and then a photosensitive property is formed on the surface of the first glass paste layer. A pattern that matches the shape of the barrier (lateral ribs) is formed by photolithography using a sandblast-resistant paste (photo method) or by screen-printing a sandblast-resistant paste, and then using a glass paste Apply to form a second glass paste layer, then, on the surface of the second glass paste layer, using a dry film resist to form a pattern that matches the shape of the main partition wall (vertical ribs), and finally, A method of manufacturing a PDP that performs sandblasting is disclosed (FIG. 7, paragraphs 0047 to 0049 of the specification).

  According to this method, the step rib can be formed by a single blasting process by providing a layer (stopper layer) having a sandblast resistance in the rib material layer. Therefore, there is an advantage that various problems that occur when DFR is laminated on the matrix rib do not occur. However, the photo method has a problem in that the step rib has a large variation in dimension. That is, in the above method, a stopper layer is formed on the surface of the first glass paste layer using a sandblast-resistant paste. However, since the first glass paste layer usually has many voids, When the paste of the property was applied to the first glass paste layer, there was a problem that a part of the sandblast-resistant paste penetrated into the voids, and the dimension of the step ribs (vertical ribs and horizontal ribs) became large. On the other hand, the screen printing method has a problem that it is difficult to accurately form a sandblast-resistant paste at a position corresponding to the lateral rib. In both cases of the photo method and the screen printing method, it is difficult to perform patterning of the stopper layer for forming the horizontal ribs with high accuracy, and there is a problem that the horizontal ribs cannot be cut with clean lines.

  Patent Document 3 discloses a rib forming method for a PDP characterized in that after the matrix rib is formed, the top of the lateral rib is processed and lowered. Patent Document 4 discloses a method of forming a PDP in which dielectric layers and barrier layers having different thermoplastic resin contents are formed, and these layers are formed simultaneously.

Japanese Patent No. 3440907 JP 2001-202876 A JP 2002-373574 A JP-A-10-144206

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a back plate for a plasma display panel capable of obtaining a stepped rib having a small size variation.

  In order to solve the above problems, in the present invention, a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric And a step rib having a vertical rib and a step rib having a horizontal rib lower than the vertical rib, the substrate, the patterned address electrode layer, and the step electrode A back plate forming member preparing step for preparing a back plate forming member in which dielectric layers are laminated in this order, and a first rib for forming a first rib material layer on the dielectric layer of the back plate forming member A material layer forming step, a stopper layer forming step for forming a stopper layer on the first rib material layer, and a photosensitive resist at a position on the stopper layer and corresponding to the lateral rib. The first photosensitive resist pattern forming step for forming the first photosensitive resist pattern, and the stopper layer exposed by blasting the first photosensitive resist pattern and the exposed stopper layer. And a first blasting step of grinding a part or the whole of the first rib material layer located thereunder to form a convex portion for forming a lateral rib, and the blasted first rib material layer and A second rib material layer forming step for forming a second rib material layer so as to cover the stopper layer, and a photosensitive resist on the second rib material layer and at a position corresponding to the vertical rib. A second photosensitive resist pattern forming step using the second photosensitive resist pattern to form the second photosensitive resist pattern, and the exposed second rib material The layer, by performing the blast treatment, providing a second blasting step and method for producing a back plate for a plasma display panel, characterized by the forming the stepped rib.

  According to the present invention, during the first blasting process, not only the exposed stopper layer but also the first rib material layer located thereunder is ground. As a result, even if a part of the blast suppressing material contained in the stopper layer forming material penetrates into the first rib material layer with many voids, the part that has penetrated unnecessarily can be removed, and the vertical ribs can be removed. And variations in dimensions of the lateral ribs can be reduced.

  In the said invention, it is preferable that the stopper layer forming material used in order to form the said stopper layer contains a glass frit and a blast suppression material. This is because the glass frit contained in the stopper layer forming material melts during firing, and the bond between the first rib material layer and the second rib material layer can be further strengthened.

  In the said invention, it is preferable that the said blast suppression material is a blast suppression resin. This is because it has excellent blast resistance and handling properties.

  In the said invention, it is preferable that at least one of the photosensitive resist used for said 1st photosensitive resist pattern formation process and said 2nd photosensitive resist pattern formation process is a dry film resist. This is because the dry film resist does not normally penetrate into the stopper layer and the second rib material layer.

  In the present invention, even when a part of the blast suppressing material contained in the stopper layer forming material penetrates into the first rib material layer having many voids, it is possible to obtain a stepped rib having a small size variation. There is an effect.

  Hereinafter, the manufacturing method of the backplate for PDP of this invention is demonstrated in detail.

  FIG. 1 is a perspective view showing an example of a method for manufacturing a PDP back plate according to the present invention. The PDP back plate and the like shown in FIG. 1 schematically represent a part of the PDP back plate and the like. Similarly, FIGS. 2 to 6 to be described later schematically show part of the PDP back plate and the like.

  In the method for manufacturing the PDP back plate shown in FIG. 1, first, as shown in FIG. 1A, a substrate 1, a patterned address electrode layer 2 formed on the substrate 1, and an address electrode layer 2 are formed. A back plate forming member 10 having a dielectric layer 3 formed so as to cover the back surface is prepared (back plate forming member preparing step). Next, as shown in FIG. 1B, a first rib material layer 4a is formed on the dielectric layer 3 of the back plate forming member 10 (first rib material layer forming step), and FIG. As shown in FIG. 2, a stopper layer 5 containing a blast suppressing resin is formed on the first rib material layer 4a (stopper layer forming step). Further, as shown in FIG. 1D, the first photosensitive resist pattern 6 is formed on the stopper layer 5 and at a position corresponding to the target lateral rib using a photosensitive resist such as DFR. (First photosensitive resist pattern forming step).

  Subsequently, as shown in FIG. 1 (e), the first photosensitive resist pattern 6 and the stopper layer 5 exposed between the first photosensitive resist pattern 6 and the stopper layer 5 exposed between them are subjected to a blasting process 7 from the vertical direction, and the exposed stopper layer 5 and A part or all of the first rib material layer 4a located below is ground (first blasting process). Thereafter, the first photosensitive resist pattern 6 is peeled to obtain a convex portion for forming a horizontal rib as shown in FIG. Here, the convex part for horizontal rib formation is demonstrated using FIG. 2A is a cross-sectional view taken along the line AA ′ in FIG. 1E, and FIG. 2B is a cross-sectional view taken along the line AA ′ in FIG. As shown in FIG. 2 (a), in the present invention, in the first blasting process, not only the stopper layer 5 exposed from between the first photosensitive resist patterns 6, but also the first layer located therebelow. The rib material layer 4a is ground. As a result, as shown in FIG. 2B, a lateral rib forming convex portion 8 is formed which is composed of the convex portion of the first rib material layer 4a and the patterned stopper layer 5y formed on the convex portion. Is done.

  Next, as shown in FIG.1 (g), the 2nd rib material layer 4b is formed so that the 1st rib material layer 4a and the stopper layer 5y which were blasted may be covered (2nd rib material layer formation process). . Next, as shown in FIG. 1 (h), the second photosensitive resist pattern is formed on the second rib material layer 4b by using a photosensitive resist such as DFR at a position corresponding to the target vertical rib. 9 is formed (second photosensitive resist pattern forming step). In this state, a blasting process 7 is performed on the second photosensitive resist pattern 9 and the exposed second rib material layer 4b from the vertical direction. As a result, as shown in FIG. 1 (i), a stepped rib composed of vertical ribs 4x and horizontal ribs 4y is obtained. Thereafter, the second photosensitive resist pattern 9 is peeled off, and the obtained ribs are baked, so that the rib material is melted and integrated to form a vitreous rib, and at the same time, organic substances contained in the rib are burned out. And the rib which consists of an inorganic substance substantially is formed. Since the shape is substantially maintained even if the rib dimensions are changed by firing, a PDP back plate having stepped ribs composed of vertical ribs 4x and horizontal ribs 4y as shown in FIG. 1 (j) is obtained. It is done.

  According to the present invention, during the first blasting process, not only the exposed stopper layer but also the first rib material layer located thereunder is ground. Thereby, even when a part of the blast suppressing material contained in the stopper layer forming material penetrates into the first rib material layer with many voids, the unnecessary permeated region (unnecessary permeation region) is removed. And the variation in the dimensions of the vertical and horizontal ribs can be reduced. This effect will be described with reference to FIGS.

  FIG. 3 is an explanatory view for explaining a method of forming a patterned stopper layer on the first rib material layer by a conventional photo method. Conventionally, as shown in FIG. 3A, first, a photosensitive resist layer 31 is formed on a first rib material layer 4a by applying a paste containing a photosensitive resist, and then FIG. As shown in b), the photosensitive resist layer 31 was exposed and developed to form a photosensitive resist pattern 31a.

  Here, FIG.3 (c) is AA 'sectional drawing of FIG.3 (b). Since the first rib material layer 4a is mainly composed of glass frit or the like, it usually has many voids. Therefore, as shown in FIG. 3A described above, when a paste containing a photosensitive resist is applied to the entire first rib material layer 4a, a part of the paste penetrates the first rib material layer 4a. A phenomenon occurs (here, it is conceptually considered that the blast suppressing material permeation layer 11 is formed). It is difficult to completely remove such a blast suppressing material permeation layer 11 by development processing in a photo method. In the blast suppressing material permeation layer 11, portions that become horizontal ribs and vertical ribs after blasting are not a big problem, and grinding is performed during blasting (second blasting in the present invention) for forming step ribs. It is considered that the region (unnecessary penetration region 12) to be used causes a large variation in the dimensions of the horizontal rib and the vertical rib.

  Here, the dimension of the lateral rib width is expected to vary in a direction that is larger than planned. This is presumably because a part of the blast suppressing material remains in the first rib material layer (unnecessary permeation region) and it is difficult to accurately pattern the stopper layer by exposure and development. As a result, the shape of the edge portion of the lateral rib obtained by the blasting process becomes rough in plan view (a clean line cannot be cut).

  On the other hand, the dimension of the vertical rib width is expected to vary in a direction that becomes smaller than planned. This is because the abrasive material that collided with the rib material layer may collide with other parts in the blasting process, so that it is difficult to grind the unnecessary penetration area and the second rib that is easier to grind than the unnecessary penetration area. If the material layer exists, it is considered that secondary abrasive from the unnecessary penetration region also contributes to the grinding of the second rib material layer. The problem caused by the presence of the unnecessary permeation region appears prominently in the conventional method, for example, the method of forming the patterned stopper layer by the photo method, and no countermeasure has been taken in the unnecessary permeation region. Was the current situation.

On the other hand, in the present invention, it is possible to form step ribs with small dimensional variations. FIG. 4A shows the AA ′ cross-sectional view of FIG. 1E except that the existence of the blast suppressing material permeation layer 11 and the unnecessary permeation region 12 is conceptually considered. It is. In the present invention, as shown in FIG. 4 (b), not only the stopper layer 5 but also the first rib material layer 4a located therebelow is ground during the first blasting process. As a result, as shown in FIG. 4C, the unnecessary permeation region 12 of the blast suppressing material permeation layer 11 can be removed, and the variation in the dimensions of the vertical ribs and the horizontal ribs can be reduced during the second blasting process. It can be done. Further, if a dry film resist is used in the first photosensitive resist pattern forming step in order to remove the unnecessary permeation region 12, since the dry film resist does not normally penetrate into the stopper layer, the stopper layer is formed by the conventional photo method described above. Due to the rough pattern of the stopper layer as in the case of forming, there is no problem that the shape of the edge portion of the lateral rib obtained by blasting becomes rough in plan view (a clean line cannot be cut). Has the advantage. Further, according to the present invention, since the unnecessary permeation region is removed during the first blasting process, for example, a stopper layer forming material having a low viscosity can be actively used, and a wide range of materials can be selected. Has the advantage.
Hereinafter, the manufacturing method of the backplate for PDP of this invention is demonstrated for every process.

1. Back plate forming member preparation step First, the back plate forming member preparation step in the present invention will be described. The back plate forming member preparation step in the present invention is a step of preparing a back plate forming member in which the substrate, the patterned address electrode layer, and the dielectric layer are laminated in this order (FIG. 1A). reference).

  The material of the substrate used in the present invention is not particularly limited as long as it has a predetermined heat resistance, and the same material as the substrate used for a general PDP back plate should be used. Can do. Specific examples include glass and the like. Among them, high strain point glass that generates a small amount of distortion during firing of a dielectric or rib material is preferable.

  The material of the address electrode layer used in the present invention is not particularly limited as long as it has conductivity, and the same material as the material of the address electrode layer used for a general PDP back plate is used. can do. Specific examples include metals such as Ag. In addition, the address electrode layer used in the present invention may be a laminate of metal thin films, and specifically includes those having a three-layer metal thin film such as Cr / Cu / Cr. .

  Examples of the method for forming the patterned address electrode layer on the substrate include a photo paste method, a printing method, a thin film method, and the like. Among these, the photo paste method is preferable. Specifically, as the photo paste method, Ag paste containing a photosensitive resin is applied to the entire surface of the substrate by a screen printing method, dried, then exposed and developed in a predetermined pattern, and finally fired. The method etc. can be mentioned. Specific examples of the printing method include a method in which an Ag paste is printed in an electrode pattern using a screen plate, dried, and then fired to obtain a desired electrode. On the other hand, as the thin film method, specifically, a Cr / Cu / Cr three-layer metal thin film is formed on the entire surface of the substrate by a sputtering method, a resist is applied to the outermost layer of the metal thin film, and then dried. Examples include a method of performing exposure and development with a predetermined pattern, etching the exposed metal thin film, and finally removing the resist.

  The material of the dielectric layer used in the present invention is not particularly limited as long as it has a desired dielectric constant, and is the same as the material of the dielectric layer used for a general PDP back plate. Can be used.

  Examples of the method for forming the dielectric layer include a screen printing method and a slit die coating method. Further, a laminating method may be used in which a film in which a dielectric layer is laminated on a base film is laminated so as to cover the address electrode layer. In the present invention, after the dielectric layer is formed, drying is usually performed. However, the dielectric layer may be fired as necessary.

2. First Rib Material Layer Forming Step Next, the first rib material layer forming step in the present invention will be described. The first rib material layer forming step in the present invention is a step of forming the first rib material layer on the dielectric layer of the back plate forming member (see FIG. 1B).

Examples of the rib material layer forming material used for forming the first rib material layer include glass paste. Further, the glass paste is usually a glass frit having an average particle size of about 3 μm such as BiO ₂ , ZnO, B ₂ O ₃ , a filler made of an inorganic component such as TiO ₂ , Al ₂ O ₃ , and a resin for making a paste. Contains ingredients and solvent.

  Specific examples of the resin component include cellulose derivatives such as ethyl cellulose, hydroxypropyl cellulose, methyl cellulose, and nitrocellulose, polyester resins such as polyacrylic esters and alkyd resins, acrylic acid, methacrylic acid, itaconic acid, maleic acid, Fumaric acid, crotonic acid, vinyl acetic acid, methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, 2-hexyl acrylate, lauryl methacrylate, lauryl acrylate , Stearyl methacrylate, stearyl acrylate, dodecyl methacrylate, dodecyl acrylate, Xyl methacrylate, hexyl acrylate, octyl methacrylate, octyl acrylate, cetyl methacrylate, cetyl acrylate, nonyl methacrylate, nonyl acrylate, decyl methacrylate, decyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, glycidyl methacrylate, dimethylaminoethyl methacrylate, 2-methoxy acrylate 2 (2-ethoxyethoxy) ethyl acrylate, 2-hydroxyethyl methacrylate, diacetone acrylamide, N, N-dimethylaminopropyl acrylamide, N, N-diethylacrylamide, isopropylacrylamide, diethylaminoethyl methacrylate, t-butyl methacrylate, N , N-dimethylacrylic A homopolymer composed of monomers such as imide, α-methylstyrene, styrene, vinyltoluene, N-vinyl-2-pyrrolidone, and a copolymer composed of two or more monomers selected from the above monomers, ethylene-acrylic acid copolymer Examples thereof include polyolefin resins such as coalescence, ethylene-methacrylic acid copolymer, ethylene-vinyl acetate copolymer, polyvinyl formal, polyvinyl butyral, and the like.

  Specific examples of the solvent include terpenes such as α-, β-, and γ-terpineol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, ethylene Glycol monoalkyl ether acetates, ethylene glycol dialkyl ether acetates, diethylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, propylene glycol Dialkyl ether acetates, methanol, ethanol , Isopropanol, 2-ethylhexanol, and 1-butoxy-2-propanol and alcohols such. Moreover, you may use these individually or in mixture of 2 or more types.

  The film thickness of the first rib material layer varies depending on the shape of the target step rib, and is not particularly limited. In the present invention, as will be described later, a stopper layer is provided on the first rib material layer. Therefore, the film thickness of the first rib material layer is a major factor that determines the height of the lateral rib. Specifically, the thickness of the first rib material layer after drying is in the range of 10 μm to 200 μm, and preferably in the range of 60 μm to 150 μm. In addition, the film thickness of the first rib material layer after drying is usually about 2/3 after firing.

  Examples of the method for forming the first rib material layer include a method in which a rib material layer forming material is applied on the dielectric layer by a slit die coating method and dried. Application may be performed by a roll coating method or the like.

3. Stopper Layer Formation Step Next, the stopper layer formation step in the present invention will be described. The stopper layer forming step in the present invention is a step of forming a stopper layer on the first rib material layer (see FIG. 1C). The shape of the stopper layer formed in this step is not particularly limited, and may be formed on the entire surface of the first rib material layer, or may be formed only in a portion corresponding to the lateral rib and in the vicinity thereof.

  The composition of the stopper layer forming material used to form the stopper layer varies depending on the intended method of forming the stopper layer, but usually contains at least a blast suppressing material. The blast suppressing material is not particularly limited as long as the blast rate can be lowered, and examples thereof include a resin (blast suppressing resin). The blast suppressing resin may be either a photosensitive resin or a non-photosensitive resin, but usually a non-photosensitive resin is used. Examples of the non-photosensitive resin include acrylic and ethyl cellulose.

  When the stopper layer forming material is made of only the blast suppressing material, there are a plurality of stopper layer forming methods according to the properties of the blast suppressing material. When the blast suppressing material has a property of penetrating into the first rib material layer, the first rib material layer is applied by applying the blast suppressing material to the first rib material layer and allowing a part or all of the blast suppressing material to penetrate. A stopper layer can be formed on a part of the substrate. On the other hand, when the blast suppressing material has a property of not penetrating the first rib material layer, a stopper layer made of only the blast suppressing material can be formed by applying the blast suppressing material to the first rib material layer.

  The stopper layer forming material preferably contains glass frit in addition to the blast suppressing material. This is because the glass frit contained in the stopper layer forming material melts during firing, and the bond between the first rib material layer and the second rib material layer can be further strengthened. Furthermore, the stopper layer forming material may contain a filler composed of an inorganic component. In addition, about the glass frit, the filler which consists of an inorganic component, etc., the material similar to what is used for the material for rib material layer formation of the 1st rib material layer mentioned above can be used. In the present invention, the ratio of the resin component is larger than the material for forming the first rib material layer, which is the same material as the material for forming the rib material layer described above. The rib material layer forming material can also be used as the stopper layer forming material.

  Although it does not specifically limit as a solvent used for the material for stopper layer formation, For example, the thing similar to the solvent of the material for rib material layer formation of the 1st rib material layer mentioned above can be used.

  The stopper layer used in the present invention contains at least a blast suppressing material, can be patterned into a desired pattern during the first blasting process, and can exhibit blast resistance during the second blasting process. There is no particular limitation as long as it is present.

Here, the bra straight stopper layer and BR _A, bras straight first ribs material layer and BR _B, bras straight second ribs material layer and BR _C. In the present invention, “blast straight” refers to the grinding depth per unit time. Further, the “blast rate ratio” in the present invention refers to the ratio of blast rate when the blasting conditions are the same. In the present invention, the blast rate ratio BR _B / BR _A between the stopper layer and the first rib material layer is, for example, in the range of 1 to 100, particularly in the range of 3 to 70, particularly in the range of 5 to 40. Is preferred. The blast rate ratio BR _C / BR _A between the stopper layer and the second rib material layer is, for example, in the range of 0.5 to 50, particularly in the range of 1 to 30, particularly in the range of 1.5 to 20. Is preferred. Bra straight ratio _BR C / BR _B between the first rib material layer and a second rib material layer, for example in the range of 0.05 to 2, among others 0.1 in the range of, in particular from 0.2 to 0. It is preferable to be within the range of 7.

  When the stopper layer is composed of glass frit or the like and a blast suppressing material, the ratio of the blast suppressing material contained in the stopper layer is usually in the range of 2 to 30% by weight, especially 5 It is preferable to be in the range of 15% by weight to 15% by weight. If the ratio of the blast suppressing material is too high, the strength of the step rib after firing may be lowered, and if the ratio of the blast suppressing material is too low, sufficient blast resistance may not be exhibited. Because.

  Moreover, in this invention, it is preferable that the film thickness of the said stopper layer is small. If the thickness of the stopper layer is small, the possibility that the surface of the second rib material layer will wave when the second rib material layer to be described later is formed (the possibility that the height becomes nonuniform) is low, and the height is high. This is because it is possible to obtain a vertical rib with less variation. Moreover, if the desired blast suppressing effect can be obtained in a state where the thickness of the stopper layer is small, the grinding variation on the surface of the first rib material layer is reduced when the second rib material layer described later is formed, This is because a lateral rib with little height variation can be obtained. The thickness of the stopper layer after drying varies depending on the constituent components of the stopper layer, etc., but is usually 30 μm or less, preferably 3 μm to 20 μm, particularly preferably 3 μm to 10 μm. .

  The method for forming the stopper layer is not particularly limited as long as it can form a desired stopper layer. For example, a stopper layer forming material is applied on the first rib material layer. A drying method is used. Examples of the method for applying the stopper layer forming material include a screen printing method, a slit die coating method, and a roll coating method.

4). First Photosensitive Resist Pattern Formation Step Next, the first photosensitive resist pattern formation step in the present invention will be described. The first photosensitive resist pattern forming step in the present invention is a step of forming a first photosensitive resist pattern using a photosensitive resist on the stopper layer and at a position corresponding to the lateral rib ( (Refer FIG.1 (d)).

  The first photosensitive resist pattern functions as a resist during the first blasting process, and is usually formed to be the same pattern as the intended pattern of the lateral ribs. However, since the region intersecting and overlapping the vertical rib in plan view is protected by the second photosensitive resist pattern described later, the first photosensitive resist pattern may not be formed for the region. There is a good case.

  The photosensitive resist used in this step is not particularly limited as long as it can be processed by photolithography. The photosensitive resist may be a dry film resist or a liquid resist, but is preferably a dry film resist. This is because the dry film resist does not normally penetrate into the stopper layer and the second rib material layer. On the other hand, even when the photosensitive resist is a liquid resist, in the present invention, since the liquid resist is generally applied to the surface of the stopper layer having a low porosity, the amount of the liquid resist penetrating into the stopper layer is There are few and it is possible to use practically.

  The film thickness of the first photosensitive resist pattern is not particularly limited as long as sufficient blast resistance can be exhibited in the first blasting process, but is usually in the range of 10 μm to 100 μm. The stripe width of the first photosensitive resist pattern is a major factor that defines the top width of the lateral rib. The stripe width is, for example, preferably in the range of 30 μm to 120 μm, and more preferably in the range of 50 μm to 100 μm. The interval between adjacent stripe widths varies depending on the use of the PDP back plate, but is preferably in the range of 120 μm to 1000 μm, and more preferably in the range of 400 μm to 800 μm.

  As described above, the first photosensitive resist pattern is formed on the stopper layer and at a position corresponding to the horizontal rib, but may be formed at a position corresponding to the vertical rib at the same time. good. That is, the first photosensitive resist pattern may be formed in a matrix on the stopper layer. This is because the variation in the vertical rib width can be further reduced. In the present invention, after the first rib material layer is formed and the first blast treatment or the like is performed, the second rib material layer is formed. Usually, since the second rib material layer also contains a small amount of resin component, etc., when the second rib material layer is directly formed on the first rib material layer, the resin component penetrates into the first rib material layer. There is. As a result, similar to the phenomenon in the unnecessary permeation region when the stopper layer is formed as described above, there is a possibility that the variation in the width of the vertical ribs becomes large. Therefore, by forming the first photosensitive resist pattern in a matrix, a matrix-like stopper layer can be obtained, and the resin component of the second rib material layer is the first rib material layer in the region where the vertical rib is formed. Can be suppressed, and the variation in the vertical rib width can be further reduced.

  The method for forming the first photosensitive resist pattern is the same as the patterning method using a general photosensitive resist material. Specifically, a photosensitive resist layer is formed on the entire surface of the stopper layer and exposed. A method of developing can be mentioned.

5. First Blast Processing Step Next, the first blast processing step in the present invention will be described. In the first blasting process of the present invention, the first photosensitive resist pattern and the exposed stopper layer are subjected to a blasting process, whereby the exposed stopper layer, and the first layer located therebelow. This is a step of grinding part or all of the rib material layer to form a convex portion for forming a lateral rib (see FIGS. 1E and 1F).

  In the present invention, during the first blast treatment step, not only the exposed stopper layer but also the first rib material layer located thereunder is ground. Thereby, even when a part of the blast suppressing material contained in the stopper layer forming material penetrates into the first rib material layer with many voids, the unnecessary permeated region (unnecessary permeation region) is removed. And the variation in the dimensions of the vertical and horizontal ribs can be reduced.

  In the present invention, part or all of the first rib material layer located under the exposed stopper layer is ground. Usually, the first rib material layer is ground to such a depth that at least the unnecessary permeation region can be removed. The depth of the unnecessary permeation region varies depending on the porosity of the first rib material layer, the type of blast suppressing material, and the like. For this reason, it is preferable to confirm the depth of the unnecessary permeation region by conducting a preliminary experiment using the same material as that actually used. In the present invention, it is preferable to grind from the surface of the first rib material layer on the stopper layer side, for example, 5 μm or more, especially 10 μm or more, particularly 20 μm or more.

  On the other hand, in the present invention, all of the first rib material layer located under the exposed stopper layer may be removed by grinding. In this case, when forming the second rib material layer, the second rib material layer is removed. It should be noted that the surface of the material layer is more likely to wave (the possibility of non-uniform height). In order to reduce the possibility, it is preferable to appropriately adjust the viscosity and the like of the rib material layer forming material.

  The blasting process in this step is not particularly limited as long as the exposed first rib material layer is ground and the first photosensitive resist pattern is not ground. The material of the abrasive used for the blasting is not particularly limited as long as it can grind the first rib material layer. For example, diamond, alumina, silicon carbide, calcium carbonate, glass beads, Examples include stainless steel. The particle size of the abrasive is preferably, for example, in the range of 3 μm to 50 μm, and more preferably in the range of 10 μm to 30 μm.

In the present invention, it is preferable that the abrasive material linearly contacts the first rib material layer or the like. The blast pressure of the grinding material, for example in the range of ^{0.1kgf / cm 2 ~3.0kgf / cm 2} , preferably in the range Of these the ^{0.3kgf / cm 2 ~1.0kgf / cm 2} . The amount of spray of the abrasive is, for example, preferably in the range of 100 g / min to 6000 g / min, and more preferably in the range of 1000 g / min to 5000 g / min.

  In this step, usually, after the blasting process is finished, a peeling process for peeling the first photosensitive resist pattern from the first rib material layer is performed. This stripping treatment can be performed using a general stripping solution.

6). Second Rib Material Layer Forming Step Next, the second rib material layer forming step in the present invention will be described. The second rib material layer forming step in the present invention is a step of forming a second rib material layer so as to cover the first rib material layer and the stopper layer that have been subjected to blasting (see FIG. 1G). ).

  The film thickness of the second rib material layer varies depending on the shape of the target step rib, and is not particularly limited. In the present invention, the sum of the film thicknesses of the second rib material layer, the stopper layer, and the first rib material layer is a major factor that determines the height of the vertical rib. The sum of the film thicknesses of the second rib material layer, the stopper layer, and the first rib material layer after drying is, for example, in the range of 50 μm to 300 μm, and more preferably in the range of 100 μm to 200 μm.

  The rib material layer forming material used to form the second rib material layer is the same as the rib material layer forming material of the first rib material layer described in “2. First rib material layer forming step” above. These materials can be used. Similarly, the method for forming the second rib material layer and the like are as described above. In the present invention, the rib material layer forming materials of the second rib material layer and the first rib material layer may be the same or different from each other. In general, as the rib material layer forming material of the second rib material layer, a material that is harder to grind than the rib material layer forming material of the first rib material layer is often used. This is because the abrasive material that collided with the rib material layer during the blasting process can collide with other parts secondarily, so the unnecessary permeation area that is difficult to be ground and the second rib that is easier to grind than the unnecessary permeation area If the material layer is present, it is considered that the secondary abrasive from the unnecessary permeation region also contributes to the grinding of the second rib material layer, and such secondary grinding can be suppressed. In the present invention, a planarization process may be performed so that the surface of the second rib material layer is flat. Examples of the planarization treatment include a polishing method.

7). Second photosensitive resist pattern forming step Next, the second photosensitive resist pattern forming step in the present invention will be described. The second photosensitive resist pattern forming step in the present invention is a step of forming a second photosensitive resist pattern using a photosensitive resist on the second rib material layer and at a position corresponding to the vertical rib. (See FIG. 1 (h)).

  The second photosensitive resist pattern functions as a resist during the second blasting process, and is usually formed to be the same pattern as the intended pattern of the vertical ribs. For various dimensions such as the thickness of the photosensitive resist and the second photosensitive resist pattern used in this step, and the method for forming the second photosensitive resist pattern, etc., see “4. First photosensitive resist pattern forming step” above. The description is omitted here since it is the same as that described in FIG.

8). Second Blast Processing Step Next, the second blast processing step in the present invention will be described. The second blasting step in the present invention is a step of forming the step ribs by blasting the second photosensitive resist pattern and the exposed second rib material layer from the vertical direction. (See FIGS. 1 (i) and 1 (j)).

  In this step, the rib material layer (the first rib material layer and the second rib material layer) located under the second photosensitive resist pattern is not ground, and the first rib material layer located under the stopper layer is The rib material layers (the first rib material layer and the second rib material layer) that are not ground and on which the second photosensitive resist pattern and the stopper layer are not formed are ground. The blast process in this step is performed so as to satisfy such a condition. Since the material of the abrasive used for the blasting process is the same as the contents described in “5. First blasting process”, the description thereof is omitted here. Further, after the second blasting process, the second photosensitive resist pattern is peeled off.

9. Other Steps After the second blast treatment step described above, a firing step for firing the step rib is usually performed. The conditions such as the baking temperature, the baking time, and the baking method are the same as the conditions for a general PDP back plate, and thus the description thereof is omitted here. Further, after the firing step, a phosphor layer forming step of forming a phosphor layer on the inner peripheral surface of the step rib is performed. Examples of the method for forming the phosphor layer include a screen printing method and a dispensing method. Moreover, you may perform the washing | cleaning process which wash | cleans the surface after each process mentioned above.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples. In the examples, “parts” represents parts by weight, and “%” represents% by weight.

[Example 1]
(1) Production of back plate forming member Photosensitive silver paste (DuPont) as an address electrode on high strain point glass (“PD200” manufactured by Asahi Glass Co., Ltd.) having a size of 2080 mm × 1210 mm and a thickness of 1.8 mm. DC206) was solid-printed using a screen printing plate having an emulsion thickness of 5 μm (“T250 mesh” manufactured by Tokyo Process Service Co., Ltd.) and dried at 80 ° C. for 30 minutes. Next, exposure was performed using a photomask having a pattern with an opening width of 60 μm, and spray development was performed with a 0.3% sodium carbonate aqueous solution at a development pressure of 1.5 kgf / cm ² to form a silver electrode pattern. Next, baking was performed at 600 ° C. to form an address electrode having a film thickness of 3 μm, a line width of 50 μm, and a pitch of 200 μm on the glass substrate.
Next, PLS-3232 (manufactured by Nippon Electric Glass) is printed on the address electrodes as a dielectric layer by screen printing, dried and fired to form a dielectric layer having a thickness of 10 μm, and a member for forming a back plate Was made.

(2) Preparation of first rib material layer First, a first rib material layer paste (first rib material layer forming material) having the following composition was prepared.
Glass frit (ZnO / SiO ₂ / B ₂ O ₃ / alkali metal oxide, thermal expansion coefficient 80 × 10 ⁻⁷ / ° C., softening point 550 ° C., average particle size 3 μm) 60 parts by weight Alumina (Iwatani Chemical Industry) RA-40 manufactured by Co., Ltd.) 20 parts by weight Ethylcellulose (Etocel STD-100FP manufactured by Dow Chemical Company) 2 parts by weight Terpineol 9 parts by weight Butyl carbitol acetate 9 parts by weight

  Next, the first rib material layer forming material was coated on the dielectric layer with a die coater and dried to prepare a first rib material layer having a thickness of 102 μm.

(3) Preparation of stopper layer First, a stopper layer paste (material for forming a stopper layer) having the following composition was prepared.
Glass frit (ZnO / SiO ₂ / B ₂ O ₃ / alkali metal oxide, thermal expansion coefficient 80 × 10 ⁻⁷ / ° C., softening point 550 ° C., average particle size 3 μm) 60 parts by weight Alumina (Iwatani Chemical Industry) RA-40 manufactured by Co., Ltd.) 15 parts by weight Ethyl cellulose (Etocel STD-100FP manufactured by Dow Chemical Company) 9 parts by weight Terpineol 8 parts by weight Butyl carbitol acetate 8 parts by weight

  Next, the stopper layer forming material was coated on the first rib material layer by a screen printing method and dried to prepare a stopper layer having a thickness of 8 μm on the entire surface of the first rib material layer.

(4) Production of first photosensitive resist pattern and first blasting treatment The substrate on which the stopper layer was formed was heated to 100 ° C., and a dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., NB-235) was laminated on the stopper layer. Thereafter, exposure was performed through a striped pattern mask having a horizontal rib line width of 70 μm and a horizontal rib pitch of 600 μm. Exposure conditions were dose 250 mJ / cm ^2. Next, spray development was performed at a liquid temperature of 30 ° C. using a 0.5% anhydrous sodium carbonate aqueous solution to produce a first photosensitive resist pattern.

  Next, the region of the stopper layer not covered with the first photosensitive resist pattern by the sandblasting process using S-9 # 1200 (a stainless steel abrasive material manufactured by Fuji Seisakusho) as the abrasive material, and the first located below the region. The rib material layer was removed. The depth of the ground first rib material layer was 30 μm. Then, the 1st photosensitive resist pattern was peeled at the liquid temperature of 30 degreeC using the sodium hydroxide 2.0% aqueous solution.

(5) Production of second rib material layer First, a second rib material layer paste (second rib material layer forming material) having the following composition was produced.
Glass frit (ZnO / SiO ₂ / B ₂ O ₃ / alkali metal oxide, thermal expansion coefficient 80 × 10 ⁻⁷ / ° C., softening point 550 ° C., average particle size 3 μm) 60 parts by weight Alumina (Iwatani Chemical Industry) RA-40 manufactured by Co., Ltd.) 20 parts by weight Ethyl cellulose (Etocel STD-100FP manufactured by Dow Chemical Co., Ltd.) 3 parts by weight Terpineol 8.5 parts by weight Butyl carbitol acetate 8.5 parts by weight

  Next, the second rib material layer forming material was coated and dried with a die coater on the blasted first rib material layer and the stopper layer, thereby producing a second rib material layer. At this time, the sum of the film thicknesses of the second rib material layer, the stopper layer, and the first rib material layer was 140 μm.

(6) Preparation of second photosensitive resist pattern and second blast treatment The substrate on which the second rib material layer was formed was heated to 100 ° C., and a dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., NB) was formed on the second rib material layer. -235), the film was exposed through a striped pattern mask having a vertical rib line width of 80 μm and a vertical rib pitch of 200 μm. The exposure condition was an irradiation amount of 250 mJ / cm ² . Next, spray development was performed using a 0.5% anhydrous sodium carbonate aqueous solution at a liquid temperature of 30 ° C. to prepare a second photosensitive resist pattern.

  Next, the region of the second rib material layer not covered with the second photosensitive resist pattern is removed by sandblasting using S-9 # 1200 (a stainless steel abrasive material manufactured by Fuji Seisakusho) as a grinding material, and the step rib Formed. Then, the 2nd photosensitive resist pattern was peeled at the liquid temperature of 30 degreeC using the sodium hydroxide 2.0% aqueous solution. In the obtained stepped ribs before firing, the vertical rib height is 140 μm, the vertical rib top width is 80 μm, the vertical rib pitch is 200 μm, the horizontal rib height is 110 μm, and the horizontal rib top width is 70 μm. The lateral rib pitch was 600 μm. Thereafter, firing was performed at a peak temperature of 553 ° C., a holding time of 13 minutes, and a total firing time of 2 hours. Table 1 shows the data of the height of the step ribs obtained after firing.

[Comparative Example 1]
First, in the same manner as in Example 1, a back plate forming member was produced, and a first rib material layer was formed on the dielectric layer.
Next, using a photosensitive stopper layer forming material, the first rib material layer is coated, dried, exposed and developed by a screen printing method to obtain a horizontal rib line width of 70 μm, a horizontal rib pitch of 600 μm, and a film thickness of 10 μm. A stripe-shaped stopper layer pattern was formed.
Next, a second rib material layer was formed in the same manner as in Example 1 for the stopper layer pattern and the exposed first rib material layer. Step ribs were formed in the same manner as in Example 1 except that the member thus obtained was used. Table 2 shows the height data of the obtained stepped ribs.

  As apparent from Table 1 and Table 2 above, according to the present invention, it is possible to reduce variations in the width of the horizontal rib, the width of the vertical rib, and the level difference. In the present invention, as shown in FIG. 3 (b), not only the stopper layer 5 but also the first rib material layer 4a positioned therebelow is ground during the first blasting process. As a result, as shown in FIG. 3C, the unnecessary permeation region 12 of the blast suppressing material permeation layer 11 can be removed, and the variation in the dimensions of the longitudinal ribs and lateral ribs can be reduced during the second blasting process. It can be done.

[Example 2]
By changing the film thickness of the first rib material layer to 61 μm and adjusting the film thickness of the second rib material layer, the sum of the film thicknesses of the second rib material layer, the stopper layer, and the first rib material layer is reduced. Step ribs were formed in the same manner as in Example 1 except that the thickness was 144 μm.
Table 3 shows data on the height of the obtained stepped ribs after firing.

  As apparent from Table 3 above, in Example 2, a step rib having a larger level of step than in Example 1 could be obtained. Even in such a case, the variation in the width of the horizontal rib, the width of the vertical rib, and the level difference can be reduced.

It is a perspective view which shows an example of the manufacturing method of the backplate for PDP of this invention. It is a schematic sectional drawing explaining the 1st blasting process in this invention. It is a schematic sectional drawing explaining the conventional photo method. It is a schematic sectional drawing explaining the 1st blasting process in this invention. It is a schematic sectional drawing which illustrates the back plate for conventional PDP. It is a perspective view which illustrates the back plate for conventional PDP.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Address electrode layer 3 ... Dielectric layer 4a ... First rib material layer 4b ... Second rib material layer 4x ... Vertical rib 4y ... Horizontal rib 5 ... Stopper layer 6 ... First photosensitive resist pattern 7 ... Blast Treatment 8 ... convex portion for forming horizontal ribs 9 ... second photosensitive resist pattern 10 ... member for forming back plate

Claims (4)

A substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and a vertical rib and a vertical rib formed on the dielectric layer; A step rib having a low lateral rib, and a manufacturing method of a back plate for a plasma display panel,
A back plate forming member preparing step of preparing a back plate forming member in which the substrate, the patterned address electrode layer and the dielectric layer are laminated in this order;
A first rib material layer forming step of forming a first rib material layer on the dielectric layer of the back plate forming member;
A stopper layer forming step of forming a stopper layer on the first rib material layer;
A first photosensitive resist pattern forming step of forming a first photosensitive resist pattern using a photosensitive resist at a position on the stopper layer and corresponding to the lateral rib;
By blasting the first photosensitive resist pattern and the exposed stopper layer, a part or all of the exposed stopper layer and the first rib material layer located therebelow are ground. And a first blasting process for forming the lateral rib forming convex part,
A second rib material layer forming step of forming a second rib material layer so as to cover the first rib material layer and the stopper layer that have been blasted;
A second photosensitive resist pattern forming step for forming a second photosensitive resist pattern using a photosensitive resist at a position on the second rib material layer and corresponding to the longitudinal rib;
A second blasting process for forming the step ribs by blasting the second photosensitive resist pattern and the exposed second rib material layer;
A method for manufacturing a back plate for a plasma display panel.   The method for producing a back plate for a plasma display panel according to claim 1, wherein the stopper layer forming material used for forming the stopper layer contains a glass frit and a blast suppressing material.   The method for manufacturing a back plate for a plasma display panel according to claim 2, wherein the blast suppressing material is a blast suppressing resin.   4. The method according to claim 1, wherein at least one of the photosensitive resist used in the first photosensitive resist pattern forming step and the second photosensitive resist pattern forming step is a dry film resist. The manufacturing method of the back plate for plasma display panels as described in the said claim.

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