JP2008218082A - Manufacturing method of back plate for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a back plate for a PDP by which a back plate for the PDP having stepped ribs can be obtained by a simple method. <P>SOLUTION: The manufacturing method of the back plate for the plasma display panel comprises a preparation process of a back plate formation member to prepare the back plate formation member having a substrate, an address electrode layer of a pattern shape formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and a matrix rib which is formed on the dielectric layer and constituted of vertical ribs and horizontal ribs, and a stepped rib formation process to form a stepped rib in which the horizontal ribs are lower than the vertical ribs in height by carrying out brushing along the direction of the vertical ribs of the back plate formation member using a rib cutting brush having a brush of a metal wire. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a plasma display capable of easily forming a back plate for a plasma display panel (hereinafter, also referred to as a “PDP back plate”) having stepped ribs having different vertical and horizontal rib heights. The present invention relates to a method for manufacturing a panel back plate.

  A back plate used in a plasma display panel (hereinafter sometimes referred to as “PDP”) is usually composed of a substrate 1 and a patterned address electrode layer 2 formed on the substrate 1, as shown in FIG. A dielectric layer 3 formed on the address electrode layer 2, a rib 4 formed on the dielectric layer 3, and a phosphor layer 8 (8R, 8G, 8B) formed between the ribs 4, Have Further, the conventional PDP back plate has a mainstream having striped ribs 4 as shown in FIG. 8A, but in recent years, as shown in FIG. In addition, a PDP back plate having matrix ribs 4 having vertical ribs 4x and horizontal ribs 4y has been proposed.

  The PDP back plate having matrix ribs can increase the amount of phosphor per unit area as compared with the PDP back plate having striped ribs, so that the luminance can be improved. On the other hand, it has the disadvantage that the ribs formed vertically and horizontally are obstructed and difficult to exhaust. In order to solve such drawbacks, a technique related to a PDP back plate having ribs (step ribs) having different heights is known.

  For example, Patent Document 1 discloses a method of forming a step rib by performing dry film resist (DFR) lamination, plate making, and sandblasting twice. However, particularly in this method, there is a problem that the second DFR lamination is difficult. That is, after forming the matrix rib by the first sand blasting and further laminating DFR on the upper bottom surface of the matrix rib, there is a problem that the end of the rib is chipped by the roller pressure. Further, when the laminating pressure is high, DFR enters into the holes of the already formed matrix ribs, making it difficult to make the DFR film thickness uniform, and there is a problem that exposure and development cannot be performed properly. It was. Furthermore, there is a risk that the DFR that has entered the hole of the matrix rib is not completely removed. On the other hand, when the laminating pressure is low, there is a problem that adhesion failure occurs and the DFR is peeled off during development or blasting.

  Another problem is that alignment of the second exposure is difficult. The exposure position accuracy of the DFR of the first layer is sufficient if the relative position accuracy of the rib with respect to the address electrode can be ensured, and the pad portion of the address electrode (substantially rectangular or substantially hexagonal formed at the position corresponding to the discharge portion). It is sufficient if the accuracy of the level that the portion) enters between the vertical ribs is obtained. However, if the DFR exposure of the second layer is performed with this degree of alignment accuracy, the DFR is displaced from the vertical rib, and the edge portion of the vertical rib is ground during blasting. In addition, since two DFRs are used, there is a problem that costs increase in both the equipment and the material. Therefore, a method for manufacturing a back plate for PDP that can solve these problems has been desired.

  Patent Document 2 discloses a method for manufacturing a plasma display panel, which includes a pre-process for forming barrier ribs having the same height and a post-process for providing a height difference in the barrier ribs.

Japanese Patent No. 3440907 JP 2001-236891 A JP 2005-205530 A JP 2005-349513 A JP 2006-159402 A JP 2006-224281 A

  This invention is made | formed in view of the said situation, and it aims at providing the manufacturing method of the backplate for PDP which can obtain the backplate for PDP which has a level | step difference rib by a simple method. is there.

  In order to solve the above problems, in the present invention, a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric A back plate forming member preparing step for preparing a back plate forming member having a matrix rib formed of vertical ribs and horizontal ribs formed on the layer; and a rib cutting brush having metal wire brush bristles A step rib forming step in which the horizontal rib forms a step rib lower than the vertical rib by brushing in a direction along the vertical rib of the back plate forming member. A method for manufacturing a back plate for a plasma display panel is provided.

  According to the present invention, by using a brush for rib cutting and brushing in a direction along the longitudinal rib of the back plate forming member, only the lateral rib can be selectively cut, and the step rib is easily formed. can do. Further, the metal wire generally has high hardness, and the matrix rib can be cut well.

  In the said invention, it is preferable to perform brushing from the both directions of the direction along the vertical rib of the said backplate formation member in the case of the said level | step difference rib formation process. This is because uniform cutting can be performed.

  In this invention, there exists an effect that the backplate for PDP which has a level | step difference rib can be obtained by a simple method.

  Hereinafter, the manufacturing method of the backplate for PDP of this invention is demonstrated in detail.

  The method for manufacturing the back plate for PDP of the present invention includes a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric layer. A back plate forming member preparing step for preparing a back plate forming member having a matrix rib composed of vertical ribs and horizontal ribs formed thereon, and a rib cutting brush having metal wire brush bristles are used. A step rib forming step in which the horizontal rib forms a step rib lower than the vertical rib by brushing in a direction along the vertical rib of the back plate forming member. is there.

  According to the present invention, by using a brush for rib cutting and brushing in a direction along the longitudinal rib of the back plate forming member, only the lateral rib can be selectively cut, and the step rib is easily formed. can do. Further, the metal wire generally has high hardness, and the matrix rib can be cut well. In addition, as described above, when a method of forming a step rib by performing dry film resist (DFR) lamination, plate making, and sandblasting twice as in the conventional case, as described above, in the second DFR lamination, The problem is that the end of the rib is missing, the problem that the DFR falls into the hole of the matrix rib, the problem of the DFR peeling failure, etc., the alignment problem occurs at the second exposure, Since DFR is used, there has been a problem that costs increase. On the other hand, in the present invention, when the matrix rib is cut into the step rib, the DFR is not used and the rib forming brush is used, so that the above problem does not occur at all. Have.

  Next, the manufacturing method of the back plate for PDP of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a method for manufacturing a PDP back plate according to the present invention. In the method for manufacturing the PDP back plate shown in FIG. 1, first, as shown in FIG. 1A, a substrate 1, a patterned address electrode layer 2 formed on the substrate 1, and an address electrode layer 2 are formed. A back plate forming member 10 having a dielectric layer 3 formed so as to cover and a matrix rib 4 formed on the dielectric layer 3 and composed of vertical ribs 4x and horizontal ribs 4y is prepared. Next, as shown in FIG. 1B, brushing is performed in a direction along the longitudinal ribs 4x of the back plate forming member, using a rib cutting brush 6 having metal wire brush bristles 5. Thereby, as shown in FIG.1 (c), the level | step difference rib 4 'in which the horizontal rib 4y is lower than the vertical rib 4x is formed. Thereafter, the obtained step rib is usually fired, and a phosphor layer is formed on the inner peripheral surface of the step rib to obtain a PDP back plate.

  FIG. 2 is a schematic cross-sectional view showing a cross section AA ′ of FIG. For convenience, the description of the lateral rib 4y is omitted. As shown in FIG. 2, when the rib cutting brush 6 is moved in the direction along the vertical rib 4x of the back plate forming member 10, the brush bristles 5 of the rib cutting brush 6 are parallel to the moving direction of the vertical rib 4x. Hardly gathers and gathers in the gap between the vertical ribs 4x. As a result, only the lateral rib (not shown) orthogonal to the longitudinal rib 4x can be selectively (anisotropically) cut.

The definition of the vertical rib and the horizontal rib in the present invention is convenient, and when one of the intersecting ribs is a vertical rib, the other rib can be a horizontal rib. Moreover, the height of the vertical rib and the horizontal rib in the matrix rib before forming the step rib is usually the same.
Hereinafter, the manufacturing method of the backplate for PDP of this invention is demonstrated for every process.

1. Back plate forming member preparation step First, the back plate forming member preparation step in the present invention will be described. The back plate forming member preparation step in the present invention includes a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric layer. This is a step of preparing a back plate forming member that is formed thereon and has matrix ribs formed of vertical ribs and horizontal ribs.

  The matrix rib can be formed of, for example, glass paste as will be described later, but the matrix rib of the back plate forming member is usually formed using a material before firing. This is because it is easy to cut the lateral ribs in the step rib forming process performed thereafter. Usually, after cutting a horizontal rib and forming a level | step difference rib, a baking process is performed. However, the matrix rib may be formed using a semi-fired material as long as it does not hinder the cutting of the lateral rib.

  The back plate forming member preparing step in the present invention is not particularly limited as long as it is a step capable of preparing a back plate forming member having matrix ribs capable of forming step ribs. In the present invention, usually, the back plate forming member preparing step includes an address electrode layer forming step of forming a patterned address electrode layer on the substrate, and a dielectric forming a dielectric layer so as to cover the address electrode layer. A layer forming step, and forming a rib layer on the dielectric layer and processing the rib layer to form a matrix rib formed of vertical ribs and horizontal ribs.

FIG. 3 is a perspective view showing an example of a back plate forming member preparation step in the present invention. More specifically, it is a perspective view when the blast method is used in the matrix rib forming step. In the back plate forming member preparation step shown in FIG. 3, first, an address electrode layer forming step of forming a patterned address electrode layer 2 on the substrate 1 (FIG. 3A), the address electrode layer 2 is formed. A dielectric layer forming step of forming the dielectric layer 3 so as to cover (FIG. 3B) is performed. Next, as a matrix rib forming step, a rib layer forming process for forming a rib layer 4 ″ on the entire surface of the dielectric layer 3 (FIG. 3C), and a dry film resist layer 7 on the entire surface of the rib layer 4 ″. (FIG. 3 (d)), and dry film resist pattern formation processing for forming a dry film resist pattern 7 'in a vertical and horizontal pattern by exposing and developing the dry film resist layer 7 (FIG. 3 (e)). ), A sandblasting process for sandblasting to transfer the dry film resist pattern 7 ′ to the rib layer 4 ″ (FIG. 3 (f)), and a peeling process for peeling the dry film resist pattern 7 ′ after the sandblasting process. (FIG. 3G). Thereby, as shown in FIG. 3G, the back plate forming member 10 having the matrix ribs 4 constituted by the vertical ribs 4x and the horizontal ribs 4y is obtained.
Hereafter, each said process which comprises the member preparation process for backplate formation is demonstrated in detail.

(1) Address Electrode Layer Formation Step First, the address electrode layer formation step in the present invention will be described. The address electrode layer forming step in the present invention is a step of forming a patterned address electrode layer on the substrate.

  The material of the substrate used in the present invention is not particularly limited as long as it has a predetermined heat resistance, and the same material as the substrate used for a general PDP back plate should be used. Can do. Specifically, glass etc. can be mentioned, Among these, the glass with a small distortion produced at the time of baking of a dielectric material or a rib material is preferable.

  The material of the address electrode layer used in the present invention is not particularly limited as long as it has conductivity, and the same material as the material of the address electrode layer used for a general PDP back plate is used. can do. Specific examples include metals such as Ag. In addition, the address electrode layer used in the present invention may be a laminate of metal thin films, and specifically includes those having a three-layer metal thin film such as Cr / Cu / Cr. .

  Examples of the method for forming the patterned address electrode layer on the substrate include a photo paste method and a thin film method. Among these, the photo paste method is preferable. Specifically, as the photo paste method, Ag paste containing a photosensitive resin is applied to the entire surface of the substrate by a screen printing method, dried, then exposed and developed in a predetermined pattern, and finally fired. The method etc. can be mentioned. On the other hand, as the thin film method, specifically, a Cr / Cu / Cr three-layer metal thin film is formed on the entire surface of the substrate by a sputtering method, a resist is applied to the outermost layer of the metal thin film, and then dried. Examples include a method of performing exposure and development with a predetermined pattern, etching the exposed metal thin film, and finally removing the resist.

(2) Dielectric Layer Formation Step Next, the dielectric layer formation step in the present invention will be described. The dielectric layer forming step in the present invention is a step of forming a dielectric layer so as to cover the address electrode layer.

  The material of the dielectric layer used in the present invention is not particularly limited as long as it has a desired dielectric constant, and is the same as the material of the dielectric layer used for a general PDP back plate. Can be used.

  Examples of the method for forming the dielectric layer include a screen printing method. In the present invention, after the dielectric layer is formed, drying is usually performed, but the dielectric layer may be fired as necessary.

(3) Matrix Rib Formation Step Next, the matrix rib formation step in the present invention will be described. The matrix rib forming step in the present invention is a step of forming a matrix rib composed of vertical ribs and horizontal ribs by forming a rib layer on the dielectric layer and processing the rib layer.

  The method for forming the matrix rib is not particularly limited as long as a desired matrix rib can be obtained, and examples thereof include a blast method, a photo paste method, and an etching method. The method is preferred.

  When the method for forming the matrix rib is a blast method, the matrix rib forming step usually includes the following processes. That is, in the matrix rib forming step, a rib layer is formed on the dielectric layer by applying and drying a rib paste, and a dry film resist layer is formed on the rib layer. By exposing and developing the dry film resist layer, a dry film resist layer process for forming a patterned dry film resist pattern; a sand blasting process for sand blasting to transfer the dry film resist pattern to the rib layer; And a peeling process for peeling the dry film resist pattern after the sandblasting process. Each of the above-described processes is the same as the contents described in FIG. 3 and is the same as the process performed on a general PDP back plate, and thus description thereof is omitted here.

When the method of forming the matrix rib is the blast method, for example, glass paste or the like is used as the rib layer forming material. The glass paste is usually a glass frit having an average particle size of about 3 μm, such as BiO ₂ , ZnO, B ₂ O ₃ , an inorganic component such as TiO ₂ , Al ₂ O ₃ , a resin component for making a paste, Contains solvent.

(4) Back plate forming member Next, the back plate forming member used in the present invention will be described. The back plate forming member used in the present invention includes a substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and the dielectric layer And a matrix rib formed on the top and composed of vertical ribs and horizontal ribs.

  The top width of the vertical (horizontal) rib varies depending on the use of the back plate for PDP and the like, but is preferably in the range of 30 μm to 120 μm, particularly preferably in the range of 50 μm to 80 μm. The interval between adjacent vertical (horizontal) ribs varies depending on the use of the PDP back plate and the like, but is preferably in the range of 120 μm to 500 μm, and more preferably in the range of 160 μm to 300 μm.

  As described above, the height of the vertical rib and the horizontal rib in the matrix rib before forming the step rib is usually the same. The height of the vertical (horizontal) rib is the same as the height of the rib of a general PDP back plate, but is preferably in the range of, for example, 100 μm to 300 μm, and more preferably in the range of 120 μm to 160 μm.

2. Step Rib Forming Step Next, the step rib forming step in the present invention will be described. The step rib forming step in the present invention uses a rib cutting brush having metal wire brush bristles and performs brushing in a direction along the vertical rib of the back plate forming member so that the horizontal rib is more than the vertical rib. Is a step of forming a low step rib.

First, the rib cutting brush used in the present invention will be described. The rib cutting brush used in the present invention has at least metal wire brush hairs for cutting matrix ribs.
Although it does not specifically limit as a material of the said metal wire, For example, iron, brass, white silver, stainless steel etc. can be mentioned, Especially stainless steel is preferable.

  The length of the brush bristles varies depending on the degree of cutting the lateral ribs, but is preferably in the range of 3 mm to 50 mm, and more preferably in the range of 5 mm to 20 mm. If the bristle is too short, the ribs will be cut in the straight state, and the longitudinal ribs may be cut at the same time as the horizontal ribs. If the brush bristle is too long, uniform cutting may be difficult. Because there is.

  The thickness of the brush hair is not particularly limited as long as the lateral rib can be cut, but it is preferably in the range of 20 μm to 150 μm, and more preferably in the range of 30 μm to 80 μm.

  The hardness of the brush hair is not particularly limited as long as the matrix rib can be cut.

  The brush bristles may have a smooth surface or a roughened surface. When the brush hair has a roughened surface, it has an advantage that it can be cut efficiently, but depending on the material of the brush hair, there is a possibility that part of the brush hair remains on the rib surface. There are certain points to note.

  The shape of the rib cutting brush used in the present invention is not particularly limited as long as it has the above-described brush hair. Examples of the rib cutting brush used in the present invention include, as shown in FIG. 4, a brush-like brush (FIG. 4 (a)), an elongated, brush-like brush (FIG. 4 (b)), and cutting with a large area. Possible brushes (Fig. 4 (c)), cylindrical brushes (Fig. 4 (d)), and the like.

  Next, a method for forming step ribs using the above-described rib cutting brush will be described. In the present invention, a brush for rib cutting is used, and brushing is performed in a direction along the longitudinal rib of the back plate forming member. The brushing method in the present invention is not particularly limited as long as it can form a desired step rib.

  In the present invention, brushing may be performed so that the tip of the bristle of the rib cutting brush contacts the exposed dielectric layer, or brushing may be performed so as not to contact. Usually, since the dielectric layer is sintered, it is not cut by the rib contact brush, but depending on the brush bristle material and brushing conditions, it may be cut by the rib contact brush. is there. Therefore, in the present invention, it is preferable to perform brushing so that the tip of the bristle of the rib cutting brush does not contact the exposed dielectric layer.

  The brushing speed of the rib cutting brush with respect to the back plate forming member is not particularly limited as long as a desired step rib can be formed. For example, the brushing speed is within the range of 100 mm / s to 2000 mm / s, particularly 300 mm / s. It is preferable to be within the range of s to 1000 mm / s.

  In the present invention, it is preferable to perform the brushing so that the height of the horizontal rib is, for example, in the range of 99% to 50% of the height of the vertical rib, particularly in the range of 95% to 70%. Further, the number of brushing is not particularly limited, but for example, it is preferably in the range of 10 to 500 times, and more preferably in the range of 50 to 100 times.

  In the present invention, brushing is performed in a direction along the longitudinal ribs of the back plate forming member. In the present invention, brushing may be performed in one direction along the longitudinal rib of the back plate forming member, or brushing may be performed in both directions along the longitudinal rib of the back plate forming member. However, in the present invention, the brushing method is preferably performed in both directions along the longitudinal ribs of the back plate forming member. This is because uniform cutting can be performed. As a method of brushing in both directions along the longitudinal ribs of the back plate forming member, for example, as shown in FIG. 5A, one brushing is performed in the direction along the longitudinal ribs 4x of the back plate forming member 10. The method of brushing by reciprocating the rib cutting brush 6 left and right, and two rib cutting brushes 6 in the direction along the vertical rib 4x of the back plate forming member 10 as shown in FIG. A method of sequentially brushing each of them by moving them in opposite directions can be given.

  In the present invention, brushing is usually performed by horizontally moving at least one of the rib cutting brush and the back plate forming member in a direction parallel to the direction along the longitudinal rib. As a method of brushing while moving, in a specific example, as shown in FIG. 6A, at least one of the brush-like rib cutting brush 6 and the back plate forming member 10 is arranged along the vertical rib 4x. And a method of brushing by horizontally moving in a direction parallel to the direction, and as shown in FIG. 6B, the cylindrical rib cutting brush 6 is rotated, and the cylindrical rib cutting brush 6 and the back are further rotated. A method of performing brushing by horizontally moving at least one of the face plate forming members 10 in a direction parallel to the direction along the vertical ribs 4x can be exemplified.

  In the present invention, the horizontal rib is cut by physical contact between the rib forming brush and the horizontal rib. Therefore, a part of the rib forming brush may remain on the surface of the step rib after the step rib is formed. Therefore, in this invention, it is preferable to perform the washing | cleaning process which removes the foreign material of the level | step difference rib surface after a level | step difference rib formation process.

3. Other Steps In the present invention, usually, after the step rib forming step, a firing step for firing the step rib is performed. The conditions such as the firing temperature, firing time, firing method, and the like are the same as those for a general PDP back plate, and thus the description thereof is omitted here. Furthermore, in the present invention, a phosphor layer forming step for forming a phosphor layer on the inner peripheral surface of the step rib is usually performed after the firing step. Examples of the method for forming the phosphor layer include a screen printing method and a dispensing method. Moreover, in this invention, you may perform the washing | cleaning process of wash | cleaning the surface after each process mentioned above.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples. In the examples, “parts” represents parts by weight, and “%” represents% by weight.

[Production example]
A back plate forming member having matrix ribs composed of vertical ribs and horizontal ribs was produced by the following method.
(1) Preparation of frit mixture The frit mixture was prepared in the following manner.
Glass frit MB-10A (manufactured by Matsunami Glass Industry, d ₅₀ = 2.6 μm) ... 80 parts Aggregate (α-alumina RA-30 (manufactured by Iwatani Chemical Industry, d ₅₀ = 1.0 μm)) ... 10 parts Pigment (Dipyroxide Black # 9510 (manufactured by Dainichi Seika Kogyo)) ... 10 parts These are put in a fluororesin container and mixed for 15 minutes with a paint conditioner RC-5000 (manufactured by Red Devil) to prepare a frit mixture. did.

(2) Preparation of Matrix Rib Forming Composition A matrix rib forming composition was prepared by adding the following additives to the frit mixture.
・ Frit mixture: 80 parts ・ Etocel STD-100FP (manufactured by Dow Chemical Co., Ltd.) ... 1.44 parts ・ Diethylene glycol monobutyl ether acetate (manufactured by Junsei Kagaku) ... 9 parts After mixing these uniformly, it knead | mixed with the triple roll mill (the product made by Inoue Seisakusho, C-4 * 3 / 4x10), and produced the composition for matrix rib formation.

(3) Production of back plate forming member ELD-1155 (manufactured by Okuno Seiyaku Kogyo Co., Ltd.) is printed as a base layer on a 300 × 450 mm glass substrate by screen printing, dried and fired to form a base layer having a thickness of 10 μm. After the formation, D-590-HV-MOD (manufactured by LS-L Japan Co., Ltd.) as an address electrode is printed on the base layer in an electrode pattern by screen printing and baked. The film thickness is 2 μm and the line width is 60 μm. Electrodes with a pitch of 320 μm were formed. Next, PLS-3232 (manufactured by Nippon Electric Glass) was printed on the address electrodes as a dielectric layer by screen printing, dried and fired to form a dielectric layer having a thickness of 10 μm. Next, the matrix rib forming composition was prepared by diluting with screen oil 759 (Okuno Pharmaceutical Co., Ltd.), adjusting the viscosity to 500 poise at a shear rate of 15 [1 / sec] and 22 ° C., and coating and drying with a blade coater. A solid film having a thickness of 190 μm was produced. After heating the substrate on which the solid film is formed to 80 ° C. and laminating a dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., OSBR film BF-605) on the solid film, a parallel light printer using an ultrahigh pressure mercury lamp as a light source is used. Then, exposure was performed through a matrix pattern mask having a vertical rib line width of 74 μm, a vertical rib pitch of 320 μm, a horizontal rib line width of 224 μm, and a horizontal rib pitch of 960 μm. The exposure conditions were an intensity of 200 μW / cm ² and an irradiation amount of 80 mJ / cm ² when measured at 365 μm.

  Next, using a 0.2% aqueous solution of anhydrous sodium carbonate, spray development is performed at a liquid temperature of 35 ° C. to prepare a mask for sandblasting, drying, and then grinding molten alumina A- # 800 (manufactured by Fujimi Abrasives Industries). Unnecessary parts were removed by sandblasting as a material. Next, the sandblast mask was peeled off at a liquid temperature of 30 ° C. using a 0.7% aqueous solution of sodium hydroxide. This coating film was fired at a peak temperature of 575 ° C., a holding time of 20 minutes, and a total firing time of 2 hours. A matrix rib having a depth of 160 μm, a longitudinal rib pitch of 320 μm, a longitudinal rib upper width of 80 μm, a lateral rib upper width of 230 μm, and a lateral rib pitch of 960 μm. A member for forming a back plate having the above was obtained. An SEM photograph of the obtained matrix rib is shown in FIG.

[Example 1]
The matrix ribs of the back plate forming member obtained in the production example were brushed in the direction along the vertical ribs. The brush used was a brass wire brush with an average diameter of 80 μm and a bristle length of 7 mm. Brushing was performed 100 times in one direction with a brush at a speed of 1000 mm / sec along the longitudinal rib. When the ribs were observed with a microscope, it was observed that the horizontal rib portion of the rib material was shaved and a difference in height between the vertical ribs and the horizontal ribs was made. It was also observed that the shoulders of the vertical ribs were cut and rounded. Furthermore, it was observed that the powder from which the brush wire was scraped adhered to the upper surface of the rib.

[Example 2]
The matrix ribs of the back plate forming member obtained in the production example were brushed in the direction along the vertical ribs. The brush used was a scraper brush with an average diameter of 80 μm made by Mach, and the hair length was adjusted to 7 mm. Brushing was performed 100 times in one direction with a brush at a speed of 1000 mm / sec along the longitudinal rib. When the ribs were observed with a microscope, it was observed that the horizontal rib portion of the rib material was scraped and a difference in height between the vertical ribs and the horizontal ribs was made. It was also observed that the shoulders of the vertical ribs were cut and rounded. On the upper surface of the rib, no powder with the brush wire shaved was found.

[Example 3]
The matrix ribs of the back plate forming member obtained in the production example were brushed in the direction along the vertical ribs. The brush used was a scraper brush with an average diameter of 80 μm manufactured by Mach, and the length of the hair foot was adjusted to 20 mm. Brushing was performed 100 times in one direction with a brush at a speed of 1000 mm / sec along the longitudinal rib. When the ribs were observed with a microscope, it was observed that the horizontal rib portion of the rib material was shaved and a difference in height between the vertical ribs and the horizontal ribs was made. The shoulder of the vertical rib was not cut. Moreover, the powder | flour from which the wire of the brush was shaved was not seen by the upper surface part of the rib.

[Example 4]
The matrix ribs of the back plate forming member obtained in the production example were brushed in the direction along the vertical ribs. The brush used was a scraper brush with an average diameter of 80 μm manufactured by Mach, and the length of the hair foot was adjusted to 20 mm. Brushing was performed 50 times in one direction with a brush at a speed of 1000 mm / sec along the longitudinal rib. Further, brushing was performed at the same speed 50 times in one direction with a brush from the opposite direction along the longitudinal rib. When the ribs were observed with a microscope, it was observed that the horizontal rib portion of the rib material was shaved and a difference in height between the vertical ribs and the horizontal ribs was made. The shoulder of the vertical rib was not cut. Moreover, the powder | flour from which the wire of the brush was shaved was not seen by the upper surface part of the rib.

[Comparative Example 1]
The matrix ribs of the back plate forming member obtained in the production example were brushed in the direction along the vertical ribs. A nylon toothbrush having an average diameter of 150 μm was used as the brush. Brushing was performed 100 times in one direction with a brush at a speed of 1000 mm / sec along the longitudinal rib. The rib was observed with a microscope, but the rib material was not scraped at all.

It is a perspective view which shows an example of the manufacturing method of the backplate for PDP of this invention. It is a schematic sectional drawing which shows the AA 'cross section of FIG.1 (b). It is a perspective view which shows an example of the member preparation process for backplate formation in this invention. It is explanatory drawing which illustrates the brush for rib cutting used for this invention. It is explanatory drawing explaining the formation method of the level | step difference rib in this invention. It is explanatory drawing explaining the formation method of the level | step difference rib in this invention. It is a schematic sectional drawing which illustrates the back plate for conventional PDP. It is a perspective view which illustrates the back plate for conventional PDP. It is a SEM photograph of the matrix rib obtained by the manufacture example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Address electrode layer 3 ... Dielectric layer 4 ... Rib (matrix rib)
4x ... vertical rib 4y ... horizontal rib 4 '... step rib 4 "... rib layer 5 ... brush bristles 6 ... rib cutting brush 7 ... dry film resist layer 7' ... dry film resist pattern 8 ... phosphor layer 10 ... spine Face plate forming member

Claims (2)

A substrate, a patterned address electrode layer formed on the substrate, a dielectric layer formed so as to cover the address electrode layer, and a vertical rib and a horizontal rib formed on the dielectric layer A back plate forming member preparing step of preparing a back plate forming member having a matrix rib;
A step rib in which the horizontal rib forms a step rib lower than the vertical rib by brushing in a direction along the vertical rib of the back plate forming member using a rib cutting brush having metal wire brush bristles Forming process;
A method for producing a back plate for a plasma display panel, comprising:   2. The method of manufacturing a back plate for a plasma display panel according to claim 1, wherein, in the step rib forming step, brushing is performed from both directions along the longitudinal ribs of the back plate forming member.

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