JP2008235842A - ヒートシンクの構造及び製造方法 - Google Patents
ヒートシンクの構造及び製造方法 Download PDFInfo
- Publication number
- JP2008235842A JP2008235842A JP2007107585A JP2007107585A JP2008235842A JP 2008235842 A JP2008235842 A JP 2008235842A JP 2007107585 A JP2007107585 A JP 2007107585A JP 2007107585 A JP2007107585 A JP 2007107585A JP 2008235842 A JP2008235842 A JP 2008235842A
- Authority
- JP
- Japan
- Prior art keywords
- base
- heat sink
- fin
- fins
- caulking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007107585A JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007107585A JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008235842A true JP2008235842A (ja) | 2008-10-02 |
JP2008235842A5 JP2008235842A5 (enrdf_load_stackoverflow) | 2009-01-15 |
Family
ID=39908237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007107585A Pending JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008235842A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011222606A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Electric Corp | ヒートシンク及びヒートシンク一体型パワーモジュール |
CN102803888A (zh) * | 2012-01-05 | 2012-11-28 | 萨帕有限公司 | 散热器及其制造方法 |
-
2007
- 2007-03-19 JP JP2007107585A patent/JP2008235842A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011222606A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Electric Corp | ヒートシンク及びヒートシンク一体型パワーモジュール |
CN102803888A (zh) * | 2012-01-05 | 2012-11-28 | 萨帕有限公司 | 散热器及其制造方法 |
WO2013102301A1 (en) * | 2012-01-05 | 2013-07-11 | Sapa Ab | Heat sink and method for manufacturing |
US9233438B2 (en) | 2012-01-05 | 2016-01-12 | Sapa Ab | Heat sink and method for manufacturing |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Effective date: 20080702 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080905 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080905 |