JP2008218792A - Alignment method of plate-shaped electronic part and alignment device for use therein - Google Patents

Alignment method of plate-shaped electronic part and alignment device for use therein Download PDF

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JP2008218792A
JP2008218792A JP2007055587A JP2007055587A JP2008218792A JP 2008218792 A JP2008218792 A JP 2008218792A JP 2007055587 A JP2007055587 A JP 2007055587A JP 2007055587 A JP2007055587 A JP 2007055587A JP 2008218792 A JP2008218792 A JP 2008218792A
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plate
electronic component
sides
alignment
moved
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Mikio Kobashi
幹生 小橋
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment method and an alignment device for use therein, wherein an electronic part of a thin thickness can also be aligned by being certainly positioned without causing a crack or damage. <P>SOLUTION: The alignment method of a plate-shaped electronic part 9 comprises: a first step of sucking and holding one face of the plate-shaped electronic part 9 for suspension; and a second step of pressing one side of the plate-shaped electronic part 9 from its side face, thereby moving the plate-shaped electronic part 9 for positioning and alignment. At the second step, two opposing sides of the plate-shaped electronic part 9 are successively pressed and moved, so that after a positioning in a first direction, the other two sides perpendicular to the two sides are successively pressed for movement. As a result, a positioning in a second direction perpendicular to the first direction is performed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、特に薄い板状電子部品を整列させる方法とそれに用いる整列装置に関するものである。   The present invention relates to a method for aligning a thin plate-shaped electronic component and an alignment apparatus used therefor.

チップ部品や半導体などの電子部品の一面を、吸着コレットで吸引保持して移載する実装装置や搬送装置では、吸引保持した電子部品の位置ズレを調整するための整列機能を有している。この整列機能は、電子部品の四辺に対して、直交するように設けた二組の一対の規制板を、電子部品の側面に当接させて挟持することで、吸引保持した電子部品を一定量移動させて、所望の位置に調整する方法や、揺動などにより供給パレット上に電子部品を位置決めする方法などが用いられている。   2. Description of the Related Art A mounting device or a transfer device that transfers a surface of an electronic component such as a chip component or a semiconductor by sucking and holding it with a suction collet has an alignment function for adjusting the positional deviation of the sucked and held electronic component. This alignment function is achieved by holding a pair of sucked and held electronic parts by holding two pairs of restricting plates provided perpendicular to the four sides of the electronic parts in contact with the side surfaces of the electronic parts. A method of moving and adjusting to a desired position, a method of positioning an electronic component on a supply pallet by swinging, and the like are used.

図4は、揺動により供給パレットに、電子部品を高精度に位置決めする整列装置の一例である。この整列装置は、四枚の板状体1、2、3、4から構成されており、その最上層の板状体1には、整列させる電子部品の外形より大きな貫通孔5を、その下層である第二層目の板状体2には、電子部品の外形に略等しい整列用貫通孔6が複数設けられている。これら四枚の板状体1、2、3、4は、位置決めピン7により積層して位置決めされており、貫通孔5直下に整列用貫通孔6が配置されるように位置決めされている。これら四枚の板状体1、2、3、4からなる整列装置は、底面に設けた揺動機構8により、一定の振幅で揺動する。   FIG. 4 is an example of an alignment apparatus that positions electronic components with high accuracy on a supply pallet by swinging. This aligning device is composed of four plate-like bodies 1, 2, 3, 4 and the uppermost plate-like body 1 is provided with a through hole 5 larger than the outer shape of the electronic component to be aligned and its lower layer. The second-layer plate-like body 2 is provided with a plurality of alignment through holes 6 substantially equal to the outer shape of the electronic component. These four plate-like bodies 1, 2, 3, and 4 are positioned by being stacked by positioning pins 7, and are positioned so that the alignment through hole 6 is disposed immediately below the through hole 5. The alignment device composed of these four plate-like bodies 1, 2, 3, 4 is swung with a constant amplitude by a swinging mechanism 8 provided on the bottom surface.

貫通孔5内に供給された電子部品は、揺動機構8による揺動で移動し、底部の整列用貫通孔6の外形と合致した瞬間に、その中へ落下することで正確に整列されるものである。   The electronic components supplied into the through hole 5 are moved by swinging by the swinging mechanism 8 and are accurately aligned by dropping into the same at the moment when they match the outer shape of the alignment through hole 6 at the bottom. Is.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2003−289197号公報
As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2003-289197 A

上記従来の整列方法は、電子部品が立方体の場合、整列用貫通孔6に落下させやすいが、板状の、特に薄型の電子部品の場合、整列用貫通孔6の内壁に引っ掛かりやすく、整列させることが困難である課題があった。さらに、電子部品が整列用貫通孔6と合致する位置に移動するのを待つ必要があり、複数の電子部品を同時に整列させることが困難で時間がかかるという課題があった。   In the above conventional alignment method, when the electronic component is a cube, it is easy to drop into the alignment through hole 6. However, in the case of a plate-like, particularly thin electronic component, it is easily caught on the inner wall of the alignment through hole 6 and aligned. There was a problem that was difficult to do. Furthermore, it is necessary to wait for the electronic component to move to a position that matches the alignment through hole 6, and there is a problem that it is difficult and time-consuming to align a plurality of electronic components at the same time.

そこで本発明は、短時間で確実に板状電子部品を整列させることを目的とする。   Accordingly, an object of the present invention is to reliably align plate-like electronic components in a short time.

上記目的を達成するために、本発明は、板状電子部品の整列方法であって、前記板状電子部品の一面を吸引保持して懸架する第一の工程と、前記板状電子部品の一辺を、その側面から押圧することでこの板状電子部品を移動させて位置決め、整列させる第二の工程とからなり、前記第二の工程は、板状電子部品の対向する二辺を順次押圧して移動させることで、第一の方向の位置決めを行った後、前記二辺に直交する他の二辺を順次押圧して移動させることで、前記第一の方向に直交する第二の方向の位置決めを行うものである。   In order to achieve the above object, the present invention provides a plate-like electronic component alignment method, comprising: a first step of sucking and holding one surface of the plate-like electronic component and suspending; and one side of the plate-like electronic component. Is pressed from the side surface to move, position and align the plate-like electronic component, and the second step sequentially presses the two opposite sides of the plate-like electronic component. After positioning in the first direction, the other two sides orthogonal to the two sides are sequentially pressed and moved to move in the second direction orthogonal to the first direction. Positioning is performed.

本発明に係る板状電子部品の整列方法は、板状電子部品の一面を吸引保持して懸架した後、前記板状電子部品の一辺をその側面から押圧して移動させることで整列させる。この押圧を、板状電子部品の二辺を同時に押圧して挟持するのではなく、対向する二辺のうち一方の一辺を押圧して一定量移動させた後、その反対の一辺を押圧して移動させることにより、この押圧方向に対して第一の位置決めを行う。そして、次に、前記二辺に直交する他の二辺を、上記と同様に片方ずつ順次押圧することで、第二の位置決めを行い、板状電子部品を整列させるものである。このように、各辺を基準として順次押圧することで、複数の板状電子部品であっても、短時間で一括して位置決め、整列させることができる作用効果を奏する。さらに、板状電子部品を挟持しないので、特に薄くて軽い、かつ破損しやすい板状電子部品であっても、割れや破損することなく整列させることができる作用効果も同時に奏するものである。   In the method for aligning plate-like electronic components according to the present invention, after one surface of the plate-like electronic component is sucked and held and suspended, one side of the plate-like electronic component is pressed from the side surface and moved. Rather than pressing the two sides of the plate-like electronic component at the same time and holding this pressure, press one side of the two opposing sides and move it by a certain amount, then press the opposite side By moving it, the first positioning is performed in this pressing direction. Then, the other two sides orthogonal to the two sides are sequentially pressed one by one in the same manner as described above, thereby performing the second positioning and aligning the plate-like electronic components. As described above, by sequentially pressing each side as a reference, even a plurality of plate-like electronic components can be positioned and aligned in a short time. Further, since the plate-like electronic component is not sandwiched, even a plate-like electronic component that is particularly thin, light, and easily damaged can be simultaneously produced without being broken or damaged.

以下、本発明の詳細を、図を用いて説明する。   Hereinafter, the details of the present invention will be described with reference to the drawings.

本実施の形態における板状電子部品9の一例としては、半導体や積層型コンデンサ用素子などの、軽くて、特に外形に対して厚みが薄く、破損しやすい板状の電子部品であり、一対の短辺、長辺を有するものである。   An example of the plate-like electronic component 9 in the present embodiment is a plate-like electronic component that is light, particularly thin with respect to the outer shape and easily damaged, such as a semiconductor or a multilayer capacitor element. It has a short side and a long side.

図1は、本発明の一実施の形態における整列装置の要部斜視図である。本実施の形態の板状電子部品9の整列装置は、板状電子部品9を供給するための供給部10と、この供給部10の板状電子部品9を吸引保持して搬送するための、上下および水平方向に移動可能な吸着部11と、この吸着部11に吸引保持された板状電子部品9の傾斜(回転)、水平方向の位置ズレを修正して所定の位置に整列させる整列部12と、この整列部12で整列された板状電子部品9を移載して次の工程へ搬送するための搬出部13とから主に構成されている。   FIG. 1 is a perspective view of a main part of an alignment apparatus according to an embodiment of the present invention. The aligning device for the plate-like electronic component 9 according to the present embodiment includes a supply unit 10 for supplying the plate-like electronic component 9, and a plate-like electronic component 9 of the supply unit 10 for sucking and holding and conveying the plate-like electronic component 9. An adsorbing portion 11 that can move in the vertical and horizontal directions, and an aligning portion that corrects the tilt (rotation) of the plate-like electronic component 9 sucked and held by the adsorbing portion 11 and aligns it in a predetermined position in the horizontal direction. 12 and a carry-out part 13 for transferring the plate-like electronic components 9 aligned in the alignment part 12 and transporting them to the next process.

供給部10上には、板状電子部品9の外形より大きい有底溝14aを有するパレット14が載置されており、この有底溝14a内に板状電子部品9を挿入して予め粗く位置決めをしておく。   A pallet 14 having a bottomed groove 14a larger than the outer shape of the plate-like electronic component 9 is placed on the supply unit 10, and the plate-like electronic component 9 is inserted into the bottomed groove 14a to be roughly positioned in advance. Keep it.

吸着部11は、吸着ヘッド15とこの吸着ヘッド15を水平および垂直方向に移動させる移動機構16とから構成されている。吸着ヘッド15は、その下端に板状電子部品9の一面を真空吸引して吸引保持するための複数の吸着コレット17を備えている。移動機構16は、モータと、ボールネジやリニアガイドなどからなり、吸着ヘッド15を供給部10から整列部12へ、そして搬出部13へと搬送するものである。   The suction unit 11 includes a suction head 15 and a moving mechanism 16 that moves the suction head 15 in the horizontal and vertical directions. The suction head 15 includes a plurality of suction collets 17 for vacuum-suctioning and holding one surface of the plate-like electronic component 9 at the lower end thereof. The moving mechanism 16 includes a motor, a ball screw, a linear guide, and the like, and conveys the suction head 15 from the supply unit 10 to the alignment unit 12 and then to the carry-out unit 13.

整列部12は、天面部に複数の凸部18を一定間隔で配置し、水平方向(x方向)に移動可能な基台19と、この基台19上の凸部18を包囲しながら、交差するように配置された水平方向(y方向)に移動可能な一対の規制板20a、20bと、これら基台19および規制板20a、20bを付勢して水平方向に移動させるためのカム機構21とから構成されている。   The aligning portion 12 has a plurality of convex portions 18 arranged at regular intervals on the top surface portion, and intersects while surrounding the convex portion 18 on the base 19 and the base 19 that can move in the horizontal direction (x direction). A pair of restricting plates 20a, 20b that are arranged to move in the horizontal direction (y direction), and a cam mechanism 21 for urging and moving the base 19 and the restricting plates 20a, 20b in the horizontal direction. It consists of and.

カム機構21は、図2に示すように、一定方向に回転または一定の中心角で往復して回動するカム板22と、このカム板22の外形に倣って移動する複数のカムフォロワ23とから構成されている。これらカムフォロワ23はバネなどの付勢手段24により、常にカム板22の外周に一定の押圧力で押圧されて当接している。また、基台19および規制板20a、20bの外周部にもバネなどの付勢手段25が設けられており、常にカムフォロワ23に当接するように付勢されている。上記カム板22を一定方向に回転または、一定の中心角で回動させることで、その外形に倣ってこれらカムフォロワ23を移動させて、基台19および一対の規制板20a、20bを、当接ブロック23aを介して付勢し、一定の距離を水平移動させる。尚、基台19および一対の規制板20a、20bには、それぞれカムフォロワ23が配置されており、各々が独立して移動するものである。   As shown in FIG. 2, the cam mechanism 21 includes a cam plate 22 that rotates in a certain direction or reciprocates at a certain center angle, and a plurality of cam followers 23 that move following the outer shape of the cam plate 22. It is configured. These cam followers 23 are always in contact with the outer periphery of the cam plate 22 with a constant pressing force by a biasing means 24 such as a spring. Further, biasing means 25 such as a spring is also provided on the outer periphery of the base 19 and the regulation plates 20a and 20b, and is always biased so as to contact the cam follower 23. By rotating the cam plate 22 in a fixed direction or rotating at a fixed center angle, the cam follower 23 is moved in accordance with the outer shape of the cam plate 22 and the base 19 and the pair of regulating plates 20a and 20b are brought into contact with each other. Energizing is performed through the block 23a to horizontally move a certain distance. In addition, the cam follower 23 is each arrange | positioned at the base 19 and a pair of control board 20a, 20b, and each moves independently.

尚、本実施の形態では、カム板22を一枚で構成しているが、カムフォロワ23の数に応じて複数枚で構成してもよい。さらに、各カム板22を独立して駆動する機構を設けても良い。こうすることで、カム板22の外形形状の設計自由度を高めることができ、その結果、基台19および規制板20a、20bの動作の自由度を高めることができる。   In the present embodiment, the cam plate 22 is constituted by one piece, but may be constituted by a plurality of pieces according to the number of cam followers 23. Furthermore, a mechanism for driving each cam plate 22 independently may be provided. By doing so, the degree of freedom in designing the outer shape of the cam plate 22 can be increased, and as a result, the degree of freedom in operation of the base 19 and the restriction plates 20a and 20b can be increased.

搬出部13では、その表面に板状電子部品9の外形と略等しい有底の換装孔26を設けてあり、この換装孔26に整列させた板状電子部品9を挿入して移し替えた後、次の工程へ搬出する。尚、複数の板状電子部品9を積層する場合は、上記の移し替えを複数回繰り返した後に間欠的に搬出するものである。   In the carry-out portion 13, a bottomed replacement hole 26 substantially equal to the outer shape of the plate-like electronic component 9 is provided on the surface, and after the plate-like electronic component 9 aligned with the replacement hole 26 is inserted and transferred, To the next step. In addition, when laminating | stacking the several plate-shaped electronic component 9, after carrying out said transfer repeatedly several times, it carries out intermittently.

パレット14の有底溝14a内に挿入された板状電子部品9は、吸着ヘッド15下に搬送されて、この吸着ヘッド15を下降させることで、下端に設けた吸着コレット17でこれら板状電子部品9の一面を吸引保持して懸架する。次に板状電子部品9を懸架したまま、移動機構16により整列部12上に移動させて、基台19上に設けた複数の凸部18間にこれら板状電子部品9を挿入する。   The plate-like electronic component 9 inserted into the bottomed groove 14a of the pallet 14 is conveyed under the suction head 15, and the suction head 15 is lowered so that the plate-like electronic component 9 is provided by the suction collet 17 provided at the lower end. One side of the component 9 is suspended by suction. Next, with the plate-like electronic component 9 suspended, the plate-like electronic component 9 is inserted between the plurality of convex portions 18 provided on the base 19 by being moved onto the alignment portion 12 by the moving mechanism 16.

このとき、板状電子部品9は吸着コレット17に懸架された状態であり、その高さは、基台19の天面に当接させず、凸部18の高さ以下となるように維持する。この懸架された状態で、カム板22を回動または回転させることにより、カムフォロワ23および当接ブロック23aを介して基台19または一対の規制板20a、20bを押圧して移動させる。そして、この基台19の天面部に設けた凸部18または規制板20a、20bの側面を、板状電子部品9の、一対の短辺、長辺の側面に順次当接させることで、凸部18または規制板20a、20bを基準として傾き(回転)のズレを修正した後に、水平方向の位置を調整して所定の位置に整列させる。   At this time, the plate-like electronic component 9 is suspended from the suction collet 17, and the height thereof is not brought into contact with the top surface of the base 19 and is maintained to be equal to or lower than the height of the convex portion 18. . By rotating or rotating the cam plate 22 in this suspended state, the base 19 or the pair of regulating plates 20a and 20b is pressed and moved via the cam follower 23 and the contact block 23a. And the convex part 18 provided in the top | upper surface part of this base 19 or the side surface of regulation board 20a, 20b is made to contact | abut to the side surface of a pair of short side and long side of the plate-shaped electronic component 9 sequentially. After correcting the deviation of the tilt (rotation) with reference to the part 18 or the regulation plates 20a, 20b, the horizontal position is adjusted and aligned at a predetermined position.

そして、吸着ヘッド15を移動させて、整列させた板状電子部品9を搬出部13の上に搬送し、換装孔26へ移し替えるものである。   Then, the suction head 15 is moved so that the aligned plate-like electronic components 9 are conveyed onto the carry-out portion 13 and transferred to the replacement hole 26.

本実施の形態の特徴は、板状電子部品9を挟持して位置決めするのではなく、懸架した状態で、四辺の側面を順次押圧しながらずらすことで最終位置に位置決めする点である。このようにすることで板状電子部品9を挟持した時のたわみで破損させることがないので、薄くて破損しやすいものであっても、確実に整列させることができる。また、板状電子部品9を懸架した状態で、吸着しながら位置決めするので、位置決め後も板状電子部品9が動くことなく、複数個を同時に位置決めして、正確に換装孔26へ移し替えることができる。   A feature of the present embodiment is that the plate-like electronic component 9 is not sandwiched and positioned, but is positioned at the final position by shifting the side surfaces of the four sides while sequentially pressing in a suspended state. By doing so, the plate-like electronic component 9 is not damaged by the bending when it is sandwiched, so that even if it is thin and easily damaged, it can be surely aligned. Further, since the plate-like electronic components 9 are suspended and positioned while being attracted, the plate-like electronic components 9 do not move after positioning, and a plurality of them are simultaneously positioned and accurately transferred to the replacement hole 26. Can do.

次に、本発明の特徴である整列方法について図を用いて詳細を説明する。   Next, the details of the alignment method, which is a feature of the present invention, will be described with reference to the drawings.

図3は、図1の整列装置における整列部12、特に基台19および一対の規制板20a、20bを上方より見た上面図である。基台19上には一定間隔で設けられた凸部18を有し、一対の規制板20a、20bには、それぞれ矩形孔20c、20dが設けられている。これら一対の規制板20a、20bは、基台19上に水平方向に移動可能に載置されており、矩形孔20c、20dで凸部18の周囲を囲むようにしている。また、矩形孔20c、20dは、基台19の中心線上で一定の幅Aで交差して上下に重畳している。この交差部では、一方の矩形孔20cの側壁に設けた切欠きに、他方の矩形孔20dを嵌め込んだ構造としている。この一定の幅Aで交差している矩形孔20c、20dの側面と、凸部18の側面とが板状電子部品9を押圧して移動させるときの当接面となる。   FIG. 3 is a top view of the alignment unit 12, particularly the base 19 and the pair of regulating plates 20a and 20b in the alignment apparatus of FIG. The base 19 has convex portions 18 provided at regular intervals, and the pair of regulating plates 20a and 20b are provided with rectangular holes 20c and 20d, respectively. The pair of regulation plates 20a and 20b are placed on the base 19 so as to be movable in the horizontal direction, and surround the convex portion 18 with rectangular holes 20c and 20d. Further, the rectangular holes 20 c and 20 d intersect with each other with a certain width A on the center line of the base 19 and overlap each other. At this intersection, the other rectangular hole 20d is fitted in a notch provided in the side wall of one rectangular hole 20c. The side surfaces of the rectangular holes 20c, 20d intersecting with this constant width A and the side surfaces of the convex portions 18 serve as contact surfaces when the plate-like electronic component 9 is pressed and moved.

尚、本実施の形態での板状電子部品9は、常に吸着コレット17に吸引保持されて懸架されているものであるが、図面の煩雑感を避けるために、板状電子部品9のみを記載している。   The plate-like electronic component 9 in this embodiment is always sucked and held by the suction collet 17 and suspended, but only the plate-like electronic component 9 is shown in order to avoid the complicated feeling of the drawing. is doing.

本実施の形態での整列方法は、まず初めに図3(a)に示すごとく、板状電子部品9を基台19上の凸部18間に挿入して一定の高さで懸架した後、カム機構21(図1)により、カムフォロワ23および当接ブロック23aを介して基台19の側面を付勢する。この付勢力により、基台19は一定の距離を水平方向(矢印Bの方向)に移動することで、凸部18の側面が板状電子部品9の一対の長辺の一辺に当接して、基台19と同じ方向に板状電子部品9は移動する。このとき、吸着コレット17に傾斜(回転)して吸引保持された板状電子部品9を、凸部18の側面を基準として位置ズレを修正するのである。   First, as shown in FIG. 3A, the alignment method in the present embodiment inserts the plate-like electronic component 9 between the protrusions 18 on the base 19 and suspends it at a certain height. The cam mechanism 21 (FIG. 1) biases the side surface of the base 19 through the cam follower 23 and the contact block 23a. By this urging force, the base 19 moves a certain distance in the horizontal direction (the direction of the arrow B), so that the side surface of the projection 18 abuts one side of the pair of long sides of the plate-like electronic component 9. The plate-like electronic component 9 moves in the same direction as the base 19. At this time, the positional deviation of the plate-shaped electronic component 9 sucked and held by being inclined (rotated) by the suction collet 17 is corrected with reference to the side surface of the convex portion 18.

次に、図3(b)に示すごとく、カム機構21により、基台19を図3(a)と反対方向(矢印Cの方向)に付勢する。こうすることにより、図3(a)で当接させた一対の長辺の他方の一辺に凸部18を当接させて、反対方向に板状電子部品9を再び水平移動させて、x方向における最終位置へ板状電子部品9を位置決めする。   Next, as shown in FIG. 3B, the base 19 is biased by the cam mechanism 21 in the direction opposite to that shown in FIG. In this way, the projection 18 is brought into contact with the other side of the pair of long sides contacted in FIG. 3A, and the plate-like electronic component 9 is again horizontally moved in the opposite direction, so that the x direction The plate-like electronic component 9 is positioned at the final position in FIG.

尚、板状電子部品9の移動量は、図3(a)においてはx方向の最終位置を越えるように、また、図3(b)では最終位置となるように、基台19の移動量を予め求めておき、カム板22(図1)の外形形状を設計するものである。   It should be noted that the movement amount of the plate-like electronic component 9 exceeds the final position in the x direction in FIG. 3A and reaches the final position in FIG. 3B. Is determined in advance, and the outer shape of the cam plate 22 (FIG. 1) is designed.

次に図3(c)に示すごとく、一対の規制板20a、20bのうち一方の規制板20aをカム機構21により付勢することで、矢印D方向に水平移動させて矩形孔20cの側面を板状電子部品9の、一対の短辺の一辺に当接させる。こうすることで、矩形孔20cの側面を基準として、板状電子部品9の傾斜(回転)などの位置ズレを再度修正する。   Next, as shown in FIG. 3 (c), one of the pair of regulating plates 20a and 20b is biased by the cam mechanism 21 to horizontally move in the direction of arrow D, thereby moving the side surface of the rectangular hole 20c. The plate-like electronic component 9 is brought into contact with one side of the pair of short sides. By doing so, the positional deviation such as the inclination (rotation) of the plate-like electronic component 9 is corrected again with the side surface of the rectangular hole 20c as a reference.

そして、図3(d)に示すごとく、もう一方の規制板20bを付勢して、図3(c)で当接させた、一対の短辺の他方の一辺に矩形孔20dの側面を当接させて、板状電子部品9を反対方向である矢印Eの方向に移動させることで、y方向における最終位置へ位置決めして整列させるものである。   Then, as shown in FIG. 3 (d), the other regulating plate 20b is urged so that the other side of the pair of short sides abutted in FIG. The plate-like electronic component 9 is moved in the direction of arrow E, which is the opposite direction, so as to be positioned and aligned at the final position in the y direction.

尚、これら図3(c)、(d)においても、板状電子部品9の移動量は、図3(c)ではy方向の最終位置を越えるように、また、図3(d)では最終位置となるように、一対の規制板20a、20bの移動量を予め求めておき、カム板22(図1)の外形形状を設計するものである。   3 (c) and 3 (d), the movement amount of the plate-like electronic component 9 exceeds the final position in the y direction in FIG. 3 (c), and the final movement in FIG. 3 (d). The amount of movement of the pair of restricting plates 20a and 20b is obtained in advance so as to be positioned, and the outer shape of the cam plate 22 (FIG. 1) is designed.

ここで重要なのは、凸部18、規制板20a、20bは、板状電子部品9を挟持せず、四辺の側面に順次当接させてずらすことで最終位置まで移動させることである。このように、特に外形に対して厚みが薄く、かつ破損しやすい板状電子部品9であっても、四辺の側面、すなわちもっとも剛性の高い方向から押圧するので、応力などで撓むことがなく、割れや破損することなく高い精度で整列させることができるものである。   What is important here is that the convex portion 18 and the regulation plates 20a and 20b do not sandwich the plate-like electronic component 9, but are moved to the final position by sequentially abutting and shifting on the side surfaces of the four sides. In this way, even in the case of the plate-like electronic component 9 that is particularly thin with respect to the outer shape and easily damaged, since it is pressed from the side surfaces of the four sides, that is, the direction having the highest rigidity, there is no bending due to stress or the like. It can be aligned with high accuracy without cracking or breaking.

また、板状電子部品9を懸架した状態で、吸着しながら位置決めするので、位置決め後も板状電子部品9が動くことなく、正確に換装孔26へ移し替えることができる。   In addition, since the plate-like electronic component 9 is positioned while being sucked in a suspended state, the plate-like electronic component 9 can be accurately transferred to the replacement hole 26 without moving after the positioning.

また、板状電子部品9の四辺の側面を、順次当接させることで、複数の板状電子部品9を、割れや破損させることなく同時に、かつ確実に位置決めすることができる。これは、位置決め前の吸着位置のずれで、個々の板状電子部品9にかかる位置決め時の応力のばらつきが小さくなるからである。   Further, by sequentially abutting the side surfaces of the four sides of the plate-like electronic component 9, the plurality of plate-like electronic components 9 can be positioned simultaneously and reliably without being broken or damaged. This is because the variation in the stress applied to each plate-like electronic component 9 during positioning is reduced due to the displacement of the suction position before positioning.

また、板状電子部品9が、短辺と長辺とを有する場合は、必ず長辺側を先に当接させて移動させることで、さらに高い精度で位置決め、整列させることができる。   Further, when the plate-like electronic component 9 has a short side and a long side, the plate-like electronic component 9 can be positioned and aligned with higher accuracy by always moving the long side in contact first.

上記の実施の形態は、板状電子部品9の一対の短辺、長辺の各辺を別個に当接させて、計四回移動させるものであるが、要求される位置決め精度に応じて、例えば図3(d)の工程を省略しても良い。   In the above embodiment, the pair of short sides and long sides of the plate-like electronic component 9 are separately brought into contact with each other and moved a total of four times, but depending on the required positioning accuracy, For example, the step of FIG. 3D may be omitted.

また、図3(c)において、凸部18を長辺の一辺に沿わせながら、短辺の一辺を規制板20aで当接することで、再び板状電子部品9が傾斜することを防止することができ、さらに高い精度で整列させることができる。   Further, in FIG. 3C, the plate-like electronic component 9 is prevented from being inclined again by abutting one side of the short side with the regulating plate 20a while keeping the convex portion 18 along one side of the long side. And can be aligned with higher accuracy.

本発明に係る板状電子部品の整列方法は、板状電子部品の一面を吸引保持して懸架した後、前記板状電子部品の一辺をその側面から押圧して移動させることで整列させる。この押圧を、板状電子部品の二辺を同時に押圧して挟持するのではなく、対向する二辺のうち一方の一辺を押圧して一定量移動させた後、その反対の一辺を押圧して移動させることにより、この押圧方向に対して第一の位置決めを行う。そして、次に、前記二辺に直交する他の二辺を、上記と同様に片方ずつ順次押圧することで、第二の位置決めを行い、板状電子部品を整列させるものである。このように、各辺を基準として順次押圧することで、複数の板状電子部品であっても、短時間で一括して位置決め、整列させることができる作用効果を奏する。さらに、板状電子部品を挟持しないので、特に薄くて軽い、かつ破損しやすい板状電子部品であっても、割れや破損することなく整列させることができる作用効果も同時に奏するので、特に薄い板状電子部品を整列させる方法とそれに用いる整列装置に有用である。   In the method for aligning plate-like electronic components according to the present invention, after one surface of the plate-like electronic component is sucked and held and suspended, one side of the plate-like electronic component is pressed from the side surface and moved. Rather than pressing the two sides of the plate-like electronic component at the same time and holding this pressure, press one side of the two opposing sides and move it by a certain amount, then press the opposite side By moving it, the first positioning is performed in this pressing direction. Then, the other two sides orthogonal to the two sides are sequentially pressed one by one in the same manner as described above, thereby performing the second positioning and aligning the plate-like electronic components. As described above, by sequentially pressing each side as a reference, even a plurality of plate-like electronic components can be positioned and aligned in a short time. Furthermore, since the plate-like electronic component is not sandwiched, even a plate-like electronic component that is particularly thin, light, and easily damaged can be simultaneously aligned without cracking or breaking. The present invention is useful for a method of aligning shaped electronic components and an alignment apparatus used therefor.

本発明の一実施の形態を説明する整列装置の要部斜視図The principal part perspective view of the alignment device explaining one embodiment of this invention 同装置のカム機構を説明する模式図Schematic diagram explaining the cam mechanism of the device 同装置を用いた整列方法の一例を説明する工程の上面図Top view of a process for explaining an example of an alignment method using the apparatus 従来の整列装置を説明する分解斜視図Exploded perspective view for explaining a conventional alignment device

符号の説明Explanation of symbols

9 板状電子部品
17 吸着コレット
18 凸部
19 基台
20a、20b 規制板
21 カム機構
9 Plate-shaped electronic component 17 Adsorption collet 18 Protruding portion 19 Base 20a, 20b Restriction plate 21 Cam mechanism

Claims (5)

板状電子部品の整列方法であって、前記板状電子部品の一面を吸引保持して懸架する第一の工程と、前記板状電子部品の一辺を、その側面から押圧することでこの板状電子部品を移動させて位置決め、整列させる第二の工程とからなり、前記第二の工程は、板状電子部品の対向する二辺を順次押圧して移動させることで、第一の方向の位置決めを行った後、前記二辺に直交する他の二辺を順次押圧して移動させることで、前記第一の方向に直交する第二の方向の位置決めを行う板状電子部品の整列方法。 A method for aligning plate-like electronic components, the first step of sucking and holding one surface of the plate-like electronic component and suspending the plate-like electronic component, and pressing one side of the plate-like electronic component from its side surface It consists of a second step of moving and positioning and aligning the electronic components. In the second step, positioning in the first direction is performed by sequentially pressing and moving the opposing two sides of the plate-like electronic component. After performing this, the other two sides orthogonal to the two sides are sequentially pressed and moved, thereby positioning the plate-like electronic component in the second direction orthogonal to the first direction. 板状電子部品は、短辺と長辺とを有し、第二の工程で長辺を押圧して移動させた後、短辺を押圧して移動させる請求項1に記載の板状電子部品の整列方法。 The plate-like electronic component according to claim 1, wherein the plate-like electronic component has a short side and a long side, and after the long side is pressed and moved in the second step, the short side is pressed and moved. Alignment method. 天面部に凸部を有して水平方向に移動自在な基台と、この基台上に、前記凸部を囲むように配置された、水平方向に移動自在な一対の規制板と、これら規制板上に配置された、板状電子部品の一面を吸引保持して懸架する移動可能な吸着コレットとを備えた板状電子部品の整列装置であって、前記吸着コレットで板状電子部品を吸引保持して懸架した後、この板状電子部品の、対向する二辺の側面に、前記凸部を順次当接させて一定量移動させることで第一の方向の位置決めを行った後、前記二辺に直交する他の二辺の側面に前記規制板を当接させて一定量移動させることで、前記第一の方向と直交する第二の方向の位置決めを行い、整列させる板状電子部品の整列装置。 A base that has a convex portion on the top surface and is movable in the horizontal direction, a pair of horizontally movable restriction plates disposed on the base so as to surround the convex portion, and these restrictions An apparatus for aligning a plate-like electronic component, which is arranged on a plate and has a movable suction collet that holds and suspends one surface of the plate-like electronic component, and sucks the plate-like electronic component with the suction collet After holding and suspending, the projecting parts are sequentially brought into contact with the side surfaces of the two opposite sides of the plate-like electronic component and moved by a certain amount to perform positioning in the first direction. A plate-like electronic component that is positioned and aligned in a second direction perpendicular to the first direction by moving the fixed plate by contacting the regulating plate to the side surfaces of the other two sides perpendicular to the side. Alignment device. 板状電子部品は、長辺と短辺とを有し、前記長辺の側面に凸部を当接させた後に、前記短辺の側面に規制板を当接させる請求項3に記載の板状電子部品の整列装置。 4. The plate according to claim 3, wherein the plate-like electronic component has a long side and a short side, and after a convex portion is brought into contact with the side surface of the long side, a regulation plate is brought into contact with the side surface of the short side. -Shaped electronic component alignment device. 基台および規制板をカム機構により移動させる請求項3または請求項4に記載の板状電子部品の整列装置。 The plate-like electronic component aligning device according to claim 3 or 4, wherein the base and the regulating plate are moved by a cam mechanism.
JP2007055587A 2007-03-06 2007-03-06 Alignment method of plate-shaped electronic part and alignment device for use therein Pending JP2008218792A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101358502B1 (en) 2011-12-30 2014-02-17 한호 Alignment device for aligning center position of each of a plurality of work-pieces and table device of machining device using the same
KR101538740B1 (en) * 2013-10-14 2015-07-24 주식회사 아테코 Tape and reel apparatus and method for wrapping electronic component device
KR200490346Y1 (en) * 2019-08-06 2019-10-31 미래테크(주) Coupling of the Spacing System for Forms
CN113335587A (en) * 2021-06-25 2021-09-03 浙江联和电子有限公司 Terminal multi-track transport packaging machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101358502B1 (en) 2011-12-30 2014-02-17 한호 Alignment device for aligning center position of each of a plurality of work-pieces and table device of machining device using the same
KR101538740B1 (en) * 2013-10-14 2015-07-24 주식회사 아테코 Tape and reel apparatus and method for wrapping electronic component device
KR200490346Y1 (en) * 2019-08-06 2019-10-31 미래테크(주) Coupling of the Spacing System for Forms
CN113335587A (en) * 2021-06-25 2021-09-03 浙江联和电子有限公司 Terminal multi-track transport packaging machine
CN113335587B (en) * 2021-06-25 2022-06-10 浙江联和电子有限公司 Terminal multi-track transport packaging machine

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