JP2008218545A5 - - Google Patents

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Publication number
JP2008218545A5
JP2008218545A5 JP2007051090A JP2007051090A JP2008218545A5 JP 2008218545 A5 JP2008218545 A5 JP 2008218545A5 JP 2007051090 A JP2007051090 A JP 2007051090A JP 2007051090 A JP2007051090 A JP 2007051090A JP 2008218545 A5 JP2008218545 A5 JP 2008218545A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007051090A
Other languages
Japanese (ja)
Other versions
JP2008218545A (ja
Filing date
Publication date
Priority claimed from JP2007051090A external-priority patent/JP2008218545A/ja
Priority to JP2007051090A priority Critical patent/JP2008218545A/ja
Application filed filed Critical
Priority to MYPI20080189A priority patent/MY148161A/en
Priority to DE602008000923T priority patent/DE602008000923D1/de
Priority to EP08001912A priority patent/EP1965410B1/en
Priority to DE08001912T priority patent/DE08001912T1/de
Priority to TW097105572A priority patent/TW200849370A/zh
Priority to US12/040,074 priority patent/US20090186488A1/en
Priority to KR1020080019366A priority patent/KR100943725B1/ko
Priority to CN200810082137A priority patent/CN100590808C/zh
Publication of JP2008218545A publication Critical patent/JP2008218545A/ja
Publication of JP2008218545A5 publication Critical patent/JP2008218545A5/ja
Pending legal-status Critical Current

Links

JP2007051090A 2007-03-01 2007-03-01 ウェーハの枚葉式エッチング装置 Pending JP2008218545A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2007051090A JP2008218545A (ja) 2007-03-01 2007-03-01 ウェーハの枚葉式エッチング装置
MYPI20080189A MY148161A (en) 2007-03-01 2008-01-31 Single wafer etching apparatus
DE602008000923T DE602008000923D1 (de) 2007-03-01 2008-02-01 Einzelwaferätzgerät
EP08001912A EP1965410B1 (en) 2007-03-01 2008-02-01 Single wafer etching apparatus
DE08001912T DE08001912T1 (de) 2007-03-01 2008-02-01 Einzelwaferätzgerät
TW097105572A TW200849370A (en) 2007-03-01 2008-02-18 Single wafer etching apparatus
KR1020080019366A KR100943725B1 (ko) 2007-03-01 2008-02-29 매엽식 웨이퍼 식각 장치
US12/040,074 US20090186488A1 (en) 2007-03-01 2008-02-29 Single wafer etching apparatus
CN200810082137A CN100590808C (zh) 2007-03-01 2008-03-03 晶片的单片式蚀刻装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007051090A JP2008218545A (ja) 2007-03-01 2007-03-01 ウェーハの枚葉式エッチング装置

Publications (2)

Publication Number Publication Date
JP2008218545A JP2008218545A (ja) 2008-09-18
JP2008218545A5 true JP2008218545A5 (enExample) 2010-04-02

Family

ID=39529369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007051090A Pending JP2008218545A (ja) 2007-03-01 2007-03-01 ウェーハの枚葉式エッチング装置

Country Status (8)

Country Link
US (1) US20090186488A1 (enExample)
EP (1) EP1965410B1 (enExample)
JP (1) JP2008218545A (enExample)
KR (1) KR100943725B1 (enExample)
CN (1) CN100590808C (enExample)
DE (2) DE602008000923D1 (enExample)
MY (1) MY148161A (enExample)
TW (1) TW200849370A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115728A (ja) * 2005-10-18 2007-05-10 Sumco Corp ウェーハの枚葉式エッチング装置及びウェーハの枚葉式エッチング方法
JP2008282938A (ja) * 2007-05-10 2008-11-20 Sumco Corp ウェーハの枚葉式エッチング装置
KR101308352B1 (ko) 2011-12-16 2013-09-17 주식회사 엘지실트론 매엽식 웨이퍼 에칭장치
KR101386677B1 (ko) * 2012-10-30 2014-04-29 삼성전기주식회사 미세회로 제조방법
JP6064875B2 (ja) 2013-11-25 2017-01-25 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
KR101673061B1 (ko) 2013-12-03 2016-11-04 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
WO2015184628A1 (en) * 2014-06-06 2015-12-10 Acm Research (Shanghai) Inc. Apparatus and method for removing film on edge of backside of wafer
CN106971958A (zh) * 2016-01-14 2017-07-21 弘塑科技股份有限公司 单晶圆湿式处理装置
JP6649837B2 (ja) * 2016-04-13 2020-02-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6304364B2 (ja) * 2016-12-26 2018-04-04 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP6851831B2 (ja) * 2017-01-12 2021-03-31 株式会社ディスコ 加工装置
CN108109902A (zh) * 2017-09-13 2018-06-01 武汉新芯集成电路制造有限公司 一种解决晶圆薄膜层剥落方法及清洗装置
CN108054111A (zh) * 2017-12-19 2018-05-18 大连鑫鑫创世科技发展有限公司 一种集成电路硅片的分割方法
JP6985981B2 (ja) * 2018-05-29 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7303689B2 (ja) * 2019-07-31 2023-07-05 株式会社ディスコ エッチング装置およびウェーハ支持具
TWI888680B (zh) * 2020-12-18 2025-07-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
KR102656188B1 (ko) * 2022-02-21 2024-04-11 (주)디바이스이엔지 기판 식각 처리장치 및 기판 가장자리의 식각 제어 방법
CN114695210B (zh) * 2022-06-02 2022-09-09 西安奕斯伟材料科技有限公司 一种用于硅片边缘刻蚀的装置和方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309981B1 (en) * 1999-10-01 2001-10-30 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6333275B1 (en) * 1999-10-01 2001-12-25 Novellus Systems, Inc. Etchant mixing system for edge bevel removal of copper from silicon wafers
US6537416B1 (en) * 1999-10-01 2003-03-25 Novellus Systems, Inc. Wafer chuck for use in edge bevel removal of copper from silicon wafers
US6586342B1 (en) * 2000-04-25 2003-07-01 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
JP2001319919A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 半導体装置の製造方法及び処理装置
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP2002064079A (ja) * 2000-08-22 2002-02-28 Disco Abrasive Syst Ltd エッチング装置
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
JP2004111668A (ja) * 2002-09-19 2004-04-08 Citizen Watch Co Ltd 基板処理装置及び基板処理方法
JP2003203900A (ja) * 2002-10-17 2003-07-18 Nec Electronics Corp ウェハ処理装置およびウェハ処理方法
JP4342260B2 (ja) * 2003-09-30 2009-10-14 株式会社高田工業所 ウエハー処理装置
US20060194441A1 (en) * 2005-02-25 2006-08-31 Sakae Koyata Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same method
JP4464293B2 (ja) * 2005-02-28 2010-05-19 株式会社高田工業所 半導体基板処理装置及び半導体基板処理方法
JP4438709B2 (ja) * 2005-07-19 2010-03-24 株式会社Ｓｕｍｃｏ ウェーハの枚葉式エッチング方法
JP2007115728A (ja) * 2005-10-18 2007-05-10 Sumco Corp ウェーハの枚葉式エッチング装置及びウェーハの枚葉式エッチング方法
JP4835175B2 (ja) * 2006-01-31 2011-12-14 株式会社Ｓｕｍｃｏ ウェーハの枚葉式エッチング方法
KR20080082010A (ko) * 2006-01-31 2008-09-10 가부시키가이샤 섬코 웨이퍼의 매엽식 식각 방법
JP2008251806A (ja) * 2007-03-30 2008-10-16 Sumco Corp ウェーハの枚葉式エッチング方法及びそのエッチング装置
JP2010040601A (ja) * 2008-07-31 2010-02-18 Sumco Corp 半導体ウェーハのエッチング装置及びエッチング方法

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