JP2008218496A - Sealing resin film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing resin film by which an electronic device (e.g. semiconductor element or the like) can be simultaneously mounted and sealed at low pressure, and to provide a method of manufacturing a module using the sealing resin film (e.g. semiconductor device or the like) as well as a module precursor. <P>SOLUTION: The sealing resin film is used to seal an electronic part that is mounted to a substrate wherein a wiring pattern is formed. It is made of resin composition with minimum viscosity of 1-10<SP>7</SP>Pa s at 60-230°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sealing resin film for sealing an electronic component mounted on a substrate on which a wiring pattern is formed.

  In a semiconductor device in which a plurality of electronic components such as semiconductor elements are mounted on a substrate on which a wiring pattern is provided, a form in which a metal cap is generally provided has been the mainstream. The number of products packaged by resin sealing is increasing (for example, see Patent Documents 1 and 2).

  Specifically, Patent Document 1 states that “a batch-encapsulated semiconductor substrate is placed on one side of a mold and a semi-solid epoxy resin composition is placed on the other side and heat-cured by a compression molding method. The resin sealing method of a semiconductor device characterized by the above. "

  Patent Document 2 proposed by the same applicant as Patent Document 1 describes “a sheet-like adhesive body in which a plurality of types of epoxy resin compositions having different quality characteristics are aligned or laminated on a film”. Has been.

JP 2004-56141 A JP 2006-117919 A

However, even in the resin sealing method and the sheet-like adhesive body described in Patent Documents 1 and 2, it is necessary to mount a semiconductor element on a substrate using solder or the like before sealing. It has become clear that there has been a problem of low production efficiency because the mounting and sealing of elements have not been performed at once.
In addition, when the resin sealing method and the sheet-like adhesive body described in Patent Documents 1 and 2 are used, the pressure required for compression formation increases, and it may not be possible to sufficiently handle thin electronic components and high-frequency electronic components. It became clear.

  Accordingly, the present invention provides a sealing resin film that enables mounting and sealing of electronic components (for example, semiconductor elements and the like) collectively and at a low pressure, and a module using the sealing resin film (for example, It is an object to provide a method for manufacturing a semiconductor device and the like and a module precursor.

As a result of earnestly examining the above problems, the inventor of the present invention uses a resin composition having a minimum viscosity of 1 to 10 ⁷ Pa · s at 60 to 230 ° C. as a film for sealing. The inventors have found that sealing can be performed all at a low pressure, and the present invention has been completed.
That is, the present invention provides the following (1) to (19).

(1) A sealing resin film for sealing an electronic component mounted on a substrate on which a wiring pattern is formed,
A sealing resin film comprising a resin composition having a minimum viscosity of 1 to 10 ⁷ Pa · s at 60 to 230 ° C.

(2) The resin composition is
(A) a vinyl compound represented by the following formula (1), and
(B) The sealing resin film according to (1) above, comprising a thermosetting resin composition containing rubber and / or thermoplastic elastomer.

In formula (1), R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom, a halogen atom, an alkyl group, a halogenated alkyl group or a phenyl group, A plurality of R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ may be the same or different.
-(O-X-O)-is a structure represented by the following formula (2),-(YO)-is a repeating unit represented by the following formula (3), and Z is oxygen. An organic group having 1 or more carbon atoms, which may contain an atom, nitrogen atom, sulfur atom, or halogen atom.
Moreover, a and b represent the integer of 0-300 in which at least one is not 0, and c and d represent the integer of 0 or 1 each independently.

In the formula (2), R ⁸ , R ⁹ , R ¹⁰ , R ¹⁴ and R ¹⁵ each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R ¹¹ , R ¹² and R ¹³ are Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.
In the formula (3), R ¹⁶ and R ¹⁷ each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R ¹⁸ and R ¹⁹ each independently represent a hydrogen atom, a halogen atom, An alkyl group having 6 or less carbon atoms or a phenyl group is represented.

(3)-(O-XO)-is a structure represented by the following formula (4),
The sealing resin film according to (2), wherein-(YO)-is a repeating unit represented by the following formula (5) or (6).

(4) The sealing resin film according to (3), wherein-(YO)-is a repeating unit represented by the formula (6).
(5) The sealing resin film according to any one of (2) to (4), wherein the component (B) is a styrene thermoplastic elastomer.
(6) Any of (2) to (5) above, wherein a mass ratio ((A) :( B)) of the component (A) and the component (B) is 40:60 to 60:40. The resin film for sealing as described in 2.

(7) The resin composition is
(C) a novolak-type epoxy resin having a phenol skeleton and a biphenyl skeleton, and / or a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group, and
(D) The sealing resin film according to the above (1), comprising an epoxy resin composition containing a modified phenol novolac obtained by esterifying at least a part of a phenolic hydroxyl group with a fatty acid.

  (8) The sealing resin film according to (7), wherein the content of the component (D) is 30 to 200 parts by mass with respect to 100 parts by mass of the component (C).

  (9) The resin film for sealing according to the above (7) or (8), wherein the novolac type epoxy resin as the component (C) is an epoxy resin represented by the following formula (7).

（式（７）中、ｎは１〜１０の数（平均値）を表す。）

(In formula (7), n represents a number (average value) of 1 to 10)

  (10) For sealing according to any one of (7) to (9), wherein the bifunctional linear epoxy resin of component (C) is an epoxy resin represented by the following formula (8): Resin film.

In formula (8), Q represents a single bond, a hydrocarbon group having 1 to 7 carbon atoms, —O—, —S—, —SO ₂ —, —CO— or a group represented by the following formula, Q may be the same or different. R ²¹ represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, and a plurality of R ²¹ may be the same or different. e represents an integer of 0 to 4, and a plurality of e may be the same or different. n represents the number (average value) of 25-500.

In the formula, R ²² represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, and a plurality of R ²² may be the same or different. R ²³ represents a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, or a halogen atom, and f represents an integer of 0 to 5.

  (11) The sealing resin film according to any one of (7) to (10), wherein the component (D) is a modified phenol novolak represented by the following formula (9).

In formula (9), R ²⁴ represents an alkyl group having 1 to 5 carbon atoms, and a plurality of R ²⁴ may be the same or different. R ²⁵ represents an alkyl group having 1 to 5 carbon atoms, a phenyl group which may have a substituent, an aralkyl group which may have a substituent, an alkoxy group or a halogen atom, and a plurality of R ^{25 s} , May be the same or different. R ²⁶ is an alkyl group having 1 to 5 carbon atoms, which may have a substituent phenyl group which may have a substituent aralkyl group, an alkoxy group or a halogen atom, a plurality of R ²⁶ is , May be the same or different. g represents an integer of 0 to 3, and a plurality of g may be the same or different. h represents an integer of 0 to 3, and a plurality of h may be the same or different. n: m is 1: 1 to 1.2: 1.

(12) The sealing resin film according to (11), wherein the component (D) is such that R ²⁴ in the formula (9) is a methyl group.
(13) The sealing resin film according to any one of (7) to (12), wherein the epoxy resin composition further contains (E) an isocyanate compound.
(14) The sealing resin film according to any one of (7) to (13), wherein the epoxy resin composition further contains (F) an inorganic filler.
(15) The sealing resin film according to (14), wherein the inorganic filler of the component (F) has an average particle size of 5 μm or less.

(16) A module manufacturing method for obtaining a module by sealing an electronic component, comprising at least:
A component fixing step of installing an electronic component on a substrate on which a wiring pattern is formed and fixing the electronic component on the substrate;
A film installation step of installing the sealing resin film according to any one of (1) to (15) on the substrate and the electronic component after the component fixing step;
After the film installation step, a low-pressure heating press step of setting the base material on the sealing resin film and pressing the base material and the substrate at a pressure of 1 MPa or less while heating at 60 to 300 ° C. The manufacturing method of the module which comprises these.

  (17) A module obtained by the method for producing a module according to (16).

(18) A method for producing a module precursor that encapsulates an electronic component to obtain a module precursor, at least,
A first film installation step of installing the sealing resin film according to any one of (1) to (15) on the first substrate;
After the first film installation step, an electronic component is installed on the sealing resin film, and the electronic component is fixed on the first base material by the sealing resin film;
A second film installation step of installing the sealing resin film according to any one of (1) to (15) on the sealing resin film and the electronic component after the component fixing step;
A second base material is placed on the sealing resin film placed by the second film placement step, and heated at 60 to 230 ° C., and at a pressure of 1 MPa or less, the second base material and the first film A method for producing a module precursor, comprising: a low-pressure heating press step for pressing a substrate.

  (19) A module precursor obtained by the method for producing a module precursor described in (18) above.

As described below, according to the present invention, a resin film for sealing that enables mounting of electronic components (for example, semiconductor elements) on a substrate and sealing of the electronic components collectively and at a low pressure, and the sealing A module (for example, a semiconductor device) using a resin film and a method for producing a module precursor can be provided.
In addition, if the sealing resin film of the present invention is used, mounting and sealing of electronic components on a substrate can be performed collectively and at a low pressure, so that module production efficiency is dramatically improved, and thin electronic components and high-frequency components are improved. Can also be used to seal electronic components.
Furthermore, the method for producing a module precursor according to the present invention is very useful because a multifunctional module precursor including a large number of electronic components having different functions, types, thicknesses and shapes can be easily produced.
Furthermore, the module precursor of the present invention is very useful because it can be applied to mounting on a substrate for various uses, and at the same time, connection and sealing can be formed at the time of mounting on the substrate.

The sealing resin film according to the first aspect of the present invention (hereinafter also referred to as “the sealing resin film of the present invention”) seals an electronic component mounted on a substrate on which a wiring pattern is formed. It is the resin film for sealing for, Comprising: It is a film which consists of a resin composition in which the minimum viscosity in 60-230 degreeC becomes 1-10 < ⁷ > Pa * s.
In the present invention, the “minimum viscosity at 60 to 230 ° C.” refers to a temperature increase rate of 5 ° C./min and a frequency of 1 Hz using a viscometer (VAR-100, manufactured by REOLOGICA) at 60 to 230 ° C. It means the minimum value of viscosity that can be measured in the range.

By using the resin composition having such viscosity properties for the sealing resin film, it is possible to perform mounting and sealing of electronic components all at a low pressure. This is between the electronic components of the sealing resin film of the present invention obtained by sealing the electronic components at 60 to 300 ° C. as shown in the method for producing a module according to the second aspect of the present invention described later. Positioning on the substrate was such that the embedding into the substrate was good and the resin flow (protruding laterally during crimping) did not occur, and the bump (projection electrode) of the electronic component and the substrate electrode were in contact with each other This is probably because the electronic components are not displaced and the thickness design accuracy is also improved.
In addition, by using a resin composition having such viscosity physical properties for a sealing resin film, even a thin electronic component or a high-frequency electronic component is not damaged and can be mounted and sealed at once. .

In addition, from the viewpoint of easier mounting and sealing of electronic components at a low pressure, it is preferable to use a resin composition having a minimum viscosity of 1 to 10 ⁵ Pa · s at 60 to 230 ° C. It is more preferable to use a resin composition that provides 10 ⁴ Pa · s.

In the present invention, the resin composition comprises a thermosetting resin composition containing (A) a vinyl compound represented by the above formula (1) and (B) rubber and / or a thermoplastic elastomer. Is preferred.
Next, each component will be described in detail.

<(A) component: vinyl compound>
The vinyl compound as the component (A) is represented by the following formula (1) and is the same as that described in JP-A-2004-59644.

In the above formula (1), R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom, a halogen atom, an alkyl group, a halogenated alkyl group or a phenyl group. A plurality of R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ may be the same or different.
-(O-X-O)-is a structure represented by the following formula (2),-(YO)-is a repeating unit represented by the following formula (3), and Z is oxygen. An organic group having 1 or more carbon atoms, which may contain an atom, nitrogen atom, sulfur atom, or halogen atom.
Moreover, a and b represent the integer of 0-300 in which at least one is not 0, and c and d represent the integer of 0 or 1 each independently.

Here, in the formula ^{(2), R 8, R} 9, R 10, R 14 and R ¹⁵ each independently represent a halogen atom, an alkyl or a phenyl group having 6 or less carbon atoms, R ^11, R ¹² And R ¹³ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.
In the above formula (3), R ¹⁶ and R ¹⁷ each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R ¹⁸ and R ¹⁹ each independently represent a hydrogen atom or a halogen atom. Represents an alkyl group having 6 or less carbon atoms or a phenyl group.

  In the above formula (1), Z is preferably an alkylene group having 3 or less carbon atoms. Specifically, a methylene group is preferably exemplified.

  Furthermore, in said formula (1), a and b represent the integer of 0-300 whose at least any one is not 0, but it is preferable to represent the integer of 0-30.

In the present invention, in the above formula (2), R ⁸ , R ⁹ , R ¹⁰ , R ¹⁴ and R ¹⁵ are preferably alkyl groups having 3 or less carbon atoms, and R ¹¹ , R ¹² and R ¹³ are , A hydrogen atom or an alkyl group having 3 or less carbon atoms. Specifically, a structure represented by the following formula (4) is preferably exemplified.

In the above formula (3), R ¹⁶ and R ¹⁷ are preferably an alkyl group having 3 or less carbon atoms, and R ¹⁸ and R ¹⁹ are a hydrogen atom or an alkyl group having 3 or less carbon atoms. preferable. Specifically, a structure represented by the following formula (5) or (6) is preferably exemplified.

In the present invention, the vinyl compound as the component (A) has a number average molecular weight of 1000 to 3000, but the resulting thermosetting resin composition has a lower melt viscosity and the reactivity between the components (A). Is preferable because As the reaction proceeds between the components (A), the curing rate of the resulting thermosetting resin composition is improved, and the physical properties such as heat resistance and hardness of the cured product of the sealing resin film of the present invention are also improved. Therefore, it is preferable.
Here, the number average molecular weight is a value determined by a gel permeation chromatography method (GPC) using a standard polystyrene calibration curve.

  Moreover, in this invention, such a vinyl compound may be used individually by 1 type, and may use 2 or more types together.

<(B) component: rubber and / or thermoplastic elastomer>
Specific examples of the rubber (B) include styrene-butadiene rubber, butyl rubber, butadiene rubber, acrylic rubber, and the like.
Among these, the use of styrene-butadiene rubber improves the compatibility with the component (A), and the cured product of the sealing resin film of the present invention comprising the resulting thermosetting resin composition. It is preferable because the elastic modulus and dielectric constant are low and the durability of bonding to a substrate or electronic component is good.

  On the other hand, as the thermoplastic elastomer of the component (B), for example, styrene thermoplastic elastomer, specifically, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, olefin-based heat Examples thereof include a plastic elastomer and a polyester-based thermoplastic elastomer.

  In the present invention, the component (B) is preferably a thermoplastic elastomer from the viewpoint of the elastic modulus of the cured product of the encapsulating resin film of the present invention comprising the resulting thermosetting resin composition. In particular, styrenic thermoplastic elastomers are preferred from the viewpoints of fluidity, low dielectric constant, and low elastic modulus of the encapsulating resin film of the present invention comprising the resulting thermosetting resin composition with respect to electronic components.

  In the present invention, such rubber and / or thermoplastic elastomer may be used singly or in combination of two or more.

  In the present invention, the mass ratio ((A) :( B)) of the components (A) and (B) described above is preferably 10:90 to 90:10, and the resulting thermosetting resin composition From the viewpoint of having a low dielectric constant / low dielectric loss tangent and a low elastic modulus in a well-balanced manner, the cured product after sealing of the sealing resin film of the present invention composed of the product is more preferably 40:60 to 60:40. Preferably, it is more preferable that it is 45: 55-55: 45.

In the present invention, the thermosetting resin composition containing the component (A) and the component (B) described above is an inorganic filler, a tackifier, an antifoaming agent, a fluid as long as the effects of the present invention are not impaired. You may contain additives, such as a regulator, a film-forming auxiliary agent, and a dispersion auxiliary agent.
Here, specifically as an inorganic filler, what is illustrated as a (F) component mentioned later, for example is mentioned.

  In the present invention, the thermosetting resin composition may contain a curing catalyst, but can be cured only by heating.

In the present invention, the thermosetting resin composition can be produced by a known method.
For example, it can be produced by a method in which each of the component (A), the component (B), and various additives that may be optionally contained is mixed with a heating vacuum mixing kneader or the like in the presence or absence of a solvent. it can.
Specifically, it can be produced by dissolving in a predetermined solvent concentration, putting them into a reaction kettle heated to 40 to 100 ° C., and carrying out normal pressure mixing for 30 minutes to 6 hours. Thereafter, the mixture can be further stirred for 5 to 60 minutes under vacuum (maximum 1 Torr).

  As a method for producing a sealing resin film of the present invention comprising such a thermosetting resin composition, specifically, for example, a thermosetting resin composition is dissolved or dispersed in an organic solvent to obtain a varnish. Later, the method of apply | coating to a desired support body and making it dry is mentioned.

Specific examples of the organic solvent include aromatic solvents such as toluene and xylene; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; high-boiling solvents such as dioctyl phthalate and dibutyl phthalate; These may be used alone or in combination of two or more.
Here, although the usage-amount of an organic solvent is not specifically limited, It is preferable to use it so that solid content may be 20-90 mass%, and it is more preferable to use it so that it may become 20-50 mass%.
From the viewpoint of workability, the varnish preferably has a viscosity range of 100 to 600 mPa · s.
Here, the viscosity is a value measured using an E-type viscometer at a rotation speed of 60 rpm and 25 ° C.

The said support body is not specifically limited, As a specific example, organic films, such as metal foil, such as copper and aluminum, a polyester resin, and a polyethylene resin, etc. are mentioned.
Further, the support may be subjected to a release treatment with a silicone compound or the like.

  Further, the method for applying the varnish is not particularly limited, but from the viewpoint of thinning and film thickness control, microgravure method, slot die method, doctor co Although selected, the micro gravure method is particularly preferable because the thickness of the film can be designed to be thin. For example, a film having a thickness of 90 μm or less can be obtained by the microgravure method.

  Moreover, the drying conditions after apply | coating a varnish can be suitably set according to the kind and quantity of the organic solvent used for a varnish, the thickness of application | coating, and generally 60-120 degreeC under atmospheric pressure. Therefore, it is preferable to carry out in about 1 to 30 minutes, and it is preferable from the viewpoint of safety to use a dryer having an explosion-proof function. Moreover, drying can be performed in air | atmosphere or nitrogen atmosphere.

Since the sealing resin film of the present invention comprising such a thermosetting resin composition has a minimum viscosity of 1 to 10 ⁷ Pa · s at 60 to 230 ° C., mounting and sealing of electronic components are performed at once. In addition, it can be performed at a low pressure.

Moreover, it is preferable that the thickness of the resin film for sealing of this invention which consists of such a thermosetting resin composition is 30-500 micrometers, and it is more preferable that it is 30-125 micrometers.
Especially when thinning is required, the thickness is preferably 30 to 100 μm. Even in such a range, the encapsulating resin film of the present invention can maintain sufficient physical and electrical characteristics.

  Furthermore, the encapsulating resin film of the present invention comprising such a thermosetting resin composition has a cured product cured after encapsulating, having a low dielectric constant and a low dielectric loss tangent in a high frequency region, For example, under conditions of a temperature of 25 ° C. and a frequency of 5 GHz, the dielectric constant can be 4 or less and the dielectric loss tangent can be 0.025 or less. In addition, for example, a level of dielectric constant 2.6 or lower and dielectric loss tangent 0.005 or lower can be achieved through control of the blending ratio of component (A) and component (B).

  Furthermore, the encapsulating resin film of the present invention composed of such a thermosetting resin composition is a cured product cured after sealing, has a low elastic modulus, and can contribute to stress relaxation, Easy to handle for processing. For example, the elastic modulus by dynamic viscoelasticity measurement can be 3.5 GPa or less at a temperature of 25 ° C. Further, for example, a level of 1.5 GPa or less can be achieved through control of the blending ratio of the component (A) and the component (B).

  Furthermore, since the sealing resin film of the present invention made of such a thermosetting resin composition has a substantially uniform thickness before and after curing, the thickness uniformity after curing is excellent.

  In the present invention, the curing conditions after sealing of the sealing resin film of the present invention comprising such a thermosetting resin composition can be appropriately set, for example, at 150 to 250 ° C., It can be about 10 to 120 minutes.

In the present invention, the resin composition is (C) a novolak type epoxy resin having a phenol skeleton and a biphenyl skeleton, and / or a bifunctional type having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group. It is preferable to comprise an epoxy resin composition containing a linear epoxy resin and (D) a modified phenol novolak obtained by esterifying at least part of a phenolic hydroxyl group with a fatty acid.
Next, each component will be described in detail.

<(C) component: novolac type epoxy resin and / or bifunctional linear epoxy resin>
The novolak type epoxy resin as the component (C) has a rigid molecular skeleton and side chain, and acts in a direction that reduces the mobility of the polymer after curing.

  As the novolak type epoxy resin of the component (C), for example, an epoxy resin represented by the following formula (7) is preferably exemplified.

  In said formula (7), n represents the number (average value) of 1-10, it is preferable that it is 1-5, and it is more preferable that it is 1.

  Among these, an epoxy resin represented by the following formula (7 ′) is more preferable.

  In the above formula (7 ′), n is the same as in the above formula (7).

  The bifunctional linear epoxy resin of the component (C) has a rigid molecular skeleton and side chain, and acts in a direction that reduces the mobility of the polymer after curing.

In the present invention, the bifunctional linear epoxy resin as the component (C) has a weight average molecular weight of 10,000 to 200,000, preferably 15,000 to 70,000.
The number average molecular weight of the bifunctional linear epoxy resin as the component (C) is preferably 3,700 to 74,000, and more preferably 5,500 to 26,000.
Furthermore, the epoxy equivalent of the bifunctional linear epoxy resin as the component (C) is preferably 5000 g / equivalent or more.
Further, the bifunctional linear epoxy resin of the component (C) is particularly preferably one having a weight average molecular weight / number average molecular weight in the range of 2 to 3.
Here, the weight average molecular weight and the number average molecular weight are the values obtained using a standard polystyrene calibration curve by gel permeation chromatography (GPC), as in the measurement of the vinyl compound which is the component (A). To do.

  Specific examples of the bifunctional linear epoxy resin of the component (C) include, for example, an epoxy resin represented by the following formula (8).

In the above formula (8), Q represents a single bond, a hydrocarbon group having 1 to 7 carbon atoms, —O—, —S—, —SO ₂ —, —CO— or a group represented by the following formula: A plurality of Q may be the same or different.

In the above formula, R ²² represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, and a plurality of R ²² may be the same or different.
R ²³ represents a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, or a halogen atom.
f represents an integer of 0 to 5.

In the formula (8), R ²¹ represents a hydrocarbon group or a halogen atom having 1 to 10 carbon atoms, more R ²¹ may be different even in the same.
e represents an integer of 0 to 4, and a plurality of e may be the same or different.
n represents the number (average value) of 25-500.

  As the bifunctional linear epoxy resin of the component (C), an epoxy resin represented by the following formula (8 ′) is more preferable.

  In the above formula (8 ′), Q and n are the same as Q and n in the above formula (8), respectively.

  In this invention, such an epoxy resin may be used individually by 1 type, and may use 2 or more types together.

<(D) component: Modified phenol novolak>
The modified phenol novolak as the component (D) is obtained by fatty acid esterification of at least a part of the phenolic hydroxy group.
Preferred examples of the modified phenol novolak as the component (D) include a modified phenol novolak represented by the following formula (9).

In the above formula (9), R ²⁴ represents an alkyl group having 1 to 5 carbon atoms, preferably a methyl group, and the plurality of R ²⁴ may be the same or different.
R ²⁵ represents an alkyl group having 1 to 5 carbon atoms, a phenyl group which may have a substituent, an aralkyl group which may have a substituent, an alkoxy group or a halogen atom, and a plurality of R ²⁵ may be the same or different.
R ²⁶ represents an alkyl group having 1 to 5 carbon atoms, a phenyl group which may have a substituent, an aralkyl group which may have a substituent, an alkoxy group or a halogen atom, and a plurality of R ²⁶ may be the same or different.
g represents an integer of 0 to 3, and a plurality of g may be the same or different.
h represents an integer of 0 to 3, and a plurality of h may be the same or different.
n: m is 1: 1 to 1.2: 1, preferably about 1: 1.
The total of n and m can be 2 to 4, for example.

  In the above formula (9), n and m are average values of repeating units, and the order of repeating units is not limited, and may be block or random.

  Preferred examples of the modified phenol novolak as the component (D) include a modified phenol novolak represented by the following formula (9 ′).

In the above formula (9 '), R ^24, n and m are each the same as R ^24, n and m in the formula (9).
Particularly preferably, in the above formula (9 ′), R ²⁴ is a methyl group acetylated phenol novolak.

  In the present invention, such modified phenol novolacs may be used alone or in combination of two or more.

The content of the component (D) is preferably 30 to 200 parts by mass, and more preferably 50 to 180 parts by mass with respect to 100 parts by mass of the component (C). When the content of the component (D) is within this range, the sealing resin film made of the resulting epoxy resin composition has good curability after sealing, and good dielectric properties can be expected after curing.
In addition, when the said (C) component is a novolak-type epoxy resin which has the phenol skeleton and biphenyl skeleton mentioned above, it is especially preferable to mix | blend the said (D) component 30-70 mass parts. Moreover, when the said (C) component is the bifunctional linear epoxy resin mentioned above, it is especially preferable to mix | blend the said (D) component 120-180 mass parts.

<(E) component: isocyanate compound>
In the present invention, it is one of preferred embodiments that the epoxy resin composition containing the component (C) and the component (D) described above further contains (E) an isocyanate compound.
When there is a hydroxy group in the epoxy resin, the hydroxy group produced when the hydroxy group or the epoxy resin is ring-opened reacts with the isocyanate group in the isocyanate compound to form a urethane bond and cure. This is preferable because the crosslink density of the polymer after (sealing) can be increased and the mobility of the molecule can be further lowered. Further, since the number of highly polar hydroxy groups decreases, it is considered that the dielectric constant and dielectric loss tangent can be further reduced. Furthermore, in general, epoxy resin has a large intermolecular force, it is difficult to form a uniform film when it is made into a film, and even if it is made into a film, the film strength is weak, and it tends to crack easily during film formation. Since it is possible to eliminate these drawbacks, the processability is preferred.

Examples of the isocyanate compound of the component (E) include isocyanate compounds having two or more isocyanate groups. Specifically, hexamethylene diisocyanate (HDI), diphenylmethane diisocyanate, tolylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, tetramethylxylylene diisocyanate, xylylene diisocyanate, naphthalene Diisocyanate, trimethylhexamethylene diisocyanate, tolidine diisocyanate, p-phenylene diisocyanate, cyclohexylene diisocyanate, dimer acid diisocyanate, hydrogenated xylylene diisocyanate, ricin diisocyanate, triphenyl Examples include methane triisocyanate and tri (isocyanatophenyl) triphosphatate. These may be used alone or in combination of two or more.
Among these, hexamethylene diisocyanate and diphenylmethane diisocyanate are preferable.

  The isocyanate compound as the component (E) includes a prepolymer in which a part of the isocyanate compound forms an isocyanurate ring by a cyclization reaction. For example, the prepolymer containing the trimer of an isocyanate compound is mentioned.

  The isocyanate compound as the component (E) is particularly preferably used in combination with the bifunctional linear epoxy resin as the component (C) described above. In addition to the reaction between the hydroxy group produced by the ring-opening reaction of the epoxy resin and the isocyanate group of the component (E), the hydroxy group exists in the bifunctional linear epoxy resin. Since the group and the isocyanate group can react, a greater effect can be obtained.

  The content of the isocyanate compound as the component (E) is preferably 100 to 400 parts by mass, and more preferably 300 to 350 parts by mass with respect to 100 parts by mass of the component (C). When the content of the component (E) is within this range, foaming is suppressed and a uniform film is easily formed during film formation, and repellency is unlikely to occur. Furthermore, it is expected that after the formed film is dried, cracks hardly occur, the operability of the film is excellent, and the dielectric properties are also good.

<(F) component: inorganic filler>
In one preferred embodiment, the epoxy resin composition further contains (F) an inorganic filler.
The inorganic filler of the component (F) is not particularly limited, and further imparts desired characteristics to the epoxy resin composition. For example, a substance that adjusts the coefficient of thermal expansion, a substance that adjusts thermal conductivity, and the like can be given.

Specific examples of the substance that adjusts the coefficient of thermal expansion include silicon dioxide, aluminum oxide, and aluminum nitride.
In addition, among the substances for adjusting the thermal conductivity, the thermal conductive substance specifically includes, for example, oxides such as aluminum oxide, silicon carbide, and diamond; nitrides such as aluminum nitride and boron nitride; Etc.
These may be used alone or in combination of two or more.

  Among these, as the inorganic filler, silicon dioxide, aluminum oxide, aluminum nitride, and boron nitride are preferable.

  The content of the inorganic filler is not particularly limited as long as it is an amount necessary for exhibiting desired properties and can form a film, but the components (C) to ( It is preferable that it is 200-500 mass parts with respect to a total of 100 mass parts of E), It is more preferable that it is 350-470 mass parts, It is still more preferable that it is 380-420 mass parts. When the content of the inorganic filler is within this range, it is preferable from the viewpoint of dispersibility of the inorganic filler in the resin composition and workability of the obtained resin composition.

  The inorganic filler may be in any form such as granular, powder, flakes and the like.

  The average particle size of the inorganic filler (if it is not granular, the average maximum diameter) is 0.5 μm or less, the dispersibility of the inorganic filler in the resin composition and the processability of the resulting resin composition It is more preferable that the thickness is 0.3 μm or less from the viewpoint that a thinner film can be formed.

  The inorganic filler may be subjected to surface treatment as necessary. For example, an oxide film may be formed on the particle surface.

In the present invention, the epoxy resin composition may contain a curing accelerator as an optional component.
As the curing accelerator, those known as curing accelerators for epoxy resin compositions can be used. Specifically, for example, complex such as 2-methylimidazole and 2-ethyl-4-methylimidazole are used. Ring compounds imidazoles; phosphorus compounds such as triphenylphosphine and tetraphenylphosphonium tetraphenylborate; tertiary amines such as 2,4,6-tris (dimethylaminomethyl) phenol and benzyldimethylamine; 1,8- Diazabicyclo (5,4,0) undecene and its salts and other diazabicycloundescenes (DBU); adduct accelerators obtained by adducting amines and imidazoles with epoxy, urea, acid, etc. Can be mentioned.
It is preferable that content of a hardening accelerator is 1-10 mass parts with respect to 100 mass parts of said (C) component.

In the present invention, the epoxy resin composition may contain a polymerization initiator as an optional component.
As the polymerization initiator, a known polymerization initiator can be used. Specifically, for example, benzoyl peroxide, azobisisobutyronitrile, t-butylperoxybenzoate, 1,1,3,3 -Tetramethylptylberoxy-2-ethylhexanoate etc. are mentioned.
It is preferable that content of a polymerization initiator is 1-10 mass parts with respect to 100 mass parts of said (C) component.

  In the present invention, the epoxy resin composition may contain additives such as a tackifier, an antifoaming agent, a flow regulator, a film forming aid, and a dispersion aid, if necessary.

Specific examples of the film forming aid include divinylbenzene.
The content of the film forming auxiliary is preferably 50 to 150 parts by mass with respect to 100 parts by mass of the component (C).

Further, in the present invention, the epoxy resin composition is necessary for the purpose of improving the elastic modulus, lowering the expansion coefficient, changing the glass transition temperature (Tg value), etc., as long as the object of the present invention is not impaired. Accordingly, an epoxy resin other than the component (C) may be contained.
Examples of the epoxy resin other than the component (C) include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, an alicyclic epoxy resin, and a biphenyl epoxy resin. These may be used alone or in combination of two or more.

In the present invention, the epoxy resin composition contains a known epoxy resin curing agent such as phenol novolak, cresol novolak resin, phenol polynuclear body and the like that are not fatty acid esterified, as long as the object of the present invention is not impaired. Also good.
As a phenol polynuclear body, phenols, such as a 3-5 nuclei grade, are mentioned, for example.

In the present invention, the epoxy resin composition can be produced by a known method.
For example, in the presence or absence of a solvent, the component (C) and the component (D) as well as the component (E) which may be optionally contained are mixed with a propeller stirrer, Banbury mixer, planetary mixer It can be manufactured by a method of mixing with a heating vacuum mixing kneader or the like. In addition, the said (F) component which may be contained depending on necessity may be added after mixing the said (C)-(E) component, and may be added simultaneously with the said (C)-(E) component. Good.
Specifically, it can be produced by dissolving in a predetermined solvent concentration, putting them into a reaction kettle heated to 25 to 60 ° C., and carrying out normal pressure mixing for 30 to 60 minutes. Thereafter, the mixture can be further stirred for 5 to 60 minutes under vacuum (maximum 1 Torr). However, when the component (F) is worshiped simultaneously with other components, it is preferable to extend the mixing and stirring time under vacuum by 30 to 60 minutes.

  As a method for producing the sealing resin film of the present invention comprising such an epoxy resin composition, specifically, for example, after the epoxy resin composition is dissolved or dispersed in an organic solvent to form a varnish, a desired varnish is prepared. Examples thereof include a method of applying to a support and drying.

Here, about the kind and usage-amount of an organic solvent, it is the same as that in the thermosetting resin composition mentioned above.
The support and varnish coating method and drying conditions are also the same as those in the above-described thermosetting resin composition.

Since the sealing resin film of the present invention comprising such an epoxy resin composition has a minimum viscosity of 1 to 10 ⁷ Pa · s at 60 to 230 ° C., the mounting and sealing of electronic components are performed at a low pressure in a lump. Can be performed.

Further, the thickness of the sealing resin film of the present invention comprising such an epoxy resin composition is preferably 30 to 500 μm, preferably 30 to 125 μm, when the epoxy resin composition does not contain the component (F). However, it is more preferable.
Especially when thinning is required, the thickness is preferably 30 to 100 μm. Even in such a range, the encapsulating resin film of the present invention can maintain sufficient physical and electrical characteristics.

  On the other hand, when the said epoxy resin composition contains (F) component, it is preferable that the thickness of the resin film for sealing of this invention obtained is 30-500 micrometers, and it is more preferable that it is 30-125 micrometers.

  Furthermore, in the sealing resin film of the present invention comprising such an epoxy resin composition, the cured product cured after sealing has a low dielectric constant and a low dielectric loss tangent in a high frequency region, for example, Under conditions of a temperature of 25 ° C. and a frequency of 5 GHz, a dielectric constant of 4 or less and a dielectric loss tangent of 0.025 or less can be obtained. In addition, for example, a dielectric constant of 2.6 or less and a dielectric loss tangent of 0.005 or less can be achieved through control of the blending ratio of the component (C) and the component (D).

  Furthermore, the encapsulating resin film of the present invention comprising such an epoxy resin composition is a cured product that is cured after sealing, has a low elastic modulus, can contribute to stress relaxation, Easy to handle. For example, the elastic modulus by dynamic viscoelasticity measurement can be 3.5 GPa or less at a temperature of 25 ° C. Further, for example, a level of 1.5 GPa or less can be achieved through control of the blending ratio of the component (C) and the component (D).

  Furthermore, since the sealing resin film of the present invention made of such an epoxy resin composition has a substantially uniform thickness before and after curing, the thickness uniformity after curing is excellent.

  In the present invention, the curing conditions after sealing the sealing resin film of the present invention composed of such an epoxy resin composition are not particularly limited, but for example, the curing temperature can be increased stepwise. Specifically, the temperature can be raised stepwise to 80 ° C., 100 ° C., 150 ° C., and 180 ° C. Further, the curing time can be a condition for maintaining a complete cured state of the film.

A method for manufacturing a module according to the second aspect of the present invention (hereinafter also referred to as “module manufacturing method of the present invention”) is a method for manufacturing a module in which an electronic component is sealed to obtain a module.
A component fixing step of installing an electronic component on a substrate on which a wiring pattern is formed and fixing the electronic component on the substrate;
A film installation step of installing the sealing resin film according to the first aspect of the present invention on the substrate and the electronic component after the component fixing step;
After the film installation step, a low-pressure heating press step of setting the base material on the sealing resin film and pressing the base material and the substrate at a pressure of 1 MPa or less while heating at 60 to 300 ° C. The manufacturing method of the module which comprises these.

Next, each step will be described in detail with reference to FIG.
FIG. 1 is a cross-sectional view schematically illustrating an example of an embodiment of a module manufacturing method.

<Part fixing process>
The component fixing step is a step of installing an electronic component on a substrate on which a wiring pattern is formed, and fixing the electronic component on the substrate.
Specifically, the electronic component 2 is set on the substrate 1 on which a predetermined wiring pattern (not shown) is formed, and the electronic component 2 is fixed on the substrate 1 (see FIG. 1A). ).

Here, as the board | substrate 1, the well-known board | substrate used for a module (for example, semiconductor device) can be used.
Moreover, as the electronic component 2, a known electronic component mounted on a module substrate can be used. Specifically, for example, a semiconductor element (for example, a Philip chip), a capacitor, or the like is preferably used.
Further, the fixing method is not particularly limited. For example, the sealing resin film according to the first aspect of the present invention is previously placed on the substrate, and the electronic component is pressed against the sealing resin film; For example, a method in which an electronic component is preliminarily placed on a substrate and an electronic component is adhered or adhered to the temporary fixing resin; a flux material is adhered in advance to a bump (projection electrode) of the electronic component;

<Film installation process>
The film installation step is a step of installing the sealing resin film according to the first aspect of the present invention on the substrate and the electronic component after the component fixing step.
Specifically, this is a step of placing the sealing resin film 3 of the present invention on the substrate 1 and the electronic component 2 fixed on the substrate 1 (see FIG. 1B).

<Low pressure heating press process>
In the low-pressure heating press step, after the film installation step, the base material is placed on the sealing resin film, and the base material and the substrate are bonded at a pressure of 1 MPa or less while heating at 60 to 300 ° C. It is a step of pressing.
Specifically, after the film installation step, the base material 4 is placed on the sealing resin film 3 and the base material 4 and the substrate 1 are pressed in the direction of the arrow (FIG. 1B ) And (C).)

Specifically, for example, polyethylene terephthalate (PET) or the like can be used as the substrate 4.
In addition, considering that the base material 4 is removed from the sealing resin film 3 as described later, a member having a releasing effect (for example, a Teflon cushion) is provided on the surface in contact with the sealing resin film 3. Etc.) is preferred.

In the present invention, since the sealing resin film of the present invention is used in the low-pressure heating press step, it is possible to perform mounting and sealing of electronic components all at a low pressure of 1 MPa or less. . This is because by heating at 60 to 300 ° C., the embedding property of the sealing resin film of the present invention between the electronic components is improved and the electronic components are also mounted.
Further, since sealing can be performed at a low pressure of 1 MPa or less, it is possible to cope with sealing thin electronic components.
Furthermore, since the embedding property between the electronic components of the sealing resin film of the present invention is improved by heating at 60 to 300 ° C., the height of the electronic components can be reduced.

Here, the conditions of the low-pressure heating press can be appropriately set in a temperature range of 60 to 300 ° C. and a pressure of 1 MPa or less depending on the kind of the sealing resin film 3 to be used. For example, when the above-described thermosetting resin composition is used as the sealing resin film, the temperature can be set to 150 to 300 ° C. and the actual pressure can be set to 0.50 to 1.00 MPa. When the composition is used, the temperature can be 60 to 230 ° C. and the actual pressure 0.05 to 1.00 MPa.
This temperature is in the range of 60 to 300 ° C. depending on the material of bumps (projection electrodes) and substrate electrodes (for example, copper, solder plated on the copper surface, gold, tin, etc.) used in electronic components. It is desirable to set appropriately.

  In the present invention, the low-pressure hot pressing step can be performed under atmospheric pressure, but is preferably performed under reduced pressure (for example, 10 kPa or less), and more preferably performed under reduced pressure of 1 kPa or less.

In the module manufacturing method of the present invention, after the low-pressure hot pressing step, the module can be manufactured by curing under predetermined conditions and removing the base material 4 as necessary (FIG. 1D). )reference.).
Here, the curing conditions can be appropriately set depending on the type of the sealing resin film 3 to be used. For example, when the above-described thermosetting resin composition is used as the sealing resin film, it can be cured by heating at 180 to 200 ° C. for 30 to 240 minutes. In the case of using a material consisting of the above, it can be cured by heating at 180 to 200 ° C. for 30 to 240 minutes.

The module according to the third aspect of the present invention (hereinafter also referred to as “module of the present invention”) is a module obtained by the method for manufacturing a module according to the second aspect of the present invention.
In the module of the present invention, as described above, the cured product after sealing of the sealing resin film of the present invention has a low dielectric constant and a low dielectric loss tangent in a high frequency region. Under the conditions of ° C. and a frequency of 5 GHz, the dielectric constant can be 4 or less and the dielectric loss tangent can be 0.025 or less.
In the module of the present invention, as described above, the cured product after sealing of the sealing resin film of the present invention has a low elastic modulus and can contribute to stress relaxation. Easy to handle. For example, the elastic modulus by dynamic viscoelasticity measurement can be 3.5 GPa or less at a temperature of 25 ° C.

The module precursor manufacturing method according to the fourth aspect of the present invention (hereinafter, also referred to as “the module precursor manufacturing method of the present invention”) is a module precursor that obtains a module precursor by sealing an electronic component. A manufacturing method of at least
A first film installation step of installing the sealing resin film according to the first aspect of the present invention on the first substrate;
After the first film installation step, an electronic component is installed on the sealing resin film, and the electronic component is fixed on the first base material by the sealing resin film;
After the component fixing step, a second film installation step of installing the sealing resin film according to the first aspect of the present invention on the sealing resin film and the electronic component;
A second base material is placed on the sealing resin film placed by the second film placement step, and heated at 60 to 230 ° C., and at a pressure of 1 MPa or less, the second base material and the first film And a low-pressure heating press process for pressing the substrate.

Next, each step will be described in detail with reference to FIG.
FIG. 2 is a cross-sectional view schematically illustrating an example of an embodiment of a method for producing a module precursor.
Here, the module precursor means one having a structure in which an electronic component is sandwiched between base materials by the sealing resin film according to the first aspect of the present invention.

<First film installation process>
The said 1st film installation process is a process of installing the resin film for sealing which concerns on the 1st aspect of this invention (henceforth a "1st sealing film") on a 1st base material.
Specifically, it is a step of installing the first sealing film 6 on the substrate 5 (see FIG. 2A).
Here, as the base material 5, the same material as the base material 4 can be used.

<Part fixing process>
The component fixing step is a step of installing an electronic component on the first sealing film after the first film installing step, and fixing the electronic component on the first base material by the first sealing film. is there.
Specifically, the electronic component 7 is installed on the first sealing film 6, and a part of the electronic component 7 is embedded in the first sealing film 6. (See FIGS. 2A and 2B).

<Second film installation process>
In the second film installation step, after the component fixing step, the sealing resin film according to the first aspect of the present invention (hereinafter referred to as “second sealing film”) on the first sealing film and the electronic component. It is also a process of installing.
Specifically, it is a step of installing the second sealing film 8 on the first sealing film 6 and the electronic component 7 (see FIG. 2C).

<Low pressure heating press process>
In the low-pressure heating press step, the second base material is installed on the second sealing film installed in the second film installation step, and heated at 60 to 230 ° C., at a pressure of 1 MPa or less, 2 is a step of pressing the base material and the first base material.
Specifically, the second base material 9 is placed on the second sealing film 8 and the second base material 9 and the first base material 5 are pressed in the direction of the arrow (FIG. 2 (C ) And (D).).
Here, as the second base material 9, the same material as the base material 4 can be used.

Here, the conditions of the low-pressure heating press can be appropriately set in a temperature range of 60 to 230 ° C. and a pressure of 1 MPa or less depending on the types of the sealing films 6 and 8 to be used. For example, when using the above-described thermosetting resin composition as the sealing film, the temperature can be set to 60 to 230 ° C. and the actual pressure can be set to 0.50 to 1.00 MPa. In the case of using the above, the temperature can be set to 60 to 230 ° C., and the actual pressure can be set to 0.05 to 1.00 MPa.
Here, this temperature range is different from the temperature range (60 to 300 ° C.) of the low-pressure heating press of the module manufacturing method of the present invention described above, the curing reaction of the thermosetting resin composition described above, and the present invention described above. It is desirable to set appropriately depending on the embedding property of the sealing resin film between the electronic components.

  In the present invention, the low-pressure hot pressing step can be performed under atmospheric pressure, but is preferably performed under reduced pressure (for example, 10 kPa or less), and more preferably performed under reduced pressure of 1 kPa or less.

  In the method for producing a module precursor of the present invention, the module precursor can be produced by applying the low pressure heating press (see FIGS. 2D and 2E). At this time, the module precursor can be cut (divided into pieces) in accordance with the use of the module (see FIG. 2E).

  Such a method for producing a module precursor of the present invention is very useful because a multifunctional module precursor including a large number of electronic components having different functions, types, thicknesses and shapes can be easily produced. .

The module precursor according to the fifth aspect of the present invention (hereinafter also referred to as “module precursor of the present invention”) is a module precursor obtained by the method for producing a module precursor according to the fourth aspect of the present invention. (See FIG. 2F).
By using such a module precursor of the present invention, for example, by removing the first base material 5 and the second base material 9 shown in FIG. 2 (D) or (E) and mounting on the substrate 10, Modules can be manufactured easily.

  Since the module precursor of the present invention can be singulated as described above, it can be applied to mounting on a substrate for various purposes, and connection and sealing are simultaneously formed when mounting on the substrate. It is very useful because it can.

  Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these.

(Examples 1 to 3, Comparative Example 1)
A varnish of a thermosetting resin composition was prepared with the composition (parts by mass) shown in Table 1 below using methyl ethyl ketone as a solvent (solid content: about 30% by weight). After apply | coating the obtained varnish with a micro gravure coater so that it might become thickness 30 micrometers on a support body (PET), it was dried on 80-120 degreeC and the conditions for 10 minutes, and the resin film for sealing was obtained.
In addition, the minimum viscosity in 60-230 degreeC of a thermosetting resin composition measured the composition after preparing a varnish and drying it. Specifically, measurement was performed using a viscometer (VAR-100, manufactured by REOLOGICA) under the conditions of a temperature rising rate of 5 ° C./min and a frequency of 1 Hz, and the results are shown in Table 1 below.

Each obtained resin film for sealing was hardened on 200 degreeC and the conditions for 60 minutes.
Each film after curing was cut into 40 mm × 100 mm to obtain a cylindrical test body having a diameter of about 2 mm.
The dielectric constant (ε) and dielectric loss tangent (tan δ) of each test specimen were measured using a cavity resonator at a temperature of 25 ° C. and a frequency of 5 GHz. The results are shown in Table 1.
Moreover, the glass transition temperature (Tg) and elastic modulus (GPa) of each similar test body were measured at a frequency of 10 Hz (tensile mode) by dynamic viscoelasticity measurement (DMA). The results are shown in Table 1.

As the composition components shown in Table 1, the following components were used.
Vinyl compound A1: OPE-2st (in the general formula (1), R ^{1 to} R ⁷ are hydrogen, — (O—X—O) — is the structural formula (4), and — (Y—O) -Is structural formula (6), Z is a methylene group, and c and d are 1.), number average molecular weight 2200, manufactured by Mitsubishi Gas Chemical Co., Inc. Vinyl compound A2: OPE-2st (general formula (1 ), R ^{1 to} R ⁷ are hydrogen, — (O—X—O) — is structural formula (4), — (Y—O) — is structural formula (6), and Z is methylene. Group, c and d are 1.), number average molecular weight 30000, manufactured by Mitsubishi Gas Chemical Co., Ltd. Thermoplastic elastomer B1: TR2003, manufactured by JSR

(Examples 4 and 5)
A varnish of an epoxy resin composition was prepared with a composition (parts by mass) shown in Table 2 below and using methyl ethyl ketone as a solvent (solid content: about 30% by weight). After apply | coating the obtained varnish with a micro gravure coater so that it might become thickness 30 micrometers on a support body (PET), it was dried on 80-120 degreeC and the conditions for 10 minutes, and the resin film for sealing was obtained.
In addition, the minimum viscosity in 60-230 degreeC of a thermosetting resin composition measured the composition after preparing a varnish and drying it. Specifically, measurement was performed using a viscometer (VAR-100, manufactured by REOLOGICA) under the conditions of a heating rate of 5 ° C./min and a frequency of 1 Hz. The results are shown in Table 2 below.

The following components were used as the composition components shown in Table 2 above.
Epoxy resin C1: A novolac resin having a phenol skeleton and a biphenyl skeleton. In the formula (7 '), n = 1 to 1.2.
Epoxy resin C2: a bifunctional linear epoxy resin having a weight average molecular weight of 39000 and having a hydroxyl group. Epoxy equivalent 12000 g / equivalent, number average molecular weight 14500.
Acetylated phenol novolak D1: (n: m = 1: 1)
Curing agent: 2-ethyl-4-methylimidazole Film-forming auxiliary: Divinylbenzene (DVB960, manufactured by Nippon Steel Chemical Co., Ltd.)
・ Initiator: 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate ・ Solvent: Ethyl methyl ketone

(Example 6)
Among the obtained sealing resin films, using the sealing resin film prepared in Example 2, electronic component 1 (Si chip, t250 μm, 5 mm □) and electronic component 2 (Si chip, t125 μm, 7. 5 mm □) was sealed.

Specifically, first, after placing a sealing resin film with a thickness of 10 μm on the surface of a Teflon cushion of a PET substrate with a Teflon cushion, the electronic component 1 and the sealing resin film are placed on the sealing resin film at 180 ° C. 2 was installed, and the electronic component was fixed on a PET substrate with a Teflon cushion by the sealing resin film (see FIGS. 2A and 2B).
Next, a sealing resin film having a thickness of 135 μm was placed on the sealing resin film and the electronic component, and a heating board (base material) with a Teflon cushion was further placed thereon.
Then, using a high-temperature vacuum press (made by Kitagawa Seiki Co., Ltd.), the PET substrate and the hot plate are vacuum-pressed for 60 minutes under the conditions of 200 ° C., press pressure of 1 MPa, and vacuum degree of 1.0 kPa. Obtained (see FIGS. 2C and 2D).

FIG. 1 is a cross-sectional view schematically illustrating an example of an embodiment of a module manufacturing method. FIG. 2 is a cross-sectional view schematically illustrating an example of an embodiment of a method for producing a module precursor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,10 Board | substrate 2,7 Electronic component 3, Resin film for sealing 4 Base material 5 1st base material 6 1st sealing film 8 2nd sealing film 9 2nd base material

Claims (19)

A sealing resin film for sealing an electronic component mounted on a substrate on which a wiring pattern is formed,
A sealing resin film comprising a resin composition having a minimum viscosity of 1 to 10 ⁷ Pa · s at 60 to 230 ° C. The resin composition is
(A) a vinyl compound represented by the following formula (1), and
The resin film for sealing according to claim 1, comprising a thermosetting resin composition containing (B) rubber and / or a thermoplastic elastomer.

(In the formula (1), R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom, a halogen atom, an alkyl group, a halogenated alkyl group or a phenyl group. A plurality of R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ and R ⁷ may be the same or different.
-(O-X-O)-is a structure represented by the following formula (2),-(YO)-is a repeating unit represented by the following formula (3), and Z is oxygen. An organic group having 1 or more carbon atoms, which may contain an atom, nitrogen atom, sulfur atom, or halogen atom.
Moreover, a and b represent the integer of 0-300 in which at least one is not 0, and c and d represent the integer of 0 or 1 each independently. )

(In the formula (2), R ⁸ , R ⁹ , R ¹⁰ , R ¹⁴ and R ¹⁵ each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R ¹¹ , R ¹² and R ¹³ Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.
In the formula (3), R ¹⁶ and R ¹⁷ each independently represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R ¹⁸ and R ¹⁹ each independently represent a hydrogen atom, a halogen atom, An alkyl group having 6 or less carbon atoms or a phenyl group is represented. ) The — (O—X—O) — is a structure represented by the following formula (4),
The sealing resin film according to claim 2, wherein the — (YO) — is a repeating unit represented by the following formula (5) or (6).

  The sealing resin film according to claim 3, wherein the — (YO) — is a repeating unit represented by the formula (6).   The sealing resin film according to claim 2, wherein the component (B) is a styrene-based thermoplastic elastomer.   The sealing ratio according to any one of claims 2 to 5, wherein a mass ratio ((A) :( B)) of the component (A) and the component (B) is 40:60 to 60:40. Resin film. The resin composition is
(C) a novolak-type epoxy resin having a phenol skeleton and a biphenyl skeleton, and / or a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group, and
The resin film for sealing according to claim 1, comprising an epoxy resin composition containing (D) a modified phenol novolak obtained by esterifying at least part of a phenolic hydroxyl group with a fatty acid.   The resin film for sealing according to claim 7, wherein the content of the component (D) is 30 to 200 parts by mass with respect to 100 parts by mass of the component (C). The resin film for sealing according to claim 7 or 8, wherein the novolak type epoxy resin as the component (C) is an epoxy resin represented by the following formula (7).

(In formula (7), n represents a number (average value) of 1 to 10) The resin film for sealing according to any one of claims 7 to 9, wherein the bifunctional linear epoxy resin of the component (C) is an epoxy resin represented by the following formula (8).

(In formula (8), Q represents a single bond, a hydrocarbon group having 1 to 7 carbon atoms, —O—, —S—, —SO ₂ —, —CO— or a group represented by the following formula: A plurality of Q may be the same or different, and R ²¹ represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, and a plurality of R ²¹ may be the same or different. E represents an integer of 0 to 4, and a plurality of e may be the same or different, and n represents a number (average value) of 25 to 500.

(In the formula, R ²² represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, and a plurality of R ²² may be the same or different. R ²³ is a hydrogen atom, 1 carbon atom. 10 represents a hydrocarbon group of 10 or a halogen atom, and f represents an integer of 0 to 5.) The resin film for sealing according to any one of claims 7 to 10, wherein the component (D) is a modified phenol novolak represented by the following formula (9).

(In Formula (9), R ²⁴ represents an alkyl group having 1 to 5 carbon atoms, and a plurality of R ²⁴ may be the same or different. R ²⁵ is an alkyl group having 1 to 5 carbon atoms. Represents a group, a phenyl group which may have a substituent, an aralkyl group which may have a substituent, an alkoxy group or a halogen atom, and a plurality of R ²⁵ may be the same or different. R ²⁶ represents an alkyl group having 1 to 5 carbon atoms, a phenyl group which may have a substituent, an aralkyl group which may have a substituent, an alkoxy group or a halogen atom, and a plurality of R ²⁶ May be the same or different, g represents an integer of 0 to 3, a plurality of g may be the same or different, and h represents an integer of 0 to 3. A plurality of h may be the same or different, and n: m is 1: 1 to 1.2: 1. .) The sealing resin film according to claim 11, wherein the component (D) is such that R ²⁴ in the formula (9) is a methyl group.   The sealing resin film according to any one of claims 7 to 12, wherein the epoxy resin composition further contains (E) an isocyanate compound.   The sealing resin film according to claim 7, wherein the epoxy resin composition further contains (F) an inorganic filler.   The sealing resin film according to claim 14, wherein the inorganic filler of the component (F) has an average particle size of 5 μm or less. A method of manufacturing a module for obtaining a module by sealing an electronic component, at least,
A component fixing step of installing an electronic component on a substrate on which a wiring pattern is formed and fixing the electronic component on the substrate;
A film installation step of installing the sealing resin film according to any one of claims 1 to 15 on the substrate and the electronic component after the component fixing step;
After the film installation step, a low-pressure heating press step of setting the base material on the sealing resin film and pressing the base material and the substrate at a pressure of 1 MPa or less while heating at 60 to 300 ° C. The manufacturing method of the module which comprises these.   The module obtained by the manufacturing method of the module of Claim 16. A method for producing a module precursor that encapsulates an electronic component to obtain a module precursor, at least,
A first film installation step of installing the sealing resin film according to any one of claims 1 to 15 on a first substrate;
After the first film installation step, an electronic component is installed on the sealing resin film, and a component fixing step of fixing the electronic component on the first substrate with the sealing resin film;
After the component fixing step, a second film installation step of installing the sealing resin film according to any one of claims 1 to 15 on the sealing resin film and the electronic component;
A second base material is placed on the sealing resin film placed in the second film placement step, and heated at 60 to 230 ° C., at a pressure of 1 MPa or less, and the second base material and the first film A method for producing a module precursor, comprising: a low-pressure heating press step for pressing a substrate.   The module precursor obtained by the manufacturing method of the module precursor of Claim 18.

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