KR20190138774A - Encapsulation film and encapsulation structure, and method for producing same - Google Patents

Abstract

This invention is a manufacturing method of the film for sealing containing a thermosetting resin and an inorganic filler, Comprising: The process of preparing the resin composition containing the said reactive functional group equivalent larger than 250 g / mol as a thermosetting resin, and the said inorganic filler, It is related with the manufacturing method of the film for sealing containing the process of shape | molding a resin composition in a film form.

Description

Encapsulation film and encapsulation structure, and method for producing same

The present invention relates to a film for sealing, a sealing structure, and a method for producing the same.

With light and short and short electronic devices, miniaturization and thinning of electronic component devices (semiconductor devices, etc.) are progressing. Forms using semiconductor devices of approximately the same size as semiconductor elements (semiconductor chips such as silicon chips), or mounting forms (packages on packages) on which the semiconductor devices are mounted on the semiconductor devices, are actively carried out. Miniaturization and thinning of the device are expected to proceed further.

As the miniaturization of semiconductor elements progresses and the number of terminals increases, it becomes difficult to provide all external connection terminals (external connection terminals) on the semiconductor elements. For example, when the external connection terminals are forcibly provided, the pitch between the terminals becomes narrow and the terminal height becomes low, making it difficult to secure the connection reliability after mounting the semiconductor device. Therefore, in order to realize miniaturization and thinning of an electronic component device, many new mounting methods have been proposed.

For example, after rearranging a semiconductor device produced by dividing the semiconductor wafer into pieces at appropriate intervals, the semiconductor device is sealed using a solid or liquid resin (sealing resin), and the semiconductor The mounting method which can provide an external connection terminal on the sealing part which seals a semiconductor element in the outer side of an element, and the semiconductor device manufactured using this are proposed (for example, refer following patent document 1-patent document 3). ).

In the said mounting method, the wiring for arrange | positioning an external connection terminal and the process of forming an external connection terminal are performed with respect to the sealing structure (sealing molding) produced by sealing an electronic component. In addition, in the said mounting method, the sealing structure obtained by sealing a some electronic component (semiconductor element etc.) may be diced, and a some electronic component apparatus (semiconductor apparatus etc.) may be obtained. In this case, the more the electronic component is rearranged, the more the electronic component apparatus which can be manufactured by one process increases. Therefore, the examination which enlarges the sealing structure is performed. The current situation is that, for example, in order to use the semiconductor manufacturing apparatus for wiring formation, the sealing structure is molded into a wafer shape (fan out wafer level package), and the wafer-shaped large hardening tends to proceed. There is this. In addition, panelization of the encapsulation structure is also under consideration so as to be larger in size and to be able to use a printed wiring board manufacturing apparatus which is cheaper than a semiconductor manufacturing apparatus (fan-out panel level package).

Japanese Patent Application Laid-Open No. 2015-178635 Japanese Patent Application Laid-Open No. 2014-131016 Japanese Laid-Open Patent Publication No. 2014-197670

By the way, when sealing a to-be-sealed body using resin for sealing, a curvature is based on the difference in the thermal expansion rate of the to-be-sealed body and the sealing part (hardened | cured material of sealing resin) which seals a to-be-sealed body. It may be a problem. In particular, warpage is likely to occur in a thin semiconductor device that does not have a package substrate such as a fan out wafer level package and a fan out panel level package.

Therefore, an object of this invention is to provide the sealing film which can reduce the curvature of a sealing structure, its manufacturing method, and the sealing structure using the said sealing film.

One aspect of this invention relates to the manufacturing method of the film for sealing containing a thermosetting resin and an inorganic filler. This method includes a step of preparing a resin composition containing a resin having a reactive functional group equivalent of more than 250 g / mol as the thermosetting resin, an inorganic filler, and a step of molding the resin composition into a film form. According to this method, the film for sealing which can reduce the curvature of a sealing structure can be obtained.

The glass transition temperature after hardening of a resin composition should just be 80-180 degreeC. In this case, the sealing film which can improve the reliability of a sealing structure can be obtained.

Resin whose reactive functional group equivalent is larger than 250 g / mol may contain resin whose reactive functional group equivalent is 300-410 g / mol. In this case, the film for sealing which can further reduce the curvature of a sealing structure can be obtained. Moreover, according to this method, it is easy to obtain the film for sealing which has sufficient Tg after hardening and can improve the reliability of a sealing structure.

The resin composition may further contain a resin having a reactive functional group equivalent of 100 to 210 g / mol as the thermosetting resin. In this case, the film for sealing which can further reduce the curvature of a sealing structure can be obtained. Moreover, according to this method, it is easy to obtain the film for sealing which has sufficient Tg after hardening and can improve the reliability of a sealing structure.

The resin composition may further contain, as a thermosetting resin, a resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the resin having a reactive functional group equivalent greater than 250 g / mol. In this case, the film for sealing which can further reduce the curvature of a sealing structure can be obtained. Moreover, according to this method, it is easy to obtain the film for sealing which has sufficient Tg after hardening and can improve the reliability of a sealing structure.

Resin whose reactive functional group equivalent is larger than 250 g / mol may contain an epoxy resin. In this case, the film for sealing which can further reduce the curvature of a sealing structure can be obtained. Moreover, according to this method, it is easy to obtain the film for sealing which has sufficient Tg after hardening and can improve the reliability of a sealing structure.

The film thickness of the film for sealing should just be 20-250 micrometers. In this case, the nonuniformity of the in-plane thickness at the time of coating is easy to be suppressed, and it is easy to obtain constant dryness in the depth direction at the time of coating.

One aspect of the present invention relates to a sealing film comprising a thermosetting resin and an inorganic filler, wherein the thermosetting resin comprises a resin having a reactive functional group equivalent of more than 250 g / mol. According to this sealing film, the curvature of a sealing structure can be reduced.

The glass transition temperature after hardening of the film for sealing should just be 80-180 degreeC. In this case, the reliability of the sealing structure can be improved.

Resin whose reactive functional group equivalent is larger than 250 g / mol may contain resin whose reactive functional group equivalent is 300-410 g / mol. In this case, the warpage of the sealing structure can be further reduced, and the reliability of the sealing structure can be improved.

The thermosetting resin may further contain a resin having a reactive functional group equivalent of 100 to 210 g / mol. In this case, the warpage of the sealing structure can be further reduced, and the reliability of the sealing structure can be improved.

The thermosetting resin may further include a resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the resin having a reactive functional group equivalent greater than 250 g / mol. In this case, the warpage of the sealing structure can be further reduced, and the reliability of the sealing structure can be improved.

Resin whose reactive functional group equivalent is larger than 250 g / mol may contain an epoxy resin. In this case, the warpage of the sealing structure can be further reduced, and the reliability of the sealing structure can be improved.

The film thickness of the film for sealing should just be 20-250 micrometers. In this case, the warpage of the sealing structure can be further reduced, and the reliability of the sealing structure can be improved.

One aspect of the present invention relates to an encapsulation structure, including an encapsulated body and a cured product of the encapsulation film encapsulating the encapsulated object. In this sealing structure, curvature is reduced.

One aspect of this invention relates to the manufacturing method of the sealing structure which includes the process of sealing a to-be-sealed | blocked body using the film for sealing obtained by the said method, or the said film for sealing. According to this method, the sealing structure by which curvature was reduced can be obtained.

According to this invention, the sealing film which can reduce the curvature of a sealing structure, its manufacturing method, and the sealing structure using the said sealing film can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic cross section which shows the sealing film with a support body containing the sealing film of embodiment.
It is a schematic cross section for demonstrating one Embodiment of the manufacturing method of a sealing structure.
It is a schematic cross section for demonstrating one Embodiment of the manufacturing method of a sealing structure.

In this specification, the numerical range shown using "-" shows the range which includes the numerical value described before and after "-" as minimum value and the maximum value, respectively. In the numerical range described step by step in this specification, the upper limit or the lower limit of the numerical range of one step may be replaced with the upper limit or the lower limit of the numerical range of another step. In the numerical range described in this specification, you may replace the upper limit or the lower limit of the numerical range with the value shown in the Example. "A or B" should just contain either A and B, and may include both. As long as the material illustrated in this specification does not have a clue in particular, 1 type may be used individually and 2 or more types may be used together. In this specification, content of each component in a composition means the total amount of the said some substance which exists in a composition, unless there is particular notice in the case where there exist two or more substances corresponding to each component in a composition.

EMBODIMENT OF THE INVENTION Hereinafter, the preferred embodiment of this invention is described.

The film for sealing of this embodiment is a film-form resin composition containing a thermosetting component and an inorganic filler. As a thermosetting component, a thermosetting resin, a hardening | curing agent, a hardening accelerator, etc. are mentioned. The thermosetting component does not contain a hardening | curing agent and / or a hardening accelerator, and may contain a thermosetting resin.

(Thermosetting resin)

The thermosetting resin has two or more reactive functional groups in 1 molecule. In this embodiment, a tertiary crosslinked structure is formed by reacting a reactive functional group and another reactive functional group with heat, for example, and the sealing film hardens. The other reactive functional group which reacts with a reactive functional group may be a reactive functional group which a thermosetting resin has, and the reactive functional group which a hardening | curing agent has may be sufficient as it.

The thermosetting resin can use at least 1 sort (s) chosen from the group which consists of a thermosetting resin which is liquid at 25 degreeC, and a thermosetting resin which is not liquid at 25 degreeC. In this embodiment, it is preferable to use a liquid thermosetting resin at 25 degreeC from a viewpoint which is easy to suppress the crack of a film surface, and generation | occurrence | production of gold. And "liquid at 25 degreeC" means that the viscosity in 25 degreeC measured with the E-type viscosity meter is 400 Pa * s or less.

Thermosetting resin contains Resin A whose reactive functional group equivalent is larger than 250 g / mol. In this specification, "reactive functional group equivalent" means the mass (g / mol) of the thermosetting resin per 1 mol of reactive functional groups which a thermosetting resin has. The reactive functional group equivalent is, for example, when the reactive functional group is an epoxy group, after dissolving the thermosetting resin in chloroform, acetic acid and tetraethylammonium acetic acid solution are added to the obtained solution, and the potentiometric titration is carried out with a perchlorate acetic acid standard solution. It measures by measuring the end point which all the epoxy groups reacted. In addition, when the reactive functional group equivalent is a hydroxyl group, it is measured by adding an acetylation reagent to a thermosetting resin, heating in a glycerin bath, and after standing to cool, adding a phenolphthalein solution as an indicator, and titrating with potassium hydroxide ethanol solution.

According to the film for sealing of this embodiment, by containing resin A, the curvature of the sealing structure obtained by sealing a to-be-sealed body can be reduced. According to the findings of the present inventors, in the conventional sealing resin (for example, the sealing film which consists of resin for sealing) containing an epoxy resin and / or a phenol resin, it is easy to produce curvature of a sealing structure. In embodiment, even when the film for sealing contains an epoxy resin and / or a phenol resin, the curvature of a sealing structure can be reduced. Although the cause of such an effect is not clear, the present inventors speculate that since the film for sealing contains resin A, the crosslinking point at the time of hardening reduces, and the crosslinking density after hardening becomes small.

Examples of the resin A include epoxy resins, phenol resins, phenoxy resins, cyanate resins, thermosetting polyimides, melamine resins, urea resins, unsaturated polyesters, alkyd resins, polyurethanes, and the like. As the resin A, an epoxy resin or a phenol resin is preferable from the viewpoint of easily obtaining a cured product having excellent thermal conductivity and the effect of the present invention becomes remarkable. When resin A is an epoxy resin, the reactive functional group is an epoxy group. When resin A is a phenol resin, a reactive functional group is a hydroxyl group (phenolic hydroxyl group).

Resin A may contain the resin whose reactive functional equivalent is 280 g / mol or more from the viewpoint which can reduce the curvature of a sealing structure further, may contain the resin whose reactive functional group equivalent is 300 g / mol or more, and the reactive functional group equivalent is 330 g. You may also include resin which is / mol or more. Resin A may contain the resin whose reactive functional group equivalent is 500 g / mol or less from the viewpoint which Tg after hardening becomes sufficient and the reliability (thermal reliability) of a sealing structure can be improved, and the reactive functional group equivalent is 450 g / mol or less Resin may be included and resin which is a reactive functional group equivalent may be 410 g / mol or less. From these viewpoints, Resin A may contain the resin whose reactive functional equivalent is larger than 250 g / mol, and is 500 g / mol or less, may contain the resin whose reactive functional equivalent is 280-450 g / mol, and the reactive functional group equivalent is 300 Resin which is -410g / mol may be included, and resin whose reactive functional group equivalent is 330-410g / mol may be included.

Content of resin A is 5 mass% or more, 10 mass% or more, 12 mass% on the basis of the total mass of a thermosetting resin from a viewpoint which can reduce the curvature of a sealing structure and the improvement of the reliability of a sealing structure. It may be more than or 15 mass% or more, and may be 90 mass% or less, 85 mass% or less, 70 mass% or less, or 30 mass% or less. The above upper limit and lower limit can be combined arbitrarily. Therefore, content of resin A may be 10-90 mass%, may be 12-85 mass%, may be 15-75 mass%, 5-30 mass% based on the total mass of a thermosetting resin, for example. 10-30 mass% may be sufficient and 15-30 mass% may be sufficient. In addition, also in the following description, the upper limit and lower limit which were described individually can be combined arbitrarily.

In particular, from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure to a higher level, the content of the resin having a reactive functional group equivalent of 300 to 410 g / mol in the resin A is the total mass of the thermosetting resin. 10-90 mass% may be sufficient as a reference, and 12-85 mass% may be sufficient as it, and 15-75 mass% may be sufficient as it.

In this embodiment, it is preferable to use combining several thermosetting resin which has a reactive functional group equivalent different from each other. In this case, reduction of the curvature of a sealing structure and improvement of the reliability of a sealing structure can be compatible. In this case, even when the inorganic filler is increased (for example, when the amount of the inorganic filler is 70% by mass or more based on the total mass of the sealing film (excluding the mass of the solvent)), the curing is performed. Later cracks and cracks can be reduced. The reason why these effects are obtained is not clear, but the present inventors speculate that the crosslinked structure derived from the resin A improves the crack resistance.

It is preferable that a thermosetting resin contains resin B which has a reactive functional group equivalent of 1 / 2.9-1 / 2 times with respect to the reactive functional group equivalent of resin A. In this case, reduction of the curvature of a sealing structure and improvement of the reliability of a sealing structure can be made compatible at a higher level. Although this cause is not clear, since the crosslinking structure which has a part with a densely crosslinked and a crosslinked part by hardening is formed, sufficient Tg can be ensured after hardening, suppressing generation | occurrence | production of a stress at the time of hardening. The present inventors guess. Resin B may contain the some resin from which the reactive functional group equivalents differ.

When the thermosetting resin includes a plurality of resins A having different reactive functional group equivalents, the resin B may be a resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the at least one resin A.

The reactive functional group which resin B has may be the same as the reactive functional group which resin A has, and may differ. The reactive functional group which resin B has should just be a functional group which reacts with the reactive functional group which resin A has by heat. For example, when resin A is an epoxy resin, resin B should just be a phenol resin, a polyamide resin, a carboxylic acid resin, etc. In addition, when resin A is a phenol resin, resin B should just be an epoxy resin etc., for example.

The content of the resin B is 5% by mass or more and 15% by mass or more, based on the total mass of the thermosetting resin, from the viewpoint of reducing both the warpage of the sealing structure and the improvement of the reliability of the sealing structure to a higher level. Or 25 mass% or more, and 60 mass% or less, 50 mass% or less, or 40 mass% or less may be sufficient. Therefore, content of resin B may be 5-60 mass% on the basis of the total mass of a thermosetting resin, for example, may be 15-50 mass%, and may be 25-40 mass%.

Moreover, it is preferable that a thermosetting resin contains resin A and resin C whose reactive functional group equivalent is 250 g / mol or less. In this case, reduction of the curvature of a sealing structure and improvement of the reliability of a sealing structure can be made compatible at a higher level. Although this cause is not clear, since the crosslinking structure which has a part with a densely crosslinked and a crosslinked part by hardening is formed, sufficient Tg can be ensured after hardening, suppressing generation | occurrence | production of a stress at the time of hardening. The present inventors guess.

Resin C should just contain resin with 80 g / mol or more of reactive functional group equivalent from a viewpoint which can reduce curvature of a sealing structure further, Reactive C may contain resin with 90 g / mol or more of reactive functional group, and 100 g of reactive functional group equivalents The resin may be at least / mol or may contain a resin having a reactive functional group equivalent of at least 130 g / mol. Resin C may contain a resin having a reactive functional group equivalent of 210 g / mol or less from a viewpoint that the Tg after curing is sufficient to improve the reliability (thermal reliability) of the encapsulating structure, and the reactive functional group equivalent is 205 g / mol or less. It may contain, and may contain resin whose reactive functional group equivalent is 160 g / mol or less. From these viewpoints, resin C should just contain the resin whose reactive functional group equivalent is 80-250 g / mol, may contain resin whose reactive functional group equivalent is 90-210 g / mol, and the reactive functional group equivalent is 100-205 g / The resin may be mol, may contain a resin having a reactive functional group equivalent of 100 to 210 g / mol, may include a resin having a reactive functional group equivalent of 100 to 160 g / mol, and have a reactive functional group equivalent of 130 to 210 g / mol. Resin may be included and resin of reactive functional group equivalent may be 130-160 g / mol.

Resin C may contain the some resin from which the reactive functional group equivalents differ. For example, as resin C, you may use combining the resin whose reactive functional group equivalent is 100-160 g / mol, and the resin whose reactive functional group equivalent is 160-250 g / mol.

The reactive functional group which resin C has may be the same as or different from the reactive functional group which resin A has. For example, the reactive functional group which resin C has should just be a functional group which reacts with the reactive functional group which resin A has by heat.

The reactive functional group equivalent of the resin C may be 1 / 2.9 to 1/2 times the reactive functional group equivalent of the resin A. A preferable combination of the resin A and the resin C is a combination of a resin having a reactive functional group equivalent of 300 to 410 g / mol and a resin having a reactive functional group equivalent of 100 to 210 g / mol, and a more preferable combination is a reactive functional group equivalent of 330 to 410 g / mol and a resin having a reactive functional group equivalent of 130 to 210 g / mol.

The content of the resin C is 5% by mass or more and 15% by mass or more, based on the total mass of the thermosetting resin, from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure at a higher level. 25 mass% or more, 35 mass% or more, or 45 mass% or more may be 85 mass% or less, 75 mass% or less, 65 mass% or less, 60 mass% or less, 50 mass% or less, or 40 mass% or less. Therefore, content of resin C should just be 25-85 mass%, 35-75 mass%, 45-65 mass%, 5-60 mass based on the total mass of a thermosetting resin, for example. % May be sufficient, 15-50 mass% may be sufficient, and 25-40 mass% may be sufficient. In particular, the content of the resin having a reactive functional group equivalent of 100 to 210 g / mol in the resin C is the total mass of the thermosetting resin from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure to a higher level. 25-85 mass% may be sufficient, 35-75 mass% may be sufficient as it, and 45-65 mass% may be sufficient as a reference.

Next, 1st Embodiment in which Resin A contains an epoxy resin and 2nd Embodiment in which Resin A contains a phenol resin are explained in full detail.

[First Embodiment]

In the film for sealing of 1st Embodiment, resin A contains an epoxy resin. The epoxy resin having a reactive functional group equivalent greater than 250 g / mol can be used without particular limitation as long as it has two or more epoxy groups in one molecule and the epoxy group equivalent is larger than 250 g / mol.

Examples of the epoxy resin having a reactive functional group equivalent greater than 250 g / mol include bisphenol A epoxy resin, bisphenol AP epoxy resin, bisphenol AF epoxy resin, bisphenol B epoxy resin, bisphenol BP epoxy resin, and bisphenol C epoxy. Resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin (hexane diol bisphenol S diglycidyl ether, etc.), bisphenol P type epoxy resin, Bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin, bisphenol Z type epoxy resin, phenol novolak type epoxy resin (orthocresol novolak type epoxy resin, etc.), biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene Epoxy resin, bixylenol epoxy resin (such as bixylenol diglycidyl ether), hydrogenated bisphenol A Epoxy resin (hydrogenated bisphenol A glycidyl ether, etc.), dibasic acids of these resins modified diglycidyl ether type epoxy resin, aliphatic epoxy resin. Among these, an epoxy resin having a bisphenol A skeleton is preferable from the viewpoint of achieving both reduction in warpage of the sealing structure and improvement in the reliability of the sealing structure. An epoxy resin may be used individually by 1 type, and may use 2 or more types together.

From the viewpoint of easily cracking the film surface and generating gold, a reactive epoxy group (liquid epoxy resin) may be used at 25 ° C as an epoxy resin having a reactive functional group equivalent of more than 250 g / mol. Examples of the liquid epoxy resin include glycidyl ethers of bisphenol A, glycidyl ethers of bisphenol AD, glycidyl ethers of bisphenol S, glycidyl ethers of bisphenol F, and glycidyl ethers of hydrogenated bisphenol A. And glycidyl ethers of ethylene oxide adduct bisphenol A, glycidyl ethers of propylene oxide adduct bisphenol A, glycidyl ethers of naphthalene resin, and tri- or tetra-functional glycidylamines. Can be.

The reactive functional group equivalent of the epoxy resin having a reactive functional group equivalent of more than 250 g / mol is preferably 280 g / mol or more, more preferably 300 g / mol or more, more preferably 330 g / mol or more from the viewpoint of further reducing the warpage of the encapsulating structure. More preferred. The reactive functional group equivalent of the epoxy resin having a reactive functional group equivalent of more than 250 g / mol is preferably 500 g / mol or less from the viewpoint of increasing Tg after curing and improving the reliability (thermal reliability) of the encapsulation structure. mol or less is more preferable, and 410 g / mol or less is more preferable. From such a viewpoint, it is preferable that the reactive functional group equivalent of an epoxy resin whose reactive functional equivalent is larger than 250 g / mol is larger than 250 g / mol and is 500 g / mol or less, It is more preferable that it is 280-450 g / mol, It is 300-410 g / mol It is more preferable that it is mol, and it is especially preferable that it is 330-410 g / mol.

As a commercially available epoxy resin with a reactive functional group equivalent larger than 250 g / mol, "EXA4816", "EXA4850-1000", "EXA4850-150", etc. by DIC Corporation are mentioned.

The content of the epoxy resin having a reactive functional group equivalent of more than 250 g / mol is 5% by mass or more, based on the total mass of the thermosetting resin, from the viewpoint of achieving both a reduction in warpage of the sealing structure and an improvement in the reliability of the sealing structure. 10 mass% or more or 15 mass% or more may be sufficient as 90 mass% or less, 85 mass% or less, or 75 mass% or less. Therefore, content of the epoxy resin whose reactive functional group equivalent is larger than 250 g / mol may be 5-90 mass%, 10-85 mass% may be sufficient as 15-75 based on the total mass of a thermosetting resin, for example. Mass% may be sufficient. In particular, the content of the epoxy resin having a reactive functional group equivalent of 300 to 410 g / mol is based on the total mass of the thermosetting resin, from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure to a higher level. 5 to 90 mass% may be sufficient, 10 to 85 mass% may be sufficient, and 15 to 75 mass% may be sufficient as it.

Content of the liquid epoxy resin whose reactive functional group equivalent is larger than 250 g / mol should just be 5 mass% or more, 10 mass% or more, or 15 mass% or more on the basis of the total mass of a thermosetting resin, 90 mass% or less, 85 mass It should just be% or less or 75 mass% or less. Therefore, content of the liquid epoxy resin whose reactive functional group equivalent is larger than 250 g / mol may be 5-90 mass% based on the total mass of a thermosetting resin, for example, may be 10-85 mass%, and 15-15 75 mass% may be sufficient. When content of the liquid epoxy resin whose reactive functional group equivalent is larger than 250 g / mol is more than the said lower limit, it is easy to suppress the crack of a film surface, and generation | occurrence | production of gold. Moreover, when content of the liquid epoxy resin whose reactive functional group equivalent is larger than 250 g / mol is below the said upper limit, it becomes easy to suppress the fusion of the film excessively and edge fusion.

The thermosetting resin may contain an epoxy resin having a reactive functional group equivalent of 250 g / mol or less. Examples of the epoxy resin having a reactive functional group equivalent of 250 g / mol or less include bisphenol A epoxy resin, bisphenol AP epoxy resin, bisphenol AF epoxy resin, bisphenol B epoxy resin, bisphenol BP epoxy resin, and bisphenol C epoxy resin. , Bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin (hexane diol bisphenol S diglycidyl ether, etc.), bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC bisphenol type epoxy resin, bisphenol Z type epoxy resin, phenol novolak type epoxy resin (orthocresol novolak type epoxy resin, etc.), biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene Epoxy resin, bixylenol epoxy resin (such as bixylenol diglycidyl ether), hydrogenation ratio Sphenol A type epoxy resins (such as hydrogenated bisphenol A glycidyl ether), the dibasic acid modified diglycidyl ether type epoxy resin of these resin, an aliphatic epoxy resin, etc. are mentioned. The epoxy resin whose reactive functional group equivalent is 250 g / mol or less may be used individually by 1 type, and may use 2 or more types together.

Content of all the epoxy resins contained in the sealing film should just be 1 mass% or more on the basis of the gross mass (excluding the mass of a solvent) of the sealing film from a viewpoint of obtaining the outstanding fluidity, and 3 mass% 4 mass% or more may be sufficient, 4 mass% or more may be sufficient, 5 mass% or more may be sufficient, 10 mass% or more may be sufficient, and 15 mass% or more may be sufficient as it. Content of all the epoxy resins contained in the sealing film is 30 mass% based on the total mass (excluding the mass of the solvent) of the sealing film from the viewpoint of easily breaking the film surface and generating gold. 25 mass% or less may be sufficient, and 20 mass% or less may be sufficient. Therefore, content of all the epoxy resins contained in the sealing film should just be 1-30 mass% based on the gross mass (excluding the mass of a solvent) of the sealing film.

The thermosetting resin may further contain the resin which has a functional group which reacts with an epoxy resin with a reactive functional group equivalent larger than 250 g / mol, and heat | fever. For example, it is preferable that a thermosetting resin contains a phenol resin. As a phenol resin, if it is resin which has two or more phenolic hydroxyl groups in 1 molecule, a well-known phenol resin can be used without a restriction | limiting.

As the phenol resin, for example, a resin obtained by condensation or co-condensation of phenols and / or naphthols with aldehydes under an acidic catalyst, biphenyl skeletal phenol resins, paraxylylene-modified phenol resins, methacrylicene and parachute A silylene modified phenol resin, a melamine modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene modified phenol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, a xylylene modified naphthol resin, etc. are mentioned. Examples of the phenols include phenol, substituent-containing phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F. Examples of naphthols include α-naphthol, β-naphthol, dihydroxy naphthalene, and the like. Examples of the aldehydes include formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylic aldehyde and the like.

The reactive functional group equivalent of the phenol resin is compatible with the reactive functional group equivalent of the epoxy resin having a reactive functional group equivalent of more than 250 g / mol from the viewpoint that both the reduction of the warpage of the encapsulation structure and the improvement of the reliability of the encapsulation structure can be achieved at a higher level. 1 / 2.9-1/2 may be sufficient.

The content of the phenol resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the epoxy resin having a reactive functional group equivalent of more than 250 g / mol can reduce the warpage of the sealing structure and improve the reliability of the sealing structure. From the viewpoint of being compatible to a higher level, 15 mass% or more, 20 mass% or more, or 25 mass% or more, based on the total mass of the thermosetting resin, may be 95 mass% or less and 90 mass% or less. Or 85 mass% or less. Therefore, content of the said phenol resin may be 15-95 mass%, for example, 20-90 mass% may be sufficient as 25-85 mass% based on the total mass of a thermosetting resin.

The reactive functional group equivalent of a phenol resin should just be 250 g / mol or less from a viewpoint that the reduction of the curvature of a sealing structure and the improvement of the reliability of a sealing structure can be made compatible at a higher level. The reactive functional group equivalent of the phenol resin may be 210 g / mol or less, 205 g / mol or less, or 160 g / mol or less from the viewpoint of further reducing the warpage of the sealing structure. The reactive functional group equivalent of the phenol resin may be 80 g / mol or more, 90 g / mol or more, or 100 g / mol or more, from the viewpoint that the Tg after curing is sufficient to improve the reliability (thermal reliability) of the sealing structure. do. Accordingly, the reactive functional group equivalent of the phenol resin may be, for example, 80 to 250 g / mol, 90 to 210 g / mol, 100 to 210 g / mol, 100 to 205 g / mol, or 100 to 160 g / mol. 130-210 g / mol may be sufficient and 130-160 g / mol may be sufficient.

The thermosetting resin may contain the some phenol resin from which the reactive functional group equivalent differs. For example, the thermosetting resin may include a phenol resin having a reactive functional group equivalent of 100 to 160 g / mol, and a phenol resin having a reactive functional group equivalent of 160 to 250 g / mol.

As a phenol resin whose reactive functional group equivalent is 250 g / mol or less, the phenol resin which has a structural unit represented by following formula (1) is mentioned, for example.

[In Formula (1), when R <^1> represents a C2-C25 hydrocarbon group and there are several structural units represented by Formula (1), some R <^1> may be same or different, respectively, and is a position of R <^1> . May be any of ortho, meta, or para with respect to -OH, and the position of the bonding group (-* and -CH2- *) may be any of ortho, meta, or para with respect to -OH. May be acceptable]

The hydrocarbon group represented by R ¹ may be either linear or branched. In addition, the hydrocarbon group may be either saturated or unsaturated. When a hydrocarbon group is an unsaturated hydrocarbon group, an unsaturated hydrocarbon group may have 2 or more unsaturated bonds. The carbon number of the hydrocarbon group may be 4 to 22, 8 to 20, or 10 to 18.

Even if the phenol resin which has a structural unit represented by the said Formula (1) may consist only of the structural unit represented by the said Formula (1), and has further structural units other than the structural unit represented by said Formula (1), do. The said phenol resin should just be a random copolymer of the structural unit represented by the said Formula (1), and another structural unit, for example, The block containing the structural unit represented by the said Formula (1), and another structural unit Random copolymers containing a block containing may be used.

As another structural unit, the structural unit represented by following formula (2) is mentioned.

[In Formula (2), when R <^2> represents a hydrogen atom or a phenyl group, and when there are more than one structural unit represented by Formula (2), some R <^2> may be same or different, and the position of R <^2> , Any of ortho, meta, or para may be relative to -OH, and the position of the bonding group (-* and -CH _2- *) may be any of ortho, meta, or para relative to -OH. being]

20-100 mol% may be sufficient as content of the structural unit represented by the said Formula (1) in the said phenol resin on the basis of the whole quantity of the structural unit which comprises this phenol resin, and 30-90 mol% may be sufficient as it. , 40 to 80 mol% may be sufficient.

Content of the structural unit represented by the said Formula (2) in the said phenol resin should just be more than 0 mol% and 80 mol% or less on the basis of the whole quantity of the structural unit which comprises this phenol resin, and it is 10-70 mol % May be sufficient and 20-60 mol% may be sufficient.

The phenol resin which has a structural unit represented by the said Formula (1) contains the substituent containing phenol represented by following formula (3), formaldehyde, and the substituent represented by following formula (4) depending on the case, for example. It can obtain by making phenol react. And the example of R <^1> in following formula (3) is the same as the example of R <^1> in said formula (1), The example of R <^2> in following formula (4) is said formula (2) It is the same as the example of R <^2> in).

The content of the phenol resin having a reactive functional group equivalent of 250 g / mol or less is 15 based on the total mass of the thermosetting resin, from the viewpoint that both the reduction of the warpage of the encapsulation structure and the improvement of the reliability of the encapsulation structure can be achieved at a higher level. It may be mass% or more, 20 mass% or more, or 25 mass%, and may be 95 mass% or less, 90 mass% or less, or 85 mass% or less. Therefore, the content of the phenol resin having a reactive functional group equivalent of 250 g / mol or less is, for example, 15 to 95 mass%, 20 to 90 mass%, 25 to 85 mass, based on the total mass of the thermosetting resin. % Should be. In particular, the content of the phenol resin having a reactive functional group equivalent of 100 to 210 g / mol is based on the total mass of the thermosetting resin, from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure to a higher level. 15-95 mass% may be sufficient, 20-90 mass% may be sufficient, and 25-85 mass% may be sufficient as it.

Content of all the phenol resins contained in the sealing film may be set suitably in consideration of content of an epoxy resin and the epoxy group equivalent of an epoxy resin. The ratio of the number-of-moles M2 of epoxy groups to the number-of-moles M2 of epoxy groups in the film for sealing (M2 / M1) from the viewpoint that an unreacted epoxy resin and / or unreacted phenol resin is hard to remain and the desired cured product properties are easily obtained. ) May be 0.7 or more, 0.8 or more, or 0.9 or more, and may be 2.0 or less, 1.8 or less, or 1.7 or less. Therefore, ratio (M2 / M1) of the number-of-moles M2 of the epoxy group with respect to the number-of-moles M1 of the phenolic hydroxyl group in the sealing film may be 0.7-2.0, for example, may be 0.8-1.8, and may be 0.9-1.7.

Second Embodiment

In the film for sealing of 2nd Embodiment, resin A contains a phenol resin. A phenol resin having a reactive functional group equivalent of more than 250 g / mol may have a two or more phenolic hydroxyl groups in one molecule, and a known phenol resin can be used without particular limitation as long as it is a resin having a phenolic hydroxyl group equivalent of more than 250 g / mol. .

As the phenol resin, for example, a resin obtained by condensation or co-condensation of phenols and / or naphthols with aldehydes under an acidic catalyst, a biphenyl skeleton type phenol resin, paraxylylene-modified phenol resin, methacrylicene parapark A silylene modified phenol resin, a melamine modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene modified phenol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, a xylylene modified naphthol resin, etc. are mentioned. A phenol resin may be used individually by 1 type, and may use 2 or more types together.

The reactive functional group equivalent of a phenol resin whose reactive functional group equivalent is larger than 250 g / mol may be larger than 250 g / mol or less than 500 g / mol from the viewpoint of reducing the crosslinking point and reducing the warpage, and may be 280 to 450 g / mol. mol may be sufficient, 300-410 g / mol may be sufficient, and 330-410 g / mol may be sufficient.

The content of the phenol resin having a reactive functional group equivalent of more than 250 g / mol is 5 to 85 mass based on the total mass of the thermosetting resin from the viewpoint of achieving both a reduction in the warping of the sealing structure and an improvement in the reliability of the sealing structure. % May be sufficient, 10-80 mass% may be sufficient, and 15-75 mass% may be sufficient. In particular, the content of the phenol resin having a reactive functional group equivalent of 300 to 410 g / mol is based on the total mass of the thermosetting resin, from the viewpoint of reducing the warpage of the sealing structure and improving the reliability of the sealing structure to a higher level. 5 to 85 mass% may be sufficient, 10 to 80 mass% may be sufficient, and 15 to 75 mass% may be sufficient as it.

The thermosetting resin may contain a phenol resin having a reactive functional group equivalent of 250 g / mol or less.

The content of all the phenol resins contained in the sealing film is determined by the total mass (excluding the mass of the solvent) of the sealing film, from the viewpoint of obtaining excellent fluidity and from the viewpoint of easily breaking cracks and generation of gold on the surface of the film. 15-95 mass% may be sufficient as a reference, 20-90 mass% may be sufficient, and 25-85 mass% may be sufficient as it.

The thermosetting resin may further include a resin having a functional group reacting with a phenol resin having a reactive functional group equivalent greater than 250 g / mol and by heat. For example, it is preferable that a thermosetting resin contains an epoxy resin. As an epoxy resin, if it is resin which has two or more epoxy groups in 1 molecule, a well-known epoxy resin can be used without a restriction | limiting.

As an epoxy resin, the above-mentioned epoxy resin can be used as an epoxy resin whose reactive functional group equivalent is larger than 250 g / mol, and an epoxy resin whose reactive functional group equivalent is 250 g / mol or less.

The reactive functional group equivalent of the epoxy resin is compatible with the reactive functional group equivalent of the phenol resin having a reactive functional group equivalent of more than 250 g / mol from the viewpoint that both the reduction of the warping of the sealing structure and the improvement of the reliability of the sealing structure can be achieved at a higher level. 1 / 2.9-1/2 may be sufficient.

The content of the epoxy resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the phenol resin having a reactive functional group equivalent of more than 250 g / mol can reduce the warpage of the sealing structure and improve the reliability of the sealing structure. From the viewpoint of being compatible at a higher level, 15 to 95% by mass, may be 20 to 90% by mass, or 25 to 85% by mass, based on the total mass of the thermosetting resin.

The reactive functional group equivalent of an epoxy resin should just be 250 g / mol or less from a viewpoint that the reduction of the curvature of a sealing structure and the improvement of the reliability of a sealing structure can be made compatible at a higher level. The reactive functional group equivalent of the epoxy resin may be 80 to 250 g / mol, 90 to 210 g / mol, 100 to 205 g / mol, or 100 to 160 g / mol from the viewpoint of further reducing the warpage of the sealing structure. do.

The content of the epoxy resin having a reactive functional group equivalent of 250 g / mol or less is 15 based on the total mass of the thermosetting resin, from the viewpoint that both the reduction of the warping of the sealing structure and the improvement of the reliability of the sealing structure can be achieved at a higher level. 95 mass% may be sufficient, 20-90 mass% may be sufficient, and 25-85 mass% may be sufficient.

Content of all the epoxy resins contained in the film for sealing may be set suitably in consideration of content of a phenol resin and phenolic hydroxyl group equivalent of a phenol resin. The range of the ratio of the number-of-moles M2 of an epoxy group to the number-of-moles M1 of a phenolic hydroxyl group in the sealing film should just be the same as the range illustrated in 1st Embodiment.

(Hardener)

The film for sealing of this embodiment may contain a hardening | curing agent (excluding the component corresponding to a thermosetting resin) as a thermosetting component. Although it does not specifically limit as a hardening | curing agent, A phenol type hardening | curing agent, an acid anhydride type hardening | curing agent, an active ester type hardening | curing agent, a cyanate ester type hardening | curing agent, etc. are mentioned. When a thermosetting resin contains an epoxy resin, as a hardening | curing agent, if it is a compound which has two or more functional groups which react with an epoxy group in 1 molecule, it can use without a restriction | limiting in particular. In addition, when a thermosetting resin contains a phenol resin, as a hardening | curing agent, if it is a compound which has two or more functional groups which react with a phenolic hydroxyl group in 1 molecule, it can use without a restriction | limiting in particular. A hardening | curing agent may be used individually by 1 type, and may use 2 or more types together. When thermosetting resin contains the some resin which has a different reactive functional group, you may use together a some kind of hardening | curing agent according to the kind of reactive functional group.

Content of a hardening | curing agent should just be 1-20 mass% on the basis of the gross mass (except the mass of a solvent) of the film for sealing from a viewpoint of excellent sclerosis | hardenability of a thermosetting resin, and may be 2-15 mass%, 3 -10 mass% may be sufficient.

(Hardening accelerator)

The film for sealing of this embodiment may contain a hardening accelerator as a thermosetting component. Although it can use without a restriction | limiting in particular as a hardening accelerator, At least 1 sort (s) chosen from the group which consists of an amine hardening accelerator and a phosphorus hardening accelerator is preferable. As a hardening accelerator, an amine hardening accelerator is preferable especially from a viewpoint of obtaining the hardened | cured material which has the outstanding thermal conductivity, abundant derivative | guide_body, and a viewpoint of obtaining a desired active temperature, and an imidazole compound, aliphatic amine, and alicyclic At least 1 sort (s) chosen from the group which consists of amines is more preferable, and an imidazole compound is still more preferable. 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, etc. are mentioned as an imidazole compound. A hardening accelerator may be used individually by 1 type, and may use 2 or more types together. As a commercial item of a hardening accelerator, "2P4MZ", "1B2MZ", etc. by Shikoku Kasei Kogyo Co., Ltd. are mentioned.

As for content of a hardening accelerator, the following ranges are preferable based on the total amount of a thermosetting resin. As for content of a hardening accelerator, 0.01 mass% or more is preferable, 0.1 mass% or more is more preferable, and 0.3 mass% or more is more preferable from a viewpoint of obtaining a sufficient hardening promoting effect. As for content of a hardening accelerator, hardening does not progress easily during the process [for example, coating and drying] at the time of manufacturing the film for sealing, or during storage of the film for sealing, the crack of the film for sealing, And 5 mass% or less are preferable, 3 mass% or less is more preferable, and 1.5 mass% or less is more preferable from a viewpoint of the easy to prevent molding defect accompanying a raise of melt viscosity. From these viewpoints, 0.01-5 mass% is preferable, as for content of a hardening accelerator, 0.1-3 mass% is more preferable, 0.3-1.5 mass% is further more preferable.

(Inorganic filler)

As an inorganic filler, a conventionally well-known inorganic filler can be used and it is not specifically limited. As the constituent material of the inorganic filler, silicas (amorphous silica, crystalline silica, fused silica, spherical silica, synthetic silica, hollow silica, etc.), barium sulfate, barium titanate, talc, clay, mica powder, magnesium carbonate, calcium carbonate, Aluminum oxide (alumina), aluminum hydroxide, magnesium oxide, magnesium hydroxide, silicon nitride, aluminum nitride, aluminum borate, boron nitride, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, zirconate Calcium etc. are mentioned. Desired cured film characteristics because the surface modification (for example, surface treatment with a silane compound) or the like has a viewpoint of easily improving dispersibility in the resin composition, a sedimentation inhibiting effect in the varnish, and a relatively small thermal expansion rate. From the viewpoint of easy to obtain, an inorganic filler containing silicas is preferable. From the viewpoint of obtaining high thermal conductivity, an inorganic filler containing aluminum oxide is preferable. An inorganic filler may be used individually by 1 type, and may use 2 or more types together.

The inorganic filler may be surface modified. The method of surface modification is not specifically limited. From the viewpoint of easy processing, abundant kinds of functional groups, and easy to impart desired characteristics, surface modification using a silane coupling agent is preferred.

Examples of the silane coupling agent include alkylsilanes, alkoxysilanes, vinylsilanes, epoxysilanes, aminosilanes, acrylicsilanes, methacrylsilanes, mercaptosilanes, sulfidesilanes, isocyanate silanes, sulfur silanes, styryl silanes, alkylchlorosilanes, and the like. Can be.

Specific examples of the silane coupling agent include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane and diiso Propyldimethoxysilane, isobutyltrimethoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n- Octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, diphenyldimethoxysilane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, n-octyldimethylchlorosilane, Tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimeth Oxysilane, 3- Nylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxy Silane, bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane , Vinyltriisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxy Silane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3-aminopropyltri Ethoxysilane, aminosilane (phenylaminosilane, etc.) etc. are mentioned. A silane coupling agent may be used individually by 1 type, and may use 2 or more types together.

The average particle diameter of the inorganic filler is preferably 0.01 µm or more, more preferably 0.1 µm or more, still more preferably 0.3 µm or more, from the viewpoint of easy aggregation of the inorganic filler and easily dispersing the inorganic filler. 0.5 micrometers or more are especially preferable. As for the average particle diameter of an inorganic filler, it is easy to suppress sedimentation of an inorganic filler in a varnish, and from a viewpoint of being easy to produce a homogeneous sealing film, 25 micrometers or less are preferable, 10 micrometers or less are more preferable, 5 micrometers The following is more preferable. From these viewpoints, 0.01-25 micrometers is preferable, as for the average particle diameter of an inorganic filler, 0.01-10 micrometers is more preferable, 0.1-10 micrometers is still more preferable, 0.3-5 micrometers is especially preferable, 0.5-5 Μm is extremely preferred. 10-18 micrometers of the average particle diameter of an inorganic filler may be sufficient.

From the viewpoint of excellent fluidity of the resin composition, it is preferable to use a combination of a plurality of inorganic fillers having different average particle diameters. Among the combinations of the inorganic fillers, combinations in which the average particle diameter of the inorganic filler having the largest average particle diameter is 15 to 25 µm are preferable. It is preferable to use the inorganic filler whose average particle diameter is 15-25 micrometers, the inorganic filler whose average particle diameter is 0.5-2.5 micrometers, and the inorganic filler whose average particle diameter are 0.1-1.0 micrometer.

"Average particle diameter" is the particle diameter of the point corresponded to 50% of volume when the cumulative frequency distribution curve by particle diameter is calculated | required with the total volume of particle as 100%, and a particle size distribution measuring apparatus using the laser diffraction scattering method. Or the like. The average particle diameter of each inorganic filler combined can be confirmed from the average particle diameter of each inorganic filler at the time of mixing, and can also be confirmed by measuring a particle size distribution.

As a commercial item of an inorganic filler, "DAW20" by the Denka Corporation, the brand names "SC550O-SXE", the "SC2050-KC" by Admatechs, etc. are mentioned.

The content of the inorganic filler is encapsulated from the viewpoint of improving the thermal conductivity, and from the viewpoint that the warpage of the encapsulation structure (for example, an electronic component device such as a semiconductor device) is largely suppressed due to the difference in thermal expansion coefficient with the encapsulated body. 70 mass% or more may be sufficient, 75 mass% or more may be sufficient, 80 mass% or more may be sufficient, and 84 mass% or more may be sufficient as the basis of the total mass of the film for solvents. Content of an inorganic filler is suppressed that fluidity falls by the viewpoint which is easy to be suppressed from breaking the film for sealing in the drying process at the time of preparation of the film for sealing, and the raise of the melt viscosity of the film for sealing is suppressed, From a viewpoint of easy to encapsulate (electronic component, etc.), 93 mass% or less may be sufficient as 91 mass% or less, and 88 mass% or less may be sufficient as a reference with respect to the gross mass of the film for sealing. From these viewpoints, content of an inorganic filler may be 70-93 mass%, 75-91 mass% may be sufficient, and 80-88 mass based on the total mass (excluding the mass of a solvent) of the film for sealing. % May be sufficient. In addition, the said content is content of the inorganic filler except the quantity of a surface treating agent.

(Elastomer)

The film for sealing of this embodiment may contain an elastomer (flexible agent) as needed. It is preferable to use at least 1 sort (s) chosen from the group which consists of a polybutadiene particle, a styrene butadiene particle, an acrylic elastomer, silicone powder, a silicone oil, and a silicone oligomer from an viewpoint of excellent dispersibility and solubility. Elastomer may be used individually by 1 type, and may use 2 or more types together.

When the elastomer is particulate, there is no particular limitation on the average particle diameter of the elastomer. In eWLB (Embedded Wafer-Level Ball Grid Array) applications, it is necessary to embed semiconductor elements, so that when the encapsulation film is used for eWLB applications, the average particle diameter of the elastomer is preferably 50 µm or less. Do. It is preferable that the average particle diameter of an elastomer is 0.1 micrometer or more from a viewpoint which is excellent in the dispersibility of an elastomer.

As a commercial item of an elastomer, "SG-280 EK23", "SG-70L", "WS-023 EK30", etc. which are acrylic elastomers by Nagase Chemtex Co., Ltd. are mentioned. In addition, although some of the commercially available elastomer components are not elastomer alone, they may be dispersed in a liquid resin (for example, a liquid epoxy resin) in advance, but they can be used without any problem. As such a commercial item, "MX-136", "MX-965" by Kaneka Corporation, etc. are mentioned.

The content of the elastomer is not particularly limited in terms of adding flexibility to the film and improving cracking, and may be 1% by mass or more based on the total amount of the thermosetting component and the elastomer, and may be 5% by mass or more. 10 mass% or more may be sufficient. The content of the elastomer may be 30% by mass or less, 25% by mass or less, or 20% by mass or less, based on the total amount of the thermosetting component and the elastomer, from the viewpoint of securing fluidity required for embedding or the like. From the above description, the content of the elastomer may be 1 to 30% by mass, 5 to 25% by mass, or 10 to 20% by mass or less, based on the total amount of the thermosetting component and the elastomer.

(Other ingredients)

The sealing film of this embodiment may further contain other additives. As a specific example of such an additive, a pigment, dye, a mold release agent, antioxidant, a surface tension regulator, etc. are mentioned.

In addition, the film for sealing of this embodiment may contain a solvent (for example, the solvent used for manufacture of the film for sealing). As a solvent, what is necessary is just a conventionally well-known organic solvent. The organic solvent may be any solvent capable of dissolving components other than inorganic fillers, and examples thereof include aliphatic hydrocarbons, aromatic hydrocarbons, terpenes, halogens, esters, ketones, alcohols, and aldehydes. A solvent may be used individually by 1 type and may use 2 or more types together.

The solvent may be at least one member selected from the group consisting of esters, ketones and alcohols from the viewpoint of low environmental load and easy dissolution of the thermosetting component. Especially, when a solvent is ketones, it is easy to melt | dissolve a thermosetting component especially. The solvent may be at least one selected from the group consisting of acetone, methyl ethyl ketone and methyl isobutyl ketone from the viewpoint of low volatilization at room temperature (25 ° C.) and easy removal in drying.

It is preferable that content of the solvent (organic solvent etc.) contained in the sealing film is the following ranges based on the gross mass of the sealing film. The content of the solvent may be 0.2% by mass or more from the viewpoint of softening the sealing film and causing problems such as cracking of the sealing film, and the lowest melt viscosity, and the ease of suppressing the embedding. It may be mass% or more, 0.5 mass% or more, 0.6 mass% or more, or 0.7 mass% or more may be sufficient. The content of the solvent is such that the adhesiveness of the sealing film is excessively strong, and the handleability is lowered, and from the viewpoint of easy to suppress problems such as foaming caused by volatilization of a solvent (such as an organic solvent) at the time of thermosetting the sealing film. , 1.5 mass% or less may be sufficient, and 1 mass% or less may be sufficient. From these viewpoints, content of a solvent may be 0.2-1.5 mass%, 0.3-1 mass% may be sufficient, 0.5-1 mass% may be sufficient, 0.6-1 mass% may be sufficient, and 0.7-1 mass% may be sufficient.

The film for sealing of this embodiment can be used, for example for sealing of a semiconductor device, embedding of the electronic component arrange | positioned at a printed wiring board. In particular, the sealing film of the present embodiment can be suitably used for sealing a thin semiconductor device that does not have a package substrate such as a fan out wafer level package and a fan out panel level package.

The thickness (film thickness) of the film for sealing may be 20 micrometers or more, and 30 micrometers or more may be sufficient from a viewpoint which the nonuniformity of the in-plane thickness at the time of coating is easy to be suppressed, and the reliability of a sealing structure can be improved. 50 micrometers or more may be sufficient, and 100 micrometers or more may be sufficient as it. The thickness of the film for sealing may be 250 micrometers or less, 200 micrometers or less, and 150 micrometers or less from a viewpoint which is easy to obtain the constant dryness in a depth direction at the time of coating, and a viewpoint which can reduce the curvature of a sealing structure further. From these viewpoints, the thickness of the sealing film may be 20-250 micrometers, 30-250 micrometers may be sufficient, 50-200 micrometers may be sufficient, and 100-150 micrometers may be sufficient. In addition, a plurality of sealing films may be laminated to produce a sealing film having a thickness of more than 250 μm.

The glass transition temperature after hardening of the sealing film may be 80 degreeC or more from a viewpoint which is excellent in the reliability (thermal reliability) of the sealing structure obtained, and 100 degreeC or more may be sufficient as it. The glass transition temperature after hardening of the sealing film may be 180 degrees C or less, 165 degrees C or less, or 150 degrees C or less from a viewpoint which is excellent in the reliability (thermal reliability) of the sealing structure obtained. From these viewpoints, the glass transition temperature after hardening of the sealing film may be 80-180 degreeC, 80-165 degreeC may be sufficient, 80-150 degreeC may be sufficient, and 100-150 degreeC may be sufficient as it. The glass transition temperature of the film for sealing can be adjusted with the kind and content of a thermosetting component, the kind and content of an elastomer component, etc. Glass transition temperature can be measured by the method as described in an Example.

The film for sealing of this embodiment can also be used as a film for sealing attached to a support body, for example. The film 10 for sealing attached to the support body shown in FIG. 1 contains the support body 1 and the film 2 for sealing provided on the support body 1.

As the support 1, a polymer film, a metal foil, or the like can be used. As a polymer film, Polyolefin films, such as a polyethylene film and a polypropylene film; Vinyl films such as polyvinyl chloride films; Polyester films such as polyethylene terephthalate film; Polycarbonate film; Acetyl cellulose film; Tetrafluoroethylene films, and the like. Copper foil, aluminum foil, etc. are mentioned as metal foil.

Although the thickness of the support body 1 is not specifically limited, What is necessary is just 2-200 micrometers from a viewpoint which is excellent in workability and drying property. When the thickness of the support body 1 is 2 micrometers or more, it is easy to suppress the problem that a support body cuts at the time of coating, a problem that a support body bends by the weight of a varnish, etc. When the thickness of the support body 1 is 200 micrometers or less, it is easy to suppress the problem that the solvent drying in a varnish is disturbed, when hot air is injected from both surfaces of a coating surface and a back surface in a drying process.

In this embodiment, the support 1 does not need to be used. Moreover, you may arrange | position the protective layer for the purpose of protection of the film for sealing on the opposite side to the support body 1 of the film 2 for sealing. By forming a protective layer on the sealing film 2, handling property improves and the problem that the sealing film sticks to the back surface of a support body can be avoided when it winds up.

As the protective layer, a polymer film, a metal foil, or the like can be used. As a polymer film, Polyolefin films, such as a polyethylene film and a polypropylene film; Vinyl films such as polyvinyl chloride films; Polyester films such as polyethylene terephthalate film; Polycarbonate film; Acetyl cellulose film; Tetrafluoroethylene film etc. can be illustrated. Copper foil, aluminum foil, etc. can be illustrated as metal foil.

By the way, the mold shaping | molding of the solid or liquid resin sealing material with a metal mold | die may be used for sealing of an electronic component. For example, transfer mold molding may be used in which a pellet-type resin encapsulating material is melted and sealed by introducing a resin into a mold. However, in the transfer mold molding, since the molten resin is introduced and molded, there is a possibility that an unfilled portion is generated when the large area is to be sealed. Accordingly, in recent years, compression mold molding has been started to be used after supplying a resin encapsulant to a mold or an encapsulated body in advance. In compression mold molding, since the resin encapsulating material is directly supplied to the mold or the encapsulated body, there is an advantage that an unfilled part is hardly generated even in a large area encapsulation.

In compression mold molding, similarly to transfer mold molding, a solid or liquid resin encapsulant is used. However, when the encapsulated body is enlarged, a liquid resin encapsulation material may cause a liquid flow or the like, which may make it difficult to uniformly supply the encapsulated object. In addition, since it is necessary to supply resin uniformly on a to-be-sealed | blocked body, as a solid resin sealing material, the resin sealing material of granules or powder may be used instead of the conventional pellet-type resin. However, as the resin encapsulating material of granules or powders, it is difficult to uniformly supply the resin encapsulating material onto a mold or an encapsulated object, and since the encapsulating material is a source of oscillation because it is a granule or powder, Or contamination of the clean room may be a concern.

In mold molding, the resin is molded in a mold, so that the mold is enlarged in order to increase the size of the sealing structure. However, in order to increase the size of the mold, since high mold precision is required, the difficulty in technology is increased, and the manufacturing cost of the mold is greatly increased.

On the other hand, according to the said film for sealing, uniform supply of resin to a to-be-sealed body and reduction of oscillation are possible. Moreover, not only mold molding but also the embedding capability which can be sealed by the shaping | molding method (laminate, press etc.) which does not require a metal mold | die (high pressure die etc.) can be obtained.

The film for sealing of this embodiment is used suitably for sealing an electronic component. In particular, it can use suitably for sealing the electronic component in the thin semiconductor device which does not have package substrates, such as a fan out type wafer level package and a fan out type panel level package.

<The manufacturing method of the film for sealing>

The film 2 for sealing of this embodiment is a thermosetting resin, The process (preparation process) of preparing the resin composition containing a reactive functional group equivalent larger than 250 g / mol, an inorganic filler, and the said resin composition are film-formed Molding (molding step).

In a preparatory process, varnish (varnish-like resin composition) is produced by mixing the structural components (thermosetting resin, hardening | curing agent, hardening accelerator, an inorganic filler, a solvent, etc.) of the film 2 for sealing of this embodiment. A mixing method is not specifically limited, A mill, a mixer, and a stirring blade can be used. A solvent (organic solvent etc.) can be used in order to prepare a varnish by melt | dissolving and disperse | distributing the structural component of the resin composition which is a material of the sealing film 2, or to assist in preparing a varnish. Most of the solvent can be removed in the drying step after coating.

In the shaping | molding process, after apply | coating the said varnish to the support body 1 (film support body etc.), it heat-drys by hot air spray etc., for example. Thereby, the varnish is shape | molded in a film form, and the sealing film 10 with a support body containing the sealing film 2 can be obtained. Although it does not specifically limit as a coating (coating) method, For example, coating apparatuses, such as a comma coater, a bar coater, a kiss coater, a roll coater, a gravure coater, and a die coater, can be used.

<Bag structure>

The sealing structure of this embodiment contains a to-be-sealed | blocked body and the hardened | cured material (sealing part) of the film for sealing of this embodiment which seals the said to-be-sealed body. Examples of the sealing structure include electronic component devices. The electronic component device includes an electronic component as a sealed body. As an electronic component, it is a semiconductor element; Semiconductor wafers; integrated circuit; Semiconductor devices; Filters such as SAW filters; Passive components, such as a sensor, etc. are mentioned. You may use the semiconductor element obtained by individualizing a semiconductor wafer. An electronic component device includes a semiconductor device including a semiconductor element or a semiconductor wafer as an electronic component; A printed wiring board may be sufficient. The sealing structure of this embodiment may contain the some to-be-sealed | blocked body. The plurality of sealed bodies may be the same kind or different kinds.

Next, the manufacturing method of the sealing structure using the film for sealing of this embodiment is demonstrated. Here, the case where the electronic component which is a to-be-sealed body is a semiconductor element is demonstrated. FIG. 2: is a schematic cross section for demonstrating one Embodiment of the manufacturing method of the semiconductor device which is an electronic component apparatus as one Embodiment of the manufacturing method of the sealing structure. The manufacturing method of this embodiment arrange | positions the some semiconductor element 20 which is a to-be-encapsulated object (embedded object) on the board | substrate 30 which has the provisional fixing material 40 side by side (FIG. 2 ( a)], the supporter 1 and the encapsulation film 10 attached to the supporter including the encapsulation film 2 provided on the supporter 1 are opposed to the semiconductor element 20, and then the semiconductor element 20 The process of embedding the semiconductor element 20 in the sealing film 2 (FIG. 2 (b)) by pressing (laminating) the sealing film 2 on heating under 20, and the semiconductor element 20 The process (FIG. 2 (c)) which hardens the film 2 for sealing embedded and obtains hardened | cured material 2a is included. In this embodiment, after sealing the semiconductor element 20 with the sealing film 2 by the lamination method, the semiconductor element embedded in the hardened | cured material 2a by thermosetting the sealing film 2 ( Although the sealing structure (electronic component apparatus) containing 20) is obtained, you may obtain the sealing structure with a compression mold.

Although it does not specifically limit as a laminator used for lamination, For example, laminators, such as a roll type and a balloon type, are mentioned. The laminator may be a balloon type capable of vacuum pressurization from the viewpoint of excellent embedding properties.

Lamination is usually carried out below the softening point of the support. It is preferable that lamination temperature (sealing temperature) is near minimum melt viscosity of the film for sealing. The pressure at the time of lamination differs depending on the size, density, etc. of the to-be-sealed body (for example, electronic components, such as a semiconductor element) to embed. The pressure at the time of lamination may be in the range of, for example, 0.2 to 1.5 MPa, or may be in the range of 0.3 to 1.0 MPa. Although lamination time is not specifically limited, 20 to 600 second may be sufficient, 30 to 300 second may be sufficient, and 40 to 120 second may be sufficient.

Curing of the film for sealing can be performed, for example in air | atmosphere or under inert gas. Curing temperature (heating temperature) is not specifically limited, 80-280 degreeC may be sufficient, 100-240 degreeC may be sufficient, and 120-200 degreeC may be sufficient as it. When curing temperature is 80 degreeC or more, hardening of the film for sealing fully advances and generation | occurrence | production of a problem can be suppressed. When hardening temperature is 280 degrees C or less, there exists a tendency which can suppress generation | occurrence | production of the thermal damage to another material. Curing time (heating time) is not specifically limited, 30-600 minutes may be sufficient, 45-300 minutes may be sufficient, and 60-240 minutes may be sufficient. In the case where the curing time is in these ranges, the curing of the film for sealing proceeds sufficiently, and better production efficiency is obtained. In addition, hardening conditions may combine several conditions.

In addition, in this embodiment, you may pass each process of the following insulating layer formation, wiring pattern formation, ball mount, and dicing, and may obtain the semiconductor device which is a sealing structure.

First, the insulating layer 50 is provided in the side by which the semiconductor element 20 of the sealing molding 100 peeled from the board | substrate 30 is exposed (FIG. 3A and 3B). Next, after wiring pattern formation is performed with respect to the insulating layer 50, ball mounting is performed and the insulating layer 52, the wiring 54, and the ball 56 are formed.

Next, the sealing molding is separated into pieces by the dicing cutter 60 to obtain the semiconductor device 200.

As mentioned above, although preferred embodiment of this invention was described, this invention is not necessarily limited to embodiment mentioned above, You may change suitably in the range which does not deviate from the meaning.

EXAMPLE

EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to these Examples at all.

In the Examples and Comparative Examples, the following materials were used.

(Thermosetting resin)

A1: Flexible skeletal-containing bisphenol A type epoxy resin (DIC Corporation make, brand name "EXA4816", epoxy group equivalent: 403 g / eq, epoxy resin which shows liquid state at 25 degreeC)

A2: Flexible skeleton containing bisphenol-A epoxy resin (DIC Corporation make, brand name "EXA4850-1000", epoxy group equivalent: 350 g / eq, epoxy resin which shows liquid state at 25 degreeC)

A3: Orthocresol novolak-type epoxy resin (DIC Corporation make, brand name "N500P-1", epoxy group equivalent: 201 g / eq, epoxy resin which does not show a liquid state at 25 degreeC)

B1: hydrocarbon group-containing phenol resin (phenolic hydroxyl group equivalent: 140 g / eq)

B2: naphthalene frame | skeleton containing novolak-type phenol resin (Shin-Nitetsu Sumikin Chemical Co., Ltd. make, brand name "SN475N", phenolic hydroxyl equivalent: 205 g / eq)

B3: naphthalene frame | skeleton containing novolak-type phenol resin (Shin-Nitetsu Sumikin Chemical Co., Ltd. make, brand name "SN395", phenolic hydroxyl equivalent: 110 g / eq)

(Hardening accelerator)

C1: imidazole (Shikoku Kasei Kogyo Co., Ltd. make, brand name "2P4MZ")

(Elastomer)

D1: Acrylic acid ester polymer (Nagase Chemtex Corporation make, brand name "SG-280 EK23", molecular weight 900,000)

(Inorganic filler)

E1: silica (manufactured by Admatech Co., Ltd., product name "SX-E2", phenylaminosilane treatment, average particle diameter: 5.8 mu m)

And B1 (hydrocarbon group containing phenol resin) is resin which consists of 40 mol% of structural units represented by following formula (5), and 60 mol% of structural units represented by following formula (6).

In the present Example, B1 was prepared by the method of Unexamined-Japanese-Patent No. 2015-89949. Specifically, first, cardanol, methanol, and a 50% formaldehyde aqueous solution were mixed to obtain a mixed liquid. Subsequently, 30% sodium hydroxide aqueous solution was dripped at the obtained liquid mixture, and it reacted, and 35% hydrochloric acid was added to the obtained reaction liquid, and sodium hydroxide was neutralized. Subsequently, after adding phenol to the reaction liquid, oxalic acid was further added. Subsequently, after wash | cleaning the reaction liquid, excess phenol was distilled off. This obtained B1.

<Production of sealing film (film type epoxy resin composition)>

(Example 1)

100 g of MEK was put into a 0.5-L polyethylene container, 18.8 g of A1, 56.3 g of A3, 45.7 g of B1, 12.1 g of D1, and 866.7 g of E1 were added and stirred with a stirring blade to disperse the inorganic filler E1. Then, 0.4g of hardening | curing agents C1 were added and it stirred for 30 minutes. The obtained liquid mixture was filtered with nylon # 150 mesh (opening 106 micrometers), and the filtrate was extract | collected. This obtained the varnish epoxy resin composition. This varnish-like epoxy resin composition was apply | coated on PET film using the coating machine on condition of the following. This produced the film for sealing of thickness 210micrometer on the support body (PET film).

Coating head method: comma

Coating and drying rate: 0.5 m / min

Drying condition (temperature / furnace length): 80 ℃ / 1.5m, 100 ℃ / 1.5m

Film type support: PET film having a thickness of 38 μm

The surface of the sealing film was protected by arrange | positioning a protective layer (50-micrometer-thick polyethylene terephthalate film) on the opposite side to the support body in the sealing film. And in each following evaluation, evaluation was performed after peeling a support body and a protective layer. The same applies to the following Examples and Comparative Examples.

(Examples 2 to 4 and Comparative Examples 1 to 2)

Example 2-Example 4 and a comparison were carried out similarly to Example 1 except having changed the kind and compounding quantity of the used material (A1, A3, B1, C1, D1, and E1) as shown in Table 1. The varnish-like epoxy resin composition of Example 1 was obtained. Subsequently, except for using the varnish-like epoxy resin compositions of Examples 2 to 4 and Comparative Example 1, respectively, in place of the varnish-like epoxy resin of Example 1, the same procedures as those of Example 1 were performed. The film for sealing of Example 4 and the comparative example 1 (210 micrometers in thickness) was obtained. And the compounding quantity of each material of Table 1 is a compounding quantity (mass%) based on the total mass of the film for sealing.

<Evaluation>

By the following method, the elasticity modulus and glass transition temperature of the curvature and the crack of the sealing structure, and the hardening of the film for sealing were evaluated. And in the evaluation of the elasticity modulus after hardening of the sealing film, and glass transition temperature, the sealing film of 110 micrometers in thickness which produced on the following conditions using the varnish-like epoxy resin composition of an Example and a comparative example was used.

Coating head method: comma

Coating and drying speed: 1 m / min

Drying condition (temperature / furnace length): 80 ℃ / 1.5m, 100 ℃ / 1.5m

Film type support: PET film having a thickness of 38 μm

(1) bending of encapsulation structure

The sealing film of 210 micrometers in thickness was laminated on the silicon wafer (12 inch size) of thickness 800micrometer on the following conditions, and the uncured sealing structure (epoxy resin sealing body) was obtained.

Laminator device: vacuum pressurized laminator MVLP-500 manufactured by Meiki Seisakusho

Lamination temperature: 90 ° C

Lamination Pressure: 0.5MPa

Vacuum drain time: 30 seconds

Lamination time: 40 seconds

The obtained uncured sealing structure was cured under the following conditions to obtain a sealing structure (epoxy resin cured product).

Oven: SAFETY OVEN SPH-201 manufactured by SPECK Corporation

Oven temperature: 140 ° C

Time: 120 minutes

The curvature amount of the obtained sealing structure was measured using the following apparatus.

Warpage measurement stage apparatus name: CP-500 manufactured by Combs

Warpage measurement laser light device name: LK-030 manufactured by Keyence Co., Ltd.

As an index of cracking property, it evaluated by the curvature after hardening based on the following evaluation criteria.

A: warpage amount ≤ 2.0 mm

B: deflection> 2.0 mm

(2) Modulus of elasticity and glass transition temperature Tg after hardening of the film for sealing

On the following conditions, the film for sealing of an Example and a comparative example was laminated | stacked on copper foil, and the film for sealing with copper foil was obtained.

Laminator device: vacuum pressurized laminator MVLP-500 manufactured by Meiki Seisakusho

Lamination temperature: 110 ° C

Lamination Pressure: 0.5MPa

Vacuum drain time: 30 seconds

Lamination time: 40 seconds

The film for sealing with copper foil was stuck to the SUS board, the film for sealing was hardened on the following conditions, and the hardened | cured material (epoxy resin hardened | cured body with copper foil) of the film for sealing with copper foil was obtained.

Oven: SAFETY OVEN SPH-201 manufactured by SPECK Corporation

Oven temperature: 140 ° C

Time: 120 minutes

After peeling copper foil from the hardened | cured material of the sealing film with copper foil, the hardened | cured material of the sealing film was cut into 4 mm x 30 mm, and the test piece was produced. The elasticity modulus and glass transition temperature of the produced test piece were measured on condition of the following.

Measuring device: DVE (DVE-V4 manufactured by Rheology Corporation)

Measurement temperature: 25 to 300 ° C

Heating rate: 5 ℃ / min

When the modulus of elasticity is high, warpage and cracking tend to occur in the sealing structure, and the modulus of elasticity was evaluated according to the following criteria.

A: Modulus of elasticity (30 ° C) ≤ 25 GPa

B: Modulus of elasticity (30 ° C)> 25GPa

When the glass transition temperature Tg was low, since the thermal reliability of the sealing structure deteriorated, glass transition temperature was evaluated according to the following criteria.

A: glass transition temperature (° C.)

B: glass transition temperature (° C.) <100

<Evaluation result>

The evaluation results are shown in Table 1.

TABLE 1

1: support
2: film for encapsulation
2a: hardened | cured material (sealing part)
10: sealing film attached to the support
20: semiconductor element (encapsulated body)
30: substrate
40: temporarily fixed material
50: insulation layer
52: insulation layer
54: wiring
56: ball
60: dicing cutter
100: sealing molding (sealing structure)
200: semiconductor device (sealing structure)

Claims (16)

As a manufacturing method of the film for sealing containing a thermosetting resin and an inorganic filler,
Preparing a resin composition containing a resin having a reactive functional group equivalent of more than 250 g / mol as the thermosetting resin and the inorganic filler; And
Process of molding the resin composition into a film form
A manufacturing method of the film for sealing containing. The method of claim 1,
The said resin composition is a manufacturing method of the film for sealing whose glass transition temperature after hardening is 80-180 degreeC. The method according to claim 1 or 2,
The manufacturing method of the film for sealing whose resin whose said reactive functional group equivalent is larger than 250 g / mol contains resin whose reactive functional group equivalent is 300-410 g / mol. The method according to any one of claims 1 to 3,
The said resin composition is a manufacturing method of the film for sealing which further contains resin whose reactive functional group equivalent is 100-210 g / mol as said thermosetting resin. The method according to any one of claims 1 to 4,
The said resin composition is the said thermosetting resin, The film for sealing further containing resin which has the reactive functional group equivalent of 1 / 2.9-1/2 times with respect to the reactive functional group equivalent of the resin whose said reactive functional group equivalent is larger than 250 g / mol. Method of preparation. The method according to any one of claims 1 to 5,
The resin having a reactive functional group equivalent of more than 250 g / mol includes an epoxy resin. The method according to any one of claims 1 to 6,
The film thickness of the said sealing film is 20-250 micrometers, The manufacturing method of the sealing film. It contains a thermosetting resin and an inorganic filler,
The thermosetting resin includes a resin having a reactive functional group equivalent of more than 250 g / mol,
Encapsulation film. The method of claim 8,
The film for sealing whose glass transition temperature after hardening is 80-180 degreeC. The method according to claim 8 or 9,
The resin for sealing which the said reactive functional group equivalent is larger than 250 g / mol contains resin whose reactive functional group equivalent is 300-410 g / mol. The method according to any one of claims 8 to 10,
The said thermosetting resin is a film for sealing which further contains resin whose reactive functional group equivalent is 100-210 g / mol. The method according to any one of claims 8 to 11,
The thermosetting resin further includes a resin having a reactive functional group equivalent of 1 / 2.9 to 1/2 times the reactive functional group equivalent of the resin having the reactive functional group equivalent of more than 250 g / mol. The method according to any one of claims 8 to 12,
The resin for sealing, wherein the resin having a reactive functional group equivalent greater than 250 g / mol comprises an epoxy resin. The method according to any one of claims 8 to 13,
The film for sealing whose film thickness is 20-250 micrometers. The sealing structure containing the to-be-sealed | blocked body and the hardened | cured material of the film for sealing of any one of Claims 8-14 which seal the said to-be-sealed body. The process of sealing a to-be-sealed | blocked body using the film for sealing obtained by the method in any one of Claims 1-7, or the film for sealing in any one of Claims 8-14. The manufacturing method of the sealing structure containing.

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