JP2018064054A - Encapsulation material, and manufacturing method of encapsulation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an encapsulation material capable of improving the manufacturing efficiency and simplifying the process while ensuring excellent encapsulation performance and sealing performance of electromagnetic waves, and a manufacturing method of an encapsulation structure using the encapsulation material.SOLUTION: An encapsulation material 1 is used for encapsulating an electronic component 10 which includes a metal layer 30 and a resin layer 20a disposed over the metal layer 30 with a resin layer 20a. The manufacturing method of an encapsulation structure which includes an encapsulating step to encapsulate the electronic component 10 which includes a metal layer 30 and a resin layer 20a disposed over the metal layer 30 with a resin layer 20a of the encapsulation material 1.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a sealing material and a method for manufacturing a sealing structure.

  In recent years, with the demand for downsizing of electronic devices, further improvement has been demanded for high-density mounting of semiconductor elements. For example, in a so-called stack package type semiconductor device in which a plurality of semiconductor elements are stacked in multiple stages, since the semiconductor elements are integrated and arranged, a problem due to external noise (electromagnetic interference) may occur. Such noise problems become more prominent as electronic devices become more digital, faster, and higher in frequency. Therefore, in order to suppress the influence of noise, an electromagnetic wave shielding material that shields electromagnetic waves is used. For example, an electromagnetic wave shielding sheet is formed on a sealing material that seals a semiconductor element (for example, the following) Patent Document 1).

  Regarding the formation of an electromagnetic wave shielding sheet, for example, a method for manufacturing a semiconductor device described in Patent Document 2 is known. In the method of manufacturing a semiconductor device described in Patent Document 2, in a process of sealing a semiconductor element with a sealing material by transfer molding using an upper mold and a lower mold, a release film ( An electromagnetic wave shielding resin is applied to the carrier film), and the electromagnetic wave shielding resin is transferred and cured on the formed sealing material in the step of forming the sealing material.

Japanese Patent No. 4133737 JP 2007-287937 A

  However, the method described in Patent Document 2 requires a work of applying the electromagnetic wave shielding resin to the carrier film every time a sealing material is formed, and thus has a problem that many processes are required and labor is required. . In the manufacturing process of a semiconductor device, further improvement in production efficiency is required.

  The present invention has been made in order to solve the above-described problems. A sealing material capable of simplifying the process and improving production efficiency while ensuring excellent sealing properties and electromagnetic wave shielding properties, and An object of the present invention is to provide a manufacturing method of a sealing structure using the sealing material.

  The sealing material according to the present invention includes a metal layer and a resin layer disposed on the metal layer, and is used for sealing an electronic component with the resin layer.

  According to the sealing material according to the present invention, since the electromagnetic wave can be shielded using the metal layer of the sealing material, when the electronic component is sealed with the resin layer, a step of separately forming the electromagnetic wave shielding layer, There is no need to provide an electromagnetic shielding material in advance. Therefore, according to the sealing material according to the present invention, it is possible to simplify processes and improve production efficiency when sealing electronic components while ensuring excellent sealing properties and electromagnetic wave shielding properties. .

  A manufacturing method of a sealing structure according to the present invention includes a sealing step of sealing an electronic component with the resin layer of a sealing material including a metal layer and a resin layer disposed on the metal layer. .

  According to the manufacturing method of the sealing structure according to the present invention, since the electromagnetic wave can be shielded by using the metal layer of the sealing material, the electromagnetic wave shielding layer is separately provided when the electronic component is sealed by the resin layer. There is no need to provide a process for forming or an electromagnetic wave shielding material in advance. Therefore, according to the method for manufacturing a sealing structure according to the present invention, while ensuring excellent sealing properties and electromagnetic wave shielding properties, it is possible to simplify processes and improve production efficiency when sealing electronic components. Can be planned.

  ADVANTAGE OF THE INVENTION According to this invention, the sealing material which can aim at the simplification of a process and the improvement of production efficiency, ensuring the outstanding sealing performance and electromagnetic wave shielding, and the sealing structure using the said sealing material A method of manufacturing a body can be provided. For example, according to the present invention, it is possible to reduce the step of arranging a metal layer for shielding electromagnetic waves and improve the production efficiency.

It is a schematic cross section showing one embodiment of a sealing structure. It is a schematic cross section for demonstrating one Embodiment of the manufacturing method of a sealing structure. It is a schematic cross section for demonstrating one Embodiment of the manufacturing method of a sealing structure.

  In this specification, the terms “layer” and “film” include a structure formed in part in addition to a structure formed in the entire surface when observed as a plan view. Is done. In the present specification, numerical ranges indicated using “to” indicate ranges including the numerical values described before and after “to” as the minimum value and the maximum value, respectively. In the numerical ranges described stepwise in the present specification, the upper limit value or lower limit value of a numerical range of a certain step may be replaced with the upper limit value or lower limit value of the numerical range of another step. In the numerical range described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples. “A or B” only needs to include either A or B, and may include both. The materials exemplified in the present specification can be used singly or in combination of two or more unless otherwise specified. In the present specification, the content of each component in the composition is the sum of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. Means quantity.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The dimensional ratio in each drawing does not necessarily match the actual dimensional ratio. The present invention is not necessarily limited to the following embodiments, and modifications may be made as appropriate without departing from the spirit of the present invention.

(Sealing structure)
FIG. 1 is a schematic cross-sectional view showing a sealing structure according to the present embodiment. A sealing structure (sealed molded product, electronic component device) 100 according to the present embodiment includes an electronic component 10, a sealing portion (resin cured product) 20 that seals the electronic component 10, and a sealing portion 20. And a metal layer 30 disposed on the surface.

  The sealing structure 100 includes a plurality of electronic components 10, and the sealing unit 20 seals the plurality of electronic components 10. The metal layer 30 of the sealing structure 100 is disposed on the entire surface of the sealing portion 20.

  Examples of the electronic component 10 include a semiconductor element; a semiconductor wafer; an integrated circuit; a semiconductor device; a filter such as a SAW filter; a passive component such as a sensor. A semiconductor element obtained by separating a semiconductor wafer may be used. The sealing structure (electronic component device) according to the present embodiment may be a semiconductor device including a semiconductor element or a semiconductor wafer as an electronic component; a printed wiring board or the like. The thickness of the electronic component may be, for example, 10 to 2000 μm or 25 to 1000 μm. The plurality of electronic components 10 may be of the same type or different types. The thickness of the metal layer 30 will be described later in the description of the sealing material.

  The sealing structure is not limited to the above embodiment. For example, the constituent material of the sealing portion that seals the electronic component may be a semi-cured or uncured resin instead of the cured resin (for example, FIG. 3A described later). The sealing structure according to the present embodiment may further include an intermediate layer between the sealing portion and the metal layer.

(Encapsulant)
The sealing material which concerns on this embodiment is demonstrated. According to the sealing material according to the present embodiment, it is possible to simplify the process when sealing the electronic component and to improve the production efficiency. According to the sealing material according to the present embodiment, the resin can be uniformly supplied onto the object to be sealed (electronic component) and the generation of dust can be reduced.

  The metal layer 30 provided in the sealing material 1 may be a layer containing a metal capable of shielding electromagnetic waves. Examples of the constituent material of the metal layer 30 include copper, aluminum, and iron. The constituent material of the metal layer 30 is preferably copper from the viewpoint of high electromagnetic shielding properties and easy availability of the material. For example, the metal layer 30 may be a metal foil or a copper foil. The metal layer 30 may have a metal pattern as long as the effect of shielding electromagnetic waves is not impaired, and the metal pattern can be obtained by patterning the metal layer 30 having no pattern.

  The thickness of the metal layer 30 is preferably 0.1 μm or more, more preferably 1 μm or more, and even more preferably 3 μm or more, from the viewpoint of easily ensuring electromagnetic shielding properties. The thickness of the metal layer 30 is preferably 210 μm or less, more preferably 105 μm or less, and even more preferably 70 μm or less, from the viewpoint of excellent handleability of the sealing material.

  From the viewpoint of excellent adhesiveness, the thickness of the resin layer 20a included in the sealing material 1 may be 10 μm or more, or 20 μm or more. The thickness of the resin layer 20a may be 500 μm or less or may be 250 μm or less from the viewpoint of further improving sealing performance. In addition, the thickness of the sealing part 20 after hardening in a sealing structure may be the same as the thickness of the said resin layer 20a.

  The constituent material of the resin layer 20a is not particularly limited as long as it is usually a resin used for sealing electronic components. The resin layer 20a is preferably a layer made of a curable resin composition. The curable resin composition may be either thermosetting or photocurable.

  As a thermosetting resin composition, the resin composition containing (A) thermosetting component and (B) inorganic filler is mentioned, for example.

  Examples of the thermosetting component (A) include thermosetting resins (epoxy resins, urea resins, melamine resins, polyesters, silicone resins, polyurethanes, etc.), curing agents, and the like. (A) The thermosetting component contains, for example, (a1) an epoxy resin and (a2) a curing agent.

  The (a1) epoxy resin can be used without particular limitation as long as it has two or more glycidyl groups in one molecule. As epoxy resins, bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type Epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin, bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin, bisphenol Z type epoxy resin, bisphenol S type epoxy resin (Hexanediol bisphenol S diglycidyl ether, etc.), novolac phenol type epoxy resin, biphenyl type epoxy resin, Phthalene type epoxy resins, dicyclopentadiene type epoxy resins, bixylenol type epoxy resins (such as bixylenol diglycidyl ether), hydrogenated bisphenol A type epoxy resins (such as hydrogenated bisphenol A glycidyl ether), dibasic acid modification of these resins Examples thereof include diglycidyl ether type epoxy resins and aliphatic epoxy resins. (A1) An epoxy resin can be used individually by 1 type or in combination of 2 or more types.

  Examples of commercially available epoxy resins include “Epiclon HP-4032D”, “EXA-4750”, and “HP-4710” manufactured by DIC Corporation, and “NC-7000” (naphthalene skeleton-containing polyfunctional product) manufactured by Nippon Kayaku Co., Ltd. Epoxides of condensates of phenols and aromatic aldehydes having a phenolic hydroxyl group, such as “EPPN-502H” (trisphenol epoxy resin) manufactured by Nippon Kayaku Co., Ltd. (Trisphenol type epoxy resin); Dicyclopentadiene aralkyl type epoxy resin such as “Epiclon HP-7200H” (dicyclopentadiene skeleton-containing polyfunctional solid epoxy resin) manufactured by DIC Corporation; “NC” manufactured by Nippon Kayaku Co., Ltd. -3000H "(biphenyl skeleton-containing polyfunctional solid epoxy resin) Biphenylaralkyl type epoxy resins; “Epiclon N660” and “Epiclon N690” manufactured by DIC Corporation; novolak type epoxy resins such as “EOCN-104S” manufactured by Nippon Kayaku Co., Ltd .; “TEPIC” manufactured by Nissan Chemical Industries, Ltd. "Epiclon 860", "Epicron 900-IM", "Epicron EXA-4816" and "Epicron EXA-4822" manufactured by DIC Corporation; Asahi Ciba Co., Ltd. "Araldite AER280" manufactured by Toto Kasei Co., Ltd. "Epototo YD-134" manufactured by Toto Kasei Co., Ltd. "JER834" and "JER872" manufactured by Mitsubishi Chemical Corporation; "ELA-134" manufactured by Sumitomo Chemical Co., Ltd .; "Epicoat 807", "Epicoat" 15 ”,“ Epicoat 825 ”,“ Epicoat 827 ”,“ Epicoat 828 ”,“ Epicoat 834 ”,“ Epicoat 1001 ”,“ Epicoat 1004 ”,“ Epicoat 1007 ”and“ Epicoat 1009 ”;“ DER ”manufactured by Dow Chemical -330 "," DER-301 "and" DER-361 "; bisphenol A type epoxy resins such as" YD8125 "and" YDF8170 "manufactured by Toto Kasei Co., Ltd .; bisphenol F such as" JER806 "manufactured by Mitsubishi Chemical Corporation Type epoxy resin; phenol novolac type epoxy resin such as “Epiclon N-740” manufactured by DIC Corporation; and aliphatic epoxy resin such as “Nadecor DLC301” manufactured by Nagase ChemteX Corporation. These epoxy resins can be used alone or in combination of two or more.

  (A1) The content of the epoxy resin is preferably 50% by mass or more based on the total mass of the thermosetting resin, from the viewpoint of easily obtaining a cured product having excellent strength, and is 80% by mass or more. More preferably, it is more preferably 90% by mass or more. (A1) The content of the epoxy resin may be 100% by mass based on the total mass of the thermosetting resin.

  The content of the thermosetting resin is preferably 1% by mass or more and more preferably 5% by mass or more based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of easily obtaining excellent fluidity. preferable. The content of the thermosetting resin is preferably 30% by mass or less, based on the total mass of the resin composition (excluding the mass of the solvent), from the viewpoint of easily suppressing the occurrence of cracks and cracks on the film surface, and 25% by mass. % Or less is more preferable, and 20% by mass or less is still more preferable.

  The (a2) curing agent can be used without particular limitation as long as it has two or more functional groups that react with a glycidyl group in one molecule. (A2) As a hardening | curing agent, a phenol resin, an acid anhydride, etc. are mentioned. (A2) A hardening | curing agent can be used individually by 1 type or in combination of 2 or more types.

  The phenol resin is not particularly limited as long as it has two or more phenolic hydroxyl groups in one molecule, and a known phenol resin can be used. Examples of phenol resins include resins obtained by condensation or co-condensation of phenols and / or naphthols and aldehydes under an acidic catalyst, biphenyl skeleton type phenol resins, paraxylylene-modified phenol resins, metaxylylene / paraxylylene-modified phenol resins. Melamine-modified phenol resin, terpene-modified phenol resin, dicyclopentadiene-modified phenol resin, cyclopentadiene-modified phenol resin, polycyclic aromatic ring-modified phenol resin, xylylene-modified naphthol resin, and the like. Examples of phenols include phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and the like. Examples of naphthols include α-naphthol, β-naphthol, dihydroxynaphthalene and the like. Examples of aldehydes include formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde and the like.

  Commercially available phenol resins include “Phenolite LF2882”, “Phenolite LF2822”, “Phenolite TD-2090”, “Phenolite TD-2149”, “Phenolite VH-4150” manufactured by Dainippon Ink and Chemicals, Inc. And “Phenolite VH4170”; “XLC-LL” and “XLC-4L” manufactured by Mitsui Chemicals, Inc .; “SN-100”, “SN-300”, and “SN-395” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. And “SN-400”; “SK Resin HE910” manufactured by Air Water Co., Ltd .; “PAPS-PN2” manufactured by Asahi Organic Materials Co., Ltd .; “DL-92” manufactured by Meiwa Kasei Co., Ltd., and the like.

  (A2) The content of the curing agent is 1 to 20% by mass based on the total mass of the resin composition (excluding solvents such as organic solvents) from the viewpoint of excellent curability of the thermosetting resin. Preferably, it is 2-15 mass%, More preferably, it is 3-10 mass%.

  (A1) Ratio of epoxy resin glycidyl group equivalent (epoxy equivalent) and (a2) functional group (for example, phenolic hydroxyl group) reacting with glycidyl group of curing agent (for example, hydroxyl group equivalent) ((a1) epoxy The equivalent of the glycidyl group of the resin / (a2) the equivalent of the functional group that reacts with the glycidyl group of the curing agent) is preferably 0.7 to 2.0, more preferably 0.8 to 1.8. Preferably, it is 0.9-1.7. In these cases, unreacted (a1) epoxy resin and / or unreacted (a2) curing agent hardly remains, and desired cured film properties are easily obtained.

  (A) The thermosetting component may contain (a3) a curing accelerator. (A3) There is no restriction | limiting in particular as a hardening accelerator. (A3) The curing accelerator is preferably at least one selected from the group consisting of amine-based curing accelerators and phosphorus-based curing accelerators. In particular, as the (a3) curing accelerator, an amine-based curing accelerator is preferable from the viewpoint of abundant derivatives and a viewpoint that a desired active temperature can be easily obtained, and an imidazole compound, an aliphatic amine, and an alicyclic group. At least one selected from the group consisting of amines is more preferable, and imidazole compounds are more preferable. (A3) A hardening accelerator can be used individually by 1 type or in combination of 2 or more types.

  The content of (a3) curing accelerator is preferably 0.01 to 5% by mass, more preferably 0.1 to 3% by mass, based on the total amount of (a1) epoxy resin and (a2) curing agent. 0.3-1.5 mass% is still more preferable. (A3) When the content of the curing accelerator is 0.01% by mass or more, a sufficient curing acceleration effect is easily obtained. (A3) When the content of the curing accelerator is 5% by mass or less, curing is unlikely to proceed during the process of manufacturing the sealing material (for example, coating and drying) or during storage of the sealing material. It is easy to prevent cracking of the resin layer and molding defects accompanying an increase in melt viscosity.

  The curable resin composition of this embodiment preferably contains a resin that is liquid at 25 ° C. (for example, a liquid epoxy resin). The content of the liquid resin is preferably 20% by mass or more, more preferably 30% by mass or more, and more preferably 50% by mass or more, based on the total mass of the thermosetting resin, from the viewpoint of excellent film formability of the resin layer. Is more preferable. The content of the liquid resin is 95% by mass or less based on the total mass of the thermosetting resin, from the viewpoint of easily suppressing an excessive increase in the tackiness of the film and from the viewpoint of easily suppressing edge fusion. Is preferable, 90 mass% or less is more preferable, and 80 mass% or less is still more preferable. The content of the liquid epoxy resin may be 100% by mass based on the total mass of the thermosetting resin.

  (B) As an inorganic filler, a conventionally well-known inorganic filler can be used and it is not limited to a specific thing. (B) As a constituent material of the inorganic filler, for example, barium sulfate; barium titanate; silicas such as amorphous silica, crystalline silica, fused silica, and spherical silica; talc; clay; magnesium carbonate; calcium carbonate; Examples thereof include aluminum; aluminum hydroxide; silicon nitride; aluminum nitride. (B) The constituent material of the inorganic filler has a relatively small thermal expansion coefficient, as well as a viewpoint of easily obtaining a dispersibility improving effect in the resin and a sedimentation suppressing effect in the varnish by surface modification or the like. From the viewpoint of easily obtaining desired cured film properties, silicas are preferable. (B) An inorganic filler can be used individually by 1 type or in combination of 2 or more types.

  (B) The inorganic filler may be surface-modified. The method for surface modification is not particularly limited. Surface modification using a silane coupling agent is preferable from the viewpoint of simple treatment, rich types of functional groups, and easy provision of desired characteristics.

  Examples of the silane coupling agent include alkyl silane, alkoxy silane, vinyl silane, epoxy silane, amino silane, acrylic silane, methacryl silane, mercapto silane, sulfide silane, isocyanate silane, sulfur silane, styryl silane, alkyl chloro silane, and the like. Among the commercially available inorganic fillers, examples of the inorganic filler surface-modified with a silane coupling agent include “SC5500-SXE” and “SC2500-SXJ” manufactured by Admatechs Co., Ltd. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

  Specific examples of the silane coupling agent include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, and isobutyl. Trimethoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, Diphenyldimethoxysilane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, n Octyldimethylchlorosilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimethoxy Silane, 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxy Silane, bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxy Silane, vinyltriisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxy Examples include silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3-aminopropyltriethoxysilane, aminosilane (phenylaminosilane and the like), and the like. These silane coupling agents can be used alone or in combination of two or more.

  (B) The average particle diameter of the inorganic filler is not particularly limited, but is preferably 0.01 to 50 μm, more preferably 0.1 to 25 μm, and still more preferably 0.3 to 10 μm. (B) When the average particle diameter of an inorganic filler is 0.01 micrometer or more, aggregation of an inorganic filler is suppressed easily and an inorganic filler can be fully fully disperse | distributed easily. (B) When the average particle diameter of an inorganic filler is 50 micrometers or less, sedimentation (for example, sedimentation in a varnish) of an inorganic filler can be suppressed easily and it is easy to form a homogeneous resin layer.

  (B) The content of the inorganic filler is preferably 95% by mass or less, and more preferably 90% by mass or less, based on the total mass of the resin composition (excluding solvents such as organic solvents). In these cases, good fluidity can be secured while realizing low warpage of the sealing structure, and good adhesive strength between the metal layer and the resin layer in the sealing material can be obtained. In addition, the effect of easily suppressing the cracking of the resin layer in the drying process during the production of the sealing material, the effect of improving the adhesion between the resin layer and the metal layer, and sealing the object to be sealed The effect which becomes easy can be acquired suitably. (B) The content of the inorganic filler is 50% by mass or more from the viewpoint of easily preventing warpage of the sealing structure due to the difference in thermal expansion coefficient between the sealed body and the sealing portion. Preferably, 60 mass% or more is more preferable, and 65 mass% or more is still more preferable. From these viewpoints, the content of the (B) inorganic filler is preferably 50 to 95% by mass, and more preferably 60 to 90% by mass.

  The resin composition of this embodiment may contain (C) elastomer (flexible agent) as needed. (C) By using an elastomer, warping after sealing (for example, the warping amount of the sealing structure) and cracking of the resin in the sealing structure can be effectively reduced.

  Examples of the elastomer (C) include thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, and polybutadiene; NR (natural rubber), NBR (acrylonitrile-butadiene) Rubber), rubber particles such as acrylic rubber, urethane rubber and silicone powder; methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer, etc. And rubber particles having a core-shell structure. (C) The elastomer is preferably at least one selected from the group consisting of styrene butadiene particles, silicone powder, silicone oil and silicone oligomer from the viewpoint of excellent dispersibility and solubility. (C) An elastomer can be used individually by 1 type or in combination of 2 or more types.

  (C) There is no restriction | limiting in particular in the average particle diameter of an elastomer. (C) The average particle diameter of the elastomer is preferably 50 μm or less from the viewpoint of excellent embedding between electronic components (for example, embedding for eWLB use). (C) The average particle diameter of the elastomer is preferably 0.1 μm or more from the viewpoint of excellent dispersibility.

  (C) You may use a commercial item as an elastomer. (C) As a commercial product of elastomer, for example, “B series”, “M series” and “FM series” (all trade names) of KANE ACE (“KANE ACE” is a registered trademark) manufactured by Kaneka Corporation; Examples include “KMP series” manufactured by Shin-Etsu Chemical Co., Ltd. Some commercially available (C) elastomers are dispersed in advance in a liquid resin (for example, a liquid epoxy resin) instead of the elastomer alone, but can be used without any problem. Examples of such commercially available products include “MX-136” and “MX-965” manufactured by Kaneka Corporation.

  The resin composition of this embodiment may contain (D) an organic solvent. (D) The organic solvent may be an organic solvent derived from the varnish that remains without being removed in the drying step during the production (such as coating) of the sealing material.

  (D) As an organic solvent, a conventionally well-known organic solvent can be used. (D) As an organic solvent, the solvent which can melt | dissolve components other than (B) inorganic filler can be used. Examples of the organic solvent (D) include aliphatic hydrocarbons, aromatic hydrocarbons, terpenes, halogens, esters, ketones, alcohols, aldehydes and the like.

  The specific (D) organic solvent is selected from the group consisting of esters, ketones and alcohols from the viewpoint of low environmental burden and from the viewpoint of easily dissolving the (a1) epoxy resin and (a2) curing agent. At least one of these is preferred. Among these, ketones are preferable from the viewpoint of easily dissolving the (a1) epoxy resin and the (a2) curing agent. Among the ketones, at least one selected from the group consisting of acetone, methyl ethyl ketone and methyl isobutyl ketone is preferable from the viewpoint of low volatility at room temperature and easy removal during drying.

  (D) The content of the organic solvent is preferably 0.2 to 2.0% by mass, preferably 0.3 to 1.0% by mass based on the total mass of the resin composition (including solvents such as organic solvents). Is more preferable. (D) When the content of the organic solvent is 0.2% by mass or more, the resin composition (epoxy resin composition, etc.) becomes brittle, causing problems such as resin cracking, and the minimum melt viscosity is increased. It can prevent that the embedding property of a to-be-sealed body falls. (D) When the content of the organic solvent is 2.0% by mass or less, the adhesiveness of the resin composition becomes too strong and the handleability is deteriorated, and the volatilization of the organic solvent during thermosetting of the resin layer It is possible to easily prevent problems such as foaming.

  The resin composition of the present embodiment may further contain other additives as long as the effects of the present invention are not impaired. Specific examples of such additives include pigments, dyes, mold release agents, antioxidants, surface tension adjusting agents and the like.

  The sealing material 1 can be stored in a flat plate form, for example. The sealing material 1 can be wound around a cylindrical core or the like and stored in a roll form.

  The sealing material 1 may further include an intermediate layer between the resin layer 20 a and the metal layer 30. The sealing material 1 may further include a protective layer for the purpose of protecting the resin layer 20a on the opposite side of the resin layer 20a from the metal layer 30. Thereby, the handleability is improved. In addition, foreign matters can be prevented from being mixed into the resin layer 20a, and a problem that the resin layer 20a sticks to the back surface of the metal layer 30 when the sealing material 1 is stacked can be avoided.

  As the protective layer, a polymer film, a metal foil, or the like can be used. Examples of the polymer film include a polyolefin film such as a polyethylene film, a polypropylene film, and a polyvinyl chloride film; a polyester film such as a polyethylene terephthalate film; a polycarbonate film; an acetylcellulose film; and a tetrafluoroethylene film. Examples of the metal foil include copper foil and aluminum foil.

(Method for producing sealing material)
The manufacturing method of the sealing material 1 includes, for example, a step of applying a resin composition on the metal layer 30 to form a coating film, and a step of heating and drying the coating film to form the resin layer 20a. May be. The application method is not particularly limited, and examples thereof include die coating and comma coating. Examples of the heat drying method include hot air blowing.

  The coating film may be formed using a resin composition containing a solvent such as an organic solvent as a varnish. The varnish can be prepared, for example, by mixing (A) a thermosetting component, (B) an inorganic filler, (D) an organic solvent, and optional components used as necessary. The mixing method of each component is not particularly limited, and a mill, a mixer, a stirring blade or the like can be used. (D) The organic solvent can be used to prepare the varnish by dissolving the thermosetting component (A) contained in the resin composition, or to assist in preparing the varnish, Most can be removed in the drying process.

  (B) The inorganic filler may be preliminarily dispersed as required. For example, you may use the slurry obtained by disperse | distributing (B) inorganic filler in a solvent (for example, (D) organic solvent). Examples of the dispersion treatment method include a method using a nanomizer that advances dispersion by high-speed shearing force, a method (B) of pulverizing an inorganic filler using a spherical medium called beads (a method using a bead mill), and the like. Examples of commercially available silica slurries include “SC2050-MTK” manufactured by Admatechs Co., Ltd.

(Method for producing sealing structure)
The manufacturing method of the sealing structure (sealed molded product, electronic component device) according to the present embodiment includes the metal layer and the resin layer of the sealing material including the resin layer disposed on the metal layer. A sealing step of sealing the electronic component; The sealing step may be, for example, a step of heating and melting the resin layer and applying pressure to seal the electronic component with the resin layer. The manufacturing method of the sealing structure which concerns on this embodiment may be equipped with the process of arrange | positioning a sealing material so that a resin layer may oppose an electronic component. The manufacturing method of the sealing structure according to the present embodiment may include a step of curing the resin layer after the sealing step.

  FIG.2 and FIG.3 is a schematic cross section for demonstrating the manufacturing method of the sealing structure which concerns on this embodiment. Hereinafter, the manufacturing method of the sealing structure according to the present embodiment will be described with reference to FIGS. 2 and 3.

  In the manufacturing method of the sealing structure according to the present embodiment, first, as illustrated in FIG. 2A, the sealing material 1 according to the present embodiment is prepared. The sealing material 1 includes a metal layer 30 and a resin layer 20 a disposed on the metal layer 30. The sealing material 1 is used for sealing an electronic component with the resin layer 20a. The resin layer 20 a only needs to be provided on at least a part of the metal layer 30, and may be provided on the entire surface of the metal layer 30. The resin layer 20a has a film shape, for example. The resin layer 20a is integrated with, for example, a metal layer 30 used as a carrier when forming the resin layer 20a into a film. The sealing material is as described above.

  Next, as shown in FIG. 2B, after preparing a laminate including a substrate 50 and a temporary fixing layer 60 disposed on the substrate 50, a plurality of electronic components 10 are mounted on the temporary fixing layer 60. Deploy. Subsequently, the sealing material 1 is disposed so that the resin layer 20 a faces the electronic component 10. The resin layer 20a is heated and melted, and pressure is applied to seal the electronic component 10 with the resin layer 20a. Thereby, as shown to Fig.3 (a), a sealing structure provided with the resin layer 20a which seals the some electronic component 10 is obtained. Examples of the method for sealing the electronic component 10 with the resin layer 20a include laminating, pressing, transfer molding, compression molding, and the like.

  The heating temperature in the sealing step is not particularly limited as long as the resin layer 20a is melted, and may be, for example, 20 to 200 ° C. The pressure in a sealing process is not specifically limited, It can adjust according to the size of an electronic component, a density, etc. The pressure may be, for example, 0.01 to 5 MPa. The pressurization time is not particularly limited, and may be, for example, 10 seconds to 30 minutes.

  Next, as shown in FIG.3 (b), the sealing layer 100 is obtained by hardening the resin layer 20a and obtaining the sealing part (resin hardening layer. Hardened | cured material of the resin layer 20a) 20. As shown in FIG. The resin layer 20a may be heat-cured or photocured. The curing treatment can be performed, for example, in the atmosphere or under an inert gas. The heating temperature for thermosetting is not particularly limited, and may be, for example, 80 to 200 ° C. The curing time is not particularly limited, and may be, for example, 10 to 600 minutes.

  The manufacturing method of a sealing structure is not limited to the said embodiment.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to these Examples at all.

<Example 1>
(Preparation of varnish)
A varnish having a composition A (varnish-like resin composition) was prepared as follows. First, 172 g of an organic solvent: methyl ethyl ketone was placed in a 10 L polyethylene container. Inorganic filler: After adding 542 g of aluminum oxide particles (manufactured by Sumitomo Chemical Co., Ltd., trade name: AA-1.5, average particle size: 1.5 μm) to the container, the inorganic filler was dispersed with a stirring blade. A dispersion was obtained. In this dispersion, 48 g of thermosetting resin: bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: jER806, epoxy equivalent: 160 g / eq, epoxy resin which is liquid at 25 ° C.), thermosetting Resin: 12 g of naphthalene skeleton-containing polyfunctional solid epoxy resin (manufactured by DIC Corporation, trade name: EXA-4750, epoxy equivalent: 182 g / eq, epoxy resin not showing liquid at 25 ° C.), curing agent: phenol novolac resin (Asahi Organic Materials Co., Ltd., trade name: PAPS-PN2, phenolic hydroxyl group equivalent: 104 g / eq, phenol resin not showing liquid at 25 ° C.) was added and stirred. After confirming that the curing agent was dissolved, 0.8 g of curing accelerator: 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name: 2P4MZ) was added, and the mixture was further stirred for 1 hour. Got. This mixed solution was filtered through nylon # 200 mesh (opening 75 μm), and the filtrate was collected to prepare a varnish-like epoxy resin composition.

(Preparation of sealing material)
Using a coating machine, the varnish was applied on a copper foil (trade name: YGP-35R, copper foil thickness: 35 μm, manufactured by Nippon Electrolytic Co., Ltd.) to obtain a coating film, and then the coating film was dried. A resin layer was formed on the copper foil. Application and drying were performed under the following conditions. The thickness of the resin layer after drying was 150 μm. A sealing material was obtained by disposing a protective layer (polyethylene film) having a thickness of 50 μm on the opposite side of the resin layer from the copper foil. In each of the following measurements, the measurement was performed after the protective layer was peeled off.
Coating machine: Die coater manufactured by Hirano Techseed Co., Ltd. Coating head method: Comma Coating and drying speed: 5.0 m / min Drying conditions (temperature / furnace length): 60 ° C./3.3 m, 90 ° C./3.3 m, 110 ° C. /3.3m

(Preparation of sealing structure)
The sealing material was laminated to the electronic component under the following lamination conditions so that the resin layer of the sealing material was in contact with the electronic component (thickness: 75 μm). Next, the resin layer was thermally cured under the following curing conditions to obtain a sealed structure.

[Lamination condition]
Laminator device: manufactured by Meiki Seisakusho Co., Ltd., vacuum pressure laminator MVLP-500
Lamination temperature: 110 ° C
Lamination pressure: 0.5 MPa
Vacuuming time: 30 seconds Laminating time: 40 seconds

[Curing conditions]
Oven: manufactured by ESPEC CORP., SAFETY OVEN SPH-201
Oven temperature: 140 ° C
Time: 120 minutes

(Evaluation)
[Evaluation of sealing performance of electronic components]
The sealing performance of the electronic component was evaluated by observing the cross section of the sealing structure. The case where the electronic component was embedded and no void was observed was evaluated as “◯”, and the case where the electronic component was not embedded or insufficiently embedded was evaluated as “x”. The results are shown in Table 1.

[Evaluation of electromagnetic shielding properties]
Electromagnetic wave shielding was evaluated by the amount of electromagnetic wave attenuation in the frequency range of 50 MHz to 20 GHz. The case where the attenuation of the electromagnetic wave was 3 db or more was evaluated as “◯”, and the case where it was less than 3 db was evaluated as “x”. The results are shown in Table 1.

<Comparative Example 1>
The metal layer of the sealing material obtained in Example 1 was removed to obtain a sealing material having only a resin layer. An electronic component similar to that in Example 1 was sealed with the resin layer of the sealing material to obtain a sealing structure. And like Example 1, the sealing performance and electromagnetic wave shielding property of an electronic component were evaluated. The results are shown in Table 1.

<Comparative example 2>
Only the copper foil used in Example 1 was used as a sealing material. Since the electronic component could not be sealed because it did not have a resin layer, the sealing performance of the electronic component was evaluated as “x”.

  DESCRIPTION OF SYMBOLS 1 ... Sealing material, 10 ... Electronic component, 20 ... Sealing part, 20a ... Resin layer, 30 ... Metal layer, 50 ... Board | substrate, 60 ... Temporary fixing layer, 100 ... Sealing structure.

Claims (2)

A metal layer, and a resin layer disposed on the metal layer,
The sealing material used in order to seal an electronic component with the said resin layer.   The manufacturing method of a sealing structure provided with the sealing process which seals an electronic component with the said resin layer of the sealing material provided with a metal layer and the resin layer arrange | positioned on the said metal layer.

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