JP2008199294A - Manufacturing apparatus for tuning fork crystal oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a tuning fork crystal oscillator by efficiently fracturing a root portion with simple constitution without producing a fine fragment. <P>SOLUTION: Provided is a manufacturing apparatus for the tuning fork crystal oscillator comprising a suction plate which suctionally supports, on a reverse surface, a crystal wafer having a tuning fork crystal piece cut in a cantilever state by making a penetrating cut along a plate thickness, a pressing member which presses the tuning fork crystal piece of the crystal wafer supported on the suction plate perpendicularly downward to deform it, and a jig plate 6 which is disposed nearby opposite the suction plate across the crystal wafer and has a recessed portion 6a where the tuning fork crystal oscillator broken off from the crystal wafer can be stored in a positioned state, the jib plate 6 having a flat plate type plate member 10 having a cut 10a forming a side wall of the recessed portion 6a and a suction plate member 12 which constitutes the bottom surface of the recessed portion 6a and sucks the tuning fork crystal oscillator over nearly the entire surface thereof. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a tuning fork type crystal resonator manufacturing apparatus.

Conventionally, as a tuning fork type crystal resonator manufacturing apparatus, for example, there is one disclosed in Patent Document 1.
The tuning-fork type crystal resonator manufacturing apparatus disclosed in Patent Document 1 is configured such that the tip of a tuning-fork type crystal piece formed on a crystal wafer by photolithography is sandwiched between a pin and a chisel in the thickness direction. The tuning fork crystal piece supported in a cantilever shape is elastically deformed by moving in the direction, and the root portion is broken by applying a displacement exceeding the elastic limit to produce a tuning fork type crystal resonator. It has become.

JP 2000-68771 A

  However, according to the manufacturing apparatus and the manufacturing method of Patent Document 1, since the quartz wafer is arranged on the suction plate, a jig plate in which a tuning fork type crystal resonator broken from the quartz wafer is arranged below the suction plate. Until it is accommodated in the recess, it is necessary to move it at least as much as the thickness of the suction plate, sandwiched between the receiving pin and the chisel. For this reason, there is a problem that it takes time to move the receiving pin and the chisel up and down, and the tact time cannot be shortened. Further, when the tuning fork crystal resonator is displaced while being moved between the receiving pin and the chisel, the tuning fork crystal resonator may interfere with the jig plate and cause problems such as chipping. There is.

  Fine fragments generated by chipping cause a problem of clogging in a manufacturing apparatus or entering a vacuum container enclosing a tuning fork type crystal resonator. Therefore, frequent cleaning of the manufacturing apparatus, frequent suction of debris, and the like are necessary, and the manufacturing process becomes complicated. In addition, when debris is attached or mixed in, it may cause a malfunction of the crystal unit.

  The present invention has been made in view of the above-described circumstances, and is a tuning fork type crystal vibration that enables a tuning fork type crystal resonator to be manufactured efficiently with a simple structure and without generating fine fragments. It aims at providing the manufacturing apparatus and manufacturing method of a child.

In order to achieve the above object, the present invention provides the following means.
The present invention provides a suction plate for supporting a quartz wafer having a tuning fork crystal piece cut out in a cantilever shape by a notch penetrating in the thickness direction on the lower surface, and a state of being supported by the suction plate. A pressing member that presses and deforms a tuning fork type crystal piece of a crystal wafer vertically downward, and a tuning fork type crystal resonator that is disposed in close proximity to the suction plate at a position sandwiching the crystal wafer and is broken from the crystal wafer. A jig plate having a recess capable of being accommodated in a positioning state, the jig plate constituting a flat plate member having a notch constituting a side wall of the recess and a bottom surface of the recess, and being accommodated in the recess. And a tuning fork type crystal resonator manufacturing apparatus comprising a suction plate member for adsorbing the tuning fork type crystal resonator over substantially the entire surface thereof.

  According to the present invention, the tuning-fork type crystal piece of the crystal wafer supported on the lower surface of the suction plate is deformed by being pressed vertically downward by the pressing member, and in the concave portion of the jig plate that is disposed immediately below it. And is accommodated in a positioning state as a tuning fork type crystal resonator. In this case, unlike the conventional case in which the quartz wafer is placed on the suction plate, the tuning fork type quartz crystal unit that is broken from the quartz wafer is immediately accommodated in the recess. There is no need to sandwich and convey, and a receiving pin can be dispensed with. Therefore, the structure of the apparatus can be simplified, the time required for transporting and inserting / removing the receiving pins can be saved, and the tact time can be greatly shortened. Further, it is possible to prevent inconveniences such as chipping during conveyance.

  In this case, according to the present invention, the bottom surface of the recess is constituted by the suction plate member, so that the tuning fork type crystal resonator housed in the recess is sucked and held by the suction plate member over substantially the entire surface thereof. Therefore, the folded tuning-fork type crystal resonator can be held in the recess more stably, and it is possible to prevent the occurrence of misalignment even if an impact occurs during folding.

In the above invention, the suction plate member may be an adhesive tape.
By doing so, the tuning fork type crystal resonator can be stably held with a simple configuration. Thereby, the structure of the apparatus can be simplified and the cost can be reduced.

Moreover, in the said invention, the said plate member and the said adsorption | suction plate member may be arrange | positioned with the clearance gap smaller than the thickness dimension of the said tuning fork type crystal vibrator.
By doing so, it is possible to prevent the adsorbing plate member made of the adhesive tape and the plate member from adhering to each other, and the adsorbing plate member according to the decrease in the adsorbing force of the adsorbing plate member or the adhesion of dust accompanying use The replacement work can be facilitated. Since the gap between the plate member and the suction plate member is smaller than the thickness of the tuning fork crystal unit, it is possible to prevent inconvenience that the tuning fork type crystal unit housed in the recess enters the gap, and to stabilize the tuning fork type crystal unit in the recess. The positioning state can be maintained.

In the above invention, the plate member may be provided with a low adhesion film such as a tetrafluoroethylene resin coating or a diamond-like carbon thin film.
In this way, even if the plate member and the suction plate member made of adhesive tape come into contact with each other, it is possible to prevent the inconvenience that both are firmly bonded by the tetrafluoroethylene resin coating, and replacement of the suction plate member Work can be simplified.

Moreover, in the said invention, the said adsorption | suction board member may be provided so that winding-up is possible.
In this way, when the suction force of the suction plate member decreases or dust adheres with use, the suction plate member made of adhesive tape is wound up to replace the used adhesive portion. And a new adhesion part can be arrange | positioned on the bottom face of a recessed part. Thereby, the replacement | exchange operation | work of an adsorption | suction board member can be made still easier.

In the above invention, the suction plate member may be an electrostatic suction plate.
By doing so, the tuning fork crystal unit can be stably adsorbed to the adsorption plate member made of an electrostatic adsorption plate by utilizing the static electricity charged in the tuning fork type crystal unit.

In the above invention, a plurality of tuning fork crystal pieces are arranged in a width direction so as to be cut out in a comb shape, and the suction plate and the jig plate are moved in the width direction of the tuning fork type crystal piece. It is good also as a structure provided with the drive device to be made.
By configuring in this way, the suction plate and the jig plate are moved, and the tuning fork crystal pieces and the concave portions of the jig plate are sequentially arranged vertically below the pressing member, and a plurality of tuning fork molds arranged in the width direction are arranged. A large number of tuning fork crystal units can be easily manufactured by sequentially breaking the crystal pieces.

In the above invention, a through hole that penetrates the suction plate and allows the pressing member to pass through the suction plate extends over a plurality of tuning fork crystal pieces along the arrangement direction of the tuning fork crystal pieces. It is good also as a structure provided in.
By configuring in this way, it is not necessary to remove the pressing member from the through-hole after folding one tuning-fork type crystal unit and before folding the next tuning-fork type crystal unit, further reducing tact time can do.

In the above invention, the quartz wafer is sandwiched between the suction plate and the suction plate near the base of the tuning fork crystal piece pressed by the pressing member, and the quartz wafer is moved by moving the suction plate. It is good also as a structure provided with the roller which can roll the surface.
With this configuration, when the tuning fork crystal piece is pressed by the pressing member, the crystal wafer can be supported by the suction plate and the roller in the plate thickness direction. When moving the suction plate, the roller is rolled on the surface of the crystal wafer to maintain the crystal wafer sandwiched between the roller and the suction plate, and thereby the stress generated at the root of the tuning fork crystal piece. Concentration can be generated stably. In addition, when shifting to the tuning operation of the adjacent tuning-fork type crystal piece, it is possible to continue holding without releasing the holding state between the roller and the suction plate, eliminating the need for a complicated mechanism and reducing the manufacturing apparatus. Can be manufactured at cost.

Moreover, in the said invention, it is good also as a structure where the said press member has an inclined surface which inclines ahead of a press direction toward the front-end | tip of a tuning fork type crystal piece.
With this configuration, when the tuning fork type crystal piece is pressed by the pressing member, the tuning fork type crystal piece is deformed so as to incline forward in the pressing direction toward the tip, so that it follows the inclined surface of the pressing member. Be placed. Therefore, when the tuning fork crystal piece is broken off from the quartz wafer, the pressing member is brought into contact with the surface of the tuning fork type crystal piece over a large area, so that the tuning fork type crystal piece does not jump when it breaks. it can. As a result, it is possible to prevent the generation of fine fragments and the displacement of the tuning fork crystal piece from the recess of the jig plate.

  According to the tuning fork type crystal resonator manufacturing apparatus and method according to the present invention, it is possible to manufacture a tuning fork type crystal resonator with a simple configuration, efficiently and without generating fine fragments. Play.

A tuning fork type crystal resonator manufacturing apparatus and method according to an embodiment of the present invention will be described below with reference to FIGS.
A tuning fork type crystal resonator manufacturing apparatus 1 according to the present embodiment is an apparatus for separating a tuning fork type crystal resonator from a thin flat plate crystal wafer 2 as shown in FIGS. A tuning fork crystal piece 2a of the crystal wafer 2 is provided by a suction plate 3 that sucks the crystal wafer 2 on the lower surface and holds the crystal wafer 2 in a horizontal state, and a tip surface 5a directed vertically downward through a through hole 4 provided in the suction plate 3. A pressing member 5 that presses the upper surface of the substrate vertically downward (in the plate thickness direction), a jig plate 6 disposed adjacent to the lower side of the crystal wafer 2, a roller 7 disposed adjacent to the lower side of the crystal wafer 2, and an adsorption A driving device (not shown) is provided for moving the plate 3 and the jig plate 6 in the width direction of the tuning fork crystal piece 2a along the horizontal direction.

  As shown in FIG. 2, a plurality of tuning-fork type crystal pieces 2a are arranged on the crystal wafer 2 in a comb-teeth shape by, for example, notches 2b formed by photolithography technology and penetrating in the plate thickness direction. It is formed as follows. Each tuning fork type crystal piece 2 a is configured in a cantilever shape by connecting one end thereof to the crystal wafer 2.

In addition, the root portion of each tuning fork type crystal piece 2a connected to the crystal wafer 2 is similarly provided with a notch portion 2c that is thinly formed by cutting so that stress concentration easily occurs.
Adjacent tuning-fork type crystal pieces 2a are arranged with a minute gap with a fine cut.

The suction plate 3 is provided with positioning means and suction means (both not shown) for sucking the crystal wafer 2 in a positioning state, and the crystal wafer 2 is positioned and fixed with high accuracy.
The through-hole 4 provided in the suction plate 3 extends, for example, in the arrangement direction of the tuning fork crystal pieces 2a over the plurality of tuning fork crystal pieces 2a in accordance with the pattern of the tuning fork crystal pieces 2a on the crystal wafer 2. It is provided to extend.

  The pressing member 5 is provided so as to be movable up and down, and is arranged such that a tip surface 5a directed vertically downward presses a substantially central position in the longitudinal direction of the tuning-fork type crystal piece 2a of the crystal wafer 2. The front end surface 5 a of the pressing member 5 extends over a predetermined length along the longitudinal direction of the crystal wafer 2 and is inclined so as to descend toward the front end side of the crystal wafer 2.

  As shown in FIG. 4, the jig plate 6 includes a plate member 10 having a thickness larger than that of the tuning-fork type crystal piece 2 a, a base member 11 for fixing the plate member 10, and a lower portion of the plate member 10. And an adhesive tape (adsorbing plate member) 12 disposed with a minute gap. The plate member 10 is provided with a plurality of cutouts 10a having an opening dimension capable of accommodating the tuning-fork type crystal piece 2a in a positioned state.

  The gap between the plate member 10 and the adhesive tape 12 is set to be smaller than the thickness dimension of the tuning fork crystal piece 2a. As a result, a plurality of recesses 6a having the inner surface of the notch 10a of the plate member 10 as a side wall and the upper surface of the adhesive tape 12 as a bottom surface are formed. These recesses 6a are opened so as to expose the root portion of the tuning fork type crystal resonator 2A in a state in which the tuning fork type crystal resonator 2A separated from the crystal wafer 2 is accommodated. In the subsequent welding process, the tuning fork type crystal resonator 2a is exposed. The terminal is easily welded to the electrode (not shown) of the vibrator 2A.

The recess 6a includes an inner side surface portion that is positioned close to the side surface of the tuning fork type crystal resonator 2A when the tuning fork type crystal resonator 2A is accommodated, and a relief portion that is separated from the side surface of the tuning fork type crystal resonator 2A. The tuning fork crystal unit 2A can be easily accommodated in the recess 6a by being provided and brought into contact with a minimum area necessary for positioning.
Further, the interval between the recesses 6a is sufficiently larger than the interval between the tuning fork crystal pieces 2a in the quartz wafer 2, so that the terminals of adjacent tuning fork type crystal resonators 2A in the welding process can be in contact with each other. It can be avoided.

  As shown in FIG. 4, the adhesive tape 12 is arranged extending in the arrangement direction of the notches 10a, and the adhesive surfaces are exposed on the bottom surfaces of all the recesses 6a. At both ends of the pressure-sensitive adhesive tape 12, an unwinding portion 13 that accommodates the unused pressure-sensitive adhesive tape 12 in a wound state and a winding portion 14 that winds up the used pressure-sensitive adhesive tape 12 are provided.

  The roller 7 is disposed at a position where the crystal wafer 2 is sandwiched between the suction plate 3 and the suction plate 3 in the vicinity of the root portion of the tuning-fork type crystal piece 2a. The roller 7 has a rotation shaft 7 a parallel to the length direction of the tuning-fork type crystal piece 2 a on the crystal wafer 2. The roller 7 is provided at the tip of a swing arm 8 that can swing in the vertical direction, and can move between a position contacting the lower surface of the crystal wafer 2 and a position spaced downward.

  The driving device is a linear driving device including a known motor and a ball screw. The driving device is provided on each of the suction plate 3 and the jig plate 6 and linearly moves in the width direction of the tuning fork type crystal piece 2a on the crystal wafer 2. It can be made to. The horizontal movements of the suction plate 3 and the jig plate 6 can be performed separately. By moving the jig plate 6 in the horizontal direction while the suction plate 3 is stationary, the crystal wafer 2 and the jig plate 6 are moved. 6 can be relatively displaced in the horizontal direction.

The operation of the manufacturing apparatus 1 according to this embodiment configured as described above will be described below.
In order to manufacture the tuning fork type crystal resonator 2A using the manufacturing apparatus 1 according to the present embodiment, as shown in FIG. 2, a plurality of tuning fork type crystal pieces 2a are formed in a comb-teeth shape by a notch 2b by photolithography. A crystal wafer 2 formed in (1) is prepared. Next, the prepared crystal wafer 2 is sucked to the lower surface of the suction plate 3 and is disposed at a position close to the upper surface of the jig plate 6 as shown in FIG. At the same time, the quartz wafer 2 disposed in the vicinity of the root portion of the tuning-fork type quartz vibrating piece 2 a is sandwiched between the suction plate 3 and the roller 7 in the thickness direction.

  In this state, the jig plate 6 is moved horizontally in the arrangement direction of the tuning fork type crystal pieces 2a with respect to the suction plate 3 and the crystal wafer 2 by the operation of the driving device, and then the tuning fork type crystal resonator 2A is accommodated. The concave portion 6a is positioned below the tuning-fork type crystal piece 2a to be accommodated. Then, the pressing member 5 is lowered from vertically above through the through hole 4 provided in the suction plate 3, and the top surface of the tuning fork type crystal piece 2a is pressed downward by the tip surface 5a.

Accordingly, as shown in FIG. 1B, the tuning fork type crystal piece 2a formed in a cantilever shape is elastically pressed down by the tip surface 5a of the pressing member 5 so as to lower the tip. Deformed.
That is, as shown in FIGS. 5 and 6, the tuning fork type crystal piece 2 a is arranged in a state in which the tip portion is partially inserted into the recess 6 a of the jig plate 6. At this stage, the stress due to bending does not exceed the elastic limit, and the root portion of the tuning fork type crystal piece 2a does not break. In this state, the tip of the pressing member 5 is disposed at a position higher than the upper surface of the jig plate 6.

  In this embodiment, the jig plate 6 is horizontally moved from this state in the direction indicated by the arrow A in FIG. As a result, the side surface of the recess 6a contacts the side surface in the width direction of the tuning-fork type crystal piece 2a partially inserted into the recess 6a, and the horizontal direction is pushed to the position indicated by the arrow B in FIG. Pressure F is applied.

  Since the notch 2c is formed at the base of the tuning fork crystal piece 2a, even with a relatively small pressing force F, a large stress concentration is generated in the notch 2c in a very narrow range. As a result, the tuning fork type crystal resonator 2A can be folded from the crystal wafer 2 accurately and without generating fine fragments, accurately cut at the position of the notch 2c.

  After the tuning-fork type crystal resonator 2A is broken, the pressing member 5 is raised, the suction plate 3 is moved in the horizontal direction, and the tuning-fork type crystal piece 2a to be folded next is vertically below the pressing member 5. In addition, the jig plate 6 is moved in the horizontal direction, and the recess 6a for accommodating the tuning-fork type crystal resonator 2A to be folded next is arranged vertically below the tuning-fork type crystal piece 2a. Thereafter, the above steps are repeated.

  As described above, according to the manufacturing apparatus 1 of the tuning fork type crystal resonator 2A according to the present embodiment, the tuning fork type crystal piece 2a is elastically deformed by the pressing member 5 so that the tip portion protrudes from the surface of the crystal wafer 2. Thus, by engaging the concave portion 6a of the jig plate 6 and relatively moving the crystal wafer 2 and the jig plate 6 in the horizontal direction, a pressing force F in the width direction is applied to the tuning fork type crystal piece 2a, A plurality of tuning-fork type crystal resonators 2A can be sequentially folded and manufactured in the recess 6a so as to be accommodated in a simple manner with high accuracy and without causing inconvenience such as chipping.

In this case, since the tip of the pressing member 5 is disposed at a position higher than the upper surface of the jig plate 6, the jig plate 6 and the pressing member 5 interfere even when the jig plate 6 is moved horizontally. There is nothing.
Further, in the manufacturing apparatus 1 according to the present embodiment, since the tip surface 5a of the pressing member 5 is inclined, when the tuning fork type crystal piece 2a is elastically deformed and folded from the crystal wafer 2, the tip surface 5a is formed. The tuning fork crystal piece 2a can be brought into contact with the surface of the tuning fork crystal piece 2a with a wide contact area. As a result, it is possible to hold the tuning-fork type quartz crystal resonator 2A, which is constructed by being broken off by an impact when the tuning-fork type quartz piece 2a is broken, so that it does not jump out of the recess 6a.

  Furthermore, in the manufacturing apparatus 1 according to the present embodiment, since the bottom surface of the recess 6a is constituted by the adhesive surface of the adhesive tape 12, the tuning fork crystal resonator 2A housed in the recess 6a by being folded is The adhesive surface of the adhesive tape 12 is adsorbed on almost the entire surface. As a result, it is possible to more reliably prevent the tuning fork type crystal resonator 2A from jumping and jumping out of the concave portion 6a, and to be stably held in the concave portion 6a. Further, even if fine fragments are generated, they are adsorbed by the adhesive surface of the adhesive tape 12, so that adhesion of the fragments to the tuning fork type crystal resonator 2A can be suppressed.

  And when adhesive strength becomes weak by using or a fragment | piece adheres, the unwinding part 13 and the winding-up part 14 are operated, the used adhesive tape 12 is wound up, and it is unused. The adhesive tape 12 can be disposed below the plate member 10. Thereby, the adhesive force can be easily recovered, and the tuning fork type crystal resonator 2A can be continuously manufactured.

  In this case, the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape 12 and the plate member 10 above the pressure-sensitive adhesive tape 12 are arranged with a slight gap therebetween, so that the relative movement between the two is not hindered during winding. Further, since the gap dimension is set smaller than the thickness dimension of the tuning fork type crystal resonator 2A, there is no inconvenience that the folded tuning fork type crystal resonator 2A enters the gap.

  Further, in the manufacturing apparatus 1 according to the present embodiment, the quartz wafer 2 is adsorbed on the lower surface of the adsorption plate 3, so that the tuning fork type quartz is formed by the receiving pins and the chisel that penetrate through the jig plate as in the prior art. There is no need to convey the piece 2a. Therefore, the time for inserting and removing the receiving pin into and from the jig plate and the time for transporting at least the thickness of the suction plate between the receiving pin and the chisel are unnecessary, and it is necessary to fold one tuning-fork type crystal resonator 2A. The tact time can be greatly reduced. Moreover, the conveyance process to the recessed part 6a can be omitted, and the occurrence of problems such as chipping due to misalignment during conveyance can be prevented. As a result, the production efficiency can be improved, the generation of fine fragments can be prevented, and the quality can be improved.

  Furthermore, in the manufacturing apparatus 1 according to the present embodiment, the through-hole 4 provided in the suction plate 3 extends across the plurality of tuning-fork type crystal pieces 2a in the arrangement direction thereof, so that one tuning-fork type crystal piece It is not necessary to extract the pressing member 5 from the through hole 4 until the other adjacent tuning-fork type crystal piece 2a is folded after the folding of 2a. Therefore, the tact time required for folding one tuning fork type crystal resonator 2A can be further shortened.

  Further, according to the manufacturing apparatus 1 according to the present embodiment, since the crystal wafer 2 is sandwiched between the suction plate 3 and the roller 7, the root portion is reliably supported when the tuning fork crystal resonator 2A is folded. In addition, when the jig plate 6 is moved horizontally to apply the pressing force F to the tuning-fork type crystal piece 2a, the roller 7 is rolled on the surface of the crystal wafer 2 and continuously supported. Can do. By rolling the roller 7 on the surface of the crystal wafer 2, the friction applied to the crystal wafer 2 can be reduced and the soundness of the crystal wafer 2 can be maintained.

  In the manufacturing apparatus 1 according to the present embodiment, the tuning fork crystal piece 2a is applied with the pressing force F in the width direction to be easily and accurately folded, but instead, it is shown in FIG. As described above, the quartz wafer 2 may be broken by the pressing force F applied to the tuning fork type crystal piece 2a in the thickness direction. In FIG. 8, the depth of the recess 6a is deeper than in FIG. 1, and the tuning fork type crystal piece 2a can be greatly deformed.

  Even in this case, as in the present embodiment, by disposing the crystal wafer 2 on the lower surface of the suction plate 3, the recessed portion 6a accommodated after being folded can be disposed in the immediate vicinity of the crystal wafer 2, It can be accommodated in the positioning state immediately after being folded. Therefore, there is an advantage that the manufacturing tact time can be shortened, and the quality of the product can be improved by reducing the chance of generating fine fragments.

  Further, in the present embodiment, in order to prevent the disadvantage that the adhesive tape 12 and the plate member 10 are bonded to the plate member 10 when the adhesive tape 12 is wound and the winding is hindered, a small gap is formed between the adhesive tape 12 and the plate member 10. Instead of this, or in addition to this, at least the surface of the plate member 10 facing the adhesive surface of the adhesive tape 12 is coated with a low-coagulation material such as a coating made of tetrafluoroethylene resin or a diamond-like carbon thin film. An adhesive film may be formed. Thereby, even if the adhesive tape 12 and the plate member 10 contact, since adhesion | attachment of both is avoided, winding is not inhibited.

Moreover, in this embodiment, although the adhesive surface of the adhesive tape 12 was employ | adopted as an adsorption | suction board member arrange | positioned at the bottom face of the recessed part 6a, instead of this, as FIG. 9 shows, between electrode 15a, 15b. An electrostatic adsorption plate 15 that is charged by applying a DC voltage and that adsorbs almost the entire surface of the tuning-fork type crystal resonator 2A by static electricity may be adopted.
The electrostatic attraction plate 15 includes a dielectric material that biases charges by applying a DC voltage to the electrodes 15a and 15b, and is generated between charges induced on the surface of the tuning fork crystal resonator 2A. The tuning fork crystal unit 2A can be adsorbed almost over the entire surface by the Coulomb force. According to the electrostatic attraction plate 15, the Coulomb force can be eliminated by cutting off the voltage applied to the electrodes 15a and 15b, and the tuning fork type crystal resonator 2A can be easily removed. Therefore, there is an advantage that there is no problem of deterioration of adhesive force and adhesion of dust unlike the adhesive tape.

It is a partial longitudinal cross-sectional view which shows the manufacturing apparatus of the tuning fork type | mold crystal resonator which concerns on one Embodiment of this invention, (a) is the state which the press member raised, (b) is the state which the press member lowered | hung, respectively Show. FIG. 2 is a partial perspective view showing a crystal wafer from which a tuning fork type crystal resonator is cut out in the manufacturing apparatus of FIG. 1. It is a partial perspective view which shows the manufacturing apparatus of FIG. It is a perspective view which shows the jig | tool plate of the manufacturing apparatus of FIG. It is a partial perspective view which shows the state which mounted | wore the quartz wafer with the manufacturing apparatus of FIG. It is a perspective view which expands and shows the press member vicinity of the manufacturing apparatus of FIG. It is a partial top view which shows the relationship between the recessed part of the jig plate in the manufacturing apparatus of FIG. 1, and a tuning fork type crystal piece. It is a partial longitudinal cross-sectional view which shows the modification of the manufacturing apparatus of FIG. It is a perspective view which shows the modification of the jig | tool plate of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 2 Crystal wafer 2A Tuning fork type crystal oscillator 2a Tuning fork type crystal piece 2b Cut 3 Suction plate 5 Press member 5a Inclined surface 6 Jig plate 6a Recess 7 Roller 10a Notch 10 Plate member 12 Adhesive tape (adsorption plate member)
15 Electrostatic suction plate (suction plate member)

Claims (10)

A suction plate for supporting a quartz wafer including a tuning fork crystal piece cut out in a cantilever shape by a notch penetrating in the thickness direction on the lower surface;
A pressing member that deforms the tuning-fork type crystal piece of the quartz wafer supported by the suction plate by pressing downward vertically;
A jig plate having a concave portion that is disposed in close proximity to the suction plate at a position sandwiching the crystal wafer, and that can accommodate a tuning fork type crystal resonator broken from the crystal wafer in a positioning state;
The jig plate has a flat plate member having a notch that forms the side wall of the recess, and a suction plate member that forms the bottom surface of the recess and sucks the tuning fork crystal unit accommodated in the recess over substantially the entire surface thereof. A tuning fork type crystal resonator manufacturing apparatus comprising:   The tuning fork type crystal resonator manufacturing apparatus according to claim 1, wherein the suction plate member is an adhesive tape.   The tuning fork crystal resonator manufacturing apparatus according to claim 2, wherein the plate member and the suction plate member are arranged with a gap smaller than a thickness dimension of the tuning fork crystal resonator.   The tuning fork type crystal resonator manufacturing apparatus according to claim 2, wherein the plate member is coated with a tetrafluoroethylene resin coating or a diamond-like carbon thin film.   5. The tuning-fork type crystal resonator manufacturing apparatus according to claim 2, wherein the suction plate member is provided so as to be capable of being wound.   The tuning fork type crystal resonator manufacturing apparatus according to claim 1, wherein the suction plate member is an electrostatic suction plate. The tuning fork crystal pieces are cut into a comb shape by being arranged in the width direction,
The tuning fork type crystal resonator manufacturing apparatus according to any one of claims 1 to 6, further comprising a driving device that moves the suction plate and the jig plate in a width direction of the tuning fork type crystal piece.   The through hole through which the suction plate is inserted and the pressing member is inserted is provided in the suction plate so as to extend over a plurality of tuning fork type crystal pieces along the arrangement direction of the tuning fork type crystal pieces. 8. A device for manufacturing a tuning fork type crystal resonator as set forth in claim 7.   Roller capable of rolling the surface of the crystal wafer by moving the suction plate in the thickness direction between the suction plate and the suction plate near the base of the tuning fork crystal piece pressed by the pressing member An apparatus for producing a tuning-fork type crystal resonator according to claim 8.   10. The tuning fork type crystal resonator manufacturing apparatus according to claim 1, wherein the pressing member has an inclined surface that is inclined forward in the pressing direction toward the tip of the tuning fork type crystal piece.

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