JP4730826B2 - Tuning-fork type crystal resonator manufacturing apparatus and manufacturing method - Google Patents

Description

  The present invention relates to a tuning fork type crystal resonator manufacturing apparatus and manufacturing method.

Conventionally, as a tuning fork type crystal resonator manufacturing apparatus and manufacturing method, for example, there is one disclosed in Patent Document 1.
The tuning-fork type crystal resonator manufacturing apparatus disclosed in Patent Document 1 is configured such that the tip of a tuning-fork type crystal piece formed on a crystal wafer by photolithography is sandwiched between a pin and a chisel in the thickness direction. The tuning fork crystal piece supported in a cantilever shape is elastically deformed by moving in the direction, and the root portion is broken by applying a displacement exceeding the elastic limit to produce a tuning fork type crystal resonator. It has become.
JP 2000-68771 A

The manufacturing apparatus and manufacturing method disclosed in Patent Document 1 generate stress concentration at the root of a tuning fork crystal piece by a pressing force applied in the thickness direction when the tuning fork crystal resonator is separated from the crystal wafer. is there.
However, in the method of cutting a tuning fork crystal piece on a quartz wafer by photolithography, a cut is formed through the quartz wafer in the thickness direction, but the thickness is not changed. That is, since there is no notch recessed in the plate thickness direction, the stress concentration site is distributed over a relatively wide range in the manufacturing apparatus and method of Patent Document 1 in which stress concentration is generated by the pressing force bent in the plate thickness direction. As a result, there are inconveniences that the fractured portion is not stable and varies, or fine fragments are generated due to peeling of the crystal wafer due to the fracture.

  The generated fine debris causes a problem of clogging the manufacturing apparatus or entering a vacuum container enclosing the tuning fork type crystal resonator. Therefore, frequent cleaning of the manufacturing apparatus, frequent suction of debris, and the like are necessary, and the manufacturing process becomes complicated. In addition, if the fractured parts vary, or if fragments are attached or mixed in, it can cause problems in the crystal unit. It is necessary to manufacture a vibrator.

  The present invention has been made in view of the above-described circumstances, and makes it possible to manufacture a tuning fork type quartz crystal resonator with a simple configuration, with high accuracy and without causing fine fragments. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a tuning fork type crystal resonator.

In order to achieve the above object, the present invention provides the following means.
The present invention provides a quartz wafer with a pressing member that elastically deforms a tuning fork crystal piece that is cut out in a cantilever shape by cutting in a plate thickness direction, and sandwiches the crystal wafer between A jig plate having a recess disposed close to the pressing member and capable of accommodating a tuning fork crystal piece in a positioning state, and the jig plate and the quartz wafer are relatively displaced in the width direction of the tuning fork crystal piece. An apparatus for manufacturing a tuning-fork type quartz crystal resonator is provided.

  According to the present invention, the tuning fork type crystal piece is elastically deformed in the plate thickness direction by the operation of the pressing member, and the tip portion is accommodated in the concave portion of the jig plate located on the opposite side to the pressing member. In this state, when the driving device is operated to relatively displace the jig plate and the crystal wafer in the width direction of the tuning fork type crystal piece, the side surface in the width direction of the tuning fork type crystal piece is pressed in the width direction by the inner wall of the recess. Is done. As a result, stress concentration locally occurs at the corners formed by the cuts penetrating in the plate thickness direction at the base of the tuning fork type crystal piece, and it is easily broken and positioned in the recess of the jig plate. Is housed. Thereby, it is possible to manufacture a tuning-fork type crystal resonator that is broken accurately and without generating fine fragments.

In the said invention, it is good also as providing the adsorption | suction plate which adsorbs and holds the said quartz wafer on the lower surface.
By doing so, the suction plate sucks and holds the crystal wafer on the lower surface, so that the crystal wafer is maintained in a flat state, and the relative displacement between the crystal wafer and the jig plate can be accurately performed. .

Further, in the above invention, a plurality of the tuning fork type crystal pieces are arranged in the width direction and are cut out in a comb-teeth shape, and near the root portion of the tuning fork type crystal piece pressed by the pressing member, the crystal wafer It is good also as providing the roller which can be pinched | interposed in the plate | board thickness direction between the said adsorption | suction plates, and can roll the surface of a crystal wafer by the relative displacement of the said jig | tool plate and a crystal wafer.
In this way, when the tuning fork crystal piece is pressed by the pressing member, the crystal wafer can be supported by the suction plate and the roller in the plate thickness direction. When the jig plate and the quartz wafer are moved relative to each other, the roller is rolled on the surface of the quartz wafer, so that the quartz wafer is held between the roller and the suction plate. It is possible to more stably generate the stress concentration generated at the root portion of the. In addition, when shifting to the breaking of the adjacent tuning-fork type crystal piece, it is possible to continue holding without releasing the holding state between the roller and the suction plate, eliminating the need for a complicated mechanism and reducing the cost of the manufacturing apparatus. Can be manufactured.

Moreover, in the said invention, it is preferable that the said press member has an inclined surface which inclines ahead of a pressing direction toward the front-end | tip of a tuning fork type crystal piece.
In this way, when the tuning fork type crystal piece is pressed by the pressing member, the tuning fork type crystal piece is elastically deformed so as to incline forward in the pressing direction toward the tip, so that it follows the inclined surface of the pressing member. Be placed. Therefore, when the tuning fork type crystal piece is elastically deformed, the pressing member can be brought into contact with the surface of the tuning fork type crystal piece over a wide area so that the tuning fork type crystal piece does not jump when it is broken. As a result, it is possible to prevent the generation of fine fragments and the displacement of the tuning fork crystal piece from the recess of the jig plate.

  The present invention also relates to a method for manufacturing a tuning fork type crystal resonator in which a tuning fork type crystal piece cut into a cantilever shape is separated from a crystal wafer by a notch penetrating in the thickness direction of the crystal wafer. The quartz crystal piece is pressed in the thickness direction and elastically deformed to protrude from the surface of the crystal wafer, and the protruding tip is pressed in the width direction of the tuning fork crystal piece on the crystal wafer to Provided is a method for manufacturing a tuning fork type crystal resonator in which a root portion is broken.

  According to the present invention, it becomes possible to easily press the side surface in the width direction of a tuning fork type crystal piece cut out by fine cutting, and the tuning fork type crystal piece can be accurately and without generating fine fragments. A tuning fork crystal unit can be easily manufactured by separating from the crystal wafer.

  According to the tuning fork type crystal resonator manufacturing apparatus and method according to the present invention, it is possible to manufacture a tuning fork type crystal resonator with a simple configuration, with high accuracy and without causing fine fragments. There is an effect that can be done.

A tuning fork type crystal resonator manufacturing apparatus and method according to an embodiment of the present invention will be described below with reference to FIGS.
A tuning fork type crystal resonator manufacturing apparatus 1 according to the present embodiment is an apparatus for separating a tuning fork type crystal resonator from a thin flat plate crystal wafer 2 as shown in FIGS. A tuning fork crystal piece 2a of the crystal wafer 2 is provided by a suction plate 3 that sucks the crystal wafer 2 on the lower surface and holds the crystal wafer 2 in a horizontal state, and a tip surface 5a directed vertically downward through a through hole 4 provided in the suction plate 3. A pressing member 5 that presses the upper surface of the substrate vertically downward (in the plate thickness direction), a jig plate 6 disposed adjacent to the lower side of the crystal wafer 2, a roller 7 disposed adjacent to the lower side of the crystal wafer 2, and an adsorption A driving device (not shown) is provided for moving the plate 3 and the jig plate 6 in the width direction of the tuning fork crystal piece 2a along the horizontal direction.

  As shown in FIG. 2, a plurality of tuning-fork type crystal pieces 2a are arranged on the crystal wafer 2 in a comb-teeth shape by, for example, notches 2b formed by photolithography technology and penetrating in the plate thickness direction. It is formed as follows. Each tuning fork type crystal piece 2 a is configured in a cantilever shape by connecting one end thereof to the crystal wafer 2.

In addition, the root portion of each tuning fork type crystal piece 2a connected to the crystal wafer 2 is similarly provided with a notch portion 2c that is thinly formed by cutting so that stress concentration easily occurs.
Adjacent tuning-fork type crystal pieces 2a are arranged with a minute gap with a fine cut.

The suction plate 3 is provided with positioning means and suction means (both not shown) for sucking the crystal wafer 2 in a positioning state, and the crystal wafer 2 is positioned and fixed with high accuracy.
The through-hole 4 provided in the suction plate 3 extends, for example, in the arrangement direction of the tuning fork crystal pieces 2a over the plurality of tuning fork crystal pieces 2a in accordance with the pattern of the tuning fork crystal pieces 2a on the crystal wafer 2. It is provided to extend.

  The pressing member 5 is provided so as to be movable up and down, and is arranged such that a tip surface 5a directed vertically downward presses a substantially central position in the longitudinal direction of the tuning-fork type crystal piece 2a of the crystal wafer 2. The front end surface 5 a of the pressing member 5 extends over a predetermined length along the longitudinal direction of the crystal wafer 2 and is inclined so as to descend toward the front end side of the crystal wafer 2.

  The jig plate 6 is provided with a plurality of recesses 6a that open upward. These recesses 6a have opening dimensions that can accommodate the tuning-fork type crystal piece 2a in a positioned state. Then, in a state where the tuning fork type crystal resonator 2A separated from the crystal wafer 2 is accommodated, the tuning fork type crystal resonator 2A is opened so as to expose the root portion of the tuning fork type crystal resonator 2A. The terminal is easily welded to the electrode (not shown).

The recess 6a includes an inner side surface portion that is positioned close to the side surface of the tuning fork type crystal resonator 2A when the tuning fork type crystal resonator 2A is accommodated, and a relief portion that is separated from the side surface of the tuning fork type crystal resonator 2A. The tuning fork type crystal resonator 2A is easily accommodated in the recess 6a by being provided and brought into contact with a minimum area necessary for positioning.
Further, the interval between the recesses 6a is sufficiently larger than the interval between the tuning fork crystal pieces 2a in the quartz wafer 2, so that the terminals of adjacent tuning fork type crystal resonators 2A in the welding process can be in contact with each other. It can be avoided.

  Moreover, the suction hole 6b attracted | sucked to a negative pressure is provided in the bottom face of the recessed part 6a. By the operation of the suction hole 6b, the tuning fork type crystal resonator 2A broken off from the crystal wafer 2 can be sucked and quickly placed in the accommodated state in the recess 6a.

  The roller 7 is disposed at a position where the crystal wafer 2 is sandwiched between the suction plate 3 and the suction plate 3 in the vicinity of the root portion of the tuning-fork type crystal piece 2a. The roller 7 has a rotation shaft 7 a parallel to the length direction of the tuning-fork type crystal piece 2 a on the crystal wafer 2. The roller 7 is provided at the tip of a swing arm 8 that can swing in the vertical direction, and can move between a position contacting the lower surface of the crystal wafer 2 and a position spaced downward.

  The driving device is a linear driving device including a known motor and a ball screw. The driving device is provided on each of the suction plate 3 and the jig plate 6 and linearly moves in the width direction of the tuning fork type crystal piece 2a on the crystal wafer 2. It can be made to. The horizontal movements of the suction plate 3 and the jig plate 6 can be performed separately. By moving the jig plate 6 in the horizontal direction while the suction plate 3 is stationary, the crystal wafer 2 and the jig plate 6 are moved. 6 can be relatively displaced in the horizontal direction.

A method for manufacturing the tuning fork type crystal resonator 2A using the manufacturing apparatus 1 according to this embodiment configured as described above will be described below.
In order to manufacture the tuning fork type crystal resonator 2A using the manufacturing apparatus 1 according to the present embodiment, as shown in FIG. 2, a plurality of tuning fork type crystal pieces 2a are formed in a comb-teeth shape by a notch 2b by photolithography. A crystal wafer 2 formed in (1) is prepared. Next, the prepared crystal wafer 2 is sucked to the lower surface of the suction plate 3 and is disposed at a position close to the upper surface of the jig plate 6 as shown in FIG. At the same time, the quartz wafer 2 disposed in the vicinity of the root portion of the tuning-fork type quartz vibrating piece 2 a is sandwiched between the suction plate 3 and the roller 7 in the thickness direction.

  In this state, the jig plate 6 is moved horizontally in the arrangement direction of the tuning fork type crystal pieces 2a with respect to the suction plate 3 and the crystal wafer 2 by the operation of the driving device, and then the tuning fork type crystal resonator 2A is accommodated. The concave portion 6a is positioned below the tuning-fork type crystal piece 2a to be accommodated. Then, the pressing member 5 is lowered from vertically above through the through hole 4 provided in the suction plate 3, and the top surface of the tuning fork type crystal piece 2a is pressed downward by the tip surface 5a.

As a result, as shown in FIG. 1B, the tuning fork type crystal piece 2a is formed in a cantilever shape, so that the tip is lowered by being pressed by the tip surface 5a of the pressing member 5. So that it is elastically deformed.
That is, as shown in FIGS. 4 and 5, the tuning fork type crystal piece 2 a is arranged in a state where the tip portion is partially inserted into the recess of the jig plate 6. At this stage, the stress due to bending does not exceed the elastic limit, and the root portion of the tuning fork type crystal piece 2a does not break. In this state, the tip of the pressing member 5 is disposed at a position higher than the upper surface of the jig plate 6.

  In this embodiment, the jig plate 6 is horizontally moved from this state in the direction indicated by the arrow A in FIG. As a result, the side surface of the recess 6a comes into contact with the side surface in the width direction of the tuning-fork type crystal piece 2a partially inserted into the recess 6a, and the horizontal direction is pushed to the position indicated by the arrow B in FIG. Pressure F is applied.

  Since the notch 2c is formed at the base of the tuning fork crystal piece 2a, even with a relatively small pressing force F, a large stress concentration is generated in the notch 2c in a very narrow range. As a result, the tuning fork type crystal resonator 2A can be folded from the crystal wafer 2 accurately and without generating fine fragments, accurately cut at the position of the notch 2c.

  After the tuning-fork type crystal resonator 2A is broken, the pressing member 5 is raised, the suction plate 3 is moved in the horizontal direction, and the tuning-fork type crystal piece 2a to be folded next is vertically below the pressing member 5. In addition, the jig plate 6 is moved in the horizontal direction, and the recess 6a for accommodating the tuning-fork type crystal resonator 2A to be folded next is arranged vertically below the tuning-fork type crystal piece 2a. Thereafter, the above steps are repeated.

  Thus, according to the manufacturing apparatus 1 and the manufacturing method of the tuning fork type crystal resonator 2A according to the present embodiment, the tuning fork type crystal piece 2a is elastically deformed by the pressing member 5, and the tip portion thereof is the surface of the crystal wafer 2. The crystal plate 2 is engaged with the recess 6a of the jig plate 6 and the crystal wafer 2 and the jig plate 6 are moved relative to each other in the horizontal direction, thereby applying a pressing force F in the width direction to the tuning fork crystal piece 2a. In addition, a plurality of tuning-fork type crystal resonators 2A can be sequentially folded and manufactured in a state of being accommodated in the recess 6a without causing any inconvenience such as chipping.

In this case, since the tip of the pressing member 5 is disposed at a position higher than the upper surface of the jig plate 6, the jig plate 6 and the pressing member 5 interfere even when the jig plate 6 is moved horizontally. There is nothing.
Further, in the manufacturing apparatus 1 according to the present embodiment, since the tip surface 5a of the pressing member 5 is inclined, when the tuning fork type crystal piece 2a is elastically deformed and folded from the crystal wafer 2, the tip surface 5a is formed. The tuning fork crystal piece 2a can be brought into contact with the surface of the tuning fork crystal piece 2a with a wide contact area. As a result, it is possible to hold the tuning-fork type quartz crystal resonator 2A, which is constructed by being broken off by an impact when the tuning-fork type quartz piece 2a is broken, so that it does not jump out of the recess 6a.

  Further, in the manufacturing apparatus 1 according to the present embodiment, the quartz wafer 2 is adsorbed on the lower surface of the adsorption plate 3, so that the tuning fork type quartz is formed by the receiving pins and the chisel that penetrate through the jig plate as in the prior art. There is no need to convey the piece 2a. Therefore, the time for inserting and removing the receiving pin into and from the jig plate and the time for transporting at least the thickness of the suction plate between the receiving pin and the chisel are unnecessary, and it is necessary to fold one tuning-fork type crystal resonator 2A. The tact time can be greatly reduced. Moreover, the conveyance process to the recessed part 6a can be omitted, and the occurrence of problems such as chipping due to misalignment during conveyance can be prevented. As a result, the production efficiency can be improved, the generation of fine fragments can be prevented, and the quality can be improved.

  Furthermore, in the manufacturing apparatus 1 according to the present embodiment, the through-hole 4 provided in the suction plate 3 extends across the plurality of tuning-fork type crystal pieces 2a in the arrangement direction thereof, so that one tuning-fork type crystal piece It is not necessary to extract the pressing member 5 from the through hole 4 until the other adjacent tuning-fork type crystal piece 2a is folded after the folding of 2a. Therefore, the tact time required for folding one tuning fork type crystal resonator 2A can be further shortened.

  Further, according to the manufacturing apparatus 1 according to the present embodiment, since the crystal wafer 2 is sandwiched between the suction plate 3 and the roller 7, the root portion is reliably supported when the tuning fork crystal resonator 2A is folded. In addition, when the jig plate 6 is moved horizontally to apply the pressing force F to the tuning-fork type crystal piece 2a, the roller 7 is rolled on the surface of the crystal wafer 2 and continuously supported. Can do. By rolling the roller 7 on the surface of the crystal wafer 2, the friction applied to the crystal wafer 2 can be reduced and the soundness of the crystal wafer 2 can be maintained.

It is a partial longitudinal cross-sectional view which shows the manufacturing apparatus of the tuning fork type | mold crystal resonator which concerns on one Embodiment of this invention, (a) is the state which the press member raised, (b) is the state which the press member lowered | hung, respectively Show. FIG. 2 is a partial perspective view showing a crystal wafer from which a tuning fork type crystal resonator is cut out in the manufacturing apparatus of FIG. 1. It is a partial perspective view which shows the manufacturing apparatus of FIG. It is a partial perspective view which shows the state which mounted | wore the quartz wafer with the manufacturing apparatus of FIG. It is a perspective view which expands and shows the press member vicinity of the manufacturing apparatus of FIG. It is a partial top view which shows the relationship between the recessed part of the jig plate in the manufacturing apparatus of FIG. 1, and a tuning fork type crystal piece.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 2 Crystal wafer 2A Tuning fork type crystal oscillator 2a Tuning fork type crystal piece 2b Notch 3 Suction plate 5 Pressing member 5a Inclined surface 6 Jig plate 6a Concave part 7 Roller

Claims (2)

A pressing member that elastically deforms the tuning fork type crystal piece that is cut out in a cantilever shape by cutting into the crystal wafer in the thickness direction,
A jig plate having a recess that is disposed close to the opposite side of the pressing member across a quartz wafer and can accommodate a tuning fork type quartz piece in a positioning state,
An apparatus for manufacturing a tuning fork type crystal resonator, comprising: a drive device that relatively displaces the jig plate and the crystal wafer in a horizontal direction perpendicular to the longitudinal direction of the cantilever . A tuning fork type crystal resonator manufacturing method for separating a tuning fork type crystal piece cut out in a cantilever shape from a crystal wafer by a notch penetrating in the thickness direction of the crystal wafer,
By pressing the tuning fork type crystal piece in the thickness direction and elastically deforming it, it protrudes from the surface of the crystal wafer,
A method for manufacturing a tuning fork crystal resonator, wherein the protruding tip is pressed in the width direction of a tuning fork crystal piece on a quartz wafer to break the root portion of the tuning fork crystal piece.

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