JP2014147945A - Brazing material supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a brazing material supply device capable of accurately arranging a brazing material piece 6 in a brazing material joining part, shortening process time, and reducing manufacturing cost.SOLUTION: A brazing material supply device 10 comprises a cutting part 12 composed of a combination of a receiving blade 13 and a cutting edge 14 for cutting a tape-like brazing material 7 into a brazing material piece 6, a guide 11 for guiding the tape-like brazing material 7 to the cutting part 12, a brazing material presser 18 arranged between the guide 11 and the cutting edge 14 and pressing the tape-like brazing material 7 to the receiving blade 13 and a transfer head mechanism 17 for pressing-fixing the tape-like brazing material 7 having reached on the cutting edge 14 to the cutting edge 14 and adsorbing, holding and transferring the cut brazing material piece 6. In the brazing material supply device 10, the brazing material presser 18 presses the tape-like brazing material 7 sent in between the receiving blade 13 and the cutting edge 14 to the receiving blade 13, and releases pressing force after cutting.

Description

  The present invention relates to a brazing material supply device that cuts a brazing filler metal piece into a brazing filler metal piece and transfers the brazing filler metal piece to a predetermined position.

In the manufacturing process of a semiconductor package, a metal member such as a lead frame or a heat radiating metal plate is joined to a ceramic insulating member via a brazing material.
FIG. 6 is a perspective view showing an example of such a semiconductor package.
In FIG. 6A, a semiconductor package 1 includes a ceramic frame 3 having metallized layers 2 formed on a top surface and a bottom surface formed by printing a conductive paste such as tungsten or molybdenum and firing on the upper surface of the frame 3. A lead frame 4 made of a metal material such as an Fe—Ni alloy joined via a brazing material, and copper tungsten (Cu—W) or copper molybdenum (Cu) joined to the lower surface of the frame 3 via a brazing material. And a base 5 made of a metal material such as Mo).
As shown in FIG. 6B, the frame 3 and the lead frame 4 are joined by arranging two strip-shaped brazing material pieces 6 in parallel on the lead frame 4, and further brazing material pieces thereon. 6 and the metallized layer 2 are arranged so that the frame 3 is arranged and heat-treated at a predetermined temperature.

In order to arrange the brazing filler metal piece 6, a brazing filler metal feeding device is used that cuts the tape-like brazing filler material into a brazing filler metal piece and sucks and transfers the brazing filler metal piece. FIG. 7 shows a conventional brazing material supply device, 51 is a guide for guiding the tape-shaped brazing material 7 arranged on the upper surface portion to the cutting portion 52, and 53 and 54 are the tape-shaped brazing material 7 fed out through the guide 51. The cutting blade 54 rises when the tape-like brazing material 7 is cut. A gap h larger than the thickness of the tape-shaped brazing material 7 is provided between the receiving blade 53 and the guide 51 so that the tape-shaped brazing material 7 can be fed to the cutting portion 52.
Reference numeral 57 denotes a transfer head mechanism that abuts against the brazing filler metal piece 6 cut from the tape-like brazing filler metal 7 by the rising of the cutting blade 54 and vacuum-sucks and transfers the brazing filler metal piece 6. The suction nozzle 55 includes a suction nozzle 55 and a holder 56 that holds the suction nozzle 55. When the suction nozzle 55 sucks the brazing filler metal piece 6, the transfer head mechanism 57 moves above the lead frame 4 to place the brazing filler metal piece 6, and then returns to the original position.

  In the above brazing material supply device, after the tape-shaped brazing material 7 is cut by raising the cutting blade 54, the cut brazing material piece 6 is further raised and sucked by the suction nozzle 55. At the time of cutting the tape-shaped brazing material 7, the brazing material piece 6 is rotated or displaced due to impact or vibration caused by the operation of the cutting blade 54, and in this state, the brazing material piece 6 is attracted to the suction nozzle 55. For this reason, the brazing filler metal piece 6 is displaced on the lead frame 4 and has a problem of poor bonding.

In order to solve such a problem, Non-Patent Document 1 discloses that an upper blade cutter and a lower blade cutter for cutting a thin material fed in the horizontal direction between the upper and lower sides into small pieces, on the lower blade cutter. The above-mentioned thin material is pressed from above and fixed in position, a needle for vacuum-adsorbing the upper piece cut by the upper blade cutter and the lower blade cutter, and supporting the needle so as to move up and down, When the thin material is fed between the upper and lower cutters, it descends and presses the thin piece on the lower blade cutter with the needle, and when it is cut into the small pieces, it is adsorbed by the needle and rises to move onto the welding position on the part Then, a thin metal cutting and welding apparatus including a support frame that lowers and presses and welds a small piece adsorbed by the needle onto a component, and a spring member that is attached to the support frame and presses the needle downward is provided. Have been described.
According to the above-mentioned cutting and welding apparatus, the thin material that is fed in and pressed on the lower blade cutter is pressed and fixed in position by the needle, cut into small pieces by the cutting operation of the cutter, and this small piece is vacuum-adsorbed by the needle and transferred onto the part. Since the welding is performed, the small piece can be welded to the welding location on the part with high positional accuracy, and the welding failure with other parts due to misalignment can be eliminated.

  FIG. 8A is a perspective view showing another example of the semiconductor package. The number of leads of the lead frame 4 is larger than that of the semiconductor package 1 of FIG. Except that the lead 9 of the frame 4 is connected, the configuration is the same as that of the semiconductor package 1 of FIG. In this case, the frame 3 and the lead frame 4 are also joined by using a brazing material. As shown in FIG. 8B, four brazing material pieces 6 are arranged on the lead frame 4 in a lattice shape. Further, the frame body 3 is disposed so that the brazing filler metal piece 6 and the metallized layer 2 overlap each other, and heat treatment is performed at a predetermined temperature.

In the conventional brazing material supply device 50 shown in FIG. 7 and the cutting and welding device described in Non-Patent Document 1, only one brazing material piece can be transferred onto the lead frame at a time. In the semiconductor package 1, the brazing material piece transfer process is required four times, and the process time cannot be shortened.
In order to solve such a problem, a ring-shaped brazing material as shown in Patent Document 1 is used. In this case, as shown in FIG. 8C, the frame 3 and the lead frame 4 are joined by arranging a ring-shaped brazing material 8 on the lead frame 4 and further a ring-shaped brazing material 8 and a metallized layer thereon. The frame 3 is arranged so that 2 overlaps and heat-treated at a predetermined temperature.
If a ring-shaped brazing material as shown in Patent Document 1 is used, the brazing material can be arranged on four sides at a time, and the process time can be shortened.

Japanese Utility Model Publication No. 57-23926

JP 2002-239786 A

  In the cutting and welding apparatus described in Non-Patent Document 1, there is no description relating to a technique for fixing the tape-shaped brazing material 7 positioned between the guide 51 and the receiving blade 53 at the time of cutting. In such a cutting and welding apparatus, the tape-shaped brazing material 7 pressed against the receiving blade 53 by the rising of the cutting blade 54 is cut off from the brazing filler metal piece 6 by cutting and falls from the receiving blade 53 side to the guide 51 side. To do. Due to the impact of the drop, the position of the tip 7a of the tape-shaped brazing material 7 is displaced, and the problem that the position of the displaced tip 7a of the tape-shaped brazing material 7 is fed into the cutting blade 54 has occurred.

In addition, in order to use the ring-shaped brazing material as shown in Patent Document 1, a mold for punching the ring-shaped brazing material 8 must be prepared for each shape and size of the semiconductor package 1. There was a problem that it was difficult to reduce the manufacturing cost of the.
The present invention provides a brazing material supply device that solves the above-described problems and that can dispose the brazing filler metal piece on the brazing filler joint with high positional accuracy, reduce the process time, and reduce the manufacturing cost. With the goal.

The brazing filler metal supply device according to claim 1 of the present invention for solving the above-described problem is provided.
A cutting part comprising a combination of a receiving blade and a cutting blade for cutting the tape-shaped brazing material into a brazing material piece;
A guide for guiding the tape-shaped brazing material to the cutting portion;
A brazing material presser installed between the guide and the cutting blade and pressing the tape-shaped brazing material against the receiving blade;
A brazing filler metal supply device having a transfer head mechanism that presses and fixes the tape-shaped brazing filler metal reaching the cutting blade to the cutting blade and sucks and holds the cut brazing filler metal piece,
The brazing material presser is a brazing material supply device that presses the tape-shaped brazing material fed between the receiving blade and the cutting blade against the receiving blade and releases the pressing force after cutting. .

Moreover, the brazing material supply apparatus according to claim 2 of the present invention for solving the above-described problems is
The two tape-shaped brazing filler metals are arranged in parallel and guided to the cutting portion, the cutting portion simultaneously cuts the two tape-shaped brazing filler metals guided in parallel, and the transfer head mechanism has two 2. The brazing filler metal supply device according to claim 1, wherein the brazing filler metal piece having unit transfer heads is sucked and held one by one and is transferred.

Moreover, the brazing filler metal supply device according to claim 3 of the present invention for solving the above-described problems is provided.
The transfer head mechanism is
Means for adjusting the arrangement pitch of the two unit transfer heads to the arrangement pitch of the two brazing filler metal pieces cut;
Means for simultaneously sucking and holding the two brazing filler metal pieces by the two unit transfer heads;
Means for transferring the two brazing filler metal pieces held by adsorption;
The brazing material supply device according to claim 2, further comprising means for adjusting an arrangement pitch of the two unit transfer heads to a pitch of the brazing material joint.

Moreover, the brazing material supply apparatus according to claim 4 of the present invention for solving the above-described problem is
4. The brazing material supply device according to claim 3, wherein the unit transfer head includes a mechanism that rotates 90 degrees in the horizontal direction after the brazing material pieces are sucked and held.

  According to the brazing material supply device of the first aspect of the present invention, the tape-shaped brazing material presser is installed between the guide and the cutting blade and presses the tape-shaped brazing material supplied toward the receiving blade against the receiving blade. The brazing material press has a tape-shaped brazing material immediately before cutting, which is fed between the receiving blade and the cutting blade, pressed against the receiving blade and releases the pressing force after cutting. For this reason, since the edge part of the tape-shaped brazing material cut off from the brazing material piece immediately after cutting is pressed against the receiving blade, the edge part of the tape-shaped brazing material is not displaced due to the impact of the cutting. Therefore, the end of the tape-like brazing material is guided onto the cutting blade without causing a positional shift.

  According to the brazing material supply device of the second aspect of the present invention, two brazing material pieces can be transferred at a time, and the process time can be shortened.

  According to the brazing material supply apparatus of the third aspect of the present invention, the pitch of the two tape-shaped brazing materials and the pitch of the two unit transfer heads can be changed by changing the arrangement pitch of the two unit transfer heads. There is no need to match the pitch of the brazing joint. Therefore, the time required for adjusting the apparatus can be shortened.

  According to the brazing material supply apparatus of the fourth aspect of the present invention, the unit transfer head includes a mechanism that rotates 90 degrees in the horizontal direction, whereby the four strip-shaped brazing material pieces are arranged in a frame shape. be able to. Therefore, it is not necessary to prepare a ring-shaped brazing die for each shape and size of the semiconductor package, and the manufacturing cost of the brazing material can be reduced.

The side view of the brazing material supply apparatus which concerns on 1st Example of this invention. Explanatory drawing of operation | movement of the brazing material supply apparatus which concerns on 1st Example of this invention. The perspective view of the brazing material supply apparatus which concerns on 2nd Example of this invention. Explanatory drawing of operation | movement of the brazing material supply apparatus which concerns on 3rd Example of this invention. Explanatory drawing of operation | movement of the brazing material supply apparatus which concerns on 4th Example of this invention. An example of a semiconductor package is shown, (a) is a perspective view of the semiconductor package, (b) is an exploded perspective view for explaining an assembly method of the semiconductor package. Side view of brazing material supply device according to conventional example 2A and 2B show another example of a semiconductor package, in which FIG. 1A is a perspective view of the semiconductor package, FIG. 1B is an exploded perspective view for explaining an assembly method of the semiconductor package, and FIG. Exploded perspective view for explaining the method

(First embodiment)
1 and 2 are diagrams for explaining a brazing filler metal supply device according to a first embodiment of the present invention. FIG. 1 is a side view of the brazing filler metal supply device, and FIG. It is.
First, the brazing material supply device of the first embodiment will be described with reference to FIG.
Reference numeral 11 denotes a guide for inserting the tape-shaped brazing material 7 into the upper surface portion and guides it to the cutting portion 12. Reference numerals 13 and 14 denote the brazing material piece 6 having a predetermined length cut into the tape-shaped brazing material 7 fed through the guide 11. The cutting blade 14 rises when the tape-shaped brazing material 7 is cut. A gap h larger than the thickness of the tape-shaped brazing material 7 is provided between the receiving blade 13 and the guide 11 so that the tape-shaped brazing material 7 can be fed to the cutting part 12.
Reference numeral 17 denotes a transfer head mechanism that abuts against the brazing filler metal piece 6 cut from the tape-like brazing filler metal 7 by the rising of the cutting blade 14 and transfers it by vacuum suction. The transfer head mechanism 17 vacuums the brazing filler metal piece 6. It comprises a suction nozzle 15 for suction and a holder 16 for holding the suction nozzle 15. When the suction nozzle 15 sucks the brazing filler metal piece 6, the transfer head mechanism 17 moves above the lead frame 4 to place the brazing filler metal piece 6, and then returns to the original position.
18 is a brazing material presser that is installed between the guide 11 and the cutting blade 14 and presses the tape-shaped brazing material 7 against the receiving blade 13, and moves up and down as the cutting blade 14 moves.

Next, the operation of the brazing material supply apparatus of the first embodiment will be described with reference to FIG.
First, as shown in FIG. 2A, the tape-shaped brazing material 7 is fed between the receiving blade 13 and the cutting blade 14. Next, as shown in FIG. 2B, the brazing material presser 18 rises and presses the tape-shaped brazing material 7 against the receiving blade 13. Next, the suction nozzle 15 descends and stops at a position where the tip of the suction nozzle 15 comes into contact with the tape-like brazing material 7 to suck the tape-like brazing material 7. Next, as shown in FIG. 2 (c), the cutting blade 14 rises as shown by an arrow, and the tape-shaped brazing material 7 is cut. At this time, the cut brazing filler metal piece 6 is fixed to the suction nozzle 15 without being displaced. Further, the end 7a of the tape-like brazing material 7 after being cut is also pressed and fixed to the receiving blade 13 by the brazing material presser 18 without causing a positional shift. Next, as shown in FIG. 2D, after the transfer head mechanism 17 is raised, it moves above the lead frame 4 to place the brazing filler metal piece 6, and then returns to its original position. Further, the cutting blade 14 and the brazing material presser 18 are lowered to the position shown in FIG.
According to the brazing material supply device 10 of the present embodiment, the end portion 7a of the tape-shaped brazing material 7 immediately after cutting is pressed against the receiving blade 13, so that the position of the end portion 7a does not shift due to the impact of cutting. . Therefore, the end 7a of the tape-shaped brazing material 7 is guided onto the cutting blade 14 without causing a positional shift.

(Second embodiment)
FIG. 3 is a perspective view of a brazing material supply device according to a second embodiment of the present invention.
In the first embodiment, one brazing piece is cut and transferred at a time, but in this embodiment, two brazing pieces are cut and transferred at a time. In this case, as shown in FIG. 3, two tape-shaped brazing materials 7 are arranged in parallel on the guide 11 and guided to the cutting part 12. Further, the transfer head mechanism 17 of the present embodiment has two unit transfer heads 20, and one tape-like brazing material 7 is lowered onto each of the cutting blades 14 by lowering each unit transfer head 20. Suck and hold one by one. Next, the cutting blade 14 rises and cuts the two tape-shaped brazing materials 7 simultaneously. Finally, the cut two brazing filler metal pieces 6 are transferred by the transfer head mechanism 17 and placed on the brazing filler metal joints 4 a and 4 b of the lead frame 4. Here, the pitch P1 of the two tape-shaped brazing materials 7 reaching the cutting blade 14 and the pitch P of the two unit transfer heads 20 are the same as the pitch P2 of the joints 4a and 4b of the lead frame 4. It adjusts beforehand so that it may become. Other matters may be the same as in the first embodiment.
According to the brazing material supply apparatus of the present embodiment, two brazing material pieces can be transferred at a time, and the process time can be shortened.

(Third embodiment)
In the transfer head mechanism 17 of the second embodiment, the pitch P of each unit transfer head 20 is fixed, but in the transfer head mechanism 17 of this embodiment, the pitch P between the two unit transfer heads 20 is fixed. Can be changed. In this case, a motor (not shown) is built in the connecting arm 19 that holds the two unit transfer heads 20, and each unit transfer head 20 is connected to the motor. Then, the unit transfer head 20 moves in the longitudinal direction of the connecting arm 19 by driving the motor. As a result, the pitch P between the two unit transfer heads 20 is changed.
Next, operation | movement of the brazing material supply apparatus of a present Example is demonstrated using FIG.
FIG. 4A shows a state where the transfer head mechanism 17 is moved onto the cutting blade 14. Here, the arrangement pitch P of the two unit transfer heads 20 is matched with the pitch P1 of the two tape-shaped brazing materials 7 reaching the cutting blade 14. Next, after the brazing material presser 18 is raised and presses the tape-shaped brazing material 7 against the receiving blade 13 (see FIG. 2B), the suction nozzle 15 as shown in FIG. Is lowered and stopped at a position where the tip thereof contacts the tape-like brazing material 7, and holds the tape-like brazing material 7 by suction. Next, as shown in FIG. 4C, the cutting blade 14 rises as shown by an arrow, and the brazing filler metal piece 6 cut by cutting the tape-like brazing filler metal 7 is in a state of being sucked and held by the suction nozzle 15. . Next, as shown in FIG. 4D, after the transfer head mechanism 17 is lifted, it moves above the lead frame 4 to place the brazing filler metal piece 6 on the brazing filler joints 4a and 4b. Return to the original position. In this moving process, the arrangement pitch P of the two unit transfer heads 20 is matched with the pitch P2 of the brazing material joints 4a and 4b of the lead frame 4.
In this way, by making the arrangement pitch P of the two unit transfer heads 20 variable, the pitch P1 of the two tape-shaped brazing materials 7 and the pitch P of the two unit transfer heads 20 are joined to the lead frame 4. There is no need to match the pitch P2 of the portions 4a and 4b. Therefore, the time required for adjusting the apparatus can be shortened.

(Fourth embodiment)
The brazing filler metal supply device of the fourth embodiment includes four strips by providing a mechanism in which the two unit transfer heads 20 rotate 90 degrees in the horizontal direction in the transfer head mechanism 17 of the third embodiment. A brazing filler metal piece can be arranged in a frame shape on the brazing filler metal joint portion of the lead frame.
Next, the operation of arranging the four brazing filler metal pieces 6a, 6b, 6c and 6d on the lead frame 4 in two steps will be described with reference to FIG.
First, the operation of arranging the brazing filler metal pieces 6a and 6b on the lead frame 4 will be described. This operation is different from the operation of the third embodiment except that the operation of the transfer process in which the brazing filler metal pieces 6a and 6b sucked and held by the transfer head mechanism 17 are moved and arranged above the lead frame 4 is different. Since this is the same, only the operation of the transfer process will be described. FIG. 5A is a side view showing the entire transfer process, and FIGS. 5B to 5E are plan views showing changes in the relative positions of the brazing filler metal pieces 6a and 6b in the transfer process. First, the brazing filler metal pieces 6a and 6b immediately after being sucked and held by the unit transfer heads 20a and 20b are parallel as shown in FIG. 5B. Next, the unit transfer head 20a holding the brazing material piece 6a is rotated 90 degrees so that the angle formed by the brazing material piece 6a and the brazing material piece 6b is 90 degrees as shown in FIG. Next, the unit transfer head 20a holding the brazing material piece 6a is moved by a predetermined amount so that the brazing material pieces 6a and 6b are arranged in an L shape as shown in FIG. Then, the transfer head mechanism 17 moved onto the lead frame 4 is lowered, and the brazing filler metal pieces 6a and 6b arranged in an L shape are placed on the brazing filler metal joint portion of the lead frame 4 as shown in FIG. Deploy.
Next, the operation of arranging the brazing filler metal pieces 6c and 6d on the lead frame 4 will be described. This operation is the same as that of the third embodiment except that the operation of the transfer process in which the brazing filler metal pieces 6c and 6d attracted and held by the transfer head mechanism 17 are transferred and arranged above the lead frame 4 is different. Therefore, only the operation of the transfer process will be described. FIG. 5 (f) is a side view showing the entire transfer process, and FIGS. 5 (g) to 5 (j) are plan views showing changes in the relative positions of the brazing filler metal pieces 6c and 6d in the transfer process. First, the brazing filler metal pieces 6c and 6d immediately after being attracted and held by the unit transfer heads 20a and 20b are parallel as shown in FIG. Next, the unit transfer head 20b holding the brazing material piece 6d is rotated 90 degrees so that the angle formed by the brazing material piece 6c and the brazing material piece 6d is 90 degrees as shown in FIG. Next, the unit transfer head 20b holding the brazing material piece 6d is moved by a predetermined amount so that the brazing material pieces 6c and 6d are arranged in an L shape as shown in FIG. Then, the transfer head mechanism 17 moved onto the lead frame 4 is lowered, and the brazing filler metal pieces 6c and 6d arranged in an L shape are placed on the brazing filler metal joint portion of the lead frame 4 as shown in FIG. Deploy.
In the present embodiment, the brazing material is arranged in a frame shape on the lead frame 4 by arranging the four brazing material pieces 6a, 6b, 6c, 6d on the lead frame 4 in two steps. ing. Therefore, it is not necessary to use the ring-shaped brazing material 8 as shown in FIG. 8C, and it is not necessary to prepare a mold for punching the ring-shaped brazing material for each shape and size of the semiconductor package. Cost can be reduced.

DESCRIPTION OF SYMBOLS 1 Semiconductor package 2 Metallized layer 3 Frame 4 Lead frame 5 Base | substrate 6, 6a, 6b, 6c, 6d Brazing material piece 7 Tape-shaped brazing material 7a End part 8 Ring-shaped brazing material 9 Lead 10 Brazing material supply apparatus 11 Guide 12 Cutting Part 13 Receiving blade 14 Cutting blade 15 Suction nozzle 16 Holder 17 Transfer head mechanism 18 Brazing material presser 19 Connecting arm 20, 20a, 20b Unit transfer head

Claims (4)

  A cutting portion comprising a combination of a receiving blade and a cutting blade for cutting the tape-shaped brazing material into a brazing material piece, a guide for guiding the tape-shaped brazing material to the cutting portion, and installed between the guide and the cutting blade. A brazing material presser that presses the tape-shaped brazing material against the receiving blade, and the tape-shaped brazing material that has reached the cutting blade is pressed and fixed to the cutting blade, and the cut brazing material piece is adsorbed and held. A brazing material supply device having a transfer head mechanism for transferring the brazing material, wherein the brazing material presser presses the tape-shaped brazing material fed between the receiving blade and the cutting blade against the receiving blade, and after cutting A brazing material supply device, wherein the pressing force is released.   The two tape-shaped brazing filler metals are arranged in parallel and guided to the cutting portion, the cutting portion simultaneously cuts the two tape-shaped brazing filler metals guided in parallel, and the transfer head mechanism has two The brazing filler metal supply device according to claim 1, wherein the brazing filler metal piece having unit transfer heads is sucked and held one by one and transferred.   The transfer head mechanism includes means for adjusting the arrangement pitch of the two unit transfer heads to the arrangement pitch of the cut two brazing filler metal pieces, and the two brazing filler metal pieces by the two unit transfer heads. Means for simultaneously adsorbing and holding the two brazing filler metal pieces, and means for adjusting the arrangement pitch of the two unit transfer heads to the pitch of the brazing joint portion. The brazing material supply apparatus according to claim 2. The brazing material supply device according to claim 3, wherein the unit transfer head includes a mechanism that rotates 90 degrees in the horizontal direction after the brazing material piece is sucked and held.

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