JPH0379110A - Chucking method for thin plate type crystal tuning fork - Google Patents

Abstract

PURPOSE:To improve the shape of a broken end by mounting a wafer on a flat plate, clamping the wafer by a toothed vacuum chuck, and chucking the wafer while feeding it laterally and disconnecting a single vibrator body. CONSTITUTION:Tuning fork type vibrator bodies 4 are broken, one by one, by the toothed vacuum chuck 1. Namely, the crystal wafer (frame) 3 is fixed to a plate 13 with a pin, etc. The toothed vacuum chuck 1 moves finely as shown by an arrow 7 to clamp a single tuning fork type vibrator body 4 with the plate 13 and then moves as shown by an arrow 8 to break the cutoff part 3' of the single tuning fork vibrator body 4 and chuck and convey the body to a next process. Consequently, the shape of the peck broken end is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for separating and simultaneously chucking single resonators from a wafer in which tuning fork crystals, which are one type of crystal resonators, are mounted in series.

[Summary of the invention]

The present invention achieves low cost by placing a wafer on which a large number of tuning fork type vibrators are mounted on a flat plate, clamping it with a toothed vacuum chuck, and separating the vibrator units by horizontally feeding the wafer in this state. The present invention provides a separation chuck method in which a separation mechanism can be constructed and a vibrator with a good shape of the bent end can be obtained.

[Conventional technology]

As shown in the cross-sectional view of FIG. 2, conventionally, the chisel 5 and the receiver clamped the single vibrator 4 with the pin 6, and separated by applying lateral feed, and the receiver was chuffed to the pin 6 with a vacuum.

[Problem to be solved by the invention]

In the conventional method, there were problems in that it took time to adjust the chisel 5 and the pin 6, the separation mechanism was complicated, the cost was high, and the shape of the folded end was poor.

(Means for solving !Ill!) This is a method for separating and chucking a single tuning fork-shaped resonator from a thin crystal wafer.The wafer is placed on a flat plate and clamped with a toothed vacuum chuck. Next, by horizontally feeding the transducer, separating the transducer, and chucking the transducer at the same time, a method has been realized in which the transducer can be easily separated.

[Effect]

Since the tuning fork vibrator is folded on the plate, adjustment is easy, the cost of the disconnection mechanism is low, and the shape of the fold is improved.

(Embodiment) Hereinafter, embodiments of the present invention will be described based on the drawings. First, as shown in the plan view of FIG. However, in the present invention, a single tuning fork vibrator 4 is broken one by one using a toothed vacuum chuck 1 as shown in the cross-sectional view of FIG. 1.A crystal wafer ( The frame) 3 is fixed to the plate 13 with pins etc. The toothed vacuum chuck l moves slightly in the direction of arrow 7, and after sandwiching the tuning fork vibrator unit 4 between plate 13, moves in the direction of arrow 8. Then, the single tuning fork vibrator 4 is chucked with a vacuum that bends the separated portion 3 degrees, and then transferred to the next process.

〔Effect of the invention〕

As described above, the present invention has the effect of folding the separating portion of a single tuning fork vibrator on the plane of the plate, making adjustment easy, reducing the cost of the separating mechanism, and improving the shape of the peck break.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of a conventional cutting method, and FIG. 3 is a plan view showing a wafer of a crystal tuning fork. 1...Toothed vacuum chuck 2...Teeth 3...Wafer (frame) 3°...Separation part 4...Tuning fork vibrator unit 5...Chisel 6...Bin 13...・More than a board

Claims (1)

[Claims] This is a method for separating and chucking a single tuning fork-shaped resonator from a thin crystal wafer. A method for chucking a thin plate-like tuning fork, which is characterized by separating and chucking a single piece at the same time.