JP2007135131A - Breaking-off device for piezoelectric element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an element breaking-off device capable of accurately breaking off a plurality of piezoelectric elements supported by a wafer from the wafer at the same time. <P>SOLUTION: The element breaking-off device includes: a breaking-off means 50 that includes a plurality of breaking-off pins 52 opposed to the piezoelectric elements supported by the wafer 20 and allows the pins 52 to be relatively advanced to and retreated from the piezoelectric elements so as to break off the piezoelectric elements from the wafer 20; and an element positioning tool 70 for using an accommodation unit 72 corresponding to an outward form of the wafer 20 to position the wafer 20 and including throughholes 74 each corresponding to each of the piezoelectric elements at an inner bottom of the accommodation unit 72. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a device for breaking a plurality of piezoelectric elements formed on a wafer.

Piezoelectric devices using piezoelectric elements are widely used in small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems. Has been.
FIG. 9 is a conventional conceptual diagram in which a piezoelectric element is broken from a wafer on which a plurality of piezoelectric elements are formed (see, for example, Patent Document 1).

As shown in FIG. 9, a plurality of conventional piezoelectric elements 2 are formed on, for example, a quartz wafer 1 using a photolithography technique. That is, the outer shape of the plurality of piezoelectric elements 2, 2,... Supported by the weak support portion 3 on the frame portion 4 of the crystal wafer 1 is formed by photolithography, and then the electrode film is formed on the surface of each piezoelectric element 2. (Not shown) is patterned.

Then, the quartz wafer 1 on which the outer shape and the electrode film of the plurality of piezoelectric elements 2, 2,... Are formed as described above is placed on, for example, a table jig (not shown), and the table side is fed, The suction nozzle 5 is lowered and pressed against the piezoelectric element 2, and the fragile support portion 3 is broken to form a plurality of piezoelectric elements 2, 2,.

JP 2003-198303 A

However, in the manufacturing method of the piezoelectric element 2 as shown in FIG. 9, since the piezoelectric element 2 is folded one by one from the quartz wafer 1 by one suction nozzle 5, a plurality of piezoelectric elements 2, 2,.・
The work efficiency for forming was poor.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an element breaker that can simultaneously and accurately break a plurality of piezoelectric elements supported by a wafer from the wafer. Yes.

According to the first aspect of the present invention, the piezoelectric element is opposed to each of the plurality of piezoelectric elements supported by the wafer and advances and retreats relative to the piezoelectric element, so that the piezoelectric element is moved from the wafer. The wafer is positioned by a breaker having a plurality of breaker pins configured to break the wafer, and a housing portion corresponding to the outer shape of the wafer, and at least the plurality of piezoelectric elements are disposed on the inner bottom of the housing portion. This is achieved by an element folding device including an element positioning jig having a through hole corresponding to each.

According to the configuration of the first invention, the element folding device opposes each of the plurality of piezoelectric elements and advances and retreats relative to the piezoelectric elements, thereby folding the piezoelectric elements from the wafer. A folding means having a plurality of breaking pins is provided. For this reason, if a plurality of break-off pins are moved forward and backward relative to the wafer, the plurality of piezoelectric elements can be simultaneously broken off from the wafer.
In addition, the element breaker includes an element positioning jig that positions the wafer by the accommodating portion corresponding to the outer shape of the wafer. For this reason, since the wafer is housed in the housing portion of the element positioning jig and accurately arranged, as described above, even if the plurality of breaker pins are moved forward and backward relative to the wafer, the breaker pins Can be brought into contact with an accurate position.
And this element positioning jig has a through hole corresponding to each of at least a plurality of piezoelectric elements on the inner bottom of the accommodating portion, so that the breaker pin brought into contact with the accurate position as described above can be used as it is. By continuing to push, the piezoelectric element can be folded off from the wafer without hindrance.
Therefore, according to the present invention, it is possible to provide an element breaker that can simultaneously and accurately break a plurality of piezoelectric elements supported by a wafer from the wafer.

According to a second aspect of the present invention, in the configuration of the first aspect of the invention, the break-off means includes the break-off pin so that the piezoelectric element is inclined with respect to a portion other than the piezoelectric element of the wafer. It is arranged.
According to the configuration of the second aspect of the invention, the folding means is provided with the folding pins so that the piezoelectric element is tilted and broken with respect to the portion other than the piezoelectric element of the wafer. Then, when the piezoelectric element is folded with the breaker pin, the piezoelectric element is inclined with respect to other portions of the wafer, for example, the frame portion, so that a torsional stress is applied to the portion supporting the piezoelectric element. Therefore, the piezoelectric element can be easily folded from the wafer.

According to a third invention, in the configuration of the first or second invention, a presser cover is provided above the element positioning jig so as to cover the opening of the housing portion. .
According to the configuration of the third aspect of the invention, the presser cover that covers the opening of the housing portion is disposed above the element positioning jig. Therefore, the piezoelectric element can be reliably accommodated in the pocket of the predetermined element accommodation tray by pressing the jumping of the piezoelectric element broken off by the presser cover.

According to a fourth aspect of the invention, in the configuration of the third aspect of the invention, the receiving portion of the element positioning jig has a depth greater than the thickness of the wafer.
According to the configuration of the fourth aspect of the invention, the housing portion of the element positioning jig is formed with a depth larger than the thickness of the wafer. Therefore, as described above, even if the opening of the housing portion of the element positioning jig is covered with the presser cover, a gap is formed between the wafer and the presser cover,
As in the second aspect of the invention, the piezoelectric element can be tilted to apply a twisting stress to the support portion, and the piezoelectric element can be easily folded from the wafer.

According to a fifth aspect of the present invention, in the structure according to any one of the first to fourth aspects, the break-off means is formed with a suction hole for sucking dust due to the break-off of the piezoelectric element. And
According to the configuration of the fifth invention, since the suction means for sucking dust due to the breaking of the piezoelectric element is formed in the folding means, the dust generated when the piezoelectric element is broken, For example, vacuum suction from the suction hole can prevent dust from adhering to the piezoelectric element.

FIG. 1 is a schematic perspective view of a piezoelectric device using a piezoelectric element after being folded using the element folding device of the present invention, and shows a piezoelectric vibration gyro sensor 10 as an example of the piezoelectric device.
The piezoelectric vibration gyro sensor 10 accommodates a piezoelectric element 14 in a rectangular package 12 and is sealed with a lid 13.

The piezoelectric element 14 has a substantially square base 15 in plan view in the center, and the base 15 is joined to a TAB tape 19 formed so as to extend from the package 12 toward the lid 13, whereby the package 12 Is mounted on. And the piezoelectric element 14 is the base 1 in FIG.
5 has a pair of detection arms 16a and 16b extending from the left and right sides. In addition, the piezoelectric element 14 is connected to the connecting portions 17a, 17b in a direction perpendicular to the detection arms 16a, 16b from the base portion 15.
17b extends, and detection arms 16a and 16b are provided at the ends of the connecting portions 17a and 17b.
The driving arms 18a and 18b are formed so as to be parallel to each other.

When such a piezoelectric gyro sensor 10 rotates in the XY plane of FIG. 1, that is, around the Z axis, the driving arms 18 a and 18 b bend and vibrate due to the generation of Coriolis force, and this vibration is caused by the connecting portions 17 a and 17 b and The detection arms 16 a and 16 b are also bent and vibrated by being transmitted to the detection arms 16 a and 16 b through the base 15. The detection arms 16a, 1
The detection electrode (not shown) detects the distortion caused by the bending vibration 6b, and the rotation and angular velocity are obtained.

FIG. 2 is a partially enlarged view of a wafer 20 for forming the piezoelectric element 14 used in the piezoelectric vibration gyro sensor 10 of FIG. 1, and the element folding apparatus of the present invention is arranged in a lattice pattern of the wafer 20. The plurality of piezoelectric elements 14, 14,...
The wafer 20 is made of, for example, quartz, and a plurality of the piezoelectric elements 14, 14,
... is now supported. Specifically, the wafer 20 has a frame portion 22, and each piezoelectric element 14 is supported on the frame portion 22 via a support portion 24.

The support portion 24 is a portion that is cut when the piezoelectric element 14 is folded, and in the case of the present embodiment, the support point 24a that is the boundary so that the support portion 24 can be cleanly cut at the boundary between the support portion 24 and the base portion 15. Grooves or notches are formed in the. Further, a plurality of support portions 24 are configured to support each piezoelectric element 14, and specifically, four support portions 24 are formed and each has a center of gravity O.
Are connected to the four corners of the base 15 so as to be equidistant from each other.
In the present embodiment, the four support points 24a, 2 are located away from the center of gravity O.
4a, 24a, a part other than the region surrounded by 24a, specifically, two detection arms 16a
16b, a breaker pin, which will be described later, is pressed against the tip portion P of one detection arm 16b to cut the support point 24a.

Next, an element folding apparatus for folding a plurality of piezoelectric elements 14 from the wafer 20 will be described.
3 to 5 show the element breaker 30 according to the present embodiment. FIG. 3 is a schematic overall view of the element breaker 30. FIG. 4 is a characteristic part of the element breaker 30. FIG. 5 is an exploded perspective view of the folding unit 40 attached to the folding device 30, and FIG.
FIG. 5 is a partially enlarged vertical cross-sectional view in which 0 is combined and cut along the line AA in FIG. 4.

As shown in FIG. 3, the element folding device 30 includes a Z-axis direction moving unit 32, a suction unit 31, and a folding unit 40.
The Z-axis direction moving means 32 can move the arm 33 in the Z-axis direction in FIG. 3 by an actuator using, for example, a ball screw or an air slide. And the below-mentioned arm 33 is connected with a breaker means 50 (to be described later) of the breaker unit 40 so that the breaker means 50 can move in the Z-axis direction. Note that the present invention is not limited to such an embodiment, and for example, the folding unit 50 may be moved by an apparatus such as an arm robot.

The suction means 31 is a means for sucking dust due to breakage of the piezoelectric element by setting suction holes 54 and 84 to be described later to a negative pressure. In this embodiment, as shown in FIG. And a compressed air generation source 35. That is, the compressed air sent from the compressed air generation source 35 is blown out from an exhaust port (not shown) provided in the vacuum generator 34, whereby the air on the suction side (the air passage 38 side in FIG. 3) is vacuumed. You can do it. The suction means 31
Is not limited to such a form, and may be a means for generating a vacuum with a vacuum pump, for example.

As shown in FIGS. 3 to 5, the folding unit 40 includes, in order from the top, folding means 50 for breaking the piezoelectric elements from the wafer, a presser cover 60 for restricting the movement of the broken piezoelectric elements, An element positioning jig 70 for positioning the wafer 20, an element accommodating tray 80 for accommodating the broken piezoelectric element, and a tray setting jig 90 for setting the element accommodating tray 80 are configured.

That is, as shown in FIG. 3, the tray setting jig 90 fixed on the table 36 is
As shown in FIGS. 4 and 5, a recess 92 for detachably storing the element storage tray 80 is provided.
A plurality of convex portions 94 are provided on the opening end surface (periphery of the tray setting jig 90) 90a of the recess 92. The element positioning jig 70 and the presser cover 60 are sequentially placed on the peripheral edge 90a, and the element positioning jig 70 and the presser cover 6 are placed.
The projections 94, 94 are inserted into the through holes 71, 71, 61, 61 formed in the peripheral edge of 0, and the element positioning jig 70 and the presser cover 60 are positioned with respect to the tray setting jig 90. It has come to be.

The breaker means 50 includes the presser cover 60 and the element positioning jig 7 connected to each other.
0, the element accommodating tray 80 and the tray setting jig 90 are approached and separated from each other, and when approaching, a plurality of guide pins 57 and 57 are attached to the presser cover 60 and the element positioning jig 70 as shown in FIG. It is positioned with respect to the presser cover 60 and the element positioning jig 70 by being inserted into guide portions 67, 67, 77, 77 made of through holes formed in the peripheral edge.

Hereinafter, the folding means 50, the presser cover 60, the element positioning jig 70, the element accommodating tray 80, and the tray setting jig 90 will be described in detail.
First, the folding means 50 will be described.
As shown in FIGS. 3 and 5, the folding means 50 moves forward and backward relative to the wafer 20 (in the case of this embodiment, the Z-axis direction moving means 32 in FIG. 3 is driven). A breaker pin 52 that breaks the piezoelectric element 14 from the wafer 20 is provided. The folding pins 52 are arranged in a lattice shape so as to face each of the plurality of piezoelectric elements 14 (see FIG. 2) so that the plurality of piezoelectric elements 14 can be simultaneously folded from the wafer 20.

Specifically, as shown in FIG. 5, the breaker pin 52 needs a length L1 sufficient to press against the piezoelectric element, and has a dimension of about 0.9 mm in this embodiment. The width W2 of the break-off pin 52 is about 0.36 mm, and the whole is a fine needle shape. For this reason,
The break-off pin 52 is made of SUS (Steel Use S) to improve the accuracy of the shape and position.
As shown in FIG. 5, the tip is curved so as not to damage the piezoelectric element, and the corner is not formed at the base to increase the strength. Yes.

Further, there is only one folding pin 52 for pressing each piezoelectric element 14 shown in FIG. And
The breaker pin 52 is disposed so as to oppose the tip part P of the detection arm 16b described in FIG. 2, and when the tip part P is pushed by the breaker pin 52, the piezoelectric element of the wafer 20 shown in FIG. Piezoelectric element 14 with respect to parts other than 14 (in the case of this embodiment, support part 24 and frame part 22)
Is arranged so that it can be tilted and broken. Thereby, at the time of folding, the piezoelectric element 14
Is inclined with respect to the support portion 24, and a torsional stress is applied to the support portion 24, so that the piezoelectric element 14 can be easily folded off from the wafer 20.

Further, as shown in FIGS. 3 to 5, the breaker means 50 is formed with a plurality of suction holes 54, 54,... For sucking dust due to the breakage of the piezoelectric elements. In the present embodiment, the plurality of suction holes 54, 54,... Are through holes provided in the vicinity of the breaker pin 52 as shown in FIG. 3 is connected to the vacuum generator 34 shown in FIG. 3 through a concave space 56 provided in the upper portion of the removing means 50 and a vent passage 38 communicating with the concave space 56. A filter 37 is provided between the air passage 38 and the vacuum generator 34 so as to filter the sucked dust.

Next, the presser cover 60 will be described.
The presser cover 60 is a cover for restricting the movement of the piezoelectric element folded as described above, and covers the opening of the accommodating portion 72 of the element positioning jig 70 described later. That is, since the broken piezoelectric element jumps and may not fit in a predetermined position of an element storage tray 80 to be described later, this jump is prevented.

Since the presser cover 60 is interposed between the breaker means 50 and the element positioning means 70, a plurality of insertion holes 62, through which at least the breaker pins 52, 52, ... are inserted. 62. In the case of the present embodiment, as shown in FIG. 5, the width W1 of the insertion hole 62 is formed larger than the width W2 of the breaker pin 52. Can be led to.
The presser cover 60 is strongly attracted by a plurality of magnets 93, 93,... Provided on the peripheral edge 90a of the tray setting jig 90. In this embodiment, the press cover 60 is made of SUS430. Is used.

Next, the element positioning jig 70 will be described.
The element positioning jig 70 positions the wafer 20 by the accommodating portion 72 corresponding to the outer shape of the wafer 20. That is, as shown in FIGS. 4 and 5, the accommodating portion 72 has a concave shape, and the wafer 20 is placed on the inner bottom 76 thereof, and also faces the outer side surface of the wafer 20 as shown in FIG. 4. The position of the wafer 20 in the horizontal direction is regulated by the inner wall.

In the present embodiment, the accommodating portion 72 has a shape corresponding only to the shape of the side surfaces of the four corners 20a of the wafer 20 in the horizontal direction so that the wafer 20 can be easily taken in and out. The other portions are formed larger than the wafer 20.
Further, as shown in FIG. 5, the accommodating portion 72 is formed by diffusing and bonding a plurality of etched SUS304 thin plates 70 a, 70 b, 70 c in order to improve the shape accuracy. Diffusion bonding is a method in which the base material is brought into close contact, and pressure is applied so that plastic deformation does not occur as much as possible under a temperature condition equal to or lower than the melting point of the base material. For example, it is possible to effectively prevent the shape from changing as in, for example, welding joining.

Specifically, as shown in FIG. 3, the accommodating portion 72 has a depth D1 that is the thickness D of the wafer 20.
It is formed larger than 2. The depth D1 of the accommodating portion 72 of this embodiment is the thickness of the two thin plates 70a and 70b shown in FIG. 5, and is about twice the thickness (0.1 mm) of the wafer 20 (0).
. 2 mm). Thereby, as described above, even if the opening of the accommodating portion 72 of the element positioning jig 70 is covered with the presser cover 60, the space S1 is formed between the wafer 20 and the presser cover 60. ing. Therefore, since the piezoelectric element 14 can be tilted with respect to the support portion 24 (see FIG. 2) at the time of folding as described above using the space S1, a torsional stress is applied to the support portion 24. Thus, the piezoelectric element 14 can be easily folded from the wafer 20.

4 and 5, at least a plurality of piezoelectric elements 14,... (See FIG. 2) so as to leave a region on which the wafer is placed on the inner bottom 76 of the accommodating portion 72. Through holes 74 corresponding to each of these are formed. This through-hole 74 is a hole necessary for the break-off pin 52 to continue to push the piezoelectric element (particularly, to keep it tilted). Further, the through-hole 74 is further broken into a pocket 82 of the element accommodating tray 80 described later. 14 is a guiding means for guiding 14. In the case of this embodiment, as shown in FIGS. 3 and 5, the through hole 74 is directly connected to the pocket 82 and is spatially integrated, and has the same external shape as the external shape of the pocket 82 in the horizontal direction. Yes. In this embodiment, only the portion of the frame portion 22 of the wafer 20 in FIG. 2 is placed on the inner bottom 76 of the accommodating portion 72 in FIG. 4, and the region other than the frame portion 22 of the wafer 20 is a through hole 74. ing.

In addition, the element positioning jig 70 includes a magnet 93 (
4) is weaker than that of the magnet 93 provided in the tray setting jig 90 of the presser cover 60. Specifically, SUS304 is used. Furthermore, as shown in FIG.
A through hole 75 is formed at a position corresponding to the magnet 93. This prevents the element positioning jig 70 from weakening the suction force between the presser cover 60 and the tray setting jig 90.

Next, the element storage tray 80 will be described.
The element storage tray 80 is a tray for storing a plurality of piezoelectric elements that have been broken and dropped for each piece. Specifically, the element storage tray 80 is disposed below the element positioning jig 70, and pockets 82, 82,... For storing a plurality of piezoelectric elements for each piece are arranged in a lattice pattern. That is, as shown in FIGS. 3 and 5, the plurality of pockets 82, 82,... Are spatially connected to the plurality of through holes 74, 74,. , And a plurality of pockets 82, 82,... And through holes 74, 74,.
Each of the plurality of piezoelectric elements that have been broken down falls into a predetermined pocket 82.

Moreover, the pocket 82 is formed corresponding to each outer shape of the piezoelectric element for each piece. Specifically, the pocket 82 is concave, and its horizontal shape is a quadrilateral slightly larger than the quadrilateral connecting the maximum outer shape of the piezoelectric element, and the movement of the piezoelectric element in which the inner wall 82a is accommodated is controlled. By restricting, the piezoelectric element is positioned in the pocket 82.
For this reason, in the horizontal direction, the pocket 82 positions the piezoelectric element after being broken off, and then, for example, takes out the piezoelectric element accommodated in the element accommodating tray in order to mount and attach the piezoelectric element to the package. At this time, the piezoelectric element can be taken out with accurate positional accuracy.

Further, the pocket 82 is formed by stacking a plurality of etched thin plates so as to improve the shape accuracy. In particular, the portion of the inner wall 82a is an important portion for positioning the piezoelectric element after being broken, and is not shown for convenience of understanding.
Each thin sheet of SUS (stainless steel) is etched and formed by diffusion bonding.

The element storage tray 80 can be attached to and detached from the element breaker 30. Specifically, it is detachably accommodated in a recess 92 of a tray setting jig 90 described later, but this point will be described in detail in the tray setting jig 90.

Further, as shown in FIG. 3 to FIG. 5, a suction hole for sucking dust generated at the time of folding is left on the inner bottom 82 b of the pocket 82 so as to leave a region on which the piezoelectric element is placed. 84 is formed, and dust is sucked from the suction holes 84 to prevent the dust from adhering to the piezoelectric element. Note that the method of sucking dust from the suction hole 84 is vacuum suction in this embodiment, and the air passage 38, like the means for making the suction hole 54 provided in the breaker means 50 negative pressure, as described above. A vacuum generator 34 and a compressed air source 35 are used.
In order to prevent the element receiving tray 80 from being set at the wrong position of the tray setting jig 90, as shown in FIG. 4, the chamfer of one corner 86 is enlarged.

Next, the tray setting jig 90 will be described.
The tray setting jig 90 is connected and fixed to the table shown in FIG.
A recess 92 for detachably storing the element storage tray 80 is provided. The recess 92 is positioned in the horizontal direction by substantially matching the outer shape thereof with the outer shape of the element receiving tray 80. Further, as shown in FIG. 5, the depth D3 of the recess 92 is substantially the same as the dimension of the element receiving tray 80 in the height direction (Z-axis direction). 80 is accommodated, and when the element positioning jig 70 is placed on the peripheral edge 90 a of the tray setting jig 90, a gap is prevented from being formed between the element accommodating tray 80 and the element positioning jig 70.

Further, as shown in FIG. 4, the tray setting jig 90 has a notch 9 on the side surface 90 b and the inner bottom surface 92 a of the recess 92 so that the element receiving tray 80 can be easily attached to and detached from the recess 92.
6 is formed. Specifically, the notches 96 are formed at two locations so as to be symmetric with respect to the central axis CL. Further, the notch 96 is provided on the side surface 9 of the tray setting jig 90.
It is cut out at 0b so as to be deeper than the inner bottom surface 92a of the recess 92, and when the element receiving tray 80 is placed, it is cut away from the side face of the element receiving tray 80 toward the center. Yes. Thereby, a hand or the like can be inserted from the notch 96 and removed by lifting the bottom surface of the element storage tray 80.

Further, the tray setting jig 90 has a bottom surface 92a of the recess 92 as shown in FIGS.
In addition, a recessed portion 97 that is recessed so as to leave a region on which the element storage tray 80 is placed is provided. As shown in FIGS. 3 to 5, the recess 97 is a space for sucking dust when the piezoelectric element is broken, and a plurality of suction holes 84, 84,... Connected to. The recess 97 has a plurality of through passages 98, 9 formed on the inner bottom surface thereof.
A concave space 99 opened to the lower side of the tray setting jig 90 shown in FIG.
The concave space 99 is connected to the air passage 38 described above.

The element folding device 30 of the present invention is configured as described above. Next, its operation and the like will be described with reference to the manufacturing process of the piezoelectric vibration gyro sensor.
FIG. 6 shows a manufacturing process of the vibration gyro sensor, and FIGS. 7 and 8 are conceptual diagrams when using the element breaker 30 and correspond to the processes from step 2 to step 6 in FIG. ing. 7C, FIG. 8D, and FIG. 8E are cross sections when the wafer 20 is cut along the line B-B in FIG.

As shown in FIG. 6, when manufacturing a piezoelectric vibration gyro sensor, first, a wafer is processed by, for example, wet etching to form a plurality of piezoelectric elements supported by the wafer (step 1: preparation of wafer). . That is, as shown in FIG. 2, the base portion 15 of each piezoelectric element 14 is supported by the frame portion 22 via the plurality of support portions 24, 24 so that the outer shapes of the plurality of piezoelectric elements 14,. In addition, each electrode film is formed by vapor deposition.

In addition to the formation of the wafer, as a preparation stage for operating the element breaker,
Steps 2 to 5 in FIG. 6 are performed.
That is, as shown in FIG. 7A, the element accommodating tray 80 is accommodated so as to be in close contact with the inner wall 92b of the recess 92 of the tray setting jig 90 and the peripheral portion of the bottom surface 92a (Step 2 in FIG. 6).
).
Next, as shown in FIG. 7 (b), a convex portion 94 provided on the peripheral edge 90 a of the tray setting jig 90 has a through hole 71 (thin plates 70 a, 70 b,
The element positioning jig 70 is set so as to be inserted into a through-hole formed continuously to 70c (step 3 in FIG. 6), the wafer (piezoelectric element) is positioned, and the element Through hole 74 of positioning jig 70 and pocket 8 of element storage tray 80
2 are integrated into space.
Next, as shown in FIG. 7C, the wafer 20 is accommodated in the accommodating portion 72 of the element positioning jig 70.
(Step 4 in FIG. 6). That is, the wafer 20 is placed on the inner bottom 76 of the housing portion 72, and the horizontal position of the wafer 20 is regulated by making the outer side surface of the wafer 20 face the inner wall of the housing portion 72.

Next, as shown in FIG. 8D, the convex portion 94 of the tray setting jig 90 is moved to the presser cover 6.
Is inserted into a through-hole 61 formed in the peripheral edge of 0 and set so as to position the presser cover 60 in the horizontal direction (step 5 in FIG. 6), and a plurality of insertion holes 62, 62,.
.. And the position of the tip of the detection arm 16b of the piezoelectric element are matched.
At this time, the presser cover 60 is made of, for example, SUS430, and the tray setting jig 90 has magnets 93..., So that the presser cover 60 and the tray setting jig 90 are attracted to each other. The movement in the height direction (Z-axis direction) of the element positioning jig 70 and the element receiving tray 80 sandwiched between the presser cover 60 is restricted.

In this way, preparation is made to operate the element breaker 30. Next, as shown in FIG. 8 (e), the breaker 50 is lowered to insert the breaker pins 52,. , ...
Is pressed against the tip of the detection arm 16b of the piezoelectric element 14, and the piezoelectric element 14 is folded from the wafer 20 (step 6 in FIG. 6).
At this time, as shown in FIG. 8 (e), the opening of the accommodating portion 72 of the element positioning jig 70 is covered with the presser cover 60. The element 14 can be reliably stored in a predetermined position of the pocket 82 of the element storage tray 80.

Further, as shown in FIG. 8D, since the depth D1 of the accommodating portion 72 is formed larger than the thickness D1 of the wafer 20, the opening portion of the accommodating portion 72 of the element positioning jig 70 is the press cover 60. Even when covered, as shown in FIG. 8E, the piezoelectric element 14 can be tilted with respect to the support portion during folding. Therefore, the piezoelectric element 14 can be easily folded from the wafer 20 by applying a twisting stress to the support portion 24 (see FIG. 2). The broken piezoelectric elements 14 are separated into individual pieces, are stored in the pockets 82 of the element storage tray 80 through the through holes 74 of the element positioning jig 70.
Further, when the piezoelectric element 14 is folded from the wafer 20, the vacuum generator 3 shown in FIG.
4 and the compressed air generation source 35 are driven, and dust generated at the time of breaking is sucked from the suction holes 54 and 84 shown in FIG.

Next, when the separated piezoelectric elements are accommodated in the pockets 82 of the element accommodating tray 80, the folding means 50 is raised and the presser cover 60 is removed from the tray setting jig 90. At this time, the presser cover 60 can be easily detached from the tray set jig 90 because the presser cover 60 is merely attracted by the magnetic force of the tray set jig 90. Then, the element positioning means 70 is removed from the tray setting jig 90, and then the element receiving tray 80 is removed from the recess 92 of the tray setting jig 90, and the element receiving tray 80 in a state where the piezoelectric elements are positioned is moved to the subsequent steps. A transfer tray used in the process is used (step 7 in FIG. 6).

Next, from the pocket 82 of the element accommodating tray 80 in FIG. 8E, the separated piezoelectric elements are picked up by, for example, a collet (not shown) and removed from the rectangular package TAB. It joins on the tape 19 (refer FIG. 1) (step 8 of FIG. 6). At this time, as described above, the pocket of the element receiving tray from which the separated piezoelectric element is taken out is formed by stacking a plurality of etched thin plates to improve the shape accuracy, and the pocket Since the movement of the piezoelectric element accommodated by the inner wall is restricted, the piezoelectric element can be accurately positioned in the pocket. Therefore, the piezoelectric element is attached to the TAB tape 19 of the package.
When the piezoelectric element is taken out with a collet for connection to (see FIG. 1), the piezoelectric element can be taken out with accurate positional accuracy.

Next, the package is sealed with a lid 13 (see FIG. 1) (step 9 in FIG. 6), and the piezoelectric vibration gyro sensor is completed.

The embodiment of the present invention is configured as described above, and the element breaker 30 opposes each of the plurality of piezoelectric elements and moves back and forth relative to the wafer, thereby removing the piezoelectric elements from the wafer. A folding means 50 having a plurality of folding pins 52,... For this reason, if the plurality of breaker pins 52,... Are advanced and retracted relative to the wafer, the plurality of piezoelectric elements can be broken simultaneously from the wafer.
The element breaker 30 also includes an element positioning jig 70 that positions the wafer by the accommodating portion 72 corresponding to the outer shape of the wafer. For this reason, since the wafer is housed in the housing portion 72 of the element positioning jig 70 and is accurately arranged, as described above, the plurality of breaker pins 52... Are moved forward and backward relative to the wafer. Even if a plurality of break-off pins 52 are used,
Can be brought into contact with each other at an accurate position.
And this element positioning jig 70 has a plurality of through holes 74 corresponding to each of at least a plurality of piezoelectric elements in the inner bottom 76 of the accommodating portion 72, so that it is in an accurate position as described above. It is possible to fold the piezoelectric element from the wafer without hindrance by continuously pressing the abutting breaking pins 52,.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be combined or omitted as appropriate, and can be combined with other configurations not shown.

The schematic perspective view of the piezoelectric device using the piezoelectric element after folding using the element folding apparatus of this invention. FIG. 2 is a partially enlarged view of a wafer for forming a plurality of piezoelectric elements used in the piezoelectric vibration gyro sensor of FIG. 1. 1 is a schematic overall view of an element breaker according to an embodiment of the present invention. The disassembled perspective view of the breaker unit which is a characteristic part of the element breaker according to the embodiment of the present invention and is attached to the element breaker. FIG. 5 is a partially enlarged vertical cross-sectional view when the folding unit of FIG. 4 is combined and cut along the line AA in FIG. 4. Manufacturing process of vibration gyro sensor. It is a conceptual diagram at the time of operating an element folding apparatus, Comprising: The figure corresponding to the process to step 2-step 4 of FIG. It is a conceptual diagram at the time of operating an element folding apparatus, Comprising: The figure corresponding to the process to step 6 of FIG. The conventional conceptual diagram which is breaking off the piezoelectric element from the wafer in which the several piezoelectric element was formed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Piezoelectric vibration gyro sensor, 14 ... Piezoelectric element, 20 ... Wafer, 30
... Element breaker, 50 ... breaking means, 52 ... breaking pins, 54, 84,.
-Suction hole, 60 ... presser cover, 62 ... insertion hole, 70 ... element positioning jig, 7
2 ... accommodating part, 74 ... through hole, 80 ... element accommodating tray, 82 ... pocket,
90 ... Tray set jig

Claims (5)

A plurality of breaker pins that are opposed to each of the plurality of piezoelectric elements supported by the wafer and that are moved back and forth relative to the piezoelectric elements to break the piezoelectric elements from the wafer. With a means of collecting,
The wafer is positioned by a housing portion corresponding to the outer shape of the wafer, and an element positioning jig having a through hole corresponding to at least each of the plurality of piezoelectric elements is provided on the inner bottom of the housing portion. An element breaker. 2. The break-up pin is arranged in the break-off means so that the piezoelectric element is inclined and folded with respect to a portion other than the piezoelectric element of the wafer. Element breaker. The element breaker according to claim 1 or 2, wherein a presser cover is provided above the element positioning jig so as to cover the opening of the housing portion. 4. The element breaker according to claim 3, wherein the receiving portion of the element positioning jig has a depth larger than a thickness of the wafer. 5. The element breaker according to claim 1, wherein a suction hole for sucking dust due to breakage of the piezoelectric element is formed in the breaker.

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