JP2008193358A - 撮像素子ユニット - Google Patents

撮像素子ユニット Download PDF

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Publication number
JP2008193358A
JP2008193358A JP2007024852A JP2007024852A JP2008193358A JP 2008193358 A JP2008193358 A JP 2008193358A JP 2007024852 A JP2007024852 A JP 2007024852A JP 2007024852 A JP2007024852 A JP 2007024852A JP 2008193358 A JP2008193358 A JP 2008193358A
Authority
JP
Japan
Prior art keywords
spacer
image sensor
circuit board
image
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007024852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008193358A5 (https=
Inventor
Yoichiro Okumura
洋一郎 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Imaging Corp
Original Assignee
Olympus Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Imaging Corp filed Critical Olympus Imaging Corp
Priority to JP2007024852A priority Critical patent/JP2008193358A/ja
Publication of JP2008193358A publication Critical patent/JP2008193358A/ja
Publication of JP2008193358A5 publication Critical patent/JP2008193358A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007024852A 2007-02-02 2007-02-02 撮像素子ユニット Pending JP2008193358A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007024852A JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007024852A JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Publications (2)

Publication Number Publication Date
JP2008193358A true JP2008193358A (ja) 2008-08-21
JP2008193358A5 JP2008193358A5 (https=) 2010-02-25

Family

ID=39753025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007024852A Pending JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Country Status (1)

Country Link
JP (1) JP2008193358A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013210229A (ja) * 2012-03-30 2013-10-10 Hitachi High-Technologies Corp 検査装置及び撮像素子
US12028597B2 (en) 2020-01-27 2024-07-02 Olympus Corporation Image pickup apparatus and endoscope

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006564A (ja) * 2002-03-28 2004-01-08 Sharp Corp 積層型半導体装置
JP2006186483A (ja) * 2004-12-27 2006-07-13 Konica Minolta Photo Imaging Inc 撮像ユニットおよび撮像素子の放熱構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006564A (ja) * 2002-03-28 2004-01-08 Sharp Corp 積層型半導体装置
JP2006186483A (ja) * 2004-12-27 2006-07-13 Konica Minolta Photo Imaging Inc 撮像ユニットおよび撮像素子の放熱構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013210229A (ja) * 2012-03-30 2013-10-10 Hitachi High-Technologies Corp 検査装置及び撮像素子
US12028597B2 (en) 2020-01-27 2024-07-02 Olympus Corporation Image pickup apparatus and endoscope

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