JP2008192925A - Substrate module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To control a substrate not to move in the width direction due to some projections to thereby improve the positioning accuracy. <P>SOLUTION: A power module 1 comprises: a control circuit substrate 20 having a plurality of through holes 24; and a resin case 30 having a partition wall 34 in which a plurality of connection pins 70a and 70b respectively fitted in the plurality of through holes 24 is embedded. Of the plurality of connection pins 70a and 70b, four connection pins 70a are formed with abutting portions 73a that abut on the control circuit substrate 20. Abutting of the control circuit substrate 20 on the abutting portions 73a allows the control circuit substrate 20 to be positioned to the resin case 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate module, and more particularly to a substrate module that supports a substrate by a plurality of protrusions provided on a support member.

  Conventionally, various techniques for mounting an electronic component having a plurality of lead terminals (projections) on a printed wiring board (substrate) have been proposed (see, for example, Patent Documents 1 and 2).

  In the component mounting structure to the substrate disclosed in Patent Document 1 and Patent Document 2, printed wiring is obtained by inserting a plurality of lead terminals of electronic components into a plurality of through holes formed in the printed wiring board. Electronic components are mounted on the board. Positioning portions for positioning electronic components with respect to the printed wiring board are provided at the base portions of the lead terminals, and the electronic components are brought into contact with the positioning portions of the lead terminals so that the electronic components are in contact with the printed wiring board. Positioned.

JP 2003-332719 A Japanese Utility Model Publication No. 5-36826

  In the component mounting structure to the board disclosed in Patent Documents 1 and 2, since the electronic component is positioned with respect to the printed wiring board at each positioning portion of the lead terminal, all the positioning portions of the lead terminal are attached to the printed wiring board. Only when they abut, the electronic component is accurately positioned with respect to the printed terminal board. For this reason, if there is a variation in the position of the positioning portion of the lead terminal, there is a problem that the electronic component is attached in an inclined state with respect to the printed wiring board due to the variation.

  By the way, even when a substrate such as a printed wiring board is supported by a plurality of connection pins provided on the support member, the same problems as those described above in Patent Documents 1 and 2 occur. FIG. 15 is a schematic diagram showing a printed wiring support structure according to a conventional example. In the conventional printed wiring support structure according to an example, as shown in FIG. 15, the printed wiring board 103 is supported by a plurality of connection pins 102 provided on the support portion 101. Specifically, the printed wiring board 103 is accurately positioned by bringing all of the plurality of positioning portions 102 a provided at the base portion of each connection pin 102 into contact with the lower surface of the printed wiring board 103. At this time, when even one of the plurality of connection pins 102 has a variation in the position of the contact portion 102a, the printed wiring board 103 is inclined. For this reason, when soldering the connection portion between the connection pin 102 and the printed wiring board 103 with a robot arm or the like, soldering cannot be performed at an accurate position, resulting in poor contact.

  Accordingly, the present invention has been made to solve the above-described problems, and an object thereof is to provide a substrate module capable of improving the positioning accuracy of the substrate.

  A substrate module according to a first aspect of the present invention includes a substrate having a plurality of through portions and a support member having a plurality of protrusions that are respectively inserted into the plurality of through portions. A part of the plurality of protrusions has a contact part that contacts the substrate, and the substrate comes into contact with the contact part of the part of the protrusion, so that the substrate is supported by the support member. Is positioned with respect to.

  In this substrate module, since the substrate is positioned by a part of the plurality of protrusions, the position of the substrate is not restricted by the other protrusions excluding the part of the protrusions. Therefore, even if there is variation in the shape of the other protrusions, the substrate can be accurately positioned by some of the protrusions. As a result, the substrate positioning accuracy can be improved as compared with the case where the substrate is positioned by all the protrusions.

  The board module according to a second aspect of the invention is the board module according to the first aspect of the invention, wherein some of the protrusions are respectively inserted into the through portions that are closest to the corners of the board.

  In this substrate module, the substrate can be positioned by a part of the protrusions that are respectively inserted into the through portions closest to the corner portions of the substrate. Therefore, even when there are variations in the shape of some of the protrusions for positioning the substrate, the substrate can be prevented from being inclined due to the variations. This eliminates the inconvenience that the substrate is greatly inclined due to variations in the shape of the protrusion when some of the protrusions are arranged close to each other, and improves the positioning accuracy of the substrate. be able to. In addition, since the substrate is positioned by a part of the protrusions that are inserted into the through portions closest to the corners of the substrate, the vicinity of the corners of the substrate can be supported by some of the protrusions, and the substrate is stabilized. Can be supported.

  A substrate module according to a third aspect of the present invention is the substrate module according to the first or second aspect, wherein the contact portion is configured in a linear or planar shape parallel to one surface of the substrate.

  In this substrate module, the linear or planar contact portion contacts one surface of the substrate, so that the substrate can be supported more stably than when one surface of the substrate is supported by a point. .

  The substrate module according to a fourth aspect of the invention is the substrate module according to the first or second aspect of the invention, wherein some of the protrusions have a tapered shape that becomes wider as approaching the root portion, The part is a part having the same width as that of the penetrating part in the outer peripheral part of a part of the protrusions.

  In this board module, by moving the board in the direction of the base part of some protrusions, the contact part that is a part of the outer peripheral part of some protrusion parts and the through part of the board are fitted, The substrate is positioned with respect to the support member. In this case, since the width of the contact portion is the same as the width of the penetrating portion, it is possible to restrict the substrate from moving in the width direction with respect to a part of the protrusions. As a result, the substrate positioning accuracy can be further improved.

  A substrate module according to a fifth invention is the substrate module according to any one of the first to fourth inventions, and includes another substrate disposed on the support member. The plurality of protrusions are a plurality of connection members for electrically connecting the substrate and another substrate, and the substrate is inserted into the plurality of through portions so that the other substrate is inserted into the other substrate. And positioned with respect to the support member in a stacked state while being separated from each other.

  In this board module, the positioning accuracy of the board can be improved by a connection member (protrusion) for electrically connecting the board and another board. Accordingly, the substrate can be accurately positioned with respect to the support member in a state where the substrate is stacked while being electrically connected to and separated from the other substrate.

  A substrate module according to a sixth aspect of the present invention is the substrate module according to any one of the first to fifth aspects, wherein some of the protrusions are three or more protrusions.

  In this substrate module, since the substrate is positioned by three or more of the plurality of protrusions, the position of the substrate is not restricted by other protrusions other than the three or more protrusions. . Therefore, even if there is variation in the shape of the other protrusions, the substrate can be accurately positioned by three or more protrusions. As a result, the substrate positioning accuracy can be improved as compared with the case where the substrate is positioned by all the protrusions.

  As described above, according to the present invention, the following effects can be obtained.

  In the first invention, since the substrate is positioned by a part of the plurality of protrusions, the substrate is not positioned by other protrusions other than the part of the protrusions. Therefore, even if there are variations in the shape of the other protrusions, the substrate can be positioned by some of the protrusions without causing the variations. As a result, the substrate positioning accuracy can be improved as compared with the case where the substrate is positioned by all the protrusions.

  In the second invention, the substrate can be positioned by a part of the protrusions that are respectively inserted into the through portions that are closest to the corners of the substrate. Therefore, even when there are variations in the shape of some of the protrusions for positioning the substrate, the substrate can be prevented from being inclined due to the variations. This eliminates the inconvenience that the substrate is greatly inclined due to variations in the shape of the protrusion when some of the protrusions are arranged close to each other, and improves the positioning accuracy of the substrate. be able to. In addition, since the substrate is positioned by a part of the protrusions that are inserted into the through portions closest to the corners of the substrate, the vicinity of the corners of the substrate can be supported by some of the protrusions, and the substrate is stabilized. Can be supported.

  In the third invention, the linear or planar contact portion contacts one surface of the substrate, so that the substrate is supported more stably than when one surface of the substrate is supported by a point. be able to.

  In the fourth aspect of the invention, the substrate is moved in the direction of the base of some of the protrusions, so that the contact portion that is a part of the outer peripheral portion of the some of the protrusions and the through portion of the substrate are fitted. Thus, the substrate is positioned with respect to the support member. In this case, since the width of the contact portion is the same as the width of the penetrating portion, it is possible to restrict the substrate from moving in the width direction with respect to a part of the protrusions. As a result, the substrate positioning accuracy can be further improved.

  In the fifth invention, the positioning accuracy of the substrate can be improved by the connection member (protrusion) for electrically connecting the substrate and another substrate. Accordingly, the substrate can be accurately positioned with respect to the support member in a state where the substrate is stacked while being electrically connected to and separated from the other substrate.

  In the sixth invention, since the substrate is positioned by three or more of the plurality of protrusions, the position of the substrate is regulated by the other protrusions excluding the three or more protrusions. There is nothing. Therefore, even if there is variation in the shape of the other protrusions, the substrate can be accurately positioned by three or more protrusions. As a result, the substrate positioning accuracy can be improved as compared with the case where the substrate is positioned by all the protrusions.

  Hereinafter, embodiments of a power module according to the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing the overall configuration of a power module according to an embodiment of the present invention. 2-13 is a figure for demonstrating the structure of the power module shown in FIG. Hereinafter, with reference to FIGS. 1-13, the power module 1 which concerns on one Embodiment of this invention is demonstrated.

  The power module 1 of the present embodiment is a power module for driving a compressor motor provided in an outdoor unit of an air conditioner. As shown in FIGS. 1 to 3, the power module 1 includes a power circuit board 10, a control circuit board 20, and a resin case 30. A sealing agent 40 that seals the bare chip 12 and the like mounted on the power circuit board 10 is provided above the power circuit board 10 disposed inside the resin case 30.

  The power circuit board 10 is a board for controlling the power supply for driving the compressor motor in accordance with the operating condition of the air conditioner. This power circuit board 10 is a metal board, and as shown in FIGS. 4 and 5, a bare chip 12 having a large amount of heat is directly mounted on an aluminum nitride plate 11 having high thermal conductivity and good electrical insulation. It is comprised by. A copper thin plate 13 constituting a circuit pattern is formed on the surface of the aluminum nitride plate 11. Bonding wires 14 are connected to the bare chip 12 and the copper thin plate 13.

  The control circuit board 20 is a board for controlling the bare chip 12 of the power circuit board 10. As shown in FIG. 2, the control circuit board 20 is disposed on the upper end side of a partition wall 34 of a resin case 30 to be described later. The control circuit board 20 is configured by mounting a precision component 22 such as a microcomputer including a microprocessor, a ROM, various interfaces, and the like on a printed wiring board 21. The control circuit board 20 is provided with a pair of notches 23 having a diameter substantially equal to the outer diameter of a pair of semi-cylindrical parts 33 of the resin case 30 described later. When arranged in the case 30, the control circuit board 20 does not hit the semi-cylindrical portion 33 of the resin case 30. Further, a plurality of through holes 24 into which connection pins 70a and 70b described later can be inserted and a plurality of through holes 25 into which connection pins 60 described later can be inserted are formed in the outer edge portion of the control circuit board 20. Yes. The plurality of through holes 24 are formed along the longitudinal direction (X direction) of the control circuit board 20, and the plurality of through holes 25 are formed along the short direction (Y direction) of the control circuit board 20. ing. Then, connecting pins 70a and 70b, which will be described later, are fitted and inserted into the plurality of through holes 24, respectively, and are arranged in two upper and lower stages so as to be stacked while being separated from the power circuit board 10 described above.

  The resin case 30 is provided to arrange the power circuit board 10 and the control circuit board 20 inside thereof. The resin case 30 is provided with a recess 30a, and the power circuit board 10 and the control circuit board 20 are accommodated in the recess 30a. That is, the recess 30a is configured by a side wall 32 standing so as to surround the outer peripheries of the power circuit board 10 and the control circuit board 20, and a bottom surface 31 on which an opening 31a is formed. A pair of semi-cylindrical portions 33 projecting inward of the resin case 30 are formed on the side wall 32 so as to face each other. And in each part enclosed by the semi-cylindrical part 33 of the bottom face 31, the attachment hole 31b for attaching the power module 1 of this embodiment to the member for thermal radiation which is not shown in figure is formed. As shown in FIG. 6, an opening 31 a for installing the power circuit board 10 is provided on the bottom surface 31 of the resin case 30, and the lower surface of the aluminum nitride plate 11 of the power circuit board 10 is exposed. Thus, when the power module 1 of this embodiment is attached to a heat radiating member (not shown), the lower surface of the aluminum nitride plate 11 exposed from the opening 31a comes into contact with the heat radiating member, and the bare chip 12 that generates a large amount of heat is mounted. The heat of the power circuit board 10 is radiated.

  Further, inside the recess 30a, a region A including a portion where the power circuit board 10 installed in the opening 31a of the bottom surface 31 is disposed, and a region B including only a portion where the power circuit substrate 10 is not disposed. A partition wall 34 is provided upright from the bottom surface 31. Specifically, the partition wall 34 is formed so as to surround the periphery of the power circuit board 10, and the interior of the resin case 30 is divided into a region A and a partition surrounded by the partition wall 34 as shown in FIG. 7. A region surrounded by the wall 34 and the side wall 32 is divided into a region B. And in the area | region B, as shown in FIG. 3, the support wall 35 which supports the connection pin 60 which can be inserted in the through-hole 25 of the control circuit board 20 is standingly arranged.

  A connection pin 50 for electrically connecting an external device (not shown) and the power circuit board 10 is embedded in the side wall 32. As shown in FIGS. 8 and 9, one end 51 of the connection pin 50 is disposed so as to protrude upward from the upper end of the side wall 32, and the other end 52 is laid on the bottom surface 31. As shown in FIG. 6, the other end 52 of the connection pin 50 laid on the bottom surface 31 is laid on a portion of the resin case 30 where the power circuit board 10 is not disposed, and is positioned near the power circuit board 10. It extends to. And, as shown in FIGS. 5 and 10, the bare chip 12 of the power circuit board 10 and the copper thin plate 13 are connected to the other end 52 of the connection pin 50 laid on the bottom surface 31 through the bonding wires 14. Is done. Note that the other end 52 of the connection pin 50 on the bottom surface 31 in the region B is sealed by a sealing portion 36 provided integrally with the resin case 30. Further, a connection pin 60 for electrically connecting an external device (not shown) and the control circuit board 20 is embedded in the side wall 32. As shown in FIG. 11, one end 61 of the connection pin 60 is disposed so as to protrude upward from the upper end of the side wall 32, and the other end 62 extends upward from the upper end of the support wall 35 of the resin case 30. It arrange | positions so that it may protrude toward. The other end 62 of the connection pin 60 is connected by solder while being inserted into the through hole 25 of the control circuit board 20 to electrically connect the external device and the control circuit board 20.

  Further, as shown in FIGS. 12 and 13, four connection pins 70 a and 19 connection pins 70 b for electrically connecting the control circuit board 20 and the power circuit board 10 are embedded in the partition wall 34. ing. The connection pins 70 a and 70 b are arranged along the longitudinal direction (X direction) of the resin case 30. And the connection pin 70a is located in the end of the connection pins 70a and 70b arrange | positioned along a X direction. One ends 71 a and 71 b of the connection pins 70 a and 70 b protrude upward from the upper end of the partition wall 34, and the other ends 72 a and 72 b are laid on the bottom surface 31. One ends 71 a and 71 b of the connection pins 70 a and 70 b are fitted into the through holes 24 of the control circuit board 20. The control circuit board 20 and the one ends 71a and 71b fitted into the through holes 24 of the control circuit board 20 are soldered by a robot arm (not shown), and the control circuit board 20 and the power circuit board 10 are connected. Electrically connected. The other ends 72a and 72b of the connection pins 70a and 70b laid on the bottom surface 31 extend to a position in the vicinity of the power circuit board 10, as shown in FIGS. 10 bare chips 12 and copper thin plate 13.

  The connecting pins 70a and 70b have different shapes as shown in FIGS. Specifically, a contact portion 73 a that contacts the lower surface of the control circuit board 20 is formed at the base portion of the connection pin 70 a. As shown in FIG. 1, the contact portion 73 a is configured in a plane shape parallel to the lower surface of the control circuit board 20. Further, the connection pin 70 b is configured such that a portion corresponding to the through hole 24 of the control circuit board 20 does not contact the control circuit board 20. The four connection pins 70 a are respectively inserted into the through holes 24 that are closest to the four corners 20 a of the control circuit board 20, and the control circuit board 20 is inserted into the through holes 24 according to the insertion state. It is positioned with respect to the resin case 30. Specifically, the control circuit board 20 is positioned with respect to the resin case 30 by abutting the lower surface of the control circuit board 20 with the abutting portion 73a formed at the base portion of the one end 71a of the connection pin 70a. .

  A region A surrounded by the partition wall 34 is filled with a sealing agent 40 such as silicon gel or epoxy resin. In this way, by filling the region A surrounded by the partition wall 34 with the sealant 40, the components in the region A are compared with the case where the sealant is put on each component on the substrate with a highly viscous sealant. (Bare chip 12 or copper thin plate 13 or the like) can be reliably sealed. The sealant 40 is filled up to a position above the upper end of the bonding wire 14 connected to the bare chip 12 or the copper thin plate 13 of the power circuit board 10 and covers the bonding wire 14 so that it is not exposed.

[Features of the power module 1]
The power module 1 of this embodiment has the following features.

  In the power module 1 of the present embodiment, since the control circuit board 20 is positioned by the four connection pins 70a among the plurality of connection pins 70a and 70b, the control circuit board 20 is controlled by the connection pins 70b excluding the four connection pins 70a. The position of the circuit board 20 is not restricted. Therefore, even if there is variation in the shape of the connection pins 70b, the control circuit board 20 can be accurately positioned by the four connection pins 70a. As a result, the positioning accuracy of the control circuit board 20 can be improved as compared with the case where the control circuit board 20 is positioned by all the connection pins 70a and 70b.

  Further, in the power module 1 of the present embodiment, the control circuit board 20 can be positioned by the four connection pins 70a that are respectively inserted into the through holes 24 that are closest to the corners 20a of the control circuit board 20 respectively. it can. Therefore, even when there are variations in the shape of the four connection pins 70a for positioning the control circuit board 20, it is possible to prevent the board from being inclined due to the variations. Thereby, when the connection pins 70a are arranged close to each other, the disadvantage that the control circuit board 20 is largely inclined due to the variation in the shape of the connection pins 70a is eliminated. Positioning accuracy can be improved. Further, the control circuit board 20 can be supported by the four connection pins 70a inserted into the through holes 24 closest to the corner portion 20a of the control circuit board 20, and the control circuit board 20 can be stably supported. Can do.

  Further, in the power module 1 of the present embodiment, the planar contact portion 73a contacts the lower surface of the control circuit board 20, so that the control circuit board 20 is compared with the case where the lower surface of the control circuit board 20 is supported by dots. Can be stably supported.

  In the power module 1 of the present embodiment, the positioning accuracy of the control circuit board 20 can be improved by the connection pins 70a for electrically connecting the control circuit board 20 and the power circuit board 10. Thereby, the control circuit board 20 can be accurately positioned with respect to the resin case 30 in a state where the control circuit board 20 is electrically connected to the power circuit board 10 and stacked while being separated.

  Moreover, in the power module 1 of this embodiment, the plate-shaped control circuit board 20 can be positioned on the surface formed by connecting the four connection pins 70a. That is, the control circuit board 20 can be positioned with as few as possible (four in this embodiment) connection pins 70a that can stably support the plate-like control circuit board 20. For this reason, even if there are variations in the shape of a large number (19 in this embodiment) of the connection pins 70b, the control circuit board 20 can be stably and accurately positioned with the connection pins 70a. As a result, the positioning accuracy of the control circuit board 20 can be improved while stably supporting the control circuit board 20.

  As mentioned above, although embodiment of this invention was described based on drawing, it should be thought that a specific structure is not limited to these embodiment. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, the example in which the control circuit board 20 is positioned by the four connection pins 70a having the contact portions 73a has been shown. However, the present invention is not limited to this, and a modification shown in FIG. The control circuit board 20 may be positioned by the connection pin 170a having a tapered shape that becomes wider as it approaches the root portion. That is, the contact portion 173 a that contacts the control circuit board 20 is a portion where the width of the connection pin 170 a is the same as the width of the through hole 24. In this case, by moving the control circuit board 20 in the direction of the root of the connection pin 170a, the contact portion 173a of the connection pin 170a and the through hole 24 of the control circuit board 20 are fitted to each other, and the resin case 30 Is positioned relative to the control circuit board 20. In this case, since the width of the contact portion 173a and the width of the through hole 24 are the same, it is possible to restrict the control circuit board 20 from moving in the width direction (X direction) with respect to the connection pin 170a. it can. As a result, the positioning accuracy of the control circuit board 20 can be further improved.

  Moreover, although the said embodiment demonstrated the power module for driving the motor for compressors provided in the outdoor unit of an air conditioner, this invention is not limited to this, The motor for compressors provided in a refrigerator is driven. The present invention can be applied to various board modules such as a power module.

  Moreover, although the said embodiment demonstrated the example which positions a control circuit board with respect to a resin case with four connection pins, this invention is not restricted to this, Arbitrary three connection pins of four connection pins You may position by. In this case, the control circuit board can be positioned with the minimum connection pins that can stably support the control circuit board.

  Moreover, although the said embodiment demonstrated the case where a control circuit board was positioned with respect to the resin case by the connection pin which electrically connects a power circuit board and a control circuit board, the protrusion part of this invention is a connection pin. It is not limited.

  In the above-described embodiment, an example in which the control circuit board is positioned by a planar contact portion parallel to the lower surface of the control circuit board has been described. However, the present invention is not limited to this, and is parallel to the lower surface of the control circuit board. The control circuit board may be positioned by a linear contact portion.

  By utilizing the present invention, the positioning accuracy of the substrate can be improved.

It is a top view showing the whole power module composition concerning one embodiment of the present invention. It is the disassembled perspective view which showed the whole structure of the power module shown in FIG. It is the top view which abbreviate | omitted the control circuit board of the power module shown in FIG. It is the top view which abbreviate | omitted the control circuit board and sealing agent of the power module shown in FIG. It is sectional drawing along the AA line of FIG. It is the top view which showed the resin case of the power module shown in FIG. It is the top view which showed typically the area | region A and the area | region B of the power module shown in FIG. It is sectional drawing along the B1-B1 line | wire of FIG. FIG. 7 is a cross-sectional view taken along line B2-B2 of FIG. It is sectional drawing along CC line of FIG. It is sectional drawing along the DD line of FIG. It is sectional drawing along the E1-E1 line | wire of FIG. It is sectional drawing along the E2-E2 line of FIG. It is sectional drawing of the power module which concerns on the modification of one Embodiment of this invention. It is the schematic diagram which showed the printed wiring support structure which concerns on an example of the past.

Explanation of symbols

1 Power module (board module)
10 Power circuit boards (other boards)
20 Control circuit board (board)
20a Corner 24 Through-hole (through-hole)
30 Resin case (supporting member)
70a, 170a Connection pin (some protrusions)
70b Connection pin (protrusion)
73a, 173a Contact part

Claims (6)

A substrate (20) having a plurality of penetrations (24);
A support member (30) having a plurality of protrusions (70a, 70b, 170a) that are respectively inserted into the plurality of through portions;
A contact portion (73a) that contacts the substrate is formed on some of the plurality of protrusion portions (70a, 170a),
The substrate module (1), wherein the substrate is positioned with respect to the support member by contacting the substrate with the contact portion of the part of the protrusions.   The board module (1) according to claim 1, wherein the part of the protrusions is fitted into each of the penetrating parts closest to the corners (20a) of the board.   The substrate module (1) according to claim 1 or 2, wherein the contact portion (73a) is configured in a linear shape or a planar shape parallel to one surface of the substrate. The part of the protrusions (170a) has a tapered shape that becomes wider as approaching the root part,
The board module (1) according to claim 1 or 2, wherein the contact part (173a) is a part having the same width as the width of the penetrating part in an outer peripheral part of the part of the protrusions. . Comprising another substrate (10) disposed on the support member;
The plurality of protrusions are a plurality of connecting members for electrically connecting the substrate and the other substrate,
The said board | substrate is positioned with respect to the said supporting member in the state laminated | stacked, spaced apart from the said other board | substrate, by inserting and inserting the said some connection member in these penetration parts, respectively. The board | substrate module (1) of any one of -4.   The board module (1) according to any one of claims 1 to 5, wherein the part of the protrusions (70a) is three or more protrusions.

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