JP6302115B1 - Self-standing terminal for external lead-out and semiconductor module manufacturing method - Google Patents
Self-standing terminal for external lead-out and semiconductor module manufacturing method Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000009795 derivation Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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Abstract
【課題】自立することができ、自立した状態で導電パターンに取り付けられることができる外部導出用自立端子を提供する。【解決手段】本発明に係る外部導出用自立端子は、モジュールケース内に配置された放熱板上に形成された導電パターンに接合されるための接合部と、前記モジュールケース外の上方に配置されるための主端子片と、前記接合部と前記主端子片との間を上下方向に連結する連結板とを有する外部導出用自立端子であって、前記連結板に延出された脚部を有し、前記脚部の下端部には水平方向に延伸された延伸部が形成されている。【選択図】図１An external lead-out self-supporting terminal that can be self-supporting and can be attached to a conductive pattern in a self-supporting state is provided. A self-standing terminal for external derivation according to the present invention is disposed at a joint portion for joining to a conductive pattern formed on a heat sink disposed in a module case, and above the outside of the module case. An external lead-out self-supporting terminal having a main terminal piece for connecting and a connecting plate for vertically connecting between the joint and the main terminal piece, and a leg portion extending to the connecting plate And an extending portion extending in the horizontal direction is formed at the lower end of the leg portion. [Selection] Figure 1
Description
本発明は、半導体モジュールに用いられる外部導出用自立端子及び半導体モジュールの製造方法に関し、特に組立治具を用いずに外部導出用自立端子を取り付けることができる半導体モジュールの製造方法に関する。 The present invention relates to an external lead-out self-supporting terminal used in a semiconductor module and a method for manufacturing a semiconductor module, and more particularly to a semiconductor module manufacturing method in which an external lead-out free-standing terminal can be attached without using an assembly jig.
近年、半導体モジュール等の半導体装置の実装において高密度化が進んでいる。このような半導体モジュールでは放熱板を設け、その放熱板を介して電子部品等で発生した熱が放熱されるようになっている。 In recent years, the density of semiconductor devices such as semiconductor modules has been increased. In such a semiconductor module, a heat radiating plate is provided, and heat generated in an electronic component or the like is radiated through the heat radiating plate.
図３は、半導体モジュールを示す外観を示す斜視図である。半導体モジュール１は、平板形状の放熱板５１と、放熱板５１上に接着剤で接着された略長方形状の樹脂ケース（モジュールケース）５２とを備えた外観を有する。放熱板５１の長手方向の両端部近傍には、ねじ止め等に利用され得る孔５１ａがそれぞれ貫通形成されている。また、樹脂ケース５２の上面には、３個の外部導出用端子１１０の主端子片（先端部）が長手方向に一列に並んで配置されている。 FIG. 3 is a perspective view showing an external appearance of the semiconductor module. The semiconductor module 1 has an external appearance including a flat plate-shaped heat sink 51 and a substantially rectangular resin case (module case) 52 bonded on the heat sink 51 with an adhesive. In the vicinity of both end portions in the longitudinal direction of the heat radiating plate 51, holes 51a that can be used for screwing or the like are respectively formed. Further, the main terminal pieces (tip portions) of the three external lead-out terminals 110 are arranged in a line in the longitudinal direction on the upper surface of the resin case 52.
なお、放熱板５１は、アルミニウムや銅製の放熱ベース上に導電パターン付絶縁基板が固着されたものであり、その導電パターンに多数の電子部品や３個の外部導出用端子１１０が半田付けされている。そして、樹脂ケース５２の内部にはシリコーンゲル（封止樹脂）が充填されている。 In addition, the heat sink 51 is obtained by fixing an insulating substrate with a conductive pattern on a heat dissipation base made of aluminum or copper, and a large number of electronic components and three external lead-out terminals 110 are soldered to the conductive pattern. Yes. The resin case 52 is filled with silicone gel (sealing resin).
このような半導体モジュール１は、電子部品や外部導出用端子１１０が導電パターンに取り付けられることで製造される。図４の（ａ）は、導電パターンに取り付けられる前の従来の外部導出用端子１１０の一例を示す斜視図であり、図４の（ｂ）は、（ａ）に示す外部導出用端子１１０の正面図であり、図４の（ｃ）は、（ａ）に示す外部導出用端子１１０の側面図である。外部導出用自立端子１１０は、下部に形成された接合部３０と、上部に形成された主端子片（先端部）１０と、接合部３０と主端子片１０との間を上下方向に連結する連結板２０とを有する。 Such a semiconductor module 1 is manufactured by attaching an electronic component or an external lead-out terminal 110 to a conductive pattern. 4A is a perspective view showing an example of a conventional external lead terminal 110 before being attached to the conductive pattern, and FIG. 4B is a perspective view of the external lead terminal 110 shown in FIG. 4 is a front view, and FIG. 4C is a side view of the external lead-out terminal 110 shown in FIG. The external lead-out self-supporting terminal 110 connects the joint 30 formed in the lower part, the main terminal piece (tip part) 10 formed in the upper part, and the joint 30 and the main terminal piece 10 in the vertical direction. And a connecting plate 20.
ところが、このような外部導出用端子１１０の下部には、導電パターンに接合されるための接合部３０が形成されているだけであり、外部導出用端子１１０は半田付けされるまで起立した姿勢を保つことができない。よって、外部導出用端子１１０を導電パターンに接合する際には取付姿勢に保たさせる組立治具等を用いている（例えば特許文献１参照）。 However, only the joint 30 to be joined to the conductive pattern is formed at the lower part of the external lead-out terminal 110, and the external lead-out terminal 110 stands up until it is soldered. I can't keep it. Therefore, when joining the external lead-out terminal 110 to the conductive pattern, an assembly jig or the like that keeps the mounting posture is used (for example, see Patent Document 1).
ここで、半導体モジュール１の製造方法について説明する。まず、第一組立治具を用いて多数の電子部品を板状半田を介して放熱板５１上の所定の位置に位置決めする。次に、第二組立治具を用いて３個の外部導出用端子１１０を板状半田を介して放熱板５１上の所定の位置に位置決めする。次に、このように組み合わせられたものを熱板上に載せ、各部材間に介在させた板状半田を溶融させ、電子部品や外部導出用端子１１０を放熱板５１上の所定の位置にそれぞれ半田付けする。次に、第一組立治具と第二組立治具とを取り除く。 Here, a method for manufacturing the semiconductor module 1 will be described. First, a large number of electronic components are positioned at predetermined positions on the heat radiation plate 51 via plate-like solder using the first assembly jig. Next, using the second assembly jig, the three external lead-out terminals 110 are positioned at predetermined positions on the heat radiating plate 51 through the plate-like solder. Next, the combination is placed on the hot plate, the plate-like solder interposed between the members is melted, and the electronic component and the external lead-out terminal 110 are placed at predetermined positions on the heat sink 51, respectively. Solder. Next, the first assembly jig and the second assembly jig are removed.
次に、樹脂ケース５２の貫通孔５２ａに外部導出用端子１１０の主端子片１０を挿通させながら、放熱板５１の外周に樹脂ケース５２を嵌め合わせて放熱板５１と樹脂ケース５２とを接着剤で接着する。次に、樹脂ケース５２の内部にシリコーンゲルを充填する。最後に、外部導出用端子１１０の主端子片１０を樹脂ケース５２の上面に沿うように略直角に折曲げて、半導体モジュール１を完成させる。 Next, while the main terminal piece 10 of the external lead-out terminal 110 is inserted through the through hole 52a of the resin case 52, the resin case 52 is fitted to the outer periphery of the heat sink 51 to bond the heat sink 51 and the resin case 52 to each other. Glue with. Next, silicone gel is filled into the resin case 52. Finally, the main terminal piece 10 of the external lead-out terminal 110 is bent at a substantially right angle along the upper surface of the resin case 52 to complete the semiconductor module 1.
しかしながら、半導体モジュール１を製造する際には、第二組立治具を用いて３個の外部導出用端子１１０を位置決めして保持させなければならず、非常に手間であった。
また、回路設計において第二組立治具を用いるためのスペースを設けなければならず、スペースを設けないと第二組立治具自体も外部導出用端子１１０と一緒に半田付けされてしまうことがあった。つまり、半導体モジュール１の実装において高密度化を進めるにあたって非常に問題があった。
そこで、本発明は、上述した如き課題に鑑みてなされたものであり、自立することができ、自立した状態で導電パターンに取り付けられることができる外部導出用自立端子を提供することを目的とする。
However, when manufacturing the semiconductor module 1, it is necessary to position and hold the three external lead-out terminals 110 using the second assembly jig, which is very troublesome.
In addition, a space for using the second assembly jig must be provided in the circuit design. If the space is not provided, the second assembly jig itself may be soldered together with the external lead-out terminal 110. It was. That is, there has been a very problem in increasing the density in mounting the semiconductor module 1.
Therefore, the present invention has been made in view of the above-described problems, and an object thereof is to provide an external lead-out self-supporting terminal that can be self-supporting and can be attached to a conductive pattern in a self-supporting state. .
以上のような目的を達成するために、本発明に係る外部導出用自立端子は、モジュールケース内に配置された放熱板上に形成された導電パターンに接合されるための接合部と、前記モジュールケース外の上方に配置されるための主端子片と、前記接合部と前記主端子片との間を上下方向に連結する連結板とを有する外部導出用自立端子であって、前記連結板に延出された脚部を有し、前記脚部の下端部には水平方向に延伸された延伸部が形成されていることを特徴とする。 In order to achieve the above object, a self-standing terminal for external derivation according to the present invention includes a joint portion for joining to a conductive pattern formed on a heat sink disposed in a module case, and the module An external lead-out self-supporting terminal having a main terminal piece to be disposed above the outside of the case, and a connecting plate that connects the joint portion and the main terminal piece in the vertical direction. It has an extended leg part, and the extending part extended in the horizontal direction is formed in the lower end part of the said leg part, It is characterized by the above-mentioned.
上記発明においては、前記脚部は、２本の脚からなることが好ましい。 In the said invention, it is preferable that the said leg part consists of two legs.
また、本発明に係る半導体モジュールの製造方法は、上述したような外部導出用自立端子と、導電パターンが形成された放熱板と、前記外部導出用自立端子の主端子片を導出するための貫通孔を有するモジュールケースとを備える半導体モジュールの製造方法であって、（ａ）前記放熱板上に形成された導電パターンに前記外部導出用自立端子の接合部を載置するとともに、前記放熱板上に形成された導電パターン以外に前記外部導出用自立端子の延伸部を載置する載置工程と、（ｂ）前記導電パターンと前記接合部とを半田で接合する接合工程とを含むことを特徴とする。 In addition, the semiconductor module manufacturing method according to the present invention includes an external lead-out terminal as described above, a heat sink having a conductive pattern formed thereon, and a through hole for leading out the main terminal piece of the external lead-out self-supporting terminal. A method of manufacturing a semiconductor module comprising a module case having a hole, wherein (a) a joint portion of the external lead-out self-standing terminal is placed on a conductive pattern formed on the heat sink, and the heat sink In addition to the conductive pattern formed in the step, a mounting step of mounting the extended portion of the external lead-out self-standing terminal, and (b) a bonding step of bonding the conductive pattern and the bonding portion with solder are included. And
上記発明においては、（ａ）載置工程では、前記外部導出用自立端子を前記放熱板上に配置するための組立治具を用いないことが好ましい。 In the said invention, it is preferable not to use the assembly jig | tool for arrange | positioning the said self-standing terminal for external extraction on the said heat sink at (a) mounting process.
本発明に係る外部導出用自立端子によれば、自立させることができ、自立させた状態で導電パターンに取り付けることができ、外部導出用自立端子を位置決め保持するための組立治具が不要となり、組立を簡略化することができる。また、使用中には、発生した熱が脚部を介して放熱板に伝達され、放熱効率が向上する。 According to the external lead-out self-supporting terminal according to the present invention, it can be self-supporting, can be attached to the conductive pattern in a self-supporting state, an assembly jig for positioning and holding the external lead-out self-supporting terminal becomes unnecessary, Assembly can be simplified. Further, during use, the generated heat is transmitted to the heat radiating plate through the legs, and the heat radiating efficiency is improved.
以下に、本発明の実施形態について図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
＜外部導出用自立端子＞
図１の（ａ）は、実施形態に係る外部導出用端子を示す斜視図であり、図１の（ｂ）は、（ａ）に示す外部導出用端子の正面図であり、図１の（ｃ）は、（ａ）に示す外部導出用端子の側面図である。
外部導出用自立端子１００は、下部に形成された接合部３０と、上部に形成された主端子片１０と、接合部３０と主端子片１０との間を上下方向に連結する連結板２０と、連結板２０に延出された脚部４０とを有する。すなわち、本実施形態に係る外部導出用自立端子１００には脚部４０が形成されている。
<Self-standing terminal for external derivation>
1A is a perspective view showing an external lead-out terminal according to the embodiment, and FIG. 1B is a front view of the external lead-out terminal shown in FIG. c) is a side view of the external lead-out terminal shown in FIG.
The external lead-out self-standing terminal 100 includes a joint portion 30 formed in the lower portion, a main terminal piece 10 formed in the upper portion, and a connecting plate 20 that connects the joint portion 30 and the main terminal piece 10 in the vertical direction. The leg portion 40 extends to the connecting plate 20. That is, the leg part 40 is formed in the external lead-out self-supporting terminal 100 according to the present embodiment.
接合部３０は、側面視でコの字形状を呈しており、連結板２０下部から後方に延出された上側板状体３０ａと、上側板状体３０ａから下方に延出された連結板３０ｂと、連結板３０ｂから前方に延出された下側板状体３０ｃとを有する。このような接合部３０の全ての部分は、連結板２０より後方に配置されている。そして、下側板状体３０ｃが放熱板５１上の導電パターン５１ａの所定の位置や、半導体モジュール１内に搭載された図示しない半導体チップ等の電子部品の電極上に半田や導電性接着剤等によって接合される。 The joint portion 30 has a U-shape when viewed from the side, and includes an upper plate 30a extending rearward from the lower portion of the connecting plate 20 and a connecting plate 30b extending downward from the upper plate 30a. And a lower plate-like body 30c extending forward from the connecting plate 30b. All the parts of the joining part 30 are arranged behind the connecting plate 20. Then, the lower plate-like body 30c is placed on a predetermined position of the conductive pattern 51a on the heat sink 51, or on an electrode of an electronic component such as a semiconductor chip (not shown) mounted in the semiconductor module 1 by solder, conductive adhesive or the like. Be joined.
主端子片１０は、樹脂ケース（モジュールケース）５２外の上方に配置されるための板状体であり、その中央部に円形状の孔１１が貫通形成されている。 The main terminal piece 10 is a plate-like body that is disposed above the resin case (module case) 52, and a circular hole 11 is formed through the central portion thereof.
連結板２０は、接合部３０と主端子片１０との間を上下方向に連結する板状体であり、後述するが半導体モジュール１を製造する際に、主端子片１０が樹脂ケース（モジュールケース）５２外の上方に配置されるように予め設定された距離だけ延出されている。また、連結板２０と主端子片１０との間には図示しない溝１２がコイニングにより形成されており、この溝１２を境にして連結板２０と主端子片１０との間で略直角に折曲げられるようになっている。 The connecting plate 20 is a plate-like body that connects the joint portion 30 and the main terminal piece 10 in the vertical direction. When the semiconductor module 1 is manufactured as described later, the main terminal piece 10 is a resin case (module case). ) It is extended by a preset distance so as to be arranged above 52. Further, a groove 12 (not shown) is formed by coining between the connecting plate 20 and the main terminal piece 10, and the connecting plate 20 and the main terminal piece 10 are folded at a substantially right angle with the groove 12 as a boundary. It can be bent.
本実施形態に係る脚部４０は、何本の脚を有してもよいが、２本の脚を有することが好ましく、本実施形態では略Ｌ字形状を呈する右側脚４１と左側脚４２とからなる場合について説明する。本実施形態では、右側脚４１は連結板２０の右下部に連結されるとともに左側脚４２は連結板２０の左下部に連結されている。右側脚４１は、下方に延出された連結部４１ｂと、連結部４１ｂから前方（水平方向）に所定距離だけ延出された延伸部４１ａとを有する。また、左側脚４２も、下方に延出された連結部４２ｂと、連結部４２ｂから前方（水平方向）に所定距離だけ延出された延伸部４２ａとを有する。これら延伸部４１ａ、４２ａは、放熱板５１上の導電パターンの形成されていない所定の位置に載置され、脚部４０は電気的な接続には用いられていない。しかしこの脚部４０は放熱板５１や電子部品等の熱を伝達することができるため、２本の脚部４０の分外部導出用自立端子１００の放熱面積を広くすることができる。
なお、上記脚部４０及び外部導出用自立端子１００の材質としては、特に限定されないが銅等が挙げられる。また、上記脚部４０と外部導出用自立端子１００とは一体形成されたものであってもよく、別々に形成されたものであってもよい。
The leg portion 40 according to the present embodiment may have any number of legs, but preferably has two legs. In the present embodiment, the right leg 41 and the left leg 42 each having a substantially L shape. The case where consists of will be described. In the present embodiment, the right leg 41 is connected to the lower right portion of the connecting plate 20 and the left leg 42 is connected to the lower left portion of the connecting plate 20. The right leg 41 includes a connecting portion 41b extending downward, and an extending portion 41a extending forward (horizontal direction) from the connecting portion 41b by a predetermined distance. The left leg 42 also includes a connecting portion 42b extending downward and an extending portion 42a extending a predetermined distance forward (horizontal direction) from the connecting portion 42b. These extending portions 41a and 42a are placed at predetermined positions on the heat radiation plate 51 where no conductive pattern is formed, and the leg portions 40 are not used for electrical connection. However, since the leg portion 40 can transmit heat from the heat radiating plate 51 and the electronic component, the heat radiation area of the self-standing terminal 100 for external lead-out can be increased by the two leg portions 40.
In addition, although it does not specifically limit as a material of the said leg part 40 and the self-standing terminal 100 for external derivation, Copper etc. are mentioned. Further, the leg portion 40 and the external lead-out self-standing terminal 100 may be integrally formed or may be formed separately.
よって、本実施形態に係る外部導出用自立端子１００によれば、接合部３０と延伸部４１ａと延伸部４２ａとの３点で、連結板２０と主端子片１０とを支えることができ、安定して自立させることができる。また、連結板２０の上下方向における予め設定された距離が長くなっても延伸部４１ａ、４２ａの長さ（所定距離）を調整することで自立させることができる。さらに、延伸部４１ａ、４２ａの長さ（所定距離）を調整することで放熱性も調整することができる。 Therefore, according to the external lead-out self-supporting terminal 100 according to the present embodiment, the connecting plate 20 and the main terminal piece 10 can be supported at three points of the joining portion 30, the extending portion 41a, and the extending portion 42a, and stable. Can be made independent. Moreover, even if the preset distance in the up-down direction of the connecting plate 20 becomes long, it can be made independent by adjusting the lengths (predetermined distances) of the extending portions 41a, 42a. Furthermore, heat dissipation can also be adjusted by adjusting the length (predetermined distance) of the extending portions 41a and 42a.
＜半導体モジュールの製造方法＞
ここで、半導体モジュール１の製造方法について説明する。図２は、樹脂ケースを取り付ける前の状態の斜視図である。
本実施形態に係る半導体モジュール１の製造方法は、電子部品や３個の外部導出用端子１００等の各部品を所定の位置に位置決めする載置工程（ａ）と、各部品を半田で接合する接合工程（ｂ）と、樹脂ケース接着工程（ｃ）と、折曲工程（ｄ）とを含む。
<Semiconductor module manufacturing method>
Here, a method for manufacturing the semiconductor module 1 will be described. FIG. 2 is a perspective view of a state before the resin case is attached.
The manufacturing method of the semiconductor module 1 according to the present embodiment includes a placement step (a) for positioning each component such as an electronic component and the three external lead-out terminals 100 at a predetermined position, and joining each component with solder. A joining process (b), a resin case adhesion process (c), and a bending process (d) are included.
（ａ）載置工程
（ａ−１）まず、第一組立治具を用いて多数の電子部品を板状半田を介して放熱板５１上の所定の位置に位置決めする。
（ａ−２）次に、３個の外部導出用端子１００を板状半田を介して放熱板５１上の所定の位置に位置決めする。このとき、放熱ベース５１ｃ上に形成された導電パターン５１ａに外部導出用自立端子１００の接合部３０を載置するとともに、放熱ベース５１ｃ上に形成された絶縁基板（導電パターン以外）５１ｂに外部導出用自立端子１００の延伸部４１ａ、４２ａを載置する。すなわち、本実施形態に係る外部導出用自立端子１００の製造方法の工程（ａ−２）では、組立治具を用いる必要がない。
(A) Placement Step (a-1) First, a large number of electronic components are positioned at predetermined positions on the heat radiation plate 51 via plate-like solder using the first assembly jig.
(A-2) Next, the three external lead-out terminals 100 are positioned at predetermined positions on the heat radiating plate 51 through plate-like solder. At this time, the joint portion 30 of the external lead-out self-standing terminal 100 is placed on the conductive pattern 51a formed on the heat dissipation base 51c, and is led out to the insulating substrate (other than the conductive pattern) 51b formed on the heat dissipation base 51c. The extending portions 41a and 42a of the self-supporting terminal 100 are placed. That is, it is not necessary to use an assembly jig in the step (a-2) of the manufacturing method of the external lead-out self-standing terminal 100 according to the present embodiment.
（ｂ）接合工程
このように組み合わせられたものを熱板上に載せ、各部材間に介在させた半田を溶融させ、電子部品や外部導出用端子１００を放熱板５１上の所定の位置にそれぞれ半田付けする。
(B) Joining step The combination thus obtained is placed on a hot plate, the solder interposed between the members is melted, and the electronic component and the external lead-out terminal 100 are placed at predetermined positions on the heat sink 51, respectively. Solder.
（ｃ）樹脂ケース接着工程
次に、樹脂ケース５２の貫通孔５２ａに外部導出用端子１００の主端子片１０を挿通させながら、放熱板５１の外周に樹脂ケース５２を嵌め合わせて接着剤で接着する。次に、樹脂ケース５２の内部にシリコーンゲルを充填する。
なお、上記接着剤としては、特に限定されないがシリコンゴム等が挙げられる。
（ｄ）折曲工程
最後に、外部導出用端子１００の主端子片１０を樹脂ケース５２の上面に沿うように略直角に折曲げて、半導体モジュール１を完成させる（図３参照）。
(C) Resin Case Adhesion Step Next, the resin case 52 is fitted to the outer periphery of the heat sink 51 and is bonded with an adhesive while the main terminal piece 10 of the external lead-out terminal 100 is inserted into the through hole 52a of the resin case 52. To do. Next, silicone gel is filled into the resin case 52.
The adhesive is not particularly limited, and examples thereof include silicon rubber.
(D) Bending process Finally, the main terminal piece 10 of the external lead-out terminal 100 is bent at a substantially right angle along the upper surface of the resin case 52 to complete the semiconductor module 1 (see FIG. 3).
以上のように実施形態に係る外部導出用自立端子１００によれば、自立させた状態で導電パターン５１ａに取り付けることができ、外部導出用自立端子１００を位置決め保持するための組立治具が不要となり、組立を簡略化することができる。 As described above, according to the external lead-out self-supporting terminal 100 according to the embodiment, it can be attached to the conductive pattern 51a in a self-supporting state, and an assembly jig for positioning and holding the external lead-out free-standing terminal 100 becomes unnecessary. Assembling can be simplified.
本発明に係る外部導出用自立端子は、組立治具を用いずに外部導出用自立端子を取り付けることができる半導体モジュールの製造方法等として有用である。 The external lead-out self-supporting terminal according to the present invention is useful as a method for manufacturing a semiconductor module or the like in which the external lead-out self-supporting terminal can be attached without using an assembly jig.
１ 半導体モジュール
１０ 主端子片
２０ 連結板
３０ 接合部
４０ 脚部
４１ 右側脚
４１ａ 延伸部
４２ 左側脚
４２ａ 延伸部
５１ 放熱板
５１ａ 導電パターン
５２ 樹脂ケース（モジュールケース）
１００ 外部導出用自立端子
DESCRIPTION OF SYMBOLS 1 Semiconductor module 10 Main terminal piece 20 Connection board 30 Joining part 40 Leg part 41 Right leg 41a Extension part 42 Left leg 42a Extension part 51 Heat sink 51a Conductive pattern 52 Resin case (module case)
100 Free standing terminal for external lead
Claims (4)
前記モジュールケース外の上方に配置されるための主端子片と、
前記接合部と前記主端子片との間を上下方向に連結する連結板とを有する外部導出用自立端子であって、
前記連結板に延出された脚部を有し、前記脚部の下端部には水平方向に延伸された延伸部が形成されていることを特徴とする外部導出用自立端子。 A joint for joining to a conductive pattern formed on a heat sink arranged in the module case;
A main terminal piece for being arranged above the outside of the module case;
A self-standing terminal for external derivation having a connecting plate that connects the joint and the main terminal piece in the vertical direction,
A self-supporting external lead terminal having a leg portion extending to the connecting plate, and an extending portion extending in a horizontal direction is formed at a lower end portion of the leg portion.
（ａ）前記放熱板上に形成された導電パターンに前記外部導出用自立端子の接合部を載置するとともに、前記放熱板上に形成された導電パターン以外に前記外部導出用自立端子の延伸部を載置する載置工程と、
（ｂ）前記導電パターンと前記接合部とを半田で接合する接合工程とを含むことを特徴とする半導体モジュールの製造方法。 The external lead-out self-supporting terminal according to claim 1 or 2, a heat radiating plate on which a conductive pattern is formed, and a module case having a through hole for leading out the main terminal piece of the external lead-out self-supporting terminal. A method for manufacturing a semiconductor module comprising:
(A) The joint portion of the external lead-out self-supporting terminal is placed on the conductive pattern formed on the heat sink, and the extension portion of the external lead-out self-supporting terminal other than the conductive pattern formed on the heat sink A mounting process for mounting;
(B) A method of manufacturing a semiconductor module, comprising: a bonding step of bonding the conductive pattern and the bonding portion with solder.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59170971U (en) * | 1983-04-30 | 1984-11-15 | 日本電気ホームエレクトロニクス株式会社 | Lead member |
| JPH08222292A (en) * | 1995-02-16 | 1996-08-30 | Yazaki Corp | Terminal for printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59170971U (en) * | 1983-04-30 | 1984-11-15 | 日本電気ホームエレクトロニクス株式会社 | Lead member |
| JPH08222292A (en) * | 1995-02-16 | 1996-08-30 | Yazaki Corp | Terminal for printed circuit board |
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