JPS59170971U - Lead member - Google Patents
Lead memberInfo
- Publication number
- JPS59170971U JPS59170971U JP1983065311U JP6531183U JPS59170971U JP S59170971 U JPS59170971 U JP S59170971U JP 1983065311 U JP1983065311 U JP 1983065311U JP 6531183 U JP6531183 U JP 6531183U JP S59170971 U JPS59170971 U JP S59170971U
- Authority
- JP
- Japan
- Prior art keywords
- lead member
- lead
- bridging
- leg pieces
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
、 第1図は半導体装置の一例を示す部分透視平面図
、第2図は第1図A−A面図、第3図は第1図装置に用
いたリード連の斜視図、第4図は本考案によるリードを
用いた半導体装置の側断面図、第5図はリード連の斜視
図を示す。
12・・・・・・リード、13a・・・・・・脚片、1
4・・・・・・リード部、17・・・・・・切断予定部
。, FIG. 1 is a partially transparent plan view showing an example of a semiconductor device, FIG. 2 is a view taken along the line A-A in FIG. 1, FIG. 3 is a perspective view of a series of leads used in the device shown in FIG. FIG. 5 is a side sectional view of a semiconductor device using leads according to the present invention, and a perspective view of a series of leads. 12... Lead, 13a... Leg piece, 1
4... Lead part, 17... Part to be cut.
Claims (1)
一方の脚片にリード部を立設し、かつ一方の脚片の橋絡
側部分に切断予定部を形成したことを特徴とするリード
部材。While bridging one end of a pair of opposing leg pieces,
A lead member characterized in that a lead portion is provided upright on one of the leg pieces, and a portion to be cut is formed on the bridging side portion of the one leg piece.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983065311U JPS59170971U (en) | 1983-04-30 | 1983-04-30 | Lead member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983065311U JPS59170971U (en) | 1983-04-30 | 1983-04-30 | Lead member |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59170971U true JPS59170971U (en) | 1984-11-15 |
Family
ID=30195506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983065311U Pending JPS59170971U (en) | 1983-04-30 | 1983-04-30 | Lead member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59170971U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6302115B1 (en) * | 2017-03-23 | 2018-03-28 | 株式会社三社電機製作所 | Self-standing terminal for external lead-out and semiconductor module manufacturing method |
-
1983
- 1983-04-30 JP JP1983065311U patent/JPS59170971U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6302115B1 (en) * | 2017-03-23 | 2018-03-28 | 株式会社三社電機製作所 | Self-standing terminal for external lead-out and semiconductor module manufacturing method |
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